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IEEE Transactions on Knowledge and Data Engineering
Nov. 2013 (vol. 25 no. 11)
ISSN: 1041-4347
Table of Contents
REGULAR PAPERS
Ruoyi Jiang, University of Kansas, Lawrence
Hongliang Fei, University of Kansas, Lawrence
Jun Huan, University of Kansas, Lawrence
pp. 2421-2433
Nguyen Quoc Viet Hung, École Polytechnique Fédérale de Lausanne (EPFL), Lausanne
Hoyoung Jeung, SAP Research Brisbane
Karl Aberer, École Polytechnique Fédérale de Lausanne (EPFL), Lausanne
pp. 2434-2447
Yiping Li, Tsinghua University, Beijing
Jianwen Chen, Tsinghua University, Beijing
Ling Feng, Tsinghua University, Beijing
pp. 2463-2482
Feng Yan, Purdue University, West Lafayette
Shreyas Sundaram, University of Waterloo, Waterloo
S.V.N. Vishwanathan, Purdue University, West Lafayette
Yuan Qi, Purdue University, West Lafayette
pp. 2483-2493
V. D'Orangeville, University of Sherbrooke, Sherbrooke
M. Andre Mayers, University of Sherbrooke, Sherbrooke
M. Ernest Monga, University of Sherbrooke, Sherbrooke
M. Shengrui Wang, University of Sherbrooke, Sherbrooke
pp. 2494-2506
Ken C.K. Lee, Amazon Web Services, Amazon.com
Baihua Zheng, Singapore Management University, Singapore
Cindy Chen, University of Massachusettes Lowell, Lowell
Chi-Yin Chow, City University of Hong Kong, Hong Kong
pp. 2507-2520
Xixian Han, Harbin Institute of Technology, Harbin
Jianzhong Li, Harbin Institue of Technology, Harbin
Donghua Yang, Harbin Institue of Technology, Harbin
Jinbao Wang, Harbin Institue of Technology, Harbin
pp. 2521-2535
Jintian Deng, Hong Kong Baptist University, Hong Kong
Byron Choi, Hong Kong Baptist University, Hong Kong
Jianliang Xu, Hong Kong Baptist University, Hong Kong
Haibo Hu, Hong Kong Baptist University, Hong Kong
Sourav S. Bhowmick, Nanyang Technological University, Singapore
pp. 2536-2550
Alexandros Iosifidis, Aristotle University of Thessaloniki, Thessaloniki
Anastasios Tefas, Aristotle University of Thessaloniki, Thessaloniki
Ioannis Pitas, Aristotle University of Thessaloniki, Thessaloniki
pp. 2564-2575
Wojciech Kotlowski, Poznan University of Technology, Poznan
Roman Slowinski, Poznan University of Technology, Poznan and Polish Academy of Sciences, Warsaw
pp. 2576-2589
Kush R. Varshney, IBM Thomas J. Watson Research Center, Yorktown Heights
Ryan J. Prenger, Lawrence Livermore National Laboratory, Livermore
Tracy L. Marlatt, Lawrence Livermore National Laboratory, Livermore
Barry Y. Chen, Lawrence Livermore National Laboratory, Livermore
William G. Hanley, Exponent, Menlo Park
pp. 2590-2601
Mohamed Nabeel, Purdue University, West Lafayette
Ning Shang, Qualcomm Inc., San Diego
Elisa Bertino, Purdue University, West Lafayette
pp. 2602-2614
Huey-Ru Wu, National Taiwan University, Taipei
Mi-Yen Yeh, Academia Sinica, Taipei
Ming-Syan Chen, Academia Sinica and National Taiwan University, Taipei
pp. 2615-2628
Changqing Chen, Michigan State University, East Lansing
Alok Watve, Michigan State University, East Lansing
Sakti Pramanik, Michigan State University, East Lansing
Qiang Zhu, The University of Michigan, Dearborn
pp. 2629-2643
Weixiong Rao, Tongji University, Shanghai
Lei Chen, The Hong Kong University of Science and Technology, Hong Kong
Sasu Tarkoma, University of Helsinki, Helsinki
pp. 2644-2657
Jianguo Lu, University of Windsor, Windsor
Dingding Li, University of Windsor, Windsor
pp. 2658-2663
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