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IEEE Transactions on Parallel and Distributed Systems
April 2014 (vol. 25 no. 4)
ISSN: 1045-9219
Table of Contents
Papers
Lionel Ni, Hong Kong Univ. of Sci. & Technol., Hong Kong, China
Lei Chen, Hong Kong Univ. of Sci. & Technol., Hong Kong, China
Lei Kang, Hong Kong Univ. of Sci. & Technol., Hong Kong, China
Siyuan Liu, Heinz Coll., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 982-992
Anand Tripathi, Dept. of Comput. Sci., Univ. of Minnesota, Minneapolis, MN, USA
Vinit Padhye, Dept. of Comput. Sci., Univ. of Minnesota, Minneapolis, MN, USA
pp. 1044-1054
Mo Li, Sch. of Comput. Eng., Nanyang Technol. Univ., Singapore, Singapore
Yuan He, Sch. of Software, Tsinghua Univ., Beijing, China
Wei Dong, Coll. of Comput. Sci., Zhejiang Univ., Hangzhou, China
Yunhao Liu, Sch. of Software, Tsinghua Univ., Beijing, China
Jiliang Wang, Sch. of Software, Tsinghua Univ., Beijing, China
pp. 1003-1013
Keqin Li, Dept. of Comput. Sci., State Univ. of New York, New Paltz, NY, USA
Weimin Zheng, Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
Yongwei Wu, Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
Yulai Yuan, Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
pp. 971-981
Shaojun Wei, Inst. of Microelectron., Tsinghua Univ., Beijing, China
Fang Wang, Res. Inst. of Inf. Technol., Tsinghua Univ., Beijing, China
Zhaolin Li, Res. Inst. of Inf. Technol., Tsinghua Univ., Beijing, China
Guoyue Jiang, Inst. of Microelectron., Tsinghua Univ., Beijing, China
pp. 840-850
Xiaobo Zhou, Dept. of Comput. Sci., Univ. of Colorado, Colorado Springs, CO, USA
Changjun Jiang, Dept. of Comput. Sci. & Technol., Tongji Univ., Shanghai, China
Palden Lama, Dept. of Comput. Sci., Univ. of Colorado, Colorado Springs, CO, USA
Yanfei Guo, Dept. of Comput. Sci., Univ. of Colorado, Colorado Springs, CO, USA
pp. 876-886
Mahesh V. Tripunitara, Dept. of Electr. & Comput. Eng., Univ. of Waterloo, Waterloo, ON, Canada
Jeffrey Lok Tin Woo, Dept. of Electr. & Comput. Eng., Univ. of Waterloo, Waterloo, ON, Canada
pp. 898-907
Eyuphan Bulut, Cisco Syst., Richardson, TX, USA
Boleslaw K. Szymanski, Dept. of Comput. Sci., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 919-928
Majeed M. Hayat, Dept. of Electr. & Comput. Eng., Univ. of New Mexico, Albuquerque, NM, USA
Jorge E. Pezoa, Dept. of Electr. & Comput. Eng., Univ. of New Mexico, Albuquerque, NM, USA
pp. 1034-1043
Ulrich Schmid, Embedded Comput. Syst. Group, Vienna Univ. of Technol., Vienna, Austria
Peter Robinson, Div. of Math. Sci., Nanyang Technol. Univ., Singapore, Singapore
Martin Biely, IC IIF LSR, EPFL, Lausanne, Switzerland
pp. 1078-1088
Matteo Sereno, Dipt. di Inf., Univ. di Torino, Turin, Italy
Marco Grangetto, Dipt. di Inf., Univ. di Torino, Turin, Italy
Rossano Gaeta, Dipt. di Inf., Univ. di Torino, Turin, Italy
Valerio Bioglio, Dipt. di Elettron. e Telecomun., Politec. di Torino, Turin, Italy
pp. 1014-1023
Minjie Zhang, Sch. of Comput. Sci. & Software Eng., Univ. of Wollongong, Wollongong, NSW, Australia
Danny Sutanto, Sch. of Electr., Univ. of Wollongong, Wollongong, NSW, Australia
Dayong Ye, Sch. of Comput. Sci. & Software Eng., Univ. of Wollongong, Wollongong, NSW, Australia
pp. 887-897
Xianghui Cao, Dept. of Control Sci. & Eng., Zhejiang Univ., Hangzhou, China
Jianping He, Dept. of Control Sci. & Eng., Zhejiang Univ., Hangzhou, China
Jiming Chen, Dept. of Control Sci. & Eng., Zhejiang Univ., Hangzhou, China
Peng Cheng, Dept. of Control Sci. & Eng., Zhejiang Univ., Hangzhou, China
pp. 1055-1065
Bo Li, Dept. of Comput. Sci. & Eng., Hong Kong Univ. of Sci. & Technol. (HKUST), Kowloon, China
Yuchen Wu, Dept. of Comput. Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China
Yanmin Zhu, Dept. of Comput. Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China
pp. 1089-1100
Guiyuan Jiang, Sch. of Comput. Sci. & Technol., Tianjin Univ., Tianjin, China
Kai Wang, Sch. of Software & Microelectron., Peking Univ., Beijing, China
Wu Jigang, Sch. of Comput. Sci. & Software Eng., Tianjin Polytech. Univ., Tianjin, China
Thambipillai Srikanthan, Sch. of Comput. Eng., Nanyang Technol. Univ., Singapore, Singapore
pp. 929-938
Guoxin Liu, Dept. of Electr. & Comput. Eng., Clemson Univ., Clemson, SC, USA
Haiying Shen, Dept. of Electr. & Comput. Eng., Clemson Univ., Clemson, SC, USA
pp. 862-875
Albert Y. Zomaya, Sch. of Inf. Technol., Univ. of Sydney, Sydney, NSW, Australia
Malith Jayasinghe, Sch. of Comput. Sci. & IT (CS&IT), RMIT Univ., Melbourne, VIC, Australia
Zahir Tari, Sch. of Comput. Sci. & IT (CS&IT), RMIT Univ., Melbourne, VIC, Australia
Panlop Zeephongsekul, Sch. of Math. & Geospatial Sci., RMIT Univ., Melbourne, VIC, Australia
pp. 851-861
Jie Wu, Dept. of Comput. & Inf. Sci., Temple Univ., Philadelphia, PA, USA
Guojun Wang, Sch. of Inf. Sci. & Eng., Central South Univ., Changsha, China
Jiannong Cao, Dept. of Comput., Hong Kong Polytech. Univ., Kowloon, China
Md Zakirul Alam Bhuiyan, Sch. of Inf. Sci. & Eng., Central South Univ., Changsha, China
pp. 939-949
Chonggang Wang, InterDigital Commun., PA, USA
Hongbo Jiang, Dept. of Electron. & Inf. Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
Guang Tan, Shenzhen Inst. of Adv. Technol., Shenzhen, China
Shengkai Zhang, Dept. of Electron. & Inf. Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
pp. 908-918
Francois Tessier, INRIA Bordeaux Sud-Ouest, Talence, France
Guillaume Mercier, INRIA Bordeaux Sud-Ouest, Talence, France
Emmanuel Jeannot, INRIA Bordeaux Sud-Ouest, Talence, France
pp. 993-1002
Mai Abdelhakim, Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
Tongtong Li, Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
Leonard E. Lightfoot, Air Force Res. Lab., Wright-Patterson AFB, OH, USA
Jian Ren, Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
pp. 950-959
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