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IEEE Transactions on Pattern Analysis and Machine Intelligence
Jan. 2014 (vol. 36 no. 1)
ISSN: 0162-8828
Table of Contents
Front Covers
EDITORIAL
REGULAR PAPERS
Pablo Marquez-Neila, Dept. de Intel. Artificial, Univ. Politec. de Madrid, Madrid, Spain
Luis Baumela, Dept. de Intel. Artificial, Univ. Politec. de Madrid, Madrid, Spain
Luis Alvarez, Dept. de Inf. y Sist., Univ. de las Palmas de Gran Canaria, Las Palmas de Gran Canaria, Spain
pp. 2-17
Weixin Li, Univ. of California, San Diego, La Jolla, CA, USA
Vijay Mahadevan, Univ. of California, San Diego, La Jolla, CA, USA
Nuno Vasconcelos, Univ. of California, San Diego, La Jolla, CA, USA
pp. 18-32
Albert Gordo, LEAR Group, INRIA Grenoble Rhone-Alpes, Montbonnot, France
Florent Perronnin, Xerox Res. Centre Eur. (XRCE), Meylan, France
Yunchao Gong, Dept. of Comput. Sci., Univ. of North Carolina at Chapel Hill, Chapel Hill, NC, USA
Svetlana Lazebnik, Dept. of Comput. Sci., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
pp. 33-47
Daniel L. Sussman, Johns Hopkins Univ., Baltimore, MD, USA
Minh Tang, Johns Hopkins Univ., Baltimore, MD, USA
Carey E. Priebe, Johns Hopkins Univ., Baltimore, MD, USA
pp. 48-57
Anton Milan, Dept. of Comput. Sci., Tech. Univ. Darmstadt, Darmstadt, Germany
Stefan Roth, Dept. of Comput. Sci., Tech. Univ. Darmstadt, Darmstadt, Germany
Konrad Schindler, Photogrammetry & Remote SensingGroup, ETH Zurich, Zurich, Switzerland
pp. 58-72
Jaishanker K. Pillai, Dept. of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD, USA
Maria Puertas, Dept. of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD, USA
Rama Chellappa, Dept. of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD, USA
pp. 73-85
Chao Liu, Center for Imaging Sci., Rochester Inst. of Technol., Rochester, NY, USA
Jinwei Gu, Center for Imaging Sci., Rochester Inst. of Technol., Rochester, NY, USA
pp. 86-98
Ming-Yu Liu, Mitsubishi Electr. Res. Labs. (MERL), Mitsubishi Electr. Corp., Cambridge, MA, USA
Oncel Tuzel, Mitsubishi Electr. Res. Labs. (MERL), Mitsubishi Electr. Corp., Cambridge, MA, USA
Srikumar Ramalingam, Mitsubishi Electr. Res. Labs. (MERL), Mitsubishi Electr. Corp., Cambridge, MA, USA
Rama Chellappa, Univ. of Maryland, College Park, MD, USA
pp. 99-112
Sumit Shekhar, Dept. of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD, USA
Vishal M. Patel, Dept. of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD, USA
Nasser M. Nasrabadi, U.S. Army Res. Lab., Adelphi, MD, USA
Rama Chellappa, Dept. of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD, USA
pp. 113-126
Anne Hendrikse, Signals & Syst. Group, Univ. of Twente, Overijsel, Netherlands
Raymond Veldhuis, Signals & Syst. Group, Univ. of Twente, Overijsel, Netherlands
Luuk Spreeuwers, Signals & Syst. Group, Univ. of Twente, Overijsel, Netherlands
pp. 127-139
Remi Emonet, Idiap Res. Inst., Martigny, Switzerland
Jagannadan Varadarajan, Idiap Res. Inst., Martigny, Switzerland
Jean-Marc Odobez, Idiap Res. Inst., Martigny, Switzerland
pp. 140-156
Christopher Zach, Microsoft Res. Cambridge, Cambridge, UK
Christian Hane, Comput. Vision & Geometry Group, ETH Zurich, Zurich, Switzerland
Marc Pollefeys, Comput. Vision & Geometry Group, ETH Zurich, Zurich, Switzerland
pp. 157-170
SHORT PAPERS
R. Litman, Sch. of Electr. Eng., Tel Aviv Univ., Tel Aviv, Israel
A. M. Bronstein, Sch. of Electr. Eng., Tel Aviv Univ., Tel Aviv, Israel
pp. 171-180
Ziheng Zhou, Dept. of Comput. Sci. & Eng., Univ. of Oulu, Oulu, Finland
Xiaopeng Hong, Dept. of Comput. Sci. & Eng., Univ. of Oulu, Oulu, Finland
Guoying Zhao, Dept. of Comput. Sci. & Eng., Univ. of Oulu, Oulu, Finland
Matti Pietikainen, Dept. of Comput. Sci. & Eng., Univ. of Oulu, Oulu, Finland
pp. 1
Xin Yang, Electr. & Comput. Eng. Dept., Univ. of California, Santa Barbara, Santa Barbara, CA, USA
Kwang-Ting Cheng, Electr. & Comput. Eng. Dept., Univ. of California, Santa Barbara, Santa Barbara, CA, USA
pp. 188-194
Shijian Lu, Inst. for Infocomm Res., A*STAR, Singapore, Singapore
Cheston Tan, Inst. for Infocomm Res., A*STAR, Singapore, Singapore
Joo-Hwee Lim, Inst. for Infocomm Res., A*STAR, Singapore, Singapore
pp. 195-201
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