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  • 1993 IEEE Virtual Reality Annual International Symposium
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1993 IEEE Virtual Reality Annual International Symposium
Seattle, WA, USA
September 18-September 22
ISBN: 0-7803-1363-1
Table of Contents
Papers
K.-I. Kameyama, Toshiba Corp., Kawasaki, Japan
K. Ohtomi, Toshiba Corp., Kawasaki, Japan
pp. 519-524
T. Poston, Inst. of Syst. Sci., Nat. Singapore Univ., Singapore
K.M. Fairchild, Inst. of Syst. Sci., Nat. Singapore Univ., Singapore
pp. 512-518
K. Yamamoto, Dept. of Inf. Electron., Nagoya Univ., Chikusa-ku, Nagoya, Japan
A. Ishiguro, Dept. of Inf. Electron., Nagoya Univ., Chikusa-ku, Nagoya, Japan
Y. Uchikawa, Dept. of Inf. Electron., Nagoya Univ., Chikusa-ku, Nagoya, Japan
pp. 505-511
J. Yamashita, Nat. Inst. of Biosci.&Human-Technol., Tsukuba, Ibaraki, Japan
Y. Fukui, Nat. Inst. of Biosci.&Human-Technol., Tsukuba, Ibaraki, Japan
pp. 499-504
A. Chanezon, ATR Commun. Syst. Res. Lab., Kyoto, Japan
H. Takemura, ATR Commun. Syst. Res. Lab., Kyoto, Japan
Y. Kitamura, ATR Commun. Syst. Res. Lab., Kyoto, Japan
F. Kishino, ATR Commun. Syst. Res. Lab., Kyoto, Japan
pp. 492-498
T.P. Caudell, Boeing Comput. Services, Seattle, WA, USA
A.L. Janin, Boeing Comput. Services, Seattle, WA, USA
S.K. Johnson, Boeing Comput. Services, Seattle, WA, USA
pp. 478-485
J.A. Dickerson, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
B. Kosko, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 471-477
C. Shaw, Dept. of Comput. Sci., Alberta Univ., Edmonton, Alta., Canada
M. Green, Dept. of Comput. Sci., Alberta Univ., Edmonton, Alta., Canada
pp. 463-469
M.C. Stanley, Dept. of Mech. Eng., Northwestern Univ., Evanston, IL, USA
J.E. Colgate, Dept. of Mech. Eng., Northwestern Univ., Evanston, IL, USA
pp. 456-462
J. Calvin, LORAL Adv. Distributed Simulation, Inc., Cambridge, MA, USA
A. Dickens, LORAL Adv. Distributed Simulation, Inc., Cambridge, MA, USA
B. Gaines, LORAL Adv. Distributed Simulation, Inc., Cambridge, MA, USA
P. Metzger, LORAL Adv. Distributed Simulation, Inc., Cambridge, MA, USA
D. Miller, LORAL Adv. Distributed Simulation, Inc., Cambridge, MA, USA
D. Owen, LORAL Adv. Distributed Simulation, Inc., Cambridge, MA, USA
pp. 450-455
H. Elsimary, Electron. Res. Inst., Cairo, Egypt
S. Mashali, Electron. Res. Inst., Cairo, Egypt
pp. 436-441
D.T. Chen, Thayer Sch. of Eng., Dartmouth Coll., NH, USA
S.D. Pieper, Thayer Sch. of Eng., Dartmouth Coll., NH, USA
pp. 429-435
S.K. Singh, Thayer Sch. of Eng., Dartmouth Coll., Hanover, NH, USA
A. Kumar, Thayer Sch. of Eng., Dartmouth Coll., Hanover, NH, USA
L. Shi, Thayer Sch. of Eng., Dartmouth Coll., Hanover, NH, USA
pp. 422-428
J.-H. Youn, Dept. of Comput. Sci., Korea Adv. Inst. of Sci.&Technol., Taejon, South Korea
K. Wohn, Dept. of Comput. Sci., Korea Adv. Inst. of Sci.&Technol., Taejon, South Korea
pp. 415-421
J. Ohya, ATR Commun. Syst. Res. Lab., Kyoto, Japan
Y. Kitamura, ATR Commun. Syst. Res. Lab., Kyoto, Japan
H. Takemura, ATR Commun. Syst. Res. Lab., Kyoto, Japan
F. Kishino, ATR Commun. Syst. Res. Lab., Kyoto, Japan
N. Terashima, ATR Commun. Syst. Res. Lab., Kyoto, Japan
pp. 408-414
C.F. Codella, IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
R. Jalili, IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
