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IEEE Transactions on Haptics
April-June 2013 (vol. 6 no. 2)
ISSN: 1939-1412
Table of Contents
Front Covers
REGULAR PAPERS
I. M. Bullock, Dept. of Mech. Eng. & Mater. Sci., Yale Univ., New Haven, CT, USA
R. R. Ma, Dept. of Mech. Eng. & Mater. Sci., Yale Univ., New Haven, CT, USA
A. M. Dollar, Dept. of Mech. Eng. & Mater. Sci., Yale Univ., New Haven, CT, USA
pp. 129-144
M. Ayyildiz, Coll. of Eng., Koc Univ., Istanbul, Turkey
B. Guclu, Inst. of Biomed. Eng., Bogazici Univ., Istanbul, Turkey
Mustafa Zahid Yildiz, Inst. of Biomed. Eng., Bogazici Univ., Istanbul, Turkey
C. Basdogan, Coll. of Eng., Koc Univ., Istanbul, Turkey
pp. 145-155
J. C. Gwilliam, Dept. of Biomed. Eng., Johns Hopkins Univ., Baltimore, MD, USA
M. Bianchi, Interdept. Res. Center “E. Piaggio, Univ. of Pisa, Pisa, Italy
L. K. Su, Dept. of Mech. Eng., Stanford Univ., Stanford, CA, USA
A. M. Okamura, Dept. of Mech. Eng., Stanford Univ., Stanford, CA, USA
pp. 156-166
Dangxiao Wang, State Key Lab. of Virtual Reality Technol. & Syst., Beihang Univ., Beijing, China
Xin Zhang, State Key Lab. of Virtual Reality Technol. & Syst., Beihang Univ., Beijing, China
Yuru Zhang, State Key Lab. of Virtual Reality Technol. & Syst., Beihang Univ., Beijing, China
Jing Xiao, Dept. of Comput. Sci., Univ. of North Carolina, Charlotte, NC, USA
pp. 167-180
M. B. Kocsis, Aircell, Broomfield, CO, USA
S. A. Cholewiak, Dept. of Psychol., Rutgers Univ., Piscataway, NJ, USA
R. M. Traylor, Battelle Memorial Inst., Huntsville, AL, USA
B. D. Adelstein, Human Syst. Integration Div., NASA Ames Res. Center, Moffett Field, CA, USA
E. Daniel Hirleman, Sch. of Eng., Univ. of California, Merced, Merced, CA, USA
H. Z. Tan, Haptic Interface Res. Lab., Purdue Univ., West Lafayette, IN, USA
pp. 181-192
F. Danieau, Technicolor Res. & Innovation, INRIA Rennes, Cesson-Sevigne, France
A. Lecuyer, INRIA, Rennes, France
P. Guillotel, Technicolor Res. & Innovation, Cesson-Sevigne, France
J. Fleureau, Technicolor Res. & Innovation, Cesson-Sevigne, France
N. Mollet, Technicolor Res. & Innovation, Cesson-Sevigne, France
M. Christie, IRISA, Rennes, France
pp. 193-205
E. Berdahl, Dept. of Music, Stanford Univ., Stanford, CA, USA
J. O. Smith, Dept. of Music, Stanford Univ., Stanford, CA, USA
S. Weinzierl, Audio Commun. Group, Tech. Univ. of Berlin, Berlin, Germany
G. Niemeyer, Willow Garage Res. Lab. in Menlo Park, Menlo Park, CA, USA
pp. 206-216
A. Talasaz, Dept. of Electr. & Comput. Eng., Western Univ., London, ON, Canada
R. V. Patel, Dept. of Electr. & Comput. Eng., Western Univ., London, ON, Canada
pp. 217-228
A. Haddadi, Dept. of Mech. Eng., Univ. of British Columbia, Vancouver, BC, Canada
K. Hashtrudi-Zaad, Dept. of Electr. & Comput. Eng., Queen's Univ., Kingston, ON, Canada
pp. 229-241
J. G. W. Wildenbeest, Dept. of Biomech. Eng., Delft Univ. of Technol., Delft, Netherlands
D. A. Abbink, Dept. of Biomech. Eng., Delft Univ. of Technol., Delft, Netherlands
C. J. M. Heemskerk, Heemskerk Innovative Technol. B.V., Noordwijk, Netherlands
F. C. T. van der Helm, Heemskerk Innovative Technol. B.V., Noordwijk, Netherlands
H. Boessenkool, FOM Inst. Differ, Assoc. EUROATOMFOM, Nieuwegein, Netherlands
pp. 242-252
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