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A Tiered-Color Illumination Approach for Machine Inspection of Solder Joints
May 1988 (vol. 10 no. 3)
pp. 387-393

An experimental color vision inspection system for the detection of solder joint flaws on printed circuit boards is described. A tiered lighting arrangement is used to generate color contours on the solder joint for the detection and classification of defects including no solder, insufficient or excess solder, poor wetting of component leads or solder pad, and faults due to improper insertion of component leads. Each type of defect gives rise to a characteristic pattern of color contours which are processed using binary image techniques on each color plane of the image. Geometric descriptors measuring the shape of the color contours and the color level intensities of the solder joint images are used to identify each defect class. Statistical distributions are determined for each of the good and defective joint classes, from which a flaw detection and classification tree is derived. The performance of the system was tested on samples of commercially manufactured, wave-soldered circuit boards.

[1] R. Bowlby, "The DIP may take its final bows,"IEEE Spectrum, vol. 22, no. 6, pp. 37-42, June 1985.
[2] R. J. Rowland, "Surface mounting improves productivity,"Assembly Automation, pp. 14-19, Feb. 1984.
[3] R. T. Chin and C. A. Harlow, "Automated visual inspection: A survey,"IEEE Trans. Pattern Anal. Machine Intell., vol. PAMI-4, no. 6, pp. 557-573, Nov. 1982.
[4] J. K. Chou, "Automated inspection of printed circuit board," inSME Vision'85 Conf. Proc., Mar. 1985, pp. 5-20-5-33.
[5] N. Goto and T. Kondo, "An automatic inspection system for printed wiring board masks,"Pattern Recognition, vol. 12, pp. 443-455, 1980.
[6] Y. Hara, N. Akiyama, and K. Karasaki, "Automatic inspection system for printed circuit boards,"IEEE Trans. Pattern Anal. Machine Intell., vol. PAMI-5, no. 6, pp. 623-630, Nov. 1983.
[7] J. F. Jarvis, "A method for automating the visual inspection of printed-circuit boards,"IEEE Trans. Pattern Anal. Machine Intell., vol. PAMI-2, no. 1, pp. 77-82, Jan. 1980.
[8] P. Kaufmann, G. Medioni, and R. Nevatia, "Visual inspection using linear features,"Pattern Recognition, vol. 17, no. 5, pp. 485-491, 1984.
[9] O. Silven, T. Piironen, M. Elsila, and M. Pietikainen, "Performance evaluation of algorithms for visual inspection of printed circuit boards," inSeventh Int. Conf. Pattern Recognition Proc., vol. 2, July/Aug. 1984, pp. 1355-1357.
[10] F. L. Skaggs, "Machine vision system speeds PCB inspection and increases measurement efficiency," inApplying Automated Inspection, Society of Manufacturing Engineers Publications, 1985, pp. 123- 128.
[11] G. A. W. West, "A system for the automatic visual inspection of bare-printed circuit boards,"IEEE Trans. Syst., Man, Cyhern., vol. SMC-14, no. 5, pp. 767-773, Sept./Oct. 1984.
[12] M. A. West, S. M. DeFoster, E. C. Baldwin, and R. A. Ziegler, "Computer-controlled optical testing of high-density printed-circuit boards,"IBM J. Res. Develop., vol. 27, no. 1, pp. 50-58, Jan. 1983.
[13] J. L. C. Sanz and A. K. Jain, "Machine-vision techniques for inspection of printed wiring boards and thick-film circuits,"J. Opt. Soc. Amer./A, vol. 3, no. 9, pp. 1465-1482, Sept. 1986.
[14] A. J. Billota,Connections in Electronic Assemblies. New York: Marcel Dekker, 1985, pp. 1-72.
[15] C. F. Coombs, Jr.,Printed Circuits Handbook. New York: Mc-Graw-Hill, 1967, pp. 11.3-15.25.
[16] C. E. Jowett,Reliable Electronic Assembly Production. London: Business Books Ltd., 1970, pp. 53-84.
[17] H. H. Manko,Solders and Soldering, 2nd ed. New York: McGraw-Hill, 1979.
[18] H. H. Manko,Soldering Handbook for Printed Circuits and Surface Mounting. New York: Van Nostrand Reinhold, 1986.
[19] R. Vanzetti, A. C. Traub, and J. S. Ele, "Hidden solder joint defects detected by laser infrared system," inProc. IPC 24th Annu. Meeting, 1981, pp. 1-15.
[20] M. P. Seah and C. Lea, "Certainty of measurement using an automated infra-red laser inspection instrument for PCB solder joint integrity,"J. Phys., E: Sci. Instrum., vol. 18, pp. 676-682, 1985.
[21] Y. Nakagawa, "Automatic visual inspection of solder joints on printed circuit boards,"Robot Vision, vol. 336, pp. 121-127, 1982.
[22] W. E. McIntosh, "Automating the inspection of printed circuit boards,"Robotics Today, pp. 75-78, June 1983.
[23] P. A. Merrill, "Automatic visual inspection of solder joints," M. Eng. thesis, McGill Univ., Montreal, P.Q., 1984.
[24] P. J. Besl, E. J. Delp, and R. C. Jain, "Automatic visual solder joint inspection,"IEEE J. Robotics Automation, vol. RA-1, pp. 42-56, Mar. 1985.
[25] Panasonic WV-CD120 Solid State Color CCTV Camera Service Manual, Matsushita Engineering and Service Company.
[26] AT&T Image Capture Board Technical Product Descriptions, AT&T Electronic Photography and Imaging Center, 1985.
[27] D. W. Capson, "An improved algorithm for the sequential extraction of boundaries from a raster scan,"Comput. Vision, Graphics, Image Processing, vol. 28, pp. 109-125, 1984.

Index Terms:
PCB inspection; computerised pattern recognition; tiered-color illumination; machine inspection; solder joints; color vision; printed circuit boards; color contours; binary image; flaw detection; colour vision; computer vision; computerised pattern recognition; inspection; printed circuit manufacture; soldering; statistical analysis
Citation:
D.W. Capson, S.K. Eng, "A Tiered-Color Illumination Approach for Machine Inspection of Solder Joints," IEEE Transactions on Pattern Analysis and Machine Intelligence, vol. 10, no. 3, pp. 387-393, May 1988, doi:10.1109/34.3902
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