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IEEE Transactions on Computers
April 2011 (vol. 60 no. 4)
ISSN: 0018-9340
Table of Contents
Editorial
Special Section on Chips and Architectures For Emerging Technologies and Applications
Regular Papers
Thomas J. Ashby, IMEC, Leuven
Pedro Díaz, University of Edinburgh, Edinburgh
Marcelo Cintra, University of Edinburgh, Edinburgh
pp. 472-483
Preeti Ranjan Panda, Indian Institute of Technology Delhi, New Delhi
M. Balakrishnan, Indian Institute of Technology Delhi, New Delhi
Anant Vishnoi, Indian Institute of Technology Delhi, New Delhi
pp. 484-497
Z Abid, Coll. of Nanoscale Sci. & Eng., Univ. at Albany, Albany, NY, USA
Ming Liu, Inst. of Microelectron., Chinese Acad. of Sci., Beijing, China
Wei Wang, Coll. of Nanoscale Sci. & Eng., Univ. at Albany, Albany, NY, USA
pp. 463-471
Adam B. Kinsman, McMaster University, Ontario, Canada
Nicola Nicolici, McMaster University, Ontario, Canada
pp. 498-507
Frank Olaf Sem-Jacobsen, Simula Research Laboratory , Lysaker
Tor Skeie, Simula Research Laboratory, Lysaker
Olav Lysne, Simula Research Laboratory, Lysaker
José Duato, Simula Research Laboratory, Lysaker
pp. 508-525
Lei Jin, University of Pittsburgh, Pittsburgh, PA
Sangyeun Cho, University of Pittsburgh, Pittsburgh, PA
pp. 526-537
Mohamed Khalgui, Martin Luther University, Germany
Olfa Mosbahi, University of Tunis El-Manar, Tunisia
ZhiWu Li, Martin Luther University, Germany
Hans-Michael Hanisch, Martin Luther University, Germany
pp. 538-551
Jae-Wan Jang, Korea Advanced Institute of Science and Technology (KAIST), Daejeon
Myeongjae Jeon, Rice University, Houston
Hyo-Sil Kim, Korea Advanced Institute of Science and Technology (KAIST), Daejeon
Heeseung Jo, Korea Advanced Institute of Science and Technology (KAIST), Daejeon
Jin-Soo Kim, Sungkyunkwan University, Suwon
Seungryoul Maeng, Korea Advanced Institute of Science and Technology (KAIST), Daejeon
pp. 552-564
Yong Tang, National University of Defense Technology, China
Bin Xiao, Hong Kong Polytechnic University, China
Xicheng Lu, National University of Defense Technology, China
pp. 565-579
Ping Xu, Illinois Institute of Technology, Chicago
Xiang-Yang Li, Illinois Institute of Technology, Chicago
Shaojie Tang, Illinois Institute of Technology, Chicago
JiZhong Zhao, Xi'an Jiaotong University, China
pp. 580-593
Brief Contributions
Po-Ching Lin, National Chung Cheng University, Chiayi, Taiwan
Ying-Dar Lin, National Chiao Tung University, Hsinchu, Taiwan
Yuan-Cheng Lai, National Taiwan University of Science and Technology, Taipei, Taiwan
pp. 594-601
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