Advanced Search 
IEEE Transactions on Pattern Analysis and Machine Intelligence
Feb. 2014 (vol. 36 no. 2)
ISSN: 0162-8828
Table of Contents
Front Covers
REGULAR PAPERS
Naejin Kong, Max-Planck-Inst. fur Intelligente Syst., Tubingen, Germany
Yu-Wing Tai, Dept. of Electr. Eng., KAIST, Daejeon, South Korea
Joseph S. Shin, Dept. of Comput. Sci., KAIST, Daejeon, South Korea
pp. 209-221
Ian Endres, Dept. of Comput. Sci., Univ. of Illinois at Urbana-Champaign, Champaign, IL, USA
Derek Hoiem, Dept. of Comput. Sci., Univ. of Illinois at Urbana-Champaign, Champaign, IL, USA
pp. 222-234
Makoto Yamada, NTT Commun. Sci. Labs., Atsugi, Japan
Leonid Sigal, Disney Res. Pittsburgh, Pittsburgh, PA, USA
pp. 235-247
Dengyu Liu, Chester F. Carlson Center for Imaging Sci., Rochester Inst. of Technol., Rochester, NY, USA
Jinwei Gu, Chester F. Carlson Center for Imaging Sci., Rochester Inst. of Technol., Rochester, NY, USA
Yasunobu Hitomi, Sony Corp., Tokyo, Japan
Mohit Gupta, Dept. of Comput. Sci., Columbia Univ., New York, NY, USA
Tomoo Mitsunaga, Sony Corp., Tokyo, Japan
Shree K. Nayar, Dept. of Comput. Sci., Columbia Univ., New York, NY, USA
pp. 248-260
Ran He, Nat. Lab. of Pattern Recognition (NLPR), Inst. of Autom., Beijing, China
Wei-Shi Zheng, Sch. of Inf. Sci. & Technol., Sun Yat-sen Univ., Guangzhou, China
Tieniu Tan, Nat. Lab. of Pattern Recognition (NLPR), Inst. of Autom., Beijing, China
Zhenan Sun, Nat. Lab. of Pattern Recognition (NLPR), Inst. of Autom., Beijing, China
pp. 261-275
Sudheendra Vijayanarasimhan, Univ. of Texas at Austin, Austin, TX, USA
Prateek Jain, Machine Learning Group, Microsoft Res., Bangalore, India
Kristen Grauman, Univ. of Texas at Austin, Austin, TX, USA
pp. 276-288
Zhen Lei, Nat. Lab. of Pattern Recognition, Inst. of Autom., Beijing, China
Matti Pietikainen, Center for Machine Vision Res., Univ. of Oulu, Oulu, Finland
Stan Z. Li, Nat. Lab. of Pattern Recognition, Inst. of Autom., Beijing, China
pp. 289-302
Yanwei Fu, Sch. of Electron. Eng. & Comput. Sci., Queen Mary Univ. of London, London, UK
Timothy M. Hospedales, Sch. of Electron. Eng. & Comput. Sci., Queen Mary Univ. of London, London, UK
Tao Xiang, Sch. of Electron. Eng. & Comput. Sci., Queen Mary Univ. of London, London, UK
Shaogang Gong, Sch. of Electron. Eng. & Comput. Sci., Queen Mary Univ. of London, London, UK
pp. 303-316
Yacov Hel-Or, Dept. of Comput. Sci., Interdiscipl. Center, Herzliya, Israel
Hagit Hel-Or, Dept. of Comput. Sci., Univ. of Haifa, Haifa, Israel
Eyal David, Dept. of Comput. Sci., Univ. of Haifa, Haifa, Israel
pp. 317-330
Jiwen Lu, Adv. Digital Sci. Center, Singapore, Singapore
Xiuzhuang Zhou, Coll. of Inf. Eng., Capital Normal Univ., Beijing, China
Yap-Pen Tan, Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
Yuanyuan Shang, Coll. of Inf. Eng., Capital Normal Univ., Beijing, China
Jie Zhou, Dept. of Autom., Tsinghua Univ., Beijing, China
pp. 331-345
Ce Liu, Microsoft Res. New England, Cambridge, UK
Deqing Sun, Pfister Group, Harvard Univ., Cambridge, MA, USA
pp. 346-360
Xiaogang Wang, Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Hong Kong, China
Meng Wang, Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Hong Kong, China
Wei Li, Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Hong Kong, China
pp. 361-374
Jerod J. Weinman, Dept. of Comput. Sci., Grinnell Coll., Grinnell, IA, USA
Zachary Butler, Dept. of Comput. Sci., Grinnell Coll., Grinnell, IA, USA
Dugan Knoll, Dept. of Comput. Sci., Grinnell Coll., Grinnell, IA, USA
Jacqueline Feild, Dept. of Comput. Sci., Univ. of Massachusetts Amherst, Amherst, MA, USA
pp. 375-387
Jingdong Wang, Media Comput. Group, Microsoft Res. Asia, Beijing, China
Naiyan Wang, Dept. of Comput. Sci. & Eng., Hong Kong Univ. of Sci. & Technol., Hong Kong, China
You Jia, Carnegie Mellon Univ., Pittsburgh, PA, USA
Jian Li, Tsinghua Univ., Beijing, China
Gang Zeng, Peking Univ., Beijing, China
Hongbin Zha, Peking Univ., Beijing, China
Xian-Sheng Hua, Microsoft Corp., Redmond, WA, USA
pp. 388-403
Du Tran, Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
Junsong Yuan, Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
David Forsyth, Dept. of Comput. Sci., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
pp. 404-416
Back Covers
Usage of this product signifies your acceptance of the Terms of Use.