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IEEE Transactions on Pattern Analysis and Machine Intelligence
Jan. 2013 (vol. 35 no. 1)
ISSN: 0162-8828
Table of Contents
EDITORIAL
REGULAR PAPERS
F. Lafarge, Geometrica Res. Group, INRIA Sophia Antipolis, Sophia Antipolis, France
R. Keriven, Acute3D, Sophia Antipolis, France
M. Brédif, Matis Lab., Univ. Paris Est, St. Mande, France
Hoang-Hiep Vu, Imagine Group, Univ. Paris Est, Marne la Vallee, France
pp. 5-17
A. Egozi, Dept. of Electr. Eng., Ben Gurion Univ., Beer-Sheva, Israel
Y. Keller, Fac. of Eng., Bar Ilan Univ., Ramat-Gan, Israel
H. Guterman, Dept. of Electr. Eng., Ben Gurion Univ., Beer-Sheva, Israel
pp. 18-27
Xingwei Yang, Image Analytics Lab., GE Global Res., Niskayuna, NY, USA
L. Prasad, Space & Remote Sensing Sci. Group, Los Alamos Nat. Lab., Los Alamos, NM, USA
L. J. Latecki, Dept. of Comput. & Inf. Sci., Temple Univ., Philadelphia, PA, USA
pp. 28-38
Jiwen Lu, Adv. Digital Sci. Center, Singapore, Singapore
Yap-Peng Tan, Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
Gang Wang, Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
pp. 39-51
Marek Vondrak, Dept. of Comput. Sci., Brown Univ., Providence, RI, USA
L. Sigal, Disney Res., Pittsburgh, PA, USA
O. C. Jenkins, Dept. of Comput. Sci., Brown Univ., Providence, RI, USA
pp. 52-65
S. Maji, Toyota Technol. Inst. at Chicago, Chicago, IL, USA
A. C. Berg, Comput. Sci. Dept., Stony Brook Univ., Stony Brook, NY, USA
J. Malik, Univ. of California at Berkeley, Berkeley, CA, USA
pp. 66-77
Iván Marín-Franch, Sch. of Optometry, Indiana Univ., Bloomington, IN, USA
D. H. Foster, Sch. of Electr. & Electron. Eng., Univ. of Manchester, Manchester, UK
pp. 78-91
Shenghua Gao, Sch. of Comput. Eng., Nanyang Technol. Univ., Singapore, Singapore
Ivor Wai-Hung Tsang, Sch. of Comput. Eng., Nanyang Technol. Univ., Singapore, Singapore
Liang-Tien Chia, Sch. of Comput. Eng., Nanyang Technol. Univ., Singapore, Singapore
pp. 92-104
S. Holzer, Dept. of Comput. Sci., Tech. Univ. of Munich (TUM), Garching, Germany
S. Ilic, Dept. of Comput. Sci., Tech. Univ. of Munich (TUM), Garching, Germany
N. Navab, Dept. of Comput. Sci., Tech. Univ. of Munich (TUM), Garching, Germany
pp. 105-117
M. Felsberg, Dept. of Electr. Eng., Linkoping Univ., Linkoping, Sweden
F. Larsson, Dept. of Electr. Eng., Linkoping Univ., Linkoping, Sweden
J. Wiklund, Dept. of Electr. Eng., Linkoping Univ., Linkoping, Sweden
N. Wadstromer, Div. of Inf. Syst., FOI Swedish Defence Res. Agency, Linkoping, Sweden
J. Ahlberg, Termisk Systemteknik AB, Linkoping, Sweden
pp. 118-129
S. Giannarou, Hamlyn Centre for Robotic Surg., Imperial Coll. London, London, UK
M. Visentini-Scarzanella, Dept. of Electr. & Electron. Eng., Imperial Coll. London, London, UK
Guang-Zhong Yang, Hamlyn Centre for Robotic Surg., Imperial Coll. London, London, UK
pp. 130-143
Joon-Young Lee, Dept. of Electr. Eng., KAIST, Daejeon, South Korea
Y. Matsushita, Microsoft Res. Asia, Beijing, China
Boxin Shi, Ikeuchi Lab., Univ. of Tokyo, Tokyo, Japan
In So Kweon, Dept. of Electr. Eng., KAIST, Daejeon, South Korea
K. Ikeuchi, Ikeuchi Lab., Univ. of Tokyo, Tokyo, Japan
pp. 144-156
Xiang Zhu, Dept. of Electr. Eng., Univ. of California, Santa Cruz, Santa Cruz, CA, USA
P. Milanfar, Dept. of Electr. Eng., Univ. of California, Santa Cruz, Santa Cruz, CA, USA
pp. 157-170
Guangcan Liu, Dept. of Comput. Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China
Zhouchen Lin, Key Lab. of Machine Perception (MOE), Peking Univ., Beijing, China
Shuicheng Yan, Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore, Singapore
Ju Sun, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
Yong Yu, Dept. of Comput. Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China
Yi Ma, Visual Comput. Group, Microsoft Res. Asia, Beijing, China
pp. 171-184
A. Borji, Dept. of Comput. Sci., Univ. of Southern California, Los Angeles, CA, USA
L. Itti, Dept. of Comput. Sci., Univ. of Southern California, Los Angeles, CA, USA
pp. 185-207
Ji Liu, Univ. of Wisconsin-Madison, Madison, WI, USA
P. Musialski, VRVis Res. Center, Vienna, Austria
P. Wonka, Arizona State Univ., Tempe, AZ, USA
Jieping Ye, Arizona State Univ., Tempe, AZ, USA
pp. 208-220
Shuiwang Ji, Dept. of Comput. Sci., Old Dominion Univ., Norfolk, VA, USA
Wei Xu, Facebook, Inc., Menlo Park, CA, USA
Ming Yang, NEC Labs. America, Inc., Cupertino, CA, USA
Kai Yu, Baidu Inc., Beijing, China
pp. 221-231
T. J. Cashman, Fac. of Inf., Univ. of Lugano, Lugano, Switzerland
A. W. Fitzgibbon, Microsoft Res. Ltd., Cambridge, UK
pp. 232-244
SHORT PAPERS
M. Alterman, Dept. of Electr. Eng., Technion - Israel Inst. of Technol., Haifa, Israel
Y. Y. Schechner, Dept. of Electr. Eng., Technion - Israel Inst. of Technol., Haifa, Israel
P. Perona, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
J. Shamir, Dept. of Electr. Eng., Technion - Israel Inst. of Technol., Haifa, Israel
pp. 245-251
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