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An Interconnect Reliability-Driven Routing Technique for Electromigration Failure Avoidance
Sept.-Oct. 2012 (vol. 9 no. 5)
pp. 770-776
ASCII Text
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Xiaodao Chen, Chen Liao, Tongquan Wei, Shiyan Hu, "An Interconnect Reliability-Driven Routing Technique for Electromigration Failure Avoidance," IEEE Transactions on Dependable and Secure Computing, vol. 9, no. 5, pp. 770-776, Sept.-Oct., 2012.
 
 
BibTex
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@article{ 10.1109/TDSC.2010.57,
author = {Xiaodao Chen and Chen Liao and Tongquan Wei and Shiyan Hu},
title = {An Interconnect Reliability-Driven Routing Technique for Electromigration Failure Avoidance},
journal ={IEEE Transactions on Dependable and Secure Computing},
volume = {9},
number = {5},
issn = {1545-5971},
year = {2012},
pages = {770-776},
doi = {http://doi.ieeecomputersociety.org/10.1109/TDSC.2010.57},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - JOUR
JO - IEEE Transactions on Dependable and Secure Computing
TI - An Interconnect Reliability-Driven Routing Technique for Electromigration Failure Avoidance
IS - 5
SN - 1545-5971
SP770
EP776
EPD - 770-776
A1 - Xiaodao Chen,
A1 - Chen Liao,
A1 - Tongquan Wei,
A1 - Shiyan Hu,
PY - 2012
KW - Routing
KW - Wires
KW - Driver circuits
KW - Reliability
KW - Steiner trees
KW - Algorithm design and analysis
KW - Current density
KW - integer linear programming.
KW - VLSI circuit computer-aided design
KW - interconnect reliability
KW - electromigration
KW - Steiner tree construction
VL - 9
JA - IEEE Transactions on Dependable and Secure Computing
ER -
 
Xiaodao Chen, Michigan Technological University, Houghton
Chen Liao, Michigan Technological University, Houghton
Tongquan Wei, East China Normal University, Shanghai
Shiyan Hu, Michigan Technological University, Houghton
As VLSI technology enters the nanoscale regime, design reliability is becoming increasingly important. A major design reliability concern arises from electromigration which refers to the transport of material caused by ion movement in interconnects. Since the lifetime of an interconnect drastically depends on the current flowing through it, the electromigration problem aggravates with increasingly growing thinner wires. Further, the current-density-induced interconnect thermal issue becomes much more severe with larger current. To mitigate the electromigration and the current-density-induced thermal effects, interconnect current density needs to be reduced. Assigning wires to thick metals increases wire volume, and thus, reduces the current density. However, overstretching thick-metal assignment may hurt routability. Thus, it is highly desirable to minimize the thick-metal usage, or total wire cost, subject to the reliability constraint. In this paper, the minimum cost reliability-driven routing, which consists of Steiner tree construction and layer assignment, is considered. The problem is proven to be NP-hard and a highly effective iterative rounding-based integer linear programming algorithm is proposed. In addition, a unified routing technique is proposed to directly handle multiple current levels, which is critical in analog VLSI design. Further, the new algorithm is extended to handle blockage. Our experiments on 450 nets demonstrate that the new algorithm significantly outperforms the state-of-the-art work [CHECK END OF SENTENCE] with up to 14.7 percent wire reduction. In addition, the new algorithm can save 11.4 percent wires over a heuristic algorithm for handling multiple currents.

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Index Terms:
Routing,Wires,Driver circuits,Reliability,Steiner trees,Algorithm design and analysis,Current density,integer linear programming.,VLSI circuit computer-aided design,interconnect reliability,electromigration,Steiner tree construction
Citation:
Xiaodao Chen, Chen Liao, Tongquan Wei, Shiyan Hu, "An Interconnect Reliability-Driven Routing Technique for Electromigration Failure Avoidance," IEEE Transactions on Dependable and Secure Computing, vol. 9, no. 5, pp. 770-776, Sept.-Oct. 2012, doi:10.1109/TDSC.2010.57
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