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| ASCII Text | x | ||
| K.A. Chen, "Computer Aided Memory Design Using Transmission Line Models," IEEE Transactions on Computers, vol. 17, no. 7, pp. 640-648, July, 1968. | |||
| BibTex | x | ||
| @article{ 10.1109/TC.1968.227440, author = {K.A. Chen}, title = {Computer Aided Memory Design Using Transmission Line Models}, journal ={IEEE Transactions on Computers}, volume = {17}, number = {7}, issn = {0018-9340}, year = {1968}, pages = {640-648}, doi = {http://doi.ieeecomputersociety.org/10.1109/TC.1968.227440}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, } | |||
| RefWorks Procite/RefMan/Endnote | x | ||
| TY - JOUR JO - IEEE Transactions on Computers TI - Computer Aided Memory Design Using Transmission Line Models IS - 7 SN - 0018-9340 SP640 EP648 EPD - 640-648 A1 - K.A. Chen, PY - 1968 KW - Index terms?Distributed parameter KW - mathematical models KW - memory analysis KW - memory array models KW - memory design KW - memory simulation KW - transmission line models. VL - 17 JA - IEEE Transactions on Computers ER - | |||
Abstract?This paper describes a computer program for analyzing a class of transmission line configurations which arise in the design of memory arrays. The systems analyzed by the program consist of interconnected pairs of mutually coupled distributed parameter transmission lines driven and terminated by linear lumped element networks. A brief discussion of the mathematical model and its implementation is given and applications of the program to the design of 2?D and 3D memory arrays are described. The applications illustrate how the program can be used to evaluate pulse propagation characteristics and noise generation mechanisms within a memory array.
Index Terms:
Index terms?Distributed parameter, mathematical models, memory analysis, memory array models, memory design, memory simulation, transmission line models.
Citation:
K.A. Chen, "Computer Aided Memory Design Using Transmission Line Models," IEEE Transactions on Computers, vol. 17, no. 7, pp. 640-648, July 1968, doi:10.1109/TC.1968.227440
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