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IEEE Transactions on Pattern Analysis and Machine Intelligence
April 2012 (vol. 34 no. 4)
ISSN: 0162-8828
Table of Contents
Front Covers
REGULAR PAPERS
C. Wojek, Max Planck Inst. for Inf., Saarbrucken, Germany
P. Dollar, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
B. Schiele, Max Planck Inst. for Inf., Saarbrucken, Germany
P. Perona, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 743-761
L. Sigal, Disney Res., Pittsburgh, PA, USA
R. Memisevic, Dept. of Comput. Sci., Univ. of Frankfurt, Frankfurt, Germany
D. J. Fleet, Dept. of Comput. Sci., Univ. of Toronto, Toronto, ON, Canada
pp. 778-790
Tai-Peng Tian, Gen. Electr. Global Res. Center, Niskayuna, NY, USA
Rui Li, Gen. Electr. Global Res. Center, Niskayuna, NY, USA
S. Sclaroff, Dept. of Comput. Sci., Boston Univ., Boston, MA, USA
pp. 654-669
Gaofeng Meng, Chinese Academy of Sciences, Beijing
Chunhong Pan, Chinese Academy of Sciences, Beijing
Shiming Xiang, Chinese Academy of Sciences , Beijing
Jiangyong Duan, Chinese Academy of Sciences, Beijing
pp. 707-722
F. Bach, Lab. d'Inf., Ecole Normale Supe'rieure, Paris, France
J. Mairal, Dept. of Stat., Univ. of California, Berkeley, CA, USA
J. Ponce, INRIA-Willow Project-Team, Ecole Normale Super., Paris, France
pp. 791-804
Jin Yu, Australian Center for Visual Technol. (ACVT), Univ. of Adelaide, Adelaide, SA, Australia
Tat-Jun Chin, Australian Center for Visual Technol. (ACVT), Univ. of Adelaide, Adelaide, SA, Australia
D. Suter, Australian Center for Visual Technol. (ACVT), Univ. of Adelaide, Adelaide, SA, Australia
pp. 625-638
Ido Leichter, Microsoft Israel R&D Center, MSR Adv. Technol. Labs. Israel, Haifa, Israel
pp. 695-706
SHORT PAPERS
Nidhal Bouaynaya, University of Arkansas at Little Rock, Little Rock
Mohammed Charif-Chefchaouni, Institut National des Postes et Telecommunications, Rabat
Dan Schonfeld, University of Illinois at Chicago, Chicago
pp. 805-813
Ryan P. Browne, University of Guelph, Guelph
Paul D. McNicholas, University of Guelph, Guelph
Matthew D. Sparling, University of Guelph, Guelph
pp. 814-817
Chunhua Shen, The University of Adelaide, Adelaide
Peng Wang, Beihang University, Beijing
Fumin Shen, Nanjing University of Science and Technology, Nanjing
Hanzi Wang, Xiamen University, Xiamen
pp. 825-832
Sing Bing Kang, Microsoft Res., Redmond, WA, USA
N. Joshi, Microsoft Res., Redmond, WA, USA
C. L. Zitnick, Microsoft Res., Redmond, WA, USA
Taeg Sang Cho, WilmerHale, LLP, Boston, MA, USA
R. Szeliski, Microsoft Res., Redmond, WA, USA
W. T. Freeman, Massachusetts Inst. of Technol., Cambridge, MA, USA
pp. 683-694
Y. Aloimonos, Dept. of Comput. Sci., Univ. of Maryland, College Park, MD, USA
A. K. Mishra, Dept. of Comput. Sci., Univ. of Maryland, College Park, MD, USA
Loong Fah Cheong, Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore, Singapore
A. Kassim, Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore, Singapore
pp. 639-653
J. Gallier, Dept. of Comput. & Inf. Sci., Univ. of Pennsylvania, Philadelphia, PA, USA
X. S. Zhou, Dept. of Comput. Sci. & Eng., Univ. of Minnesota, Minneapolis, MN, USA
O. Naroditsky, Dept. of Comput. & Inf. Sci., Univ. of Pennsylvania, Philadelphia, PA, USA
S. I. Roumeliotis, Dept. of Comput. Sci. & Eng., Univ. of Minnesota, Minneapolis, MN, USA
K. Daniilidis, Dept. of Comput. & Inf. Sci., Univ. of Pennsylvania, Philadelphia, PA, USA
pp. 818-824
Shaogang Gong, Sch. of Electron. Eng. & Comput. Sci., Queen Mary Univ. of London, London, UK
Wei-Shi Zheng, Sch. of Inf. Sci. & Technol., Sun Yat-sen Univ., Guangzhou, China
Tao Xiang, Sch. of Electron. Eng. & Comput. Sci., Queen Mary Univ. of London, London, UK
pp. 762-777
Dong Xu, Sch. of Comput. Eng., Nanyang Technol. Univ., Singapore, Singapore
Feiping Nie, Dept. of Comput. Sci. & Eng., Univ. of Texas at Arlington, Arlington, TX, USA
Yi Yang, Coll. of Comput. Sci., Zhejiang Univ., Hangzhou, China
Jiebo Luo, Kodak Res. Labs., Eastman Kodak Co., Rochester, NY, USA
Yueting Zhuang, Coll. of Comput. Sci., Zhejiang Univ., Hangzhou, China
Yunhe Pan, Coll. of Comput. Sci., Zhejiang Univ., Hangzhou, China
pp. 723-742
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