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IEEE Transactions on Mobile Computing
PrePrints
ISSN: 1536-1233
Table of Contents
Papers
Bow-Nan Cheng, MIT Lincoln Laboratory, Lexington
Randy Charland, MIT Lincoln Laboratory, Lexington
Paul Christensen, MIT Lincoln Laboratory, Lexington
Leonid Veytser, MIT Lincoln Laboratory, Lexington
James Wheeler, MIT Lincoln Laboratory, Lexington
pp. 1
Yohan Chon, Yonsei University, Seoul
Elmurod Talipov, Yonsei University, Seoul
Hyojeong Shin, Yonsei University, Seoul
Hojung Cha, Yonsei University, Seoul
pp. 1
Xuejun Zhuo, Tsinghua University, Beijing
Wei Gao, The Pennsylvania State University, University Park
Guohong Cao, The Pennsylvania State University, University Park
Sha Hua, Qualcomm Corporate R&D, San Diego
pp. 1
Trinh Minh Tri Do, Idiap Research Institute, Martigny
Daniel Gatica-Perez, Idiap Research Institute, Martigny and Ecole Polytechnique Federale de Lausanne (EPFL), Switzerland
pp. 1
Ian A. Kash, Microsoft Research Cambridge, Cambridge
Rohan Murty, Harvard University, Cambridge
David C. Parkes, Harvard University, 02138
pp. 1
Yi Ren, University of Agder, Grimstad
Vladimir I. Zadorozhny, University of Pittsburgh, Pittsburgh
Vladimir A. Oleshchuk, University of Agder, Grimstad
Frank Y. Li, University of Agder, Grimstad
pp. 1
Dola Saha, University of Colorado Boulder, Boulder
Aveek Dutta, University of Colorado Boulder, Boulder
Dirk Grunwald, University of Colorado Boulder, Boulder
Douglas Sicker, University of Colorado Boulder, Boulder
pp. 1
Veeramani Mahendran, Indian Institute of Technology Madras, Chennai
Rajkishan Gunasekaran, Indian Institute of Technology Madras, Chennai
C. Siva Ram Murthy, Indian Institute of Technology Madras, Chennai
pp. 1
Shouling Ji, Georgia State University, Atlanta and Georgia Institute of Technology, Atlanta
Raheem Beyah, Georgia Institute of Technology, Atlanta
Zhipeng Cai, Georgia State University, Atlanta
pp. 1
Changqiao Xu, Beijing University of Posts and Telecommunications, Beijing and Beijing University of Posts and Telecommunications, Wuxi
Tianjiao Liu, Beijing University of Posts and Telecommunications, Beijing
Jianfen Guan, Beijing University of Posts and Telecommunications, Beijing
Hongke Zhang, Beijing University of Posts and Telecommunications, Beijing and Beijing Jiaotong University, Beijing
Gabriel-Miro Muntean, Dublin City University, Dublin
pp. 1
Fung Po Tso, University of Glasgow, Glasgow
Lin Cui, City University of Hong Kong, Hong Kong
Lizhuo Zhang, City University of Hong Kong, Hong Kong
Weijia Jia, City University of Hong Kong, Hong Kong
Di Yao, City University of Hong Kong, Hong Kong
Jin Teng, The Ohio State University, Columbus
Dong Xuan, Ohio State University, Columbus
pp. 1
Ngoc Minh Do, University of California, Irvine, Irvine
Cheng-Hsin Hsu, National Tsing Hua University, Hsin Chu
Nalini Venkatasubramanian, University of California, Irvine , Irvine
pp. 1
Fung Po Tso, University of Glasgow, Glasgow
Lin Cui, City University of Hong Kong, Hong Kong
Lizhuo Zhang, City University of Hong Kong, Hong Kong
Weijia Jia, City University of Hong Kong, Hong Kong
Yao Di, City University of Hong Kong, Hong Kong
Jin Teng, The Ohio State University, Columbus
Dong Xuan, The Ohio State University, Columbus
pp. 1
Dan J. Dechene, IBM Semiconductor Research and Development Center, Hopewell Junction
