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Automatic Solder Joint Inspection
January 1988 (vol. 10 no. 1)
pp. 31-43

The task of automating the visual inspection of pin-in-hole solder joints is addressed. Two approaches are explored: statistical pattern recognition and expert systems. An objective dimensionality-reduction method is used to enhance the performance of traditional statistical pattern recognition approaches by decorrelating feature data, generating feature weights, and reducing run-time computations. The expert system uses features in a manner more analogous to the visual clues that a human inspector would rely on for classification. Rules using these cues are developed, and a voting scheme is implemented to accumulate classification evidence incrementally. Both methods compared favorably with human inspector performance.

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Index Terms:
computer vision; automatic joint inspection; PCBs; decorrelation; pin-in-hole solder joints; statistical pattern recognition; expert systems; objective dimensionality-reduction method; feature data; feature weights; voting scheme; classification evidence; computer vision; computerised pattern recognition; electronic engineering computing; expert systems; inspection; printed circuit testing
Citation:
S.L. Bartlett, P.J. Besl, C.L. Cole, R. Jain, D. Mukherjee, K.D. Skifstad, "Automatic Solder Joint Inspection," IEEE Transactions on Pattern Analysis and Machine Intelligence, vol. 10, no. 1, pp. 31-43, Jan. 1988, doi:10.1109/34.3865
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