L. Koved, IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
J.B. Lewis, IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 401-407
C. Carlsson, Swedish Inst. of Comput. Sci., Kista, Sweden
O. Hagsand, Swedish Inst. of Comput. Sci., Kista, Sweden
pp. 394-400
S.A. Su, Dept. of Comput. Sci., Maryland Univ., College Park, MD, USA
pp. 387-393
W.D. Curtis, Boeing Comput. Services, Seattle, WA, USA
A.L. Janin, Boeing Comput. Services, Seattle, WA, USA
K. Zikan, Boeing Comput. Services, Seattle, WA, USA
pp. 377-385
M.F. Deering, Sun Microsystems Comput. Corp., Mountain View, CA, USA
pp. 357-363
M. Nelson, Defence Sci.&Technol. Organ., Salisbury, SA, Australia
pp. 349-355
J. Emhardt, Dept. of Comput. Sci., Freie Univ. Berlin, Germany
J. Semmler, Dept. of Comput. Sci., Freie Univ. Berlin, Germany
T. Strothotte, Dept. of Comput. Sci., Freie Univ. Berlin, Germany
pp. 342-348
M. Ishii, Precision&Intelligence Lab., Tokyo Inst. of Technol., Midoriku, Yokohama, Japan
M. Sato, Precision&Intelligence Lab., Tokyo Inst. of Technol., Midoriku, Yokohama, Japan
pp. 331-335
B. Soderberg, LORAL Adv. Distributed Simulation, Bellevue, WA, USA
D. Miller, LORAL Adv. Distributed Simulation, Bellevue, WA, USA
pp. 318-329
R.D. Bess, Loral Adv. Distributed Simulation, Bellevue, WA, USA
pp. 308-317
B.A. Reichlen, Sun Microsystems Lab., Inc., Chelmsford, MA, USA
pp. 300-307
M. Regan, Dept. of Comput. Sci., Monash Univ., Clayton, Vic., Australia
R. Pose, Dept. of Comput. Sci., Monash Univ., Clayton, Vic., Australia
pp. 293-299
H. Iwata, Inst. of Eng. Mech., Tsukuba Univ., Japan
pp. 287-292
M. Bostrom, Thayer Sch. of Eng., Dartmouth Coll., Hanover, NH, USA
S.K. Singh, Thayer Sch. of Eng., Dartmouth Coll., Hanover, NH, USA
pp. 280-286
K. Hirota, Dept. of Mechano-Inf., Toyko Univ., Japan
M. Hirose, Dept. of Mechano-Inf., Toyko Univ., Japan
pp. 256-262
A.L. Janin, Boeing Comput. Services, Seattle, WA, USA
D.W. Mizell, Boeing Comput. Services, Seattle, WA, USA
T.P. Caudell, Boeing Comput. Services, Seattle, WA, USA
pp. 246-255
E.K. Edwards, Dept. of Comput. Sci., North Carolina Univ., Chapel Hill, NC, USA
J.P. Rolland, Dept. of Comput. Sci., North Carolina Univ., Chapel Hill, NC, USA
K.P. Keller, Dept. of Comput. Sci., North Carolina Univ., Chapel Hill, NC, USA
pp. 223-233
P.A. Millman, Dept. of Mech. Eng., Northwestern Univ., Evanston, IL, USA
M. Stanley, Dept. of Mech. Eng., Northwestern Univ., Evanston, IL, USA
J.E. Colgate, Dept. of Mech. Eng., Northwestern Univ., Evanston, IL, USA
pp. 216-222
J.E. Colgate, Dept. of Mech. Eng., Northwestern Univ., Evanston, IL, USA
P.E. Grafing, Dept. of Mech. Eng., Northwestern Univ., Evanston, IL, USA
M.C. Stanley, Dept. of Mech. Eng., Northwestern Univ., Evanston, IL, USA
G. Schenkel, Dept. of Mech. Eng., Northwestern Univ., Evanston, IL, USA
pp. 202-208
J. Chen, Wisconsin Univ., Madison, WI, USA
B.D. Van Veen, Wisconsin Univ., Madison, WI, USA
K.E. Hecox, Wisconsin Univ., Madison, WI, USA
pp. 188-193
T. Yonekura, Dept. of Comput.&Inf. Sci., Ibaraki, Univ., Japan
N. Ariyoshi, Dept. of Comput.&Inf. Sci., Ibaraki, Univ., Japan
Y. Watanabe, Dept. of Comput.&Inf. Sci., Ibaraki, Univ., Japan
pp. 183-187
S.T. Pope, DSLab, Swedish Inst. for Comput. Sci., Kista, Sweden
L.E. Fahlen, DSLab, Swedish Inst. for Comput. Sci., Kista, Sweden