Abdallah Shami, The University of Western Ontario, London
pp. 1
Yu Zhang, University of Arizona, Tucson
Loukas Lazos, University of Arizona, Tucson
William Kozma, University of Arizona, Tucson
pp. 1
Sokol Kosta, Sapienza University of Rome, Rome
Alessandro Mei, Sapienza University of Rome, Rome
Julinda Stefa, Sapienza University of Rome, Rome
pp. 1
Po-Hsuan Tseng, National Taipei University of Technology, Taipei
Zhi Ding, University of California, Davis, Davis
Kai-Ten Feng, National Chiao Tung University, Hsinchu
pp. 1
Javad Vazifehdan, Delft University of Technology, Delft
R. Venkatesha Prasad, Delft University of Technology, Delft
Ignas Niemegeers, Delft University of Technology, Delft
pp. 1
Evangelos B. Mazomenos, University of Southampton, Southampton
Jeffrey S. Reeve, University of Southampton, Southampton
Neil M. White, University of Southampton, Southampton
Andrew D. Brown, University of Southampton, Southampton
pp. 1
Yufei Wang, Hong Kong Polytechnic University, Hong Kong
Qixin Wang, Hong Kong Polytechnic University, Hong Kong
Guanbo Zheng, University of Houston, Houston
Zheng Zeng, University of Illinois at Urbana-Champaign
Rong Zheng, University of Houston, Houston
Qian Zhang, Hong Kong University of Science and Technology, Hong Kong
pp. 1
Shu Liu, University of Notre Dame, Notre Dame
Yingxin Jiang, University of Notre Dame, Notre Dame
Aaron Striegel, University of Notre Dame, Notre Dame
pp. 1
Pedro H. J. Nardelli, University of Oulu, Finland and University of Campinas, Brazil
Marios Kountouris, SUPELEC, France
Paulo Cardieri, University of Campinas, Brazil
Matti Latva-aho, University of Oulu, Finland
pp. 1
Yu Xiao, Aalto University, Finland
Yong Cui, Tsinghua University, China
Petri Savolainen, Helsinki Institute for Information Technology/University of Helsinki and Aalto University, Finland
Matti Siekkinen, Aalto University, Finland
An Wang, Tsinghua University and Beijing University of Posts and Telecommunications
Liu Yang, Tsinghua University and Beijing JiaoTong University
Antti Yla-Jaaski, Helsinki Institute for Information Technology and Aalto University
Sasu Tarkoma, Helsinki Institute for Information Technology/University of Helsinki and Aalto University, Finland
pp. 1
Pedro Henrique Gomes, University of Southern California
Nelson L. S. da Fonseca, University of Campinas, Brazil
Omar C. Branquinho, Pontifical Catholic University of Campinas, Brazil
pp. 1
Ozgur Yurur, University of South Florida, Tampa
Miguel Labrador, University of South Florida, Tampa
Wilfrido Moreno, University of South Florida, Tampa
pp. 1
Yi Song, University of North Carolina at Charlotte, Charlotte
Jiang (Linda) Xie, University of North Carolina at Charlotte, Charlotte
Xudong Wang, University of Michigan-Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai
pp. 1
Hyewon Lee, Seoul National University, Seoul
Seongho Byeon, Seoul National University, Seoul
Byoungjin Kim, SK Telecom, Seongnam
Kwang Bok Lee, Seoul National University, Seoul
Sunghyun Choi, Seoul National University, Seoul
pp. 1
Apostolos Destounis, Alcatel-Lucent Bell Labs France, Nozay
Mohamad Assaad, SUPÉLEC, Gif-sur-Yvette
Merouane Debbah, SUPÉLEC, Gif-sur-Yvette
Bessem Sayadi, Alcatel-Lucent Bell Labs France, Nozay
Afef Feki, Alcatel-Lucent Bell Labs France, Nozay
pp. 1
Sahin Cem Geyik, Rensselaer Polytechnic Institute, Troy
Eyuphan Bulut, Rensselaer Polytechnic Institute, Troy
