ISBN: 0-8186-7000-2

D.E. Long, AT&T Bell Labs., Murray Hill, NJ, USA

M.A. Iyer, AT&T Bell Labs., Murray Hill, NJ, USA

M. Abramovici, AT&T Bell Labs., Murray Hill, NJ, USA

Srimat T. Chakradhar

Steven G. Rothweiler

M.C. Hansen, Advanced Comput. Archit. Lab., Michigan Univ., Ann Arbor, MI, USA

J.P. Hayes, Advanced Comput. Archit. Lab., Michigan Univ., Ann Arbor, MI, USA

F. Corno, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy

P. Prinetto, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy

M. Rebaudengo, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy

M.S. Reorda, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy

E. Veiluva, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy

D. Gizopoulos, Inst. of Informatics & Telecommun., NCSR Demokritos, Attiki, Greece

D. Nikolos, Inst. of Informatics & Telecommun., NCSR Demokritos, Attiki, Greece

A. Paschalis, Inst. of Informatics & Telecommun., NCSR Demokritos, Attiki, Greece

A. Balivada, Comput. Eng. Res. Center, Texas Univ., Austin, TX, USA

Y. Hoskote, Comput. Eng. Res. Center, Texas Univ., Austin, TX, USA

J.A. Abraham, Comput. Eng. Res. Center, Texas Univ., Austin, TX, USA

D. Vazquez, Dpto. de Diseno Analogico, Univ. de Sevilla, Spain

A. Rueda, Dpto. de Diseno Analogico, Univ. de Sevilla, Spain

J.L. Huertas, Dpto. de Diseno Analogico, Univ. de Sevilla, Spain

S. Khaled, Ecole Polytech., Montreal, Que., Canada

B. Kaminska, Ecole Polytech., Montreal, Que., Canada

B. Courtois, Ecole Polytech., Montreal, Que., Canada

M. Lubaszewski, Ecole Polytech., Montreal, Que., Canada

S. Sunter, Telecom Microelectron. Centre, Northern Telecom Electron. Ltd., Nepean, Ont., Canada

L. Sebaa, Western Digital Corp., Irvine, CA, USA

N. Gardner, Western Digital Corp., Irvine, CA, USA

R. Neidorff, Western Digital Corp., Irvine, CA, USA

R. Valley, Western Digital Corp., Irvine, CA, USA

L.-C. Wang, Texas Univ., Austin, TX, USA

P.R. Mercer, Texas Univ., Austin, TX, USA

S.W. Kao, Texas Univ., Austin, TX, USA

T.W. Williams, Texas Univ., Austin, TX, USA

P.C. Maxwell, Hewlett-Packard Co., USA

V. Dabholkar, State Univ. of New York, Buffalo, NY, USA

S. Chakravarty, State Univ. of New York, Buffalo, NY, USA

J. Najm, State Univ. of New York, Buffalo, NY, USA

J. Patel, State Univ. of New York, Buffalo, NY, USA

J.A. Segura, Dept. of Phys., Balearic Islands Univ., Palma de Mallorca, Spain

M. Roca, Dept. of Phys., Balearic Islands Univ., Palma de Mallorca, Spain

D. Mateo, Dept. of Phys., Balearic Islands Univ., Palma de Mallorca, Spain

A. Rubio, Dept. of Phys., Balearic Islands Univ., Palma de Mallorca, Spain

J. Arguelles, Dept. de Electron., Cantabria Univ., Santander, Spain

M.J. Lopez, Dept. de Electron., Cantabria Univ., Santander, Spain

J. Blanco, Dept. de Electron., Cantabria Univ., Santander, Spain

M. Martinez, Dept. de Electron., Cantabria Univ., Santander, Spain

S. Bracho, Dept. de Electron., Cantabria Univ., Santander, Spain

J. Savir, IBM Corp., Hopewell Junction, NY, USA

A.P. Stroele, Inst. of Comput. Design & Fault Tolerance, Karlsruhe Univ., Germany

S.K. Mukund, Center for Reliable Comput., Stanford Univ., CA, USA

E.J. McCluskey, Center for Reliable Comput., Stanford Univ., CA, USA

T.R.N. Rao, Center for Reliable Comput., Stanford Univ., CA, USA

N. Mukherjee, Microelectron. & Comput. Syst. Lab., McGill Univ., Montreal, Que., Canada

H. Kassab, Microelectron. & Comput. Syst. Lab., McGill Univ., Montreal, Que., Canada

J. Rajski, Microelectron. & Comput. Syst. Lab., McGill Univ., Montreal, Que., Canada

J. Tyszer, Microelectron. & Comput. Syst. Lab., McGill Univ., Montreal, Que., Canada

J.A. Floyd, Semicond Product Center, Motorola Inc., Austin, TX, USA

M. Perry, Semicond Product Center, Motorola Inc., Austin, TX, USA

H. Yotsuyanagi, Dept. of Appl. Phys., Osaka Univ., Japan

S. Kajihara, Dept. of Appl. Phys., Osaka Univ., Japan

K. Kinoshita, Dept. of Appl. Phys., Osaka Univ., Japan

F.F. Hsu, Center for Reliable & High Performance Comput., Illinois Univ., Urbana, IL, USA

