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IEEE Transactions on Mobile Computing
Feb. 2014 (vol. 13 no. 2)
ISSN: 1536-1233
Table of Contents
Papers
Kang Chen, Clemson University, Clemson
Haiying Shen, Clemson University , Clemson
Haibo Zhang, Cerner Cooperation, Kansas City
pp. 235-249
Xinfeng Li, The Ohio State University, Columbus
Jin Teng, The Ohio State University, Columbus
Boying Zhang, The Ohio State University The Ohio State University, Columbus Columbus
Adam C. Champion, The Ohio State University, Columbus
Dong Xuan, Ohio State University, Columbus
pp. 250-262
Ngoc Minh Do, University of California, Irvine, Irvine
Cheng-Hsin Hsu, National Tsing Hua University, Hsin Chu
Nalini Venkatasubramanian, University of California, Irvine , Irvine
pp. 274-286
Zhongli Liu, University of Massachusetts Lowell, Lowell
Yinjie Chen, University of Massachusetts Lowell, Lowell
Benyuan Liu, University of Massachusetts Lowell, Lowell
Chengyu Cao, University of Connecticut, Storrs
Xinwen Fu, University of Massachusetts Lowell, Lowell
pp. 287-298
Bow-Nan Cheng, MIT Lincoln Laboratory, Lexington
Randy Charland, MIT Lincoln Laboratory, Lexington
Paul Christensen, MIT Lincoln Laboratory, Lexington
Leonid Veytser, MIT Lincoln Laboratory, Lexington
James Wheeler, MIT Lincoln Laboratory, Lexington
pp. 299-310
Roee Diamant, The University of British Columbia, Vancouver
Hwee-Pink Tan, Institute for Infocomm Research, Singapore
Lutz Lampe, The University of British Columbia, Vancouver
pp. 311-323
Giusi Alfano, Politecnico di Torino, Torino
Michele Garetto, Università di Torino, Torino
Emilio Leonardi, Politecnico di Torino, Torino
pp. 324-336
Po-Hsuan Tseng, National Taipei University of Technology, Taipei
Zhi Ding, University of California, Davis, Davis
Kai-Ten Feng, National Chiao Tung University, Hsinchu
pp. 350-363
Wei-Liang Shen, Academia Sinica, Taipei
Chung-Shiuan Chen, Academia Sinica, Taipei
Kate Ching-Ju Lin, Academia Sinica, Taipei
Kien A. Hua, University of Central Florida, Orlando
pp. 364-376
Yong Li, Tsinghua University, Beijing
Pan Hui, Deutsche Telekom Laboratories, Berlin
Depeng Jin, Tsinghua University, Beijing
Li Su, Tsinghua University, Beijing
Lieguang Zeng, Tsinghua University, Beijing
pp. 377-391
Vishal Sevani, Indian Institute of Technology Bombay, Mumbai
Bhaskaran Raman, Indian Institute of Technology Bombay, Mumbai
Piyush Joshi, Indian Institute of Technology Bombay, Mumbai
pp. 392-406
Guey-Yun Chang, National Central University, Jhongli
Wen-Hung Teng, National Central University, Jhongli
Hao-Yu Chen, National Central University, Jhongli
Jang-Ping Sheu, National Tsing Hua University, Hsinchu
pp. 407-421
Dan J. Dechene, IBM Semiconductor Research and Development Center, Hopewell Junction
Abdallah Shami, The University of Western Ontario, London
pp. 422-433
Javad Vazifehdan, Delft University of Technology, Delft
R. Venkatesha Prasad, Delft University of Technology, Delft
Ignas Niemegeers, Delft University of Technology, Delft
pp. 434-447
Ivan Wang-Hei Ho, The Hong Kong Polytechnic University, Hong Kong
Patrick P. Lam, P2 Mobile Technologies Limited, Hong Kong
Peter Han Joo Chong, Nanyang Technological University, Singapore
Soung Chang Liew, The Chinese University of Hong Kong, Hong Kong
pp. 448-456
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