Boleslaw K. Szymanski, Rensselaer Polytechnic Institute, Troy
pp. 1
Roee Diamant, The University of British Columbia, Vancouver
Hwee-Pink Tan, Institute for Infocomm Research, Singapore
Lutz Lampe, The University of British Columbia, Vancouver
pp. 1
Shan-Hung Wu, National Tsing Hua University, Hsinchua and Telcordia Technologies, Piscataway
Jang-Ping Sheu, National Tsing Hua University, Hsinchu
Chung-Ta King, National Tsing Hua Univeristy, Hsinchu
pp. 1
Francesco Pantisano, University of Oulu, Oulu and University of Bologna, Bologna
Mehdi Bennis, University of Oulu, Oulu
Walid Saad, University of Oulu, Oulu and University of Miami, Coral Gables
Merouane Debbah, Supelec, Gif-sur-Yvette
Matti Latva-aho, University of Oulu, Oulu
pp. 1
Zongpeng Li, University of Calgary, Calgary
Baochun Li, University of Toronto, Toronto
Yuefei Zhu, University of Toronto, Toronto
pp. 1
Ivan Wang-Hei Ho, The Hong Kong Polytechnic University, Hong Kong
Patrick P. Lam, P2 Mobile Technologies Limited, Hong Kong
Peter Han Joo Chong, Nanyang Technological University, Singapore
Soung Chang Liew, The Chinese University of Hong Kong, Hong Kong
pp. 1
Yong Li, Tsinghua University, Beijing
Pan Hui, Deutsche Telekom Laboratories, Berlin
Depeng Jin, Tsinghua University, Beijing
Li Su, Tsinghua University, Beijing
Lieguang Zeng, Tsinghua University, Beijing
pp. 1
Ahmad Rahmati, Broadcom Corporation, Sunnyvale
Clayton Shepard, Rice University, Houston
Chad Tossell, USAF Research Laboratory, Wright-Patterson Air Force Base, OH
Lin Zhong, Rice University, Houston
Philip Kortum, Rice University, Houston
Angela Nicoara, Deutsche Telekom Silicon Valley Innovation Center, Mountain View
Jatinder Singh, Stanford University, Stanford
pp. 1
Yin Chen, Qualcomm Research Silicon Valley
Dimitrios Lymberopoulos, Microsoft, Redmond
Jie Liu, Microsoft, Redmond
Bodhi Priyantha, Microsoft, Redmond
pp. 1
Qingsi Wang, University of Michigan, Ann Arbor
Mingyan Liu, University of Michigan, Ann Arbor
pp. 1
Yong Li, Tsinghua University, Beijing
Mengjong Qian, Tsinghua University, Beijing
Depeng Jin, Tsinghua University, Beijing
Pan Hui, The Hong Kong University of Science and Technology, Hong Kong and also with Telekom Innovation Laboratories, Berlin
Zhaocheng Wang, Tsinghua University, Beijing
Sheng Chen, University of Southampton, Southampton and King Abdulaziz University, Saudi Arabia
pp. 1
Jun Liu, university of connecticut, storrs
zhaohui wang, University of Connecticut, Storrs
Michael Zuba, University of Connecticut, Storrs
Zheng Peng, University of Connecticut, Storrs
Jun-Hong Cui, University of Connecticut, Storrs
Shengli zhou, University of Connecticut, Storrs
pp. 1
Zaixin Lu, University of Texas at Dallas, Richardson
Yan Shi, University of Wisconsin - Platteville, Platteville
Weili Wu, University of Texas at Dallas, Richardson
Bin Fu, University of Texas - Pan American, Edinburg
pp. 1
Sandesh Uppoor, INSA Lyon and INRIA, Lyon
Oscar Trullols-Cruces, Universitat Politècnica de Catalunya, Barcelona
Marco Fiore, INSA Lyon and INRIA
Jose M. Barcelo-Ordinas, Universitat Politècnica de Catalunya, Barcelona
pp. 1
Stephan Sigg, National Institute of Informatics, Tokyo
Markus Scholz, Karlsruhe Institute of Technology, Karlsruhe
Shuyu Shi, National Institute of Informatics, Tokyo
Yusheng Ji, National Institute of Informatics, Tokyo