J.H. Patel, Center for Reliable & High Performance Comput., Illinois Univ., Urbana, IL, USA

Ting-Yu Kuo, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA

Chun-Yeh Liu, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA

K.K. Saluja, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA

K. Vahidi, Dept. of Comput. Sci. & Eng., California Univ., San Diego, La Jolla, CA, USA

A. Orailoglu, Dept. of Comput. Sci. & Eng., California Univ., San Diego, La Jolla, CA, USA

Xinli Gu, Dept. of Comput. & Inf. Sci., Linkoping Univ., Sweden

M. Renovell, Lab. d'Informatique, Robotique et Microelectronique, Univ. des Sci. et Tech. du Languedoc, Montpellier, France

P. Huc, Lab. d'Informatique, Robotique et Microelectronique, Univ. des Sci. et Tech. du Languedoc, Montpellier, France

Y. Bertrand, Lab. d'Informatique, Robotique et Microelectronique, Univ. des Sci. et Tech. du Languedoc, Montpellier, France

Ding Lu, Dept. of Electr. Eng., Colorado State Univ., Fort Collins, CO, USA

C.Q. Tong, Dept. of Electr. Eng., Colorado State Univ., Fort Collins, CO, USA

S.R. Makar, Center for Reliable Comput., Stanford Univ., CA, USA

E.J. McCluskey, Center for Reliable Comput., Stanford Univ., CA, USA

V.H. Champac, Inst. Nacional de Astrofisica, Opt. y Electron., Puebla, Mexico

J. Figueras, Inst. Nacional de Astrofisica, Opt. y Electron., Puebla, Mexico

P. Liden, Dept. of Comput. Eng., Chalmers Univ. of Technol., Goteborg, Sweden

P. Dahlgren, Dept. of Comput. Eng., Chalmers Univ. of Technol., Goteborg, Sweden

T.J. Chakraborty, AT&T Bell Labs., Princeton, NJ, USA

V.D. Agrawal, AT&T Bell Labs., Princeton, NJ, USA

R. Nair, Synopsys Inc., Mountain View, CA, USA

Dong Sam Ha, Synopsys Inc., Mountain View, CA, USA

M. Riedel, MACS Lab., McGill Univ., Montreal, Que., Canada

J. Rajski, MACS Lab., McGill Univ., Montreal, Que., Canada

A. Bogliolo, DEIS, Bologna Univ., Italy

M. Damiani, DEIS, Bologna Univ., Italy

P. Olivo, DEIS, Bologna Univ., Italy

B. Ricco, DEIS, Bologna Univ., Italy

C.E. Stroud, Dept. of Electr. Eng., Kentucky Univ., Lexington, KY, USA

T.R. Damarla, Dept. of Electr. Eng., Kentucky Univ., Lexington, KY, USA

S. Edirisooriya, Motorola Comput. Group, USA

G. Edirisooriya, Motorola Comput. Group, USA

T. Liu, Dept. of Comput. Sci., Texas A&M Univ., College Station, TX, USA

F. Lombardi, Dept. of Comput. Sci., Texas A&M Univ., College Station, TX, USA

J. Salinas, Dept. of Comput. Sci., Texas A&M Univ., College Station, TX, USA

C. Thibeault, Dept. of Electr. Eng., Ecole de Technol. Superieure, Montreal, Que., Canada

S. Narayanan, Sun Microsyst. Inc., Mountain View, CA, USA

M.A. Breuer, Sun Microsyst. Inc., Mountain View, CA, USA

Kwang-Ting Cheng, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA

A. Khoche, Dept. of Comput. Sci., Utah Univ., Salt Lake City, UT, USA

E. Brunvand, Dept. of Comput. Sci., Utah Univ., Salt Lake City, UT, USA

M. Soufi, Ecole Polytech. de Montreal, Que., Canada

Y. Savaria, Ecole Polytech. de Montreal, Que., Canada

B. Kaminska, Ecole Polytech. de Montreal, Que., Canada

O.A. Petlin, Dept. of Comput. Sci., Manchester Univ., UK

S.B. Furber, Dept. of Comput. Sci., Manchester Univ., UK

M. Dalpasso, Dipartimento di Elettronica Inf. e Sistemistica, Bologna Univ., Italy

M. Favalli, Dipartimento di Elettronica Inf. e Sistemistica, Bologna Univ., Italy

P. Olivo, Dipartimento di Elettronica Inf. e Sistemistica, Bologna Univ., Italy

R.S. Reddy, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA

I. Pomeranz, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA

S.M. Reddy, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA

S. Kajihara, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA

U. Mahlstedt, Inst. fur Theor. Elektrotech., Hannover Univ., Germany

J. Alt, Inst. fur Theor. Elektrotech., Hannover Univ., Germany

M. Heinitz, Inst. fur Theor. Elektrotech., Hannover Univ., Germany

J. Rius, Dept. d'Enginyeria Electron., Univ. Politecnica de Catalunya, Barcelona, Spain

J. Figueras, Dept. d'Enginyeria Electron., Univ. Politecnica de Catalunya, Barcelona, Spain

