Advanced Search 
IEEE Transactions on Knowledge and Data Engineering
Aug. 2012 (vol. 24 no. 8)
ISSN: 1041-4347
Table of Contents
Regular Papers
Donghun Lee, SAP R&D Center Korea, Seoul
Sang K. Cha, Seoul National University, Seoul
Arthur H. Lee, Claremont McKenna College, Claremont
pp. 1345-1360
Faiz A. Currim, University of Arizona, Tucson
Sabah A. Currim, University of Arizona, Tucson
Curtis E. Dyreson, Utah State University, Logan
Richard T. Snodgrass, University of Arizona , Tucson
Stephen W. Thomas, Queen's University, Kingston
Rui Zhang, University of Arizona, Tucson
pp. 1361-1377
Longbing Cao, University of Technology, Sydney
Yuming Ou, University of Technology, Sydney
Philip S. Yu, University of Illinois at Chicago, Chicago
pp. 1378-1392
Mirjana Mazuran, Politecnico di Milano, Milano
Elisa Quintarelli, Politecnico di Milano, Milano
Letizia Tanca, Politecnico di Milano, Milano
pp. 1393-1407
Andrew K.C. Wong, University of Waterloo, Waterloo
Dennis Zhuang, University of Waterloo, Waterloo
Gary C.L. Li, University of Waterloo, Waterloo
En-Shiun Annie Lee, University of Waterloo, Waterloo
pp. 1408-1421
Shuang-Hong Yang, Georgia Institute of Technology, Atlanta
Bao-Gang Hu, Chinese Academy of Sciences, Beijing
pp. 1422-1434
Khurram Shehzad, University of Engineering and Technology, Taxila
pp. 1435-1447
Xiaofeng Ding, Huazhong University of Science and Technology, Wuhan
Hai Jin, Huazhong University of Science and Technology, Wuhan
pp. 1448-1462
Yao-Chung Fan, National Tsing Hua Univerisity, Hsinchu
Arbee L.P. Chen, National Chengchi University, Taiwan
pp. 1463-1477
Papers
Xi-Zhao Wang, Hebei University, Baoding
Ling-Cai Dong, Hebei University, Baoding
Jian-Hui Yan, Hebei University, Baoding
pp. 1491-1505
Xiao Pan, Shijiazhuang Tiedao University, China
Jianliang Xu, Hong Kong Baptist University, Kowloon
Xiaofeng Meng, Renmin University of China, Beijing
pp. 1506-1519
Daniel Keren, Haifa University, Haifa
Izchak Sharfman, Technion, Haifa
Assaf Schuster, Technion, Haifa
Avishay Livne, Technion, Haifa
pp. 1520-1535
Usage of this product signifies your acceptance of the Terms of Use.