Michael Beigl, Karlsruhe Institute of Technology, Karlsruhe
pp. 1
Huy Nguyen, University of Houston, Houston
Gabriel Scalosub, Ben-Gurion University of the Negev, Beer Sheva
Rong Zheng, University of Houston, Houston
pp. 1
Jinbei Zhang, Shanghai Jiao Tong University, Shanghai and Xidian University, Xi'an
Xinbing Wang, Shanghai Jiaotong University, Shanghai and Southeast University, Nanjing
Xiaohua Tian, Shanghai Jiao Tong University, Shanghai
Yun Wang, Shanghai Jiaotong University, Shanghai
Xiaoyu Chu, Shanghai Jiaotong University, Shanghai
Yu Cheng, Illinois Institute of Technology, Chicago
pp. 1
Young-Hoon Park, Cloud Solution Team of DMC R&D Center in Samsung Electronics
Dong-Hyun Je, Telecommunication-Systems Business in Samsung Electronics
Min-Ho Park, Soongsil University, Seoul
Seung-Woo Seo, Seoul National University, Seoul
pp. 1
Yun Han Bae, Sangmyung University, Seoul
Bong Dae Choi, Sungkyunkwan University, Suwon
Attahiru S. Alfa, University of Manitoba, Winnipeg
pp. 1
Giusy Alfano, Politecnico di Torino, Torino
Michele Garetto, Università di Torino, Torino
Emilio Leonardi, Politecnico di Torino, Torino
pp. 1
Hengchang Liu, UIUC, Champaign
Zhiheng Xie, University of Virginia, Charlottesville
Jingyuan Li, University of Virginia, Charlottesville
Shan Lin, Temple University, Philadelphia
David Siu, OCEANIT Inc., Honolulu
Pan Hui, Deutsche Telekom Research Lab, Berlin
Kamin Whitehouse, University of Virginia, Charlottesville
John A. Stankovic, University of Virginia, Charlottesville
pp. 1
Tian Hao, Michigan State University, East Lansing
Ruogu Zhou, Michigan State University, East Lansing
Guoliang Xing, Michigan State University, East Lansing
Matt W. Mutka, Michigan State University, East Lansing
Jiming Chen, Zhejiang University, Hangzhou
pp. 1
Tarun Bansal, Ohio State University, Columbus
Dong Li, Ohio State University, Columbus
Prasun Sinha, Ohio State University, Columbus
pp. 1
Jin Tang, Illinois Institute of Technology, Chicago
Yu Cheng, Illinois Institute of Technology, Chicago
Weihua Zhuang, University of Waterloo, Waterloo
pp. 1
Xinfeng Li, The Ohio State University, Columbus
Jin Teng, The Ohio State University, Columbus
Boying Zhang, The Ohio State University The Ohio State University, Columbus Columbus
Adam Champion, The Ohio State University, Columbus
Dong Xuan, Ohio State University, Columbus
pp. 1
Wei Gao, University of Tennessee, Knoxville
Guohong Cao, Pennsylvania State University, University Park
Arun Iyengar, IBM T.J. Watson Research Center, Hawthorne
Mudhakar Srivatsa, IBM T.J. Watson Research Center, Hawthorne
pp. 1
Wei-Liang Shen, Academia Sinica, Taipei
Chung-Shiuan Chen, Academia Sinica, Taipei
Kate Ching-Ju Lin, Academia Sinica, Taipei
Kien Hua, University of Central Florida, Orlando
pp. 1
Shuqin Li, Alcatel-Lucent Shanghai Bell Co., Ltd., Shanghai
Jianwei Huang, The Chinese University of Hong Kong, Hong Kong
Shuo-Yen Robert Li, The Chinese University of Hong Kong, Hong Kong
pp. 1
Gianpiero Costantino, Istituto di Informatica e Telematica del CNR, Pisa
Fabio Martinelli, Istituto di Informatica e Telematica del CNR, Pisa
Paolo Santi, Istituto di Informatica e Telematica del CNR, Pisa
pp. 1
Kameswari Chebrolu, Indian Institute of Technology, Bombay
Ashutosh Dhekne, Indian Institute of Technology, Bombay
pp. 1
Veljko Pejovic, University of Birmingham, UK and University of California, Santa Barbara.
Elizabeth M. Belding, University of California, Santa Barbara
pp. 1
Yu Wang, Michigan State University, East Lansing
Rui Tan, Michigan State University, East Lansing
Guoliang Xing, Michigan State University, East Lansing
Jianxun Wang, Michigan State University, East Lansing
Xiaobo Tan, Michigan State University, East Lansing
pp. 1
M.R. Basheer, Missouri University of Science and Technology Mohammed Rana Basheer, Rolla Newport Beach
S. Jagannathan, Missouri University of Science and Technology, Rolla
pp. 1
Qinglin Zhao, Macau University of Science and Technology, Macau
Danny H.K. Tsang, Hong Kong University of Science and Technology, Hong Kong
Taka Sakurai, The University of Melbourne, Melbourne
pp. 1
Guey-Yun Chang, National Central University, Jhongli
Wen-Hung Teng, National central university, Jhongli
Hao-Yu Chen, National Central University, Jhongli
Jang-Ping Sheu, National Tsing Hua University, Hsinchu
pp. 1
Kaishun Wu, Hong Kong University of Science and Technology, Hong Kong
Haochao Li, Hong Kong University of Science and Technology, Hong Kong
Lu Wang, Hong Kong University of Science and Technology, Hong Kong
Youwen Yi, Hong Kong University of Science and Technology, Hong Kong
Yunhuai Liu, Third Research Institute of Ministry of Public Security, Shanghai
Dihu Chen, Sun Yat-sen University, Guangzhou
Xiaonan Luo, Sun Yat-sen University, Guangzhou
Qian Zhang, Hong Kong University of Science and Technology, Hong Kong
Lionel M. Ni, Hong Kong University of Science and Technology, Hong Kong
pp. 1
Krishna P. N. Puttaswamy, Bell Labs, Alcatel-Lucent, Holmdel
Shiyuan Wang, University of California, Santa Barbara, Santa Barbara
Troy Steinbauer, University of California, Santa Barbara, Santa Barbara
Divyakant Agrawal, University of California, Santa Barbara, Santa Barbara
Amr El Abbadi, University of California, Santa Barbara, Santa Barbara
Christopher Kruegel, University of California, Santa Barbara, Santa Barbara
Ben Y. Zhao, University of California, Santa Barbara, Santa Barbara
pp. 1
Keren Tan, Dartmouth College, Hanover
Chris McDonald, The University of Western Australia, Perth
Bennet Vance, Dartmouth College, Hanover
Chrisil Arackaparambil, Dartmouth College, Hanover
Sergey Bratus, Dartmouth College, Hnaover
David Kotz, Dartmouth College, Hanover
pp. 1
Liang He, Singapore University of Technology and Design, Singapore
Zhe Yang, University of Victoria, Victoria
Jianping Pan, University of Victoria, Victoria
Lin Cai, University of Victoria, Victoria
Jingdong Xu, Nankai University, Tianjin
Yu Gu, Singapore University of Technology and Design, Singapore
pp. 1
Longxiang Gao, Deakin University, Burwood
Ming Li, Deakin University, Burwood
Alessio Bonti, Deakin University, Burwood
Wanlei Zhou, Deakin University, Burwood
Shui Yu, Deakin University, Burwood
pp. 1
Manuel Fogue, University of Zaragoza, Teruel
Piedad Garrido, University of Zaragoza, Teruel
Francisco J. Martinez, University of Zaragoza, Teruel
Juan-Carlos Cano, Universitat Politècnica de València, València
Carlos T. Calafate, Universitat Politècnica de València, València
Pietro Manzoni, Universitat Politècnica de València, València
pp. 1
Lingjie Duan, Singapore University of Technology and Design, Singapore
Jianwei Huang, The Chinese University of Hong Kong, Hong Kong
Biying Shou, City University of Hong Kong, Hong Kong
pp. 1
Yanmin Zhu, Shanghai Jiao Tong University, Shanghai
Zhi Li, Shanghai Jiao Tong University, Shanghai
Hongzi Zhu, Shanghai Jiao Tong University, Shanghai
Minglu Li, Shanghai Jiao Tong University, Shanghai
Qian Zhang, Hong Kong University of Science and Technology, Hong Kong
pp. 1
Chetna Singhal, Indian Institute of Technology, Delhi, New Delhi
Satish Kumar, Qualcomm India Pvt. Ltd., Hyderabad
Swades De, Indian Institute of Technology, Delhi, New Delhi
Nitin Panwar, Cisco Systems, Bangalore
Ravindra Tonde, Samsung India Software Center, Noida
Pradipta De, IBM-India Research Lab, New Delhi
pp. 1
Basel Alomair, Computer Research Institute (CRI), King Abdulaziz City for Science and Technology (KACST), Saudi Arabia
Radha Poovendran, University of Washington, Seattle
pp. 1
Vishal Sevani, Indian Institute of Technology Bombay, Mumbai
Bhaskaran Raman, Indian Institute of Technology Bombay, Mumbai
Piyush Joshi, Indian Institute of Technology Bombay, Mumbai
pp. 1
Kai Hong, Stevens Institute of Technology, Hoboken
Shamik Sengupta, City University of New York, New York
R. Chandramouli, Stevens Institute of Technology, Hoboken
pp. 1
Yue Zhao, Southwest Jiaotong University, Chengdu
Xuming Fang, Southwest Jiaotong University, Chengdu
Rongsheng Huang, University of Florida, Gainesville
Yuguang Fang, University of Florida, Gainesville and Xidian University, Xian
pp. 1
Xiaohua Xu, Illinois Institute of Technology Xiaohua Xu, Chicago
Xiang-Yang Li, Illinois Institute of Technology, Chicago
Peng-Jun Wan, Illinois Institute of Technology, Chicago
pp. 1
Amir Nakib, Université Paris Est Créteil, Créteil
Boubaker Daachi, Université Paris Est Créteil, Créteil
Mustapha Dakkak, Université Paris Est Créteil, Créteil
Patrick Siarry, Université Paris Est Créteil, Créteil
pp. 1
Chengzhi Li, Broadcom Corporation, Matawan
Huaiyu Dai, North Carolina State University, Raleigh
pp. 1
Suong H. Nguyen, Swinburne University of Technology, Hawthorn
Hai L. Vu, Swinburne University of Technology, Hawthorn
Lachlan L.H. Andrew, Swinburne University of Technology, Hawthorn
pp. 1
Fengyuan Ren, Tsinghua University, Beijing
Yinsheng Xu, Tsinghua University, Beijing
Hongkun Yang, The University of Texas at Austin, Austin
Jiao Zhang, Tsinghua University, Beijing
Chuang Lin, Tsinghua University, Beijing
pp. 1
Chuan Qin, University of South Carolina, Columbia
Xuan Bao, Duke University, Durham
Romit Roy Choudhury, Duke University, Durham
Srihari Nelakuditi, University of South Carolina, Columbia
pp. 1
Alireza Keshavarz-Haddad, Shiraz University, Shiraz
Rudolf Riedi, Fribourg University of Applied Science of Western Switzerland
pp. 1
Santosh Nannuru, McGill University, Montreal
Yunpeng Li, Beijing University of Posts and Telecommunications, Beijing
Yan Zeng, Beijing University of Posts and Telecommunications, Beijing
Mark Coates, McGill University, Montreal
Bo Yang, Beijing University of Posts and Telecommunications, Beijing
pp. 1
Amir Aminzadeh Gohari, University of California, Santa Barbara, Santa Barbara
Volkan Rodoplu, University of California, Santa Barbara, Santa Barbara
pp. 1
Yuan-Cheng Lai, National Taiwan University of Science and Technology, Taipei
Ling-Yen Hsiao, Natioanl Taiwan University of Science and Technology, Taipei
Hong-Jie Chen, National Taiwan University of Science and Technology, Taipei
Ching-Neng Lai, Hsing Wu Institute of Technology, New Taipei
Jian-Wei Lin, Chien Hsin University of Science and Technology, Taoyuan
pp. 1-1
Xianfu Chen, VTT Technical Research Centre of Finland, Oulu
Zhifeng Zhao, Zhejiang University, Hangzhou
Honggang Zhang, Zhejiang University, Hangzhou
pp. 1-1
Panayiotis Kolios, King's College London, London
Vasilis Friderikos, King's College, London, London
Katerina Papadaki, London School of Economics, London
pp. 1
Xinwen Zhang, Huawei Research Center, Santa Clara
Jean-Pierre Seifert, Deutsche Telekom Laboratories and Technical University of Berlin, Berlin
Onur Aciicmez, Samsung Information Systems America, San Jose
pp. 1
Sahar Hoteit, University Pierre and Marie Curie, Paris and Massachusetts Institute of Technology, Cambridge
Stefano Secci, University Pierre and Marie Curie, Paris
Rami Langar, University Pierre and Marie Curie, Paris
Guy Pujolle, University Pierre and Marie Curie, Paris, and Pohang University of Science and Technology, Pohang
pp. 1-1
Zhongli Liu, University of Massachusetts Lowell, Lowell
Yinjie Chen, University of Massachusetts Lowell, Lowell
Benyuan Liu, University of Massachusetts Lowell, Lowell
Chengyu Cao, University of Connecticut, Storrs
Xinwen Fu, University of Massachusetts Lowell, Lowell
pp. 1
Henrique Moniz, Microsoft Research, Cambridge
Nuno F. Neves, University of Lisboa, Lisboa
Miguel Correia, Instituto Superior Tecnico, Lisboa
pp. 1
Anthea Wain Sy Au, University of Toronto, Toronto
Chen Feng, University of Toronto, Toronto and Beijing Jiaotong University, Beijing
Shahrokh Valaee, University of Toronto, Toronto
Sophia Reyes, University of Toronto, Toronto
Sameh Sorour, University of Toronto, Toronto
Samuel N. Markowitz, University of Toronto, Toronto
Deborah Gold, The Canadian National Institute for the Blind, Toronto
Keith Gordon, The Canadian National Institute for the Blind, Toronto
Moshe Eizenman, University of Toronto, Toronto
pp. 1-1
Canming Jiang, Virginia Polytechnic Institute and State University, Blacksburg
Yi Shi, Virginia Polytechnic Institute and State University, Blacksburg
Sastry Kompella, U.S. Naval Research Laboratory, Washington DC
Y. Thomas Hou, Virginia Tech, Blacksburg
Scott F. Midkiff, Virginia Polytechnic Institute and State University, Blacksburg
Gildas Avoine, Universite catholique de Louvain, Louvain-la-Neuve
Muhammed Ali Bingol, Tubitak Bilgem Uekae, Kocaeli
Xavier Carpent, Universite catholique de Louvain, Louvain-la-Neuve
Siddika Berna Ors Yalcin, Istanbul Technical University, Istanbul
pp. 1-1
Andrea Passarella, Institute for Informatics and Telematics of the National Research Council, Pisa
Marco Conti, Institute for Informatics and Telematics of the National Research Council, Pisa
pp. 1
Zhipeng Yang, University of Louisiana at Lafayette, Lafayette
Ting Ning, University of Louisiana at Lafayette, Lafayette
Hongyi Wu, University of Louisiana at Lafayette, Lafayette
pp. 1-1
Wei Wang, University of Toronto, Toronto
Ben Liang, University of Toronto, Toronto
Baochun Li, University of Toronto, Toronto
pp. 1
Md Yusuf Sarwar Uddin, University of Illinois at Urbana-Champaign, Urbana
Hossein Ahmadi, University of Illinois at Urbana-Champaign, Urbana
Tarek Abdelzaher, University of Illinois at Urbana-Champaign, Urbana
Robin Kravets, University of Illinois at Urbana-Champaign, Urbana
pp. 1-1
Dileep Kalathil, University of Southern California, Los Angeles
Rahul Jain, University of Southern California, Los Angeles
pp. 1-1
Kyu-Han Kim, Hewlett-Packard Laboratories, Palo Alto
Kang G. Shin, University of Michigan, Ann Arbor
Dragos Niculescu, University Politehnica of Bucharest, Bucharest
pp. 1-1
Shibo He, Zhejiang University, Hangzhou
Jiming Chen, Zhejiang University, Hangzhou
Fachang Jiang, Zhejiang University, Hangzhou
David K.Y. Yau, Purdue University, West Lafayette
Guoliang Xing, Michigan State University, East Lansing
Youxian Sun, Zhejiang University, Hangzhou
pp. 1
Web Extra: View Supplement Material (PDF)
Kang G. Shin, University of Michigan, Ann Arbor
Chansu Yu, Cleveland State University, Cleveland and POSTECH, Pohang
Jeong-Yoon Lee, POSTECH, Pohang
Young-Joo Suh, POSTECH, Pohang
pp. 1-1
Xi Fang, Arizona State University, Tempe
Dejun Yang, Arizona State University, Tempe
Guoliang Xue, Arizona State University, Tempe
pp. 1-1
Alex Leith, Iowa State University, Ames
Slim Alouini, KAUST, Saudi Arabia
Dong In Kim, Sungkyunkwan University, Suwon
Xuemin (Sherman) Shen, University of Waterloo, Waterloo
Zhiqiang Wu, Wright State University, Dayton
pp. 1-1
Zhixue Lu, The Ohio State University, Columbus
Tarun Bansal, The Ohio State University, Columbus
Prasun Sinha, The Ohio State University, Columbus
pp. 1-1
YoungSang Yun, University of Florida, Gainesville
Ye Xia, University of Florida, Gainesville
Behnam Behdani, University of Florida, Gainesville
J. Cole Smith, University of Florida, Gainesville
Maria Gorlatova, Columbia University, New York
Aya Wallwater, Columbia University, New York
Gil Zussman, Columbia University, New York
pp. 1-1
Web Extra: Viiew Supplemental Material (PDF)
Goutam K. Audhya, BSNL, Kolkata
Koushik Sinha, Hewlett Packard Labs, Bangalore
Kalikinkar Mandal, University of Waterloo, Waterloo
Rana Dattagupta, Jadavpur University, Kolkata
Sasthi C. Ghosh, Indian Statistical Institute, Kolkata
Bhabani P. Sinha, Indian Statistical Institute, Kolkata
pp. 1-1
Yunchuan Wei, Beijing Institute of Technology, Beijing
Kai Zeng, University of Michigan at Dearborn, Dearborn
Prasant Mohapatra, University of California at Davis, Davis
Mohamed M. Atia, Queen's University, Kingston
Aboelmagd Noureldin, Royal Military College of Canada, Kingston
Michael J. Korenberg, Queen's University, Kingston
Xu Chen, The Chinese University of Hong Kong, Hong Kong
Jianwei Huang, The Chinese University of Hong Kong, Hong Kong
Husheng Li, The University of Tennessee Knoxville, Knoxville
pp. 1-1
Hassan Aboubakr Omar, University of Waterloo, Waterloo
Weihua Zhuang, University of Waterloo, Waterloo
Li Li, Communications Research Centre, Ottawa
Markus Fiedler, Blekinge Institute of Technology, Karlskrona
Katarzyna Wac, University of Geneva, Geneva
Richard Bults, MobiHealth BV, Enschede
Patrik Arlos, Blekinge Institute of Technology, Karlskrona
Shaohe Lv, National University of Defense Technology, Changsha
Weihua Zhuang, University of Waterloo, Waterloo
Ming Xu, National University of Defense Technology, Changsha
Xiaodong Wang, National University of Defense Technology, Changsha
Chi Liu, National University of Defense Technology, Changsha
Xingming Zhou, National University of Defense Technology, Changsha
Kai-Ten Feng, National Chiao Tung University, Hsinchu
Jia-Shi Lin, National Chiao Tung University, Hsinchu
Wei-Neng Lei, National Chiao Tung University, Hsinchu
Aldo Cassola, Northeastern University, Boston
Tao Jin, Northeastern University, Boston
Guevara Noubir, Northeastern University, Boston
Bishal Thapa, Northeastern University, Boston
Min-Ho Park, Carnegie Mellon University, Pittsburgh
Young-Hoon Park, Seoul National University, Seoul
Han-You Jeong, Pusan National University, Pusan
Seung-Woo Seo, Seoul National University, Seoul
Zhou Yuan, University of Houston, Houston
Zhu Han, University of Houston, Houston and Kyung Hee University, Yongin
Yan Lindsay Sun, University of Rhode Island, Kingston
Husheng Li, University of Tennessee, Knoxville
Ju Bin Song, Kyung Hee University, Yongin
pp. 1-1
Jonathan Lutz, Arizona State University, Tempe
Charles J. Colbourn, Arizona State University, Tempe
Violet R. Syrotiuk, Arizona State University, Tempe
Huai-Lei Fu, National Taiwan University, Taipei
Phone Lin, National Taiwan University, Taipei
Yi-Bing Lin, National Chiao Tung University, Hsinchu
Sriram Lakshmanan, Georgia Institute of Technology, Atlanta
Cheng-lin Tsao, Georgia Institute of Technology, Atlanta
Raghupathy Sivakumar, Georgia Institute of Technology, Atlanta
Dan Xu, University of California, Davis, Davis
Xin Liu, University of California, Davis, Davis
Zhu Han, University of Houston, Houston
Lei Yang, Google, Mountain View
Robert P. Dick, University of Michigan, Ann Arbor
Gokhan Memik, Northwestern University, Evanston
Peter Dinda, Northwestern University, Evanston
Lin Dai, City University of Hong Kong, Hong Kong
Xinghua Sun, City University of Hong Kong, Hong Kong
Przemyslaw Pawelczak, Heinrich Hertz Institute, Berlin
Shaunak Joshi, Cisco Systems, Inc, San Jose
Sateesh Addepalli, Cisco Systems, Inc, San Jose
John Villasenor, University of California, Los Angeles, Los Angeles
Danijela Cabric, University of California, Los Angeles, Los Angeles
Hiroshi Saito, NTT Service Integration Laboratories, Musashino-Shi
Daisei Uchida, NTT Access System Laboratories, Yokosuka
Jihoon Park, University of California, Los Angeles, Los Angeles
Przemyslaw Pawełczak, University of California, Los Angeles, Los Angeles
Danijela Čabrić, University of California, Los Angeles, Los Angeles
Yu Zhang, Rutgers University, North Brunswick
Zhibin Wu, Rutgers University, North Brunswick
Wade Trappe, Rutgers University, North Brunswick
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