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Issue No.02 - Feb. (vol.13)
ISSN: 1536-1233
TABLE OF CONTENTS
Kang Chen , Dept. of Electr. & Comput. Eng., Clemson Univ., Clemson, SC, USA
Haiying Shen , Dept. of Electr. & Comput. Eng., Clemson Univ., Clemson, SC, USA
Haibo Zhang , Cerner Corp., Overland Park, KS, USA
pp. 235-249
Xinfeng Li , The Ohio State University, Columbus
Jin Teng , The Ohio State University, Columbus
Boying Zhang , The Ohio State University The Ohio State University, Columbus Columbus
Adam C. Champion , The Ohio State University, Columbus
Dong Xuan , Ohio State University, Columbus
pp. 250-262
Dong Li , Ohio State University, Columbus
Prasun Sinha , Ohio State University , Columbus
pp. 263-273
Ngoc Minh Do , Donald Bren Sch. of Inf. & Comput. Sci., Univ. of California, Irvine, Irvine, CA, USA
Cheng-Hsin Hsu , Dept. of Comput. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Nalini Venkatasubramanian , Donald Bren Sch. of Inf. & Comput. Sci., Univ. of California, Irvine, Irvine, CA, USA
pp. 274-286
Zhongli Liu , Dept. of Comput. Sci., Univ. of Massachusetts Lowell, Lowell, MA, USA
Yinjie Chen , Dept. of Comput. Sci., Univ. of Massachusetts Lowell, Lowell, MA, USA
Benyuan Liu , Dept. of Comput. Sci., Univ. of Massachusetts Lowell, Lowell, MA, USA
Chengyu Cao , Dept. of Mech. Eng., Univ. of Connecticut, Storrs, CT, USA
Xinwen Fu , Dept. of Comput. Sci., Univ. of Massachusetts Lowell, Lowell, MA, USA
pp. 287-298
Bow-Nan Cheng , MIT Lincoln Laboratory, Lexington
Randy Charland , MIT Lincoln Laboratory, Lexington
Paul Christensen , MIT Lincoln Laboratory, Lexington
Leonid Veytser , MIT Lincoln Laboratory, Lexington
James Wheeler , MIT Lincoln Laboratory, Lexington
pp. 299-310
Roee Diamant , Dept. of Electr. & Comput. Eng., Univ. of British Columbia, Vancouver, BC, Canada
Hwee-Pink Tan , Institutefor Infocomm Res., Singapore, Singapore
Lutz Lampe , Dept. of Electr. & Comput. Eng., Univ. of British Columbia, Vancouver, BC, Canada
pp. 311-323
Giusi Alfano , Politecnico di Torino, Torino
Michele Garetto , Università di Torino, Torino
Emilio Leonardi , Politecnico di Torino, Torino
pp. 324-336
Zhenhua Gong , University of Notre Dame, Notre Dame
Martin Haenggi , University of Notre Dame, Notre Dame
pp. 337-349
Po-Hsuan Tseng , National Taipei University of Technology, Taipei
Zhi Ding , University of California, Davis, Davis
Kai-Ten Feng , National Chiao Tung University, Hsinchu
pp. 350-363
Wei-Liang Shen , Academia Sinica, Taipei
Chung-Shiuan Chen , Academia Sinica, Taipei
Kate Ching-Ju Lin , Academia Sinica, Taipei
Kien A. Hua , University of Central Florida, Orlando
pp. 364-376
Yong Li , Tsinghua University, Beijing
Pan Hui , Deutsche Telekom Laboratories, Berlin
Depeng Jin , Tsinghua University, Beijing
Li Su , Tsinghua University, Beijing
Lieguang Zeng , Tsinghua University, Beijing
pp. 377-391
Vishal Sevani , Indian Institute of Technology Bombay, Mumbai
Bhaskaran Raman , Indian Institute of Technology Bombay, Mumbai
Piyush Joshi , Indian Institute of Technology Bombay, Mumbai
pp. 392-406
Guey-Yun Chang , National Central University, Jhongli
Wen-Hung Teng , National Central University, Jhongli
Hao-Yu Chen , National Central University, Jhongli
Jang-Ping Sheu , National Tsing Hua University, Hsinchu
pp. 407-421
Dan J. Dechene , IBM Semiconductor Research and Development Center, Hopewell Junction
Abdallah Shami , The University of Western Ontario, London
pp. 422-433
Javad Vazifehdan , Dept. of Telecommun., Delft Univ. of Technol., Delft, Netherlands
R. Venkatesha Prasad , Dept. of Telecommun., Delft Univ. of Technol., Delft, Netherlands
Ignas Niemegeers , Dept. of Telecommun., Delft Univ. of Technol., Delft, Netherlands
pp. 434-447
Ivan Wang-Hei Ho , The Hong Kong Polytechnic University, Hong Kong
Patrick P. Lam , P2 Mobile Technologies Limited, Hong Kong
Peter Han Joo Chong , Nanyang Technological University, Singapore
Soung Chang Liew , The Chinese University of Hong Kong, Hong Kong
pp. 448-456
Chan-Kyu Han , Sungkyunkwan University, Suwon
Hyoung-Kee Choi , Sungkyunkwan University, Suwon
pp. 457-468
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