Advanced Search 
IEEE Transactions on Pattern Analysis and Machine Intelligence
February 2012 (vol. 34 no. 2)
ISSN: 0162-8828
Table of Contents
Front Covers
EDITORIAL
REGULAR PAPERS
V. Frinken, Inst. of Comput. Sci. & Appl. Math. (IAM), Univ. of Bern, Bern, Switzerland
A. Fischer, Inst. of Comput. Sci. & Appl. Math. (IAM), Univ. of Bern, Bern, Switzerland
R. Manmatha, Dept. of Comput. Sci., Univ. of Massachusetts, Amherst, MA, USA
H. Bunke, Inst. of Comput. Sci. & Appl. Math. (IAM), Univ. of Bern, Bern, Switzerland
pp. 211-224
K. Ali, EPFL IC CVLAB, Lausanne, Switzerland
F. Fleuret, Centre du Parc, Idiap Res. Inst., Martigny, Switzerland
D. Hasler, CSEM SA, Neuchdtel, Switzerland
P. Fua, EPFL IC CVLAB, Lausanne, Switzerland
pp. 225-239
Myung Jin Choi, Two Sigma Investments, New York, NY, USA
Antonio Torralba, Comput. Sci. & Artificial Intell. Lab., Massachusetts Inst. of Technol., Cambridge, MA, USA
Alan S. Willsky, Lab. for Inf. & Decision Syst., Massachusetss Inst. of Technol., Cambridge, MA, USA
pp. 240-252
Zhenyue Zhang, Dept. of Math., Zhejiang Univ., Hangzhou, China
Jing Wang, Sch. of Comput. Sci. & Technol., Huaqiao Univ., Xiamen, China
Hongyuan Zha, Coll. of Comput., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 253-265
Seungkyu Lee, Adv. Media Lab., Samsung Adv. Inst. of Technol. (SALT), Yongin, South Korea
Yanxi Liu, Dept. of Comput. Sci. & Electr. Eng., Pennsylvania State Univ., University Park, PA, USA
pp. 266-278
M. Muehlich, CanControls, Aachen, Germany
D. Friedrich, Inst. of Imaging & Comput. Vision, RWTH Aachen Univ., Aachen, Germany
T. Aach, Inst. of Imaging & Comput. Vision, RWTH Aachen Univ., Aachen, Germany
pp. 279-291
Ralf Schlueter, Comput. Sci. Dept., RWTH Aachen Univ., Aachen, Germany
Markus Nussbaum-Thom, Comput. Sci. Dept., RWTH Aachen Univ., Aachen, Germany
Hermann Ney, Comput. Sci. Dept., RWTH Aachen Univ., Aachen, Germany
pp. 292-301
Shoushun Chen, Sch. of Electr. & Electron. Eng. (EEE), Nanyang Technol. Univ., Singapore, Singapore
P. Akselrod, Electr. Eng. Dept., Yale Univ., New Haven, CT, USA
Bo Zhao, Sch. of Electr. & Electron. Eng. (EEE), Nanyang Technol. Univ., Singapore, Singapore
J. A. Perez-Carrasco, Inst. Microelectron. Sevilla (IMSE), Sevilla, Spain
B. Linares-Barranco, Inst. Microelectron. Sevilla (IMSE), Sevilla, Spain
E. Culurciello, Electr. Eng. Dept., Yale Univ., New Haven, CT, USA
pp. 302-314
S. Alpert, Fac. of Math. & Comput. Sci., Weizmann Inst. of Sci., Rehovot, Israel
M. Galun, Fac. of Math. & Comput. Sci., Weizmann Inst. of Sci., Rehovot, Israel
A. Brandt, Fac. of Math. & Comput. Sci., Weizmann Inst. of Sci., Rehovot, Israel
R. Basri, Fac. of Math. & Comput. Sci., Weizmann Inst. of Sci., Rehovot, Israel
pp. 315-327
C. Rudin, MIT Sloan Sch. of Manage., Massachusetts Inst. of Technol., Cambridge, MA, USA
D. Waltz, Center for Comput. Learning Syst., Columbia Univ., New York, NY, USA
R. N. Anderson, Center for Comput. Learning Syst., Columbia Univ., New York, NY, USA
A. Boulanger, Center for Comput. Learning Syst., Columbia Univ., New York, NY, USA
A. Salleb-Aouissi, Center for Comput. Learning Syst., Columbia Univ., New York, NY, USA
M. Chow, Consolidated Edison Co. of New York, New York, NY, USA
H. Dutta, Center for Comput. Learning Syst., Columbia Univ., New York, NY, USA
P. N. Gross, Center for Comput. Learning Syst., Columbia Univ., New York, NY, USA
B. Huang, Center for Comput. Learning Syst., Columbia Univ., New York, NY, USA
S. Ierome, Consolidated Edison Co. of New York, New York, NY, USA
D. F. Isaac, Consolidated Edison Co. of New York, New York, NY, USA
A. Kressner, Grid Connections, LLC, Consolidated Edison Co. of New York, New York, NY, USA
R. J. Passonneau, Center for Comput. Learning Syst., Columbia Univ., New York, NY, USA
A. Radeva, Center for Comput. Learning Syst., Columbia Univ., New York, NY, USA
L. Wu, Center for Comput. Learning Syst., Columbia Univ., New York, NY, USA
pp. 328-345
Yong Jae Lee, Dept. of Electr. & Comput. Eng., Univ. of Texas at Austin, Austin, TX, USA
K. Grauman, Dept. of Comput. Sci., Univ. of Texas at Austin, Austin, TX, USA
pp. 346-358
Long Zhu, Univ. of California, Los Angeles, Los Angeles, CA, USA
Yuanhao Chen, Univ. of California, Los Angeles, Los Angeles, CA, USA
Yuan Lin, Shanghai Jiaotong Univ., Shanghai, China
Chenxi Lin, Alibaba Group R&D, Beijing, China
A. Yuille, Univ. of California, Los Angeles, Los Angeles, CA, USA
pp. 359-371
A. Wagner, Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
J. Wright, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
A. Ganesh, Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
Zihan Zhou, Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
H. Mobahi, Comput. Sci. Dept., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
Yi Ma, Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana- Champaign, Urbana, IL, USA
pp. 372-386
O. Kahler, Dept. of Eng. Sci., Univ. of Oxford, Oxford, UK
J. Denzler, Lehrstuhl fur Digitale Bildverarbeitung, Friedrich-Schiller-Univ. Jena, Jena, Germany
pp. 387-401
SHORT PAPERS
D. Gorisse, Yakaz Lab., Paris, France
M. Cord, LIP6, Sorbonne Univ., Paris, France
F. Precioso, Lab. d'lnf., Signaux et Syst. (I3S), Univ. de Nice - Sophia Antipolis, Sophia Antipolis, France
pp. 402-409
L. De-Maeztu, Dept. of Electr. & Electron. Eng., Public Univ. of Navarre, Pamplona, Spain
A. Villanueva, Dept. of Electr. & Electron. Eng., Public Univ. of Navarre, Pamplona, Spain
R. Cabeza, Dept. of Electr. & Electron. Eng., Public Univ. of Navarre, Pamplona, Spain
pp. 410-416
Usage of this product signifies your acceptance of the Terms of Use.