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IEEE Transactions on Knowledge and Data Engineering PrePrints ISSN: 1041-4347 Table of Contents
 | Papers |
Carlos A. Heuser, Universidade Federal do Rio Grande do Sul, UFRGS, Porto Alegre-RS
Hiroyuki Yoshida, Massachusetts General Hospital and Harvard Medical School, Boston
Qing Chen, University of Texas at Dallas, Richardson
Jing Gao, University of Illinois at Urbana-Champaign, Urbana
Jiawei Han, University of Illinois at Urbana-Champaign, Urbana
Heli Sun, Xi'an Jiaotong University, Xi'an
Hongbo Deng, University of Illinois at Urbana-Champaign, Urbana
Jiawei Han, University of Illinois at Urbana-Champaign, Urbana
Yuh-Jye Lee, National Taiwan University of Science and Technology, Taipei
Yi-Ren Yeh, Academia Sinica and National Taiwan University, Taipei
Takeshi Yamada, NTT Science and Core Technology Laboratory Group, Atsugi
Xinhai Liu, The People's Bank of China, Beijing and Wuhan University of Science and Technology, wuhan
Lu Yu, Clemson University, Clemson
Lu Qin, The Chinese University of Hong Kong, Hong Kong
Lijun Chang, The Chinese University of Hong Kong, Hong Kong
Jun Huan, University of Kansas, Lawrence
Paolo Terenziani, Universitá del Piemonte Orientale, Alessandria and Universitá di Torino, Torino
Wei Wang, The University of New South Wales, Sydney
Xiao Chuan, The University of New South Wales, Sydney
Xuemin Lin, The University of New South Wales, Sydney
Deng Cai, Zhejiang Univerisity, Hangzhou
Y. Narahari, Indian Institute of Science (IISc), Bangalore
Piotr Duda, Czestochowa University of Technology, Czestochowa
Yang Cao, State Intellectual Property Office of the PRC, Beijing
Ju Fan, Tsinghua University, Beijing
Wei Jiang, Missouri University of Science and Technology, Rolla
Bai-En Shie, National Cheng Kung University, Tainan City
Nenghai Yu, University of Science and Technology of China, Hefei
Lise Getoor, University of Maryland at College Park, College Park
Yu Peng, The Hong Kong University of Science and Technology, Hong Kong
Qian Wan, University of Wisconsin - Madison, Madison
Bart Baesens, Katholieke Universiteit Leuven, Leuven and University of Southampton, Highfield Southampton
Ziyu Guan, University of California, Santa Barbara, Santa Barbara
Gengxin Miao, University of California, Santa Barbara, Santa Barbara
Xifeng Yan, University of California, Santa Barbara, Santa Barbara
Deng Cai, Zhejiang Univerisity, Hangzhou
Feifei Li, University of Utah, Salt Lake City
Bin Yao, Shanghai Jiao Tong Univeresity, Shanghai
Zhao Zhang, City University of Hong Kong, Hong Kong
Shimei Pan, IBM Research - T. J. Watson Center, Hawthorne
Furu Wei, Microsoft Research Asia, Beijing
Jisu Oh, SAMSUNG Electronics Co., Ltd., Suwon-si
Xuan Li, Institute of Software, Chinese Academy of Sciences, Beijing
Liang Du, Institute of Software, Chinese Academy of Sciences, Beijing
Yi-Dong Shen, Institute of Software, Chinese Academy of Sciences, Beijing
Kelvin Sim, Institute for Infocomm Research, Singapore
Gao Cong, Nanyang Technological University, Singapore
Jing Li, University of Hong Kong, Hong Kong
Yin Yang, Advanced Digital Sciences Center, Singapore
Shen Ge, University of Hong Kong, Hong Kong
Mao Ye, Penn State University, University Park
Xiao He, University of Munich, Munich
Lushan Han, University of Maryland, Baltimore County, Baltimore
Tim Finin, University of Maryland, Baltimore County, Baltimore
Anupam Joshi, University of Maryland, Baltimore County, Baltimore
Yelena Yesha, University of Maryland, Baltimore County, Baltimore
Hao Ying, Wayne State University, Detroit
Ruizhang Huang, Guizhou University, China and The Hong Kong Polytechnic University, Hong Kong
Guan Yu, Nankai University, Tianjin
Dik Lun Lee, Hong Kong University of Science and Technology, Hong Kong
