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IEEE Transactions on Knowledge and Data Engineering
September 2009 (vol. 21 no. 9)
ISSN: 1041-4347
Table of Contents
REGULAR PAPERS
Steven C.H. Hoi, Nanyang Technological University, Singapore
Rong Jin, Michigan State University, East Lansing
Michael R. Lyu, The Chinese University of Hong Kong, Shatin
pp. 1233-1248
Ping Luo, Chinese Academy of Sciences and Hewlett-Packard Labs China, Beijing
Hui Xiong, Rutgers University, Newark
Guoxing Zhan, Wayne State University, Detroit
Junjie Wu, Beihang University, Beijing
Zhongzhi Shi, Chinese Academy of Sciences, Beijing
pp. 1249-1262
Haibo He, Stevens Institute of Technology, Hoboken
Edwardo A. Garcia, Stevens Institute of Technology, Hoboken
pp. 1263-1284
Shiming Xiang, Tsinghua National Laboratory for Information Science and Technology, Beijing
Feiping Nie, Tsinghua National Laboratory for Information Science and Technology, Beijing
Changshui Zhang, Tsinghua National Laboratory for Information Science and Technology, Beijing
Chunxia Zhang, Beijing Institute of Computer Science, Beijing
pp. 1285-1298
Tianhao Zhang, Shanghai Jiao Tong University, Shanghai
Dacheng Tao, The Hong Kong Polytechnic University, Kowloon
Xuelong Li, Birkbeck College, University of London, London
Jie Yang, Shanghai Jiao Tong University, Shanghai
pp. 1299-1313
Yunjun Gao, Singapore Management University, Singapore and Zhejiang University, Hangzhou
Baihua Zheng, Singapore Management University, Singapore
Gencai Chen, Zhejiang University, Hangzhou
Wang-Chien Lee, Pennsylvania State University, University Park
Ken C.K. Lee, Pennsylvania State University, University Park
Qing Li, City University of Hong Kong, Hong Kong
pp. 1314-1327
Sven Groppe, University of Lübeck, Lübeck
Jinghua Groppe, University of Lübeck, Lübeck
Dirk Müller, University of Paderborn, Paderborn
pp. 1328-1342
Ahmet Bulut, Like.com, San Mateo
Nick Koudas, University of Toronto, Toronto
Anand Meka, University of California Santa Barbara, Santa Barbara
Ambuj K. Singh, University of California, Santa Barbara, Santa Barbara
Divesh Srivastava, AT&T Labs-Research, Florham Park
pp. 1343-1357
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