pp. 176-182
Y. Adachi, Suzuki Motor Corp., Yokohama, Japan
pp. 162-168
S. Zhai, Dept. of Ind. Eng., Toronto Univ., Ont., Canada
P. Milgram, Dept. of Ind. Eng., Toronto Univ., Ont., Canada
pp. 155-161
S. Kandel, Inst. de la Commun. Parlee, Stendhal Univ., Grenoble, France
L.-J. Boe, Inst. de la Commun. Parlee, Stendhal Univ., Grenoble, France
pp. 148-154
M.F. Deering, Sun Microsystems Comput. Corp., Mountain View, CA, USA
pp. 141-147
H.A. Sowizral, Boeing Comput. Services, Seattle, WA, USA
pp. 132-139
M. Hirose, Dept. of Mechano-Inf., Tokyo Univ., Japan
K. Yokoyama, Dept. of Mechano-Inf., Tokyo Univ., Japan
S.-I. Sato, Dept. of Mechano-Inf., Tokyo Univ., Japan
pp. 125-131
D. Song, Nat. Center for Supercomput. Applications, Illinois Univ., Urbana, IL, USA
M. Norman, Nat. Center for Supercomput. Applications, Illinois Univ., Urbana, IL, USA
pp. 111-117
F. Arai, Dept. of Mechano-Inf.&Syst., Nagoya Univ., Japan
T. Fukuda, Dept. of Mechano-Inf.&Syst., Nagoya Univ., Japan
Y. Yamamoto, Dept. of Mechano-Inf.&Syst., Nagoya Univ., Japan
pp. 104-110
C. Stary, CD-Lab for Expert Syst., Vienna Univ. of Technol., Austria
pp. 97-103
M. Slater, Dept. of Comput. Sci., QMW Univ. of London, UK
M. Usoh, Dept. of Comput. Sci., QMW Univ. of London, UK
pp. 90-96
J.M. Moshell, Inst. for Simulation&Training, Univ. of Central Florida, Orlando, FL, USA
B.S. Blau, Inst. for Simulation&Training, Univ. of Central Florida, Orlando, FL, USA
pp. 83-89
L.B. Rosenberg, Center for Design Res., Stanford Univ., CA, USA
pp. 76-82
C. Faigle, Northeast Parallel Archit. Center, Syracuse Univ., NY, USA
G.C. Fox, Northeast Parallel Archit. Center, Syracuse Univ., NY, USA
W. Furmanski, Northeast Parallel Archit. Center, Syracuse Univ., NY, USA
J. Niemiec, Northeast Parallel Archit. Center, Syracuse Univ., NY, USA
D.A. Simoni, Northeast Parallel Archit. Center, Syracuse Univ., NY, USA
pp. 62-68
S. Feiner, Center for Telecommun. Res., Columbia Univ., New York, NY, USA
M. Zhou, Center for Telecommun. Res., Columbia Univ., New York, NY, USA
L. Crutcher, Center for Telecommun. Res., Columbia Univ., New York, NY, USA
A. Lazar, Center for Telecommun. Res., Columbia Univ., New York, NY, USA
pp. 55-61
K.M. Fairchild, Inst. of Syst. Sci., Nat. Univ. of Singapore, Kent Ridge, Singapore
B.H. Lee, Inst. of Syst. Sci., Nat. Univ. of Singapore, Kent Ridge, Singapore
J. Loo, Inst. of Syst. Sci., Nat. Univ. of Singapore, Kent Ridge, Singapore
H. Ng, Inst. of Syst. Sci., Nat. Univ. of Singapore, Kent Ridge, Singapore
L. Serra, Inst. of Syst. Sci., Nat. Univ. of Singapore, Kent Ridge, Singapore
pp. 47-53
B.J. Shepherd, IBM Corp., Austin, TX, USA
pp. 41-46
D. Henry, Human Interface Technol. Lab., Washington Univ., Seattle, WA, USA
T. Furness, Human Interface Technol. Lab., Washington Univ., Seattle, WA, USA
pp. 33-40
S. Bryson, NASA Ames Res. Center, Moffett Field, CA, USA
pp. 20-26
S. Tanner, Boeing Defense&Space, Huntsville, AL, USA
pp. 14-19
P.J. Metzger, LORAL Adv. Distributed Simulation, Inc., Cambridge, MA, USA
pp. 7-13
H. Amari, Comput.&Commun. Res. Center, Tokyo Electric Power Co., Inc., Japan
T. Nagumo, Comput.&Commun. Res. Center, Tokyo Electric Power Co., Inc., Japan
M. Okada, Comput.&Commun. Res. Center, Tokyo Electric Power Co., Inc., Japan
pp. 1-6
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