APRIL 2008 (VOL. 7, No. 4) 385
1536-1233/08/$31.00 © 2008 IEEE
Published by the IEEE Computer Society
Published by the IEEE Computer Society
Editorial: EIC Farewell and New EIC Introduction
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My term as the Editor-in-Chief (EIC) of Transactions on Mobile Computing (TMC) ended on 31 December 2007. I would like to take this opportunity to thank the many individuals who have contributed to the success of TMC. First, I would like to thank all of the Associate Editors who have served on the editorial board of TMC. We could not have maintained the high standards of the journal and the timeliness of the review process without their conscientious work. My thanks to Jennifer Carruth, whose help as the Transactions Assistant has been invaluable. Her contributions to TMC have helped us in maintaining a relatively short submission-to-decision time for the submitted manuscripts, and also in making the review process a positive experience for the authors. The TMC Steering Committee, chaired by Rajesh Gupta, offered useful advice throughout my tenure as EIC. Their guidance has been important in setting editorial policies for the journal. Many IEEE Computer Society staff members were also of significant assistance during my tenure. In particular, I would like to thank Alicia Stickley, Suzanne Wagner, Kimberly Sperka, and Angela Burgess for their support. Last but not least, my thanks to all of the authors who submitted their manuscripts to TMC and all of the reviewers without whose help we could not maintain the high quality of TMC.
Since its inception in 2002, with Tom La Porta as the first EIC, TMC has grown significantly. TMC was published quarterly in 2002 and has been published monthly since 2006. Along with the increasing reputation of TMC, the number of submissions has also increased significantly. Despite the increase in volume, we have been able to maintain high quality due to the hard work of our editors and reviewers. I believe that TMC has now established itself as a leading journal in the area of mobile computing and wireless networking.
It is with great pleasure that I welcome Mani B. Srivastava as the new EIC of TMC. Mani has previously served in leadership roles for other publications, and also on the TMC Editorial Board. I have no doubt that TMC will continue to grow under his leadership. I trust that our readers and authors will continue supporting TMC over the years to come.
Nitin H. Vaidya
Mani B. Srivastava is on the faculty at the University of California, Los Angeles (UCLA), where he is a professor and vice chair of electrical engineering and a professor of computer science. He is also associated with UCLA's Center for Embedded Networked Sensing (CENS), where he coleads the Systems Area Research. Previously, he did his undergraduate studies at the Indian Institute of Technology, Kanpur, and received the MS and PhD degrees from the University of California, Berkeley. He worked at AT&T/Lucent Bell Labs Research from 1992-1996. His research interests are in power-aware computing and communications, wireless and mobile systems, embedded computing, pervasive sensing, and their applications in urban, social, and personal contexts. He has published nearly 200 papers and received several patents in these areas. He has served as the editor-in-chief of the ACM Sigmobile Mobile Computing and Communications Review and as an associate editor for the IEEE Transactions on Mobile Computing, the IEEE/ACM Transactions on Networking, and the ACM Transactions on Sensor Networks. He has served as the TPC cochair for ACM MobiHoc, ACM SenSys, and IEEE/ACM IPSN. He has received the President of India's Gold Medal for academic excellence, the US National Science Foundation CAREER Award, the Okawa Foundation Grant, the Best Paper Award at IEEE ICDCS, and Design Contest and Demonstration Awards at IEEE/ACM DAC, IEEE ISSCC, IEEE/ACM ISLPED, and IEEE/ACM IPS.
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