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IEEE Transactions on Haptics
July-Sept. 2013 (vol. 6 no. 3)
ISSN: 1939-1412
Table of Contents
Front Covers
REGULAR PAPERS
F. Ryden, Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
H. J. Chizeck, Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
pp. 257-267
L. A. Jones, Dept. of Mech. Eng., Massachusetts Inst. of Technol., Cambridge, MA, USA
H. Z. Tan, Human Comput. Interaction Group, Microsoft Res. Asia, Beijing, China
pp. 268-284
V. Panday, Fac. of Human Movement Sci., VU Univ. Amsterdam, Amsterdam, Netherlands
W. M. B. Tiest, Fac. of Human Movement Sci., VU Univ. Amsterdam, Amsterdam, Netherlands
A. M. L. Kappers, Fac. of Human Movement Sci., VU Univ. Amsterdam, Amsterdam, Netherlands
pp. 285-295
I. M. Bullock, Dept. of Mech. Eng. & Mater. Sci., Yale Univ., New Haven, CT, USA
J. Z. Zheng, Inst. for Phys. Sci. (IPS), Mclean, VA, USA
S. D. L. Rosa, Dept. of Mech. Eng. & Mater. Sci., Yale Univ., New Haven, CT, USA
C. Guertler, Dept. of Mech. Eng. & Mater. Sci., Yale Univ., New Haven, CT, USA
A. M. Dollar, Dept. of Mech. Eng. & Mater. Sci., Yale Univ., New Haven, CT, USA
pp. 296-308
S. Feyzabadi, Robot. Innovation Center, German Res. Center for Artificial Intell., Bremen, Germany
S. Straube, Robot. Lab., Univ. of Bremen, Bremen, Germany
M. Folgheraiter, Robot. Innovation Center, German Res. Center for Artificial Intell., Bremen, Germany
J. C. Albiez, Robot. Innovation Center, German Res. Center for Artificial Intell., Bremen, Germany
pp. 309-319
K. O. Sofia, Dept. of Mech. Eng., Massachusetts Inst. of Technol., Cambridge, MA, USA
L. Jones, Dept. of Mech. Eng., Massachusetts Inst. of Technol., Cambridge, MA, USA
pp. 320-329
B. T. Gleeson, Dept. of Comput. Sci., Univ. of British Columbia, Vancouver, BC, Canada
W. R. Provancher, Dept. of Mech. Eng., Univ. of Utah, Salt Lake City, UT, USA
pp. 330-339
Inwook Hwang, Dept. of Comput. Sci. & Eng., Haptics & Virtual Reality Lab., Pohang, South Korea
Hyeseon Lee, Dept. of Ind. & Manage. Eng., POSTECH, Pohang, South Korea
Seungmoon Choi, Dept. of Comput. Sci. & Eng., Haptics & Virtual Reality Lab., Pohang, South Korea
pp. 340-351
Inwook Hwang, Dept. of Comput. Sci. & Eng., Pohang Univ. of Sci. & Technol., Pohang, South Korea
Jongman Seo, Dept. of Comput. Sci. & Eng., Pohang Univ. of Sci. & Technol., Pohang, South Korea
Myongchan Kim, Dept. of Comput. Sci. & Eng., Pohang Univ. of Sci. & Technol., Pohang, South Korea
Seungmoon Choi, Dept. of Comput. Sci. & Eng., Pohang Univ. of Sci. & Technol., Pohang, South Korea
pp. 352-362
SHORT PAPERS
A. Jazayeri, Dept. of Electr. & Comput. Eng., Univ. of Alberta, Edmonton, AB, Canada
M. Tavakoli, Dept. of Electr. & Comput. Eng., Univ. of Alberta, Edmonton, AB, Canada
pp. 363-369
T. Amemiya, NTT Commun. Sci. Labs., NTT Corp., Atsugi, Japan
H. Gomi, NTT Commun. Sci. Labs., NTT Corp., Atsugi, Japan
pp. 370-375
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