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IEEE Transactions on Mobile Computing
Feb. 2013 (vol. 12 no. 2)
ISSN: 1536-1233
Table of Contents
Papers
M. Carmen Lucas-Estañ, Commun. Eng. Dept., Univ. Miguel Hernandez of Elche (Ed. Quorum V), Alicante, Spain
J. Gozalvez, Commun. Eng. Dept., Univ. Miguel Hernandez of Elche (Ed. Quorum V), Alicante, Spain
pp. 193-205
Yong Ding, VMware Inc., Palo Alto, CA, USA
K. Pongaliur, Dept. of Comput. Sci. & Eng., Michigan State Univ., East Lansing, MI, USA
Li Xiao, Dept. of Comput. Sci. & Eng., Michigan State Univ., East Lansing, MI, USA
pp. 206-218
Kyungtae Kang, Dept. of Comput. Sci. & Eng., Hanyang Univ., Ansan, South Korea
Min-Young Nam, Dept. of Comput. Sci., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
Lui Sha, Dept. of Comput. Sci., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
pp. 219-232
R. Tiwari, Ebay, Inc., San Jose, CA, USA
T. N. Dinh, Dept. of Comput. & Inf. Sci. & Eng., Univ. of Florida, Gainesville, FL, USA
M. T. Thai, Dept. of Comput. & Inf. Sci. & Eng., Univ. of Florida, Gainesville, FL, USA
pp. 233-247
B. Alomair, Comput. Res. Inst. (CRI), King Abdulaziz City for Sci. & Technol. (KACST), Riyadh, Saudi Arabia
A. Clark, Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
J. Cuellar, Corp. Res. & Technol., CERT, Munich, Germany
R. Poovendran, Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
pp. 248-260
F. El-Moukaddem, Dept. of Comput. Sci., Michigan State Univ., East Lansing, MI, USA
E. Torng, Dept. of Comput. Sci., Michigan State Univ., East Lansing, MI, USA
Guoliang Xing, Dept. of Comput. Sci., Michigan State Univ., East Lansing, MI, USA
pp. 261-273
Z. Khan, Centre for Wireless Commun. (CWC), Univ. of Oulu, Oulu, Finland
Janne J. Lehtomäki, Centre for Wireless Commun. (CWC), Univ. of Oulu, Oulu, Finland
L. A. DaSilva, Telecommun. Res. Centre, Trinity Coll. Dublin, Dublin, Ireland
M. Latva-aho, Centre for Wireless Commun. (CWC), Univ. of Oulu, Oulu, Finland
pp. 274-288
M. Fiore, CITI Lab., INSA Lyon, Villeurbanne, France
Claudio Ettore Casetti, Dipt. di Elettron., Politec. di Torino, Turin, Italy
C. Chiasserini, Dipt. di Elettron., Politec. di Torino, Turin, Italy
P. Papadimitratos, Sch. of Electr. Eng., KTH, Stockholm, Sweden
pp. 289-303
Z. Abichar, Dept. of Electr. Eng. & Comput. Sci., Univ. of Central Florida, Orlando, FL, USA
J. M. Chang, Dept. of Electr. & Comput. Eng., Iowa State Univ., Ames, IA, USA
pp. 304-317
E. Y. Vasserman, Dept. of Comput. & Inf. Sci., Kansas State Univ., Manhattan, KS, USA
N. Hopper, Dept. of Comput. Sci. & Eng., Univ. of Minnesota, Minneapolis, MN, USA
pp. 318-332
Yuan He, Sch. of Software, Tsinghua Univ., Beijing, China
Yunhao Liu, Sch. of Software, Tsinghua Univ., Beijing, China
Xingfa Shen, Coll. of Comput. Sci., Hangzhou Dianzi Univ., Hangzhou, China
Lufeng Mo, Sch. of Inf. Eng., Zhejiang Agric. & Forestry Univ., Hangzhou, China
Guojun Dai, Coll. of Comput. Sci., Hangzhou Dianzi Univ., Hangzhou, China
pp. 333-345
S. Sen, Dept. of Comput. Sci., Duke Univ., Durham, UK
N. Santhapuri, Bloomberg, New York, NY, USA
R. R. Choudhury, Electr. & Comput. Eng. Dept., Duke Univ., Durham, NC, USA
S. Nelakuditi, Comput. Sci. & Eng. Dept., Univ. of South Carolina, Columbia, SC, USA
pp. 346-357
Dominik Schürmann, Tech. Univ. Braunschweig, Braunschweig, Germany
S. Sigg, Inf. Syst. Archit. Sci. Res. Div., Nat. Inst. of Inf. (NII), Tokyo, Japan
pp. 358-370
Khajonpong Akkarajitsakul, Dept. of Electr. & Comput. Eng., Univ. of Manitoba, Winnipeg, MB, Canada
E. Hossain, Dept. of Electr. & Comput. Eng., Univ. of Manitoba, Winnipeg, MB, Canada
Dusit Niyato, Sch. of Comput. Eng., Nanyang Technol. Univ., Singapore, Singapore
pp. 371-385
Chi-Jen Wu, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Jan-Ming Ho, Inst. of Inf. Sci., Acad. Sinica, Taipei, Taiwan
Ming-Syan Chen, Res. Center of Inf. Technol. Innovation (CITI), Acad. Sinica, Taipei, Taiwan
pp. 386-398
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