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Issue No.04 - April (vol.25)
ISSN: 1045-9219
TABLE OF CONTENTS
Haiying Shen , Dept. of Electr. & Comput. Eng., Clemson Univ., Clemson, SC, USA
pp. 828-839
Shaojun Wei , Inst. of Microelectron., Tsinghua Univ., Beijing, China
pp. 840-850
Albert Y. Zomaya , Sch. of Inf. Technol., Univ. of Sydney, Sydney, NSW, Australia
pp. 851-861
Guoxin Liu , Dept. of Electr. & Comput. Eng., Clemson Univ., Clemson, SC, USA
pp. 862-875
Xiaobo Zhou , Dept. of Comput. Sci., Univ. of Colorado, Colorado Springs, CO, USA
pp. 876-886
Danny Sutanto , Sch. of Electr., Univ. of Wollongong, Wollongong, NSW, Australia
pp. 887-897
Mahesh V. Tripunitara , Dept. of Electr. & Comput. Eng., Univ. of Waterloo, Waterloo, ON, Canada
pp. 898-907
Boleslaw K. Szymanski , Dept. of Comput. Sci., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 919-928
Kai Wang , Sch. of Software & Microelectron., Peking Univ., Beijing, China
pp. 929-938
Jie Wu , Dept. of Comput. & Inf. Sci., Temple Univ., Philadelphia, PA, USA
pp. 939-949
Tongtong Li , Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
pp. 950-959
Dan Feng , Sch. of Comput. Sci. & Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China
pp. 960-970
Keqin Li , Dept. of Comput. Sci., State Univ. of New York, New Paltz, NY, USA
pp. 971-981
Lionel Ni , Hong Kong Univ. of Sci. & Technol., Hong Kong, China
pp. 982-992
Francois Tessier , INRIA Bordeaux Sud-Ouest, Talence, France
pp. 993-1002
Mo Li , Sch. of Comput. Eng., Nanyang Technol. Univ., Singapore, Singapore
pp. 1003-1013
Matteo Sereno , Dipt. di Inf., Univ. di Torino, Turin, Italy
pp. 1014-1023
Kang G. Shin , Dept. of Electr. Eng. & Comput. Sci., Univ. of Michigan, Ann Arbor, MI, USA
pp. 1024-1033
Majeed M. Hayat , Dept. of Electr. & Comput. Eng., Univ. of New Mexico, Albuquerque, NM, USA
pp. 1034-1043
Anand Tripathi , Dept. of Comput. Sci., Univ. of Minnesota, Minneapolis, MN, USA
pp. 1044-1054
Xianghui Cao , Dept. of Control Sci. & Eng., Zhejiang Univ., Hangzhou, China
pp. 1055-1065
Jin Li , Microsoft Res., Redmond, WA, USA
pp. 1066-1077
Ulrich Schmid , Embedded Comput. Syst. Group, Vienna Univ. of Technol., Vienna, Austria
pp. 1078-1088
Bo Li , Dept. of Comput. Sci. & Eng., Hong Kong Univ. of Sci. & Technol. (HKUST), Kowloon, China
pp. 1089-1100
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