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IEEE Transactions on Mobile Computing
Nov. 2013 (vol. 12 no. 11)
ISSN: 1536-1233
Table of Contents
Regular Papers
Kai Hong, Stevens Institute of Technology, Hoboken
Shamik Sengupta, City University of New York, New York
R. Chandramouli, Stevens Institute of Technology, Hoboken
pp. 2105-2118
Sahin Cem Geyik, Rensselaer Polytechnic Institute, Troy
Eyuphan Bulut, Rensselaer Polytechnic Institute, Troy
Boleslaw K. Szymanski, Rensselaer Polytechnic Institute, Troy
pp. 2119-2131
Longxiang Gao, Deakin University, Burwood
Ming Li, Deakin University, Burwood
Alessio Bonti, Deakin University, Burwood
Wanlei Zhou, Deakin University, Burwood
Shui Yu, Deakin University, Burwood
pp. 2132-2144
Sahar Hoteit, University Pierre and Marie Curie, Paris and Massachusetts Institute of Technology, Cambridge
Stefano Secci, University Pierre and Marie Curie, Paris
Rami Langar, University Pierre and Marie Curie, Paris
Guy Pujolle, University Pierre and Marie Curie, Paris, and Pohang University of Science and Technology, Pohang
pp. 2145-2154
Xianfu Chen, VTT Technical Research Centre of Finland, Oulu
Zhifeng Zhao, Zhejiang University, Hangzhou
Honggang Zhang, Zhejiang University, Hangzhou
pp. 2155-2166
Chengzhi Li, Broadcom Corporation, Matawan
Huaiyu Dai, North Carolina State University, Raleigh
pp. 2167-2177
Changqiao Xu, Beijing University of Posts and Telecommunications, Beijing and Beijing University of Posts and Telecommunications, Wuxi
Tianjiao Liu, Beijing University of Posts and Telecommunications, Beijing
Jianfeng Guan, Beijing University of Posts and Telecommunications, Beijing
Hongke Zhang, Beijing University of Posts and Telecommunications, Beijing and Beijing Jiaotong University, Beijing
Gabriel-Miro Muntean, Dublin City University, Dublin
pp. 2193-2205
Fung Po Tso, University of Glasgow, Glasgow
Lin Cui, City University of Hong Kong, Hong Kong
Lizhuo Zhang, City University of Hong Kong, Hong Kong
Weijia Jia, City University of Hong Kong, Hong Kong
Di Yao, City University of Hong Kong, Hong Kong
Jin Teng, The Ohio State University, Columbus
Dong Xuan, Ohio State University, Columbus
pp. 2206-2218
Yongkun Li, The Chinese University of Hong Kong, Hong Kong
John C.S. Lui, The Chinese University of Hong Kong, Hong Kong
pp. 2219-2232
Francesco Pantisano, University of Oulu, Oulu and University of Bologna, Bologna
Mehdi Bennis, University of Oulu, Oulu
Walid Saad, University of Oulu, Oulu and University of Miami, Coral Gables
Merouane Debbah, Supelec, Gif-sur-Yvette
Matti Latva-aho, University of Oulu, Oulu
pp. 2233-2246
Amir Aminzadeh Gohari, University of California, Santa Barbara, Santa Barbara
Volkan Rodoplu, University of California, Santa Barbara, Santa Barbara
pp. 2247-2260
Lingjie Duan, Singapore University of Technology and Design, Singapore
Jianwei Huang, The Chinese University of Hong Kong, Hong Kong
Biying Shou, City University of Hong Kong, Hong Kong
pp. 2261-2273
Yanmin Zhu, Shanghai Jiao Tong University, Shanghai
Zhi Li, Shanghai Jiao Tong University, Shanghai
Hongzi Zhu, Shanghai Jiao Tong University, Shanghai
Minglu Li, Shanghai Jiao Tong University, Shanghai
Qian Zhang, Hong Kong University of Science and Technology, Hong Kong
pp. 2289-2302
Kameswari Chebrolu, Indian Institute of Technology, Bombay
Ashutosh Dhekne, Indian Institute of Technology, Bombay
pp. 2303-2316
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