Hot Interconnects
Final submissions due: 11 September 2011
Publication date: January/February 2012
IEEE Micro will publish its yearly issue on “Hot Interconnects” as its January/February 2012 issue. This special issue traditionally collects some of the most significant research contributions in high-performance networking with particular emphasis on the most advanced technologies that are used in supercomputers and large-scale data centers. Contributions documenting new, original research in the area are hereby solicited for the special issue.
Areas of interest include, but are not limited to:
- Highly scalable interconnection networks
- Novel and innovative interconnect architectures
- Multicore processor interconnects
- Advanced chip-to-chip communication technologies
- High-performance host-network interface architectures
- Innovative architectures for supporting collective communication
- Survivability and fault-tolerance of interconnects
All submissions undergo peer review consistent with other professional-level technical publications.
Submission Guidelines
Log onto ScholarOne at http://mc.manuscriptcentral.com/cs-ieee and submit your manuscript. Acceptable file formats include Microsoft Word and PDF. Manuscripts should not exceed 5,000 words including references, with each average-size figure counting as 150 words toward this limit. Please direct questions to the IEEE Micro magazine assistant at micro-ma@computer.org.
Please include all figures and tables, as well as a cover page with author contact information (name, postal address, phone, fax, and e-mail address) and a 200-word abstract. Submitted manuscripts must not have been previously published or currently submitted for publication elsewhere, and all manuscripts must be cleared for publication. Accepted articles will be edited for structure, style, clarity, and readability. For more information, please visit the IEEE Micro Author Center, online at www.computer.org/portal/web/peerreviewmagazines/acmicro.
Questions?
Contact the guest editors: