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Practices in Mixed-Signal and RF IC Testing
July/August 2007 (vol. 24 no. 4)
pp. 332-339
| ASCII Text | x | ||
| Salem Abdennadher, Saghir A. Shaikh, "Practices in Mixed-Signal and RF IC Testing," IEEE Design & Test of Computers, vol. 24, no. 4, pp. 332-339, July/August, 2007. | |||
| BibTex | x | ||
| @article{ 10.1109/MDT.2007.143, author = {Salem Abdennadher and Saghir A. Shaikh}, title = {Practices in Mixed-Signal and RF IC Testing}, journal ={IEEE Design & Test of Computers}, volume = {24}, number = {4}, issn = {0740-7475}, year = {2007}, pages = {332-339}, doi = {http://doi.ieeecomputersociety.org/10.1109/MDT.2007.143}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, } | |||
| RefWorks Procite/RefMan/Endnote | x | ||
| TY - MGZN JO - IEEE Design & Test of Computers TI - Practices in Mixed-Signal and RF IC Testing IS - 4 SN - 0740-7475 SP332 EP339 EPD - 332-339 A1 - Salem Abdennadher, A1 - Saghir A. Shaikh, PY - 2007 KW - built-in tests KW - DFT KW - I/O testing KW - SiP testing KW - wireless transceiver testing KW - ATE VL - 24 JA - IEEE Design & Test of Computers ER - | |||
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2007.143
Most mixed-signal and RF IC testing in industry today involves specification-based testing using ATE. However, some companies employ alternative solutions to ATE testing that use DFT and BIST. This article presents a brief overview of common IC industry practices in mixed-signal testing and RF testing with emphasis on wired and wireless transceiver testing. The authors also discuss the testing challenges of system-in-package (SiP) technology, and present a few practiced DFT solutions.
Index Terms:
built-in tests, DFT, I/O testing, SiP testing, wireless transceiver testing, ATE
Citation:
Salem Abdennadher, Saghir A. Shaikh, "Practices in Mixed-Signal and RF IC Testing," IEEE Design & Test of Computers, vol. 24, no. 4, pp. 332-339, July-Aug. 2007, doi:10.1109/MDT.2007.143
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