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2011 IEEE Virtual Reality Conference
Singapore
March 19-March 23
ISBN: 978-1-4577-0039-2
Table of Contents
Papers
Contents (PDF)
pp. iii-viii
Ryohei Nakatsu, Interactive & Digital Media Institute, National University of Singapore, Singapore
Robert W. Lindeman, Worcester Polytechnic Institute, USA
pp. x
Michitaka Hirose, University of Tokyo, Japan
Benjamin Lok, University of Florida, USA
Aditi Majumder, University of California, Irvine, USA
Dieter Schmalstieg, Graz University of Technology, Austria
pp. xi
Lei Liu, CWI, Amsterdam, Netherlands
R van Liere, CWI, Amsterdam, Netherlands
pp. 3-10
J Jacobs, Group Res. Virtual Technol., Volkswagen AG, Wolfsburg, Germany
B Froehlich, Virtual Reality Syst. Group, Bauhaus-Univ. Weimar, Weimar, Germany
pp. 11-18
M Axholt, Dept. of Sci. & Technol., Linkoping Univ., Linko¨ping, Sweden
M A Skoglund, Div. of Autom. Control, Linkoping Univ., Linko¨ping, Sweden
Stephen D O'Connell, Swedish Air Force Combat Simulation Center, Swedish Defence Res. Agency, Sweden
Matthew D Cooper, Dept. of Sci. & Technol., Linkoping Univ., Linko¨ping, Sweden
Stephen R Ellis, Human Syst. Integration Div., NASA Ames Res. Center, MD, USA
Anders Ynnerman, Dept. of Sci. & Technol., Linkoping Univ., Linko¨ping, Sweden
pp. 27-34
Random dot markers (Abstract)
H Uchiyama, Keio Univ., Hiyoshi, Japan
H Saito, Keio Univ., Hiyoshi, Japan
pp. 35-38
G Bruder, Dept. of Comput. Sci., Univ. of Munster, Mu¨nster, Germany
F Steinicke, Dept. of Comput. Sci., Univ. of Munster, Mu¨nster, Germany
P Wieland, Psychol. Dept. II, Univ. of Munster, Mu¨nster, Germany
pp. 39-46
A Stratulat, PSA Peugeot-Citroen, Velizy, France
V Roussarie, PSA Peugeot-Citroen, Velizy, France
J Vercher, Inst. des Sci. du Mouvement, Aix-Marseille Univ., Marseille, France
C Bourdin, Inst. des Sci. du Mouvement, Aix-Marseille Univ., Marseille, France
pp. 47-50
Y Hirano, Grad. Sch. of Sci. & Eng., Ritsumeikan Univ., Kusatsu, Japan
A Kimura, Grad. Sch. of Sci. & Eng., Ritsumeikan Univ., Kusatsu, Japan
F Shibata, Grad. Sch. of Sci. & Eng., Ritsumeikan Univ., Kusatsu, Japan
H Tamura, Grad. Sch. of Sci. & Eng., Ritsumeikan Univ., Kusatsu, Japan
pp. 51-54
T C Peck, Univ. of North Carolina at Chapel Hill, Chapel Hill, NC, USA
H Fuchs, Univ. of North Carolina at Chapel Hill, Chapel Hill, NC, USA
M C Whitton, Univ. of North Carolina at Chapel Hill, Chapel Hill, NC, USA
pp. 55-62
Wei Guan, Comput. Graphics & Immersive Technol., Univ. of Southern California, Los Angeles, CA, USA
Suya You, Comput. Graphics & Immersive Technol., Univ. of Southern California, Los Angeles, CA, USA
U Neumann, Comput. Graphics & Immersive Technol., Univ. of Southern California, Los Angeles, CA, USA
pp. 71-74
M Veit, LSIIT, Univ. of Strasbourg, Strasbourg, France
A Capobianco, LSIIT, Univ. of Strasbourg, Strasbourg, France
D Bechmann, LSIIT, Univ. of Strasbourg, Strasbourg, France
pp. 75-82
T Hoinville, Italian Inst. of Technol., Genova, Italy
A Naceri, Italian Inst. of Technol., Genova, Italy
J Ortiz, Italian Inst. of Technol., Genova, Italy
E Bernier, Italian Inst. of Technol., Genova, Italy
R Chellali, Italian Inst. of Technol., Genova, Italy
pp. 83-86
Cuiting Guo, Dept. of Ind. Eng. & Logistics Manage., Hong Kong Univ. of Sci. & Technol., Hong Kong, China
J Ji, Dept. of Ind. Eng. & Logistics Manage., Hong Kong Univ. of Sci. & Technol., Hong Kong, China
R So, Dept. of Ind. Eng. & Logistics Manage., Hong Kong Univ. of Sci. & Technol., Hong Kong, China
pp. 87-90
A von Kapri, Virtual Reality Group, RWTH-Aachen Univ., Aachen, Germany
T Rick, Virtual Reality Group, RWTH-Aachen Univ., Aachen, Germany
S Feiner, Dept. of Comput. Sci., Columbia Univ., New York, NY, USA
pp. 91-94
C Stocker, Univ. of Pennsylvania, Philadelphia, PA, USA
B Sunshine-Hill, Univ. of Pennsylvania, Philadelphia, PA, USA
J Drake, Univ. of Pennsylvania, Philadelphia, PA, USA
I Perera, Univ. of Pennsylvania, Philadelphia, PA, USA
J T Kider, Univ. of Pennsylvania, Philadelphia, PA, USA
N I Badler, Univ. of Pennsylvania, Philadelphia, PA, USA
pp. 95-102
R Stenholt, Dept. of Archit., Design, & Media Technol., Aalborg Univ., Aalborg, Denmