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IEEE Transactions on Knowledge and Data Engineering
Feb. 2013 (vol. 25 no. 2)
ISSN: 1041-4347
Table of Contents
EDITORIAL
REGULAR PAPERS
Jiun-Long Huang, National Chiao Tung University, Hsinchu City
Chen-Che Huang, National Chiao Tung University, Hsinchu City
pp. 260-273
Hongmei Chen, Southwest Jiaotong University, Chengdu
Tianrui Li, Southwest Jiaotong University, Chengdu
Jianhui Lin, Southwest Jiaotong University, Chengdu
Chengxiang Hu, Chuzhou University, Chuzhou
pp. 274-284
Marco Vanetti, University of Insubria, Varese
Elisabetta Binaghi, University of Insubria, Varese
Elena Ferrari, University of Insubria, Varese
Barbara Carminati, University of Insubria, Varese
Moreno Carullo, University of Insubria, Varese
pp. 285-297
Zhixu Li, The University of Queensland, Brisbane
Laurianne Sitbon, Queensland University of Technology, Brisbane
Liwei Wang, Wuhan University, Wuhan
Xiaofang Zhou, The University of Queensland, Brisbane
Xiaoyong Du, Renmin University of China, Beijing
pp. 298-310
Tamir Tassa, The Open University, Ra'anana, Israel
Dror J. Cohen, The Open University, Ra'anana, Israel
pp. 311-324
George Kollios, Boston University, Boston
Michalis Potamias, Smart Deals, Groupon
Evimaria Terzi, Boston University, Boston
pp. 325-336
Deyu Meng, Xi'an Jiaotong University, Xi'an
Yee Leung, The Chinese University of Hong Kong, Hong Kong
Zongben Xu, Xi'an Jiaotong University, Xi'an
pp. 337-347
Siamak Tavakoli, Queen Mary University of London, United Kingdom
Alireza Mousavi, Brunel University, Uxbridge
Peter Broomhead, Brunel University, Uxbridge
pp. 348-359
Massimiliano Albanese, George Mason University, Fairfax
Andrea Pugliese, University of Calabria, Rende
V.S. Subrahmanian, University of Maryland, College Park
pp. 360-373
Timothy M. Hospedales, Queen Mary University of London, London
Shaogang Gong, Queen Mary University of London, London
Tao Xiang, Queen Mary University of London, London
pp. 374-386
Robson L.F. Cordeiro, University of São Paulo, São Carlos
Agma J.M. Traina, Universidade de São Paulo, São Carlos
Christos Faloutsos, Carnegie Mellon University, Pittsburgh
Caetano Traina Jr., University of São Paulo, São Carlos
pp. 387-401
Tias Guns, Katholieke Universiteit Leuven, Leuven
Siegfried Nijssen, Katholieke Universiteit Leuven, Leuven
Luc De Raedt, Katholieke Universiteit Leuven, Leuven
pp. 402-418
Danushka Bollegala, The University of Tokyo, Tokyo
Yutaka Matsuo, The University of Tokyo, Tokyo
Mitsuru Ishizuka, The University of Tokyo, Tokyo
pp. 419-432
Konstantinos A. Raftopoulos, National Technical University of Athens, Athens
Klimis S. Ntalianis, National Technical University of Athens, Athens
Dionyssios D. Sourlas, Elais-Unilever Hellas S.A, Athens
Stefanos D. Kollias, National Technical University of Athens, Athens
pp. 433-447
Xin Jin, University of Illinois at Urbana Champaign, Champaign
Jiebo Luo, Eastman Kodak Company, Rochester
Jie Yu, GE Global Research, Niskayuna
Gang Wang, Nanyang Technological University, and Advanced Digital Science Center, Singapore
Dhiraj Joshi, Eastman Kodak Company, Rochester
Jiawei Han, University of Illinois at Urbana Champaign, Champaign
pp. 448-460
Guoliang Li, Tsinghua Univsersity, Beijing
Jianhua Feng, Tsinghua University, Beijing
Chen Li, University of California, Irvine, Irvine
pp. 461-475
CONCISE PAPERS
K. Shehzad, University of Engineering and Technology, Taxila, Pakistan
pp. 476-480
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