|
| This Article | ||
| | ||
| Share | ||
| Bibliographic References | ||
| Add to: | ||
| | ||
| Search | ||
| ||
| ASCII Text | x | ||
| null Mou Hu, K.C. Smith, "Ternary Scan Design for VLSI Testability," IEEE Transactions on Computers, vol. 35, no. 2, pp. 167-170, February, 1986. | |||
| BibTex | x | ||
| @article{ 10.1109/TC.1986.1676735, author = {null Mou Hu and K.C. Smith}, title = {Ternary Scan Design for VLSI Testability}, journal ={IEEE Transactions on Computers}, volume = {35}, number = {2}, issn = {0018-9340}, year = {1986}, pages = {167-170}, doi = {http://doi.ieeecomputersociety.org/10.1109/TC.1986.1676735}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, } | |||
| RefWorks Procite/RefMan/Endnote | x | ||
| TY - JOUR JO - IEEE Transactions on Computers TI - Ternary Scan Design for VLSI Testability IS - 2 SN - 0018-9340 SP167 EP170 EPD - 167-170 A1 - null Mou Hu, A1 - K.C. Smith, PY - 1986 KW - VLSI KW - Multivalued signaling KW - scan design KW - ternary logic KW - testability VL - 35 JA - IEEE Transactions on Computers ER - | |||
In this correspondence, a new scheme is proposed in which ternary clocking signals are used to replace binary clocking signals in VLSI scan-testing designs. This scheme has the same advantage of high testability as the binary scan method [1], but it eliminates the mode- selecting signal line. Since this mode-selecting line must be routed to each flip-flop in the binary scan scheme, the saving is significant in reducing the circuit interconnection complexity and chip area. This correspondence describes the new ternary scheme in detail, and also suggests appropriate circuit designs using CMOS technology. Furthermore, comparisons are made between ternary scan and binary scan [3] and between ternary scan and a scan scheme using binary with a local decoder [2].
Index Terms:
VLSI, Multivalued signaling, scan design, ternary logic, testability
Citation:
null Mou Hu, K.C. Smith, "Ternary Scan Design for VLSI Testability," IEEE Transactions on Computers, vol. 35, no. 2, pp. 167-170, Feb. 1986, doi:10.1109/TC.1986.1676735
Usage of this product signifies your acceptance of the Terms of Use.