M.B. Santos, INESC, Lisbon, Portugal

M. Simoes, INESC, Lisbon, Portugal

I. Teixeira, INESC, Lisbon, Portugal

J.P. Teixeira, INESC, Lisbon, Portugal

F. Corno, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy

P. Prinetto, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy

M. Sonza Reorda, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy

U. Glaser, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy

H.T. Vierhaus, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy

T. Inoue, Grad. Sch. of Inf. Sci., Nara Inst. of Sci. & Technol., Japan

H. Maeda, Grad. Sch. of Inf. Sci., Nara Inst. of Sci. & Technol., Japan

H. Fujiwara, Grad. Sch. of Inf. Sci., Nara Inst. of Sci. & Technol., Japan

A. Zemva, Ljubljana Univ., Slovenia

F. Brglez, Ljubljana Univ., Slovenia

M.H. Konijnenburg, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands

J.T. van der Linden, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands

A.J. van de Goor, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands

B. Vinnakota, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA

N.J. Stessman, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA

A. Krstic, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA

Kwang-Ting Cheng, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA

P. Girard, Lab. d'Inf. de Robotique et de Microelectron., Univ. des Sci. et Tech. du Languedoc, Montpellier, France

C. Landrault, Lab. d'Inf. de Robotique et de Microelectron., Univ. des Sci. et Tech. du Languedoc, Montpellier, France

S. Pravossoudovitch, Lab. d'Inf. de Robotique et de Microelectron., Univ. des Sci. et Tech. du Languedoc, Montpellier, France

B. Rodriguez, Lab. d'Inf. de Robotique et de Microelectron., Univ. des Sci. et Tech. du Languedoc, Montpellier, France

H. Hengster, Dept. of Comput. Sci., Frankfurt Univ., Germany

R. Drechsler, Dept. of Comput. Sci., Frankfurt Univ., Germany

B. Becker, Dept. of Comput. Sci., Frankfurt Univ., Germany

I.P. Shaik, Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA

M.L. Bushnell, Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA

W. Ke, Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA

P.R. Menon, Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA

N.A. Touba, Dept. of Electr. Eng., Stanford Univ., CA, USA

E.J. McCluskey, Dept. of Electr. Eng., Stanford Univ., CA, USA

M. Chatterjee, Dept. of Comput. Sci., Texas A&M Univ., College Station, TX, USA

D.K. Pradhan, Dept. of Comput. Sci., Texas A&M Univ., College Station, TX, USA

N. Zacharia, Microelectron. & Comput. Syst. Lab., McGill Univ., Montreal, Que., Canada

J. Rajski, Microelectron. & Comput. Syst. Lab., McGill Univ., Montreal, Que., Canada

J. Tyszer, Microelectron. & Comput. Syst. Lab., McGill Univ., Montreal, Que., Canada

S. Lejmi, Ecole Polytech. de Montreal, Que., Canada

B. Kaminska, Ecole Polytech. de Montreal, Que., Canada

B. Ayari, Ecole Polytech. de Montreal, Que., Canada

G. Kemnitz, Inst. fur Tech. Inf., Tech. Univ. Dresden, Germany

S.K. Shoukourian, Dept. of Comput. Sci. & Numerical Math., Yerevan State Univ., Armenia

A.G. Kostanian, Dept. of Comput. Sci. & Numerical Math., Yerevan State Univ., Armenia

V.A. Margarian, Dept. of Comput. Sci. & Numerical Math., Yerevan State Univ., Armenia

A.A. Ashour, Dept. of Comput. Sci. & Numerical Math., Yerevan State Univ., Armenia

A. Bogliolo, Dipartimento di Elettronica Inf. e Sistemistica, Bologna Univ., Italy

M. Damiani, Dipartimento di Elettronica Inf. e Sistemistica, Bologna Univ., Italy

B. Hamdi

H. Bederr

M. Nicolaidis

S. Brown, AMCC, San Diego, CA, USA

G. Gutierrez, AMCC, San Diego, CA, USA

R. Nelson, AMCC, San Diego, CA, USA

C. VanKrevelen, AMCC, San Diego, CA, USA

W.W. Weber, Dept. of Electr. Eng., Auburn Univ., AL, USA

A.D. Singh, Dept. of Electr. Eng., Auburn Univ., AL, USA

J. Carletta, Dept. of Comput. Eng. & Sci., Case Western Reserve Univ., Cleveland, OH, USA

C. Papachristou, Dept. of Comput. Eng. & Sci., Case Western Reserve Univ., Cleveland, OH, USA