Electrical Modeling of Integrated-Package Power and Ground Distributions

Design&Test
2003
Issue No. 3 - May/June
Abstract - Electrical Modeling of Integrated-Package Power and Ground Distributions

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May/June 2003 (vol. 20 no. 3)

pp. 24-31

	ASCII Text	x
	Hui Zheng, Byron Krauter, Lawrence Pileggi, "Electrical Modeling of Integrated-Package Power and Ground Distributions," IEEE Design and Test of Computers, vol. 20, no. 3, pp. 24-31, May/June, 2003.

	BibTex	x
	@article{ 10.1109/MDT.2003.1198682, author = {Hui Zheng and Byron Krauter and Lawrence Pileggi}, title = {Electrical Modeling of Integrated-Package Power and Ground Distributions}, journal ={IEEE Design and Test of Computers}, volume = {20}, number = {3}, issn = {0740-7475}, year = {2003}, pages = {24-31}, doi = {http://doi.ieeecomputersociety.org/10.1109/MDT.2003.1198682}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - MGZN JO - IEEE Design and Test of Computers TI - Electrical Modeling of Integrated-Package Power and Ground Distributions IS - 3 SN - 0740-7475 SP24 EP31 EPD - 24-31 A1 - Hui Zheng, A1 - Byron Krauter, A1 - Lawrence Pileggi, PY - 2003 VL - 20 JA - IEEE Design and Test of Computers ER -

Hui Zheng, Carnegie Mellon University

Byron Krauter, IBM

Lawrence Pileggi, Carnegie Mellon University

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2003.1198682

Editor?s note:

Ensuring reliable power distribution requires accurate modeling of on-package power and ground networks. This, in turn, necessitates efficient magnetic coupling modeling?a massively complex task. Extending their previous work, these authors introduce a window-based extraction technique that uses the physical concept of susceptance to control modeling complexity.

--Soha Hassoun, Tufts University

Citation:

Hui Zheng, Byron Krauter, Lawrence Pileggi, "Electrical Modeling of Integrated-Package Power and Ground Distributions," IEEE Design and Test of Computers, vol. 20, no. 3, pp. 24-31, May/June 2003, doi:10.1109/MDT.2003.1198682

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