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IEEE Transactions on Services Computing
July-Sept. 2013 (vol. 6 no. 3)
ISSN: 1939-1374
Table of Contents
Regular Papers
Zibin Zheng, The Chinese University of Hong Kong , HK
Hao Ma, Microsoft Research, Redmond
Michael R. Lyu, The Chinese University of Hong Kong, Shatin
Irwin King, The Chinese University of Hong Kong, Shatin
pp. 289-299
Ki-Woong Park, Korea Advanced Institute of Science and Technology, Daejeon
Jaesun Han, NexR Corporation, Seoul
JaeWoong Chung, Intel Co. Ltd., Santa Clara
Kyu Ho Park, Korea Advanced Institute of Science and Technology, Daejeon
pp. 300-313
Xing Pu, Beijing Institute of Technology, Beijing
Ling Liu, Georgia Institute of Technology, Atlanta
Yiduo Mei, Xi'An Jiaotong University, Shanxi
Sankaran Sivathanu, Georgia Institute of Technology, Atlanta
Younggyun Koh, Georgia Institute of Technology, Atlanta
Calton Pu, Georgia Institute of Technology, Atlanta
Yuanda Cao, Beijing Institute of Technology, Beijing
pp. 314-329
Wei She, University of Texas at Dallas, Richardson
I-Ling Yen, University of Texas at Dallas, Richardson
Bhavani Thuraisingham, University of Texas at Dallas, Richardson
Elisa Bertino, Purdue University, West Lafayette
pp. 330-343
Xiuguo Zhang, Dalian Maritime University, Dalian
Hongbo Liu, Dalian Maritime University, Dalian
Ajith Abraham, Machine Intelligence Research Labs, Seattle
pp. 344-357
An Liu, University of Science and Technology of China, Hefei and University of Science and Technology of China, Suzhou
Qing Li, City University of Hong Kong, Hong Kong and USTC-CityU Joint Advanced Research Center, Suzhou
Liusheng Huang, University of Science and Technology of China, Hefei and University of Science and Technology of China, Suzhou
Shi Ying, Wuhan University, Wuhan
Mingjun Xiao, University of Science and Technology of China, Hefei and University of Science and Technology of China, Suzhou
pp. 387-399
Gibson Lam, Hong Kong University of Science and Technology, Hong Kong
David Rossiter, Hong Kong University of Science and Technology, Hong Kong
pp. 400-413
Chiara Sandionigi, Politecnico di Milano, Milano
Danilo Ardagna, Politecnico di Milano, Milano
Gianpaolo Cugola, Politecnico di Milano, Milano
Carlo Ghezzi, Politecnico di Milano, Milano
pp. 414-428
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