Qi Yu, Rochester Institute of Technology, Rochester
Ling Hu, University of Southern California, Los Angeles
Yin Yang, Advanced Digital Sciences Center, Singapore
Paolo Terenziani, Università del Piemonte Orientale "Amedeo Avogadro", Alessandria
Xiaofei Xu, Harbin Institute of Technology, Harbin
Yunming Ye, Harbin Institute of Technology, Shenzhen
Shu Wu, University of Sherbrooke, Sherbrooke
Byron J. Gao, Texas State University - San Marcos, San Marcos
Hui Xiong, Rutgers, the State University of New Jersey, Newark
Jin-Yi Cai, University of Wisconsin - Madison, Madison
Mingxuan Yuan, Hong Kong University of Science and Technology, Hong Kong
Lei Chen, Hong Kong University of Science and Technology, Hong Kong
Ting Yu, North Carolina State University, Raleigh
Yiming Zhang, National University of Defense Technology, Changsha
Ling Liu, Georgia Institute of Technology, Atlanta
Gautam Das, University of Texas at Arlington, Arlington
Qi Liu, Tongji University, Shanghai
Wei Fan, IBM T.J. Watson Research Center, Hawthorne
Ke Chen, Zhejiang University, Hangzhou
Zheng Lu, Shanghai Jiao Tong University, Shanghai
Weiyao Lin, Shanghai Jiao Tong University, Shanghai
Min Chen, Richard Stockton College of New Jersey, Galloway
Tao Xiang, Queen Mary University of London, London
Xin Lin, East China Normal University, Shanghai and Hong Kong Baptist University, Hong Kong
Haibo Hu, Hong Kong Baptist University, Hong Kong
Xin Jin, University of Illinois at Urbana Champaign, Champaign
Jie Yu, GE Global Research, Niskayuna
Gang Wang, Nanyang Technological University, and Advanced Digital Science Center, Singapore
Jiawei Han, University of Illinois at Urbana Champaign, Champaign
Muhammad Kamran, National University of Computer and Emerging Sciences, Islamabad
Muddassar Farooq, National University of Computer and Emerging Sciences, Islamabad
Lei Wang, University of Wollongong, NSW, Australia
Huan Liu, Arizona State University, Tempe
Jian Pei, Simon Fraser Univeristy, Burnaby
Yufei Tao, Chinese University of Hong Kong, Hong Kong
Xuemin Lin, The University of New South Wales, Sydney and East China Normal University, China
Tianrui Li, Southwest Jiaotong University, Chengdu
Da Ruan, Belgian Nuclear Research Centre (SCK•CEN), Mol and Ghent University, Ghent
Shasha Li, National University of Defense Technology, Beijing
Shuo Wang, The University of Birmingham, Birmingham
Xin Yao, The University of Birmingham, Birmingham
Jing Gao, University of Illinois at Urbana-Champaign, Urbana
Feng Liang, University of Illinois at Urbana-Champaign, Urbana
Wei Fan, IBM TJ Watson Research Center, Hawthorn
Yizhou Sun, University of Illinois at Urbana-Champaign, Urbana
Jiawei Han, University of Illinois at Urbana-Champaign, Urbana
Tias Guns, Katholieke Universiteit Leuven, Leuven
Jing Yuan, University of Science and Technology of China, Beijing
Yu Zheng, Microsoft Research Asia, Beijing
Xing Xie, Microsoft Research Asia, Beijing
Guangzhong Sun, University of Science and Technology of China, Beijing
Liang Wang, The University of Hong Kong, Hong Kong
Xuan Yang, The University of Hong Kong, Hong Kong
Marc Solé, Technical University of Catalonia (UPC), Barcelona
Josep Carmona, Technical University of Catalonia (UPC), Barcelona
Yee Leung, The Chinese University of Hong Kong, Hong Kong
Pan Du, Chinese Academy of Sciences, Beijing
Yixin Chen, Washington University in St. Louis, St. Louis
Dingyi Han, Shanghai Jiao Tong University, Shanghai
Yong Yu, Shanghai Jiao Tong University, Shanghai
Qiong Fang, Hong Kong University of Science and Technology, Hong Kong
Wilfred Ng, Hong Kong University of Science and Technology, Hong Kong
Yuliang Li, Hong Kong University of Science and Technology, Hong Kong
Zhixu Li, The University of Queensland, Brisbane
Yiyao Lu, Binghamton University, Binghamton
Hai He, Morningstar Inc., Chicago
Clement Yu, University of Illinois at Chicago, Chicago
Gao Cong, Nanyang Technological University, Singapore
Laxmidhar Behera, Indian Institute of Technology, Kanpur and University of Ulster, Londonderry
Kevin Y Yip, Chinese University of Hong Kong, Hong Kong
Ben Kao, University of Hong Kong, Hong Kong
Mao Ye, Pennsylvania State University, University Park
Ken Lee, University of Massachusetts Dartmouth, North Dartmouth
Xingjie Liu, Pennsylvania State University, University Park
Dongwon Kim, Pohang University of Science and Technology (POSTECH)
Hyeonseung Im, Pohang University of Science and Technology (POSTECH)
Sungwoo Park, Pohang University of Science and Technology (POSTECH)
Guangxia Li, Nanyang Technological University, Singapore
Kuiyu Chang, Nanyang Technological University, Singapore
Chen Li, University of California, Irvine, Irvine
Mao Ye, Penn State University, University Park
Dik Lun Lee, Hong Kong University of Science and Technology, Hong Kong
Fuzhen Zhuang, The Key Laboratory of Intelligent Information Processing, Beijing
Qing He, Institute of Computing Technology, Chinese Academy of Sciences, Beijing
Zhongzhi Shi, Institute of Computing Technology, Chinese Academy of Sciences, Beijing
Radu Sion, Stony Brook University, Stony Brook
Ning Zhong, Beijing University of Technology, Beijing and Maebashi Institute of Technology, Maebashi-City
Qinghua Hu, Harbin Institute of Technology, Harbin
Lei Zhang, The Hong Kong Polytechnic University, Hong Kong
David Zhang, The Hong Kong Polytechnic University, Hong Kong
Maozu Guo, Harbin Institute of Technology, Harbin
Daren Yu, Harbin Institute of Technology, Harbin
Dunren Che, Southern Illinois University, Carbondale
Wei Wang, Rutgers University, Piscataway
Yaping Li, University of California at Berkeley, Berkeley
Minghua Chen, The Chinese University of Hong Kong, Hong Kong
Qiwei Li, The Chinese University of Hong Kong, Hong Kong
Wei Zhang, The Chinese University of Hong Kong, Hong Kong
Byron Choi, Hong Kong Baptist University, Hong Kong
Haibo Hu, Hong Kong Baptist University, Hong Kong
Kai Zheng, University of Queensland, Brisbane
Zi Huang, University of Queensland, Brisbane
Aoying zhou, Institute of East China Normal University, Shanghai
Xiaofang Zhou, University of Queensland, Brisbane and Renmin University of China, Beijing
Marcos Quiles, Federal University of São Paulo (Unifesp), São José dos Campos
Jiming Liu, Hong Kong Baptist University, Hong Kong
Xiao Pan, Renmin University of China, Beijing
Sascha Szott, Konrad-Zuse-Zentrum für Informationstechnik, Berlin
Hong Chen, Renmin University of China, Beijing
D.G. Chen, North China Electric Power University, Beijing
L. Zhang, The Hong Kong Polytechnic University, Hong Kong
Y.P. Yang, North China Electric Power University, Beijing
X. Zhang, North China Electric Power University, Beijing
Junbeom Hur, University of Illinois at Urbana-Champaign, Urbana
Xiaofeng Ding, Huazhong University of Science and Technology, Wuhan
Hai Jin, Huazhong University of Science and Technology, Wuhan
Bin He, IBM Almaden Research Center, San Jose
Yu Huang, Arizona State University, Tempe
Yi Chen, Arizona State University, Tempe
Chengkai Li, University of Texas at Arlington, Arlington
Nan Zhang, George Washington University, Washington, DC
Wei Zhao, The University of Macau, Taipa, Macau
Lixing Wang, Hong Kong University of Science and Technology, Hong Kong
Yin Yang, Hong Kong University of Science and Technology, Hong Kong
Yong Liu, Harbin Institute of Technology, Harbin
Hong Gao, Harbin Institute of Technology, Harbin
T. M. Chan, The Hong Kong Polytechnic University, Kowloon
G.T.S. Ho, The Hong Kong Polytechnic University, Kowloon Usage of this product signifies your acceptance of the Terms of Use.
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