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IEEE Transactions on Pattern Analysis and Machine Intelligence
January 2009 (vol. 31 no. 1)
ISSN: 0162-8828
Table of Contents
Editorials
Regular Papers
Hui Zhang, United International College, P.R. China
Kwan-Yee K. Wong, The University of Hong Kong, Hong Kong
pp. 5-14
Irina Popovici, United States Naval Academy, Annapolis
William Douglas Withers, United States Naval Academy, Annapolis
pp. 15-26
Mun Wai Lee, ObjectVideo Inc., Reston
Ramakant Nevatia, University of Southern California, Los Angeles
pp. 27-38
Zhihong Zeng, University of Illinois at Urbana-Champaign, Urbana
Maja Pantic, Imperial College London, London and the University of Twente, Netherlands
Glenn I. Roisman, University of Illinois at Urbana-Champaign, Urbana
Thomas S. Huang, University of Illinois at Urbana-Champaign, Urbana
pp. 39-58
Feng Han, University of California, Los Angeles, Los Angeles
Song-Chun Zhu, University of California, Los Angeles University of California, Los Angeles, Los Angeles Los Angeles
pp. 59-73
Pekka Marttinen, University of Helsinki, Helsinki
Jing Tang, University of Helsinki, Helsinki
Bernard De Baets, Ghent University, Ghent
Peter Dawyndt, Ghent University, Ghent
Jukka Corander, Abo Akademi University, Fanriksgatan
pp. 74-85
Dongfang Zhao, Information, Distribution & Marketing, Inc., Atlanta
Li Yang, Western Michigan University, Kalamazoo
pp. 86-98
Maxime Taron, Éole Centrale de Paris and CERTIS, France
Nikos Paragios, Éole Centrale de Paris and INRIA, France
Marie-Pierre Jolly, Siemens Corporate Research, Princeton
pp. 99-113
Federico Tombari, University of Bologna, Bologna
Stefano Mattoccia, University of Bologna, Bologna
Luigi Di Stefano, University of Bologna, Bologna
pp. 129-141
Iasonas Kokkinos, Ecole Centrale Paris, France
Georgios Evangelopoulos, National Technical University of Athens, Athens
Petros Maragos, National Technical University of Athens, Athens
pp. 142-157
Short Papers
Radu Horaud, INRIA Grenoble-Rhone-Alpes, Montbonnot Saint-Martin
Matti Niskanen, University of Oulu, Oulu
Guillaume Dewaele, INRIA Grenoble-Rhone-Alpes, Montbonnot Saint-Martin
Edmond Boyer, INRIA Grenoble-Rhone-Alpes, Montbonnot Saint-Martin
pp. 158-163
Ido Leichter, Technion - Israel Institute of Technology, Haifa
Michael Lindenbaum, Technion - Israel Institute of Technology, Haifa
Ehud Rivlin, Technion - Israel Institute of Technology, Haifa
pp. 164-171
Hui Chen, University of California, Riverside
Bir Bhanu, University of California, Riverside
pp. 172-179
Chunjing Xu, The Chinese University of Hong Kong, Hong Kong
Jianzhuang Liu, The Chinese University of Hong Kong, Hong Kong
Xiaoou Tang, The Chinese University of Hong Kong, Hong Kong
pp. 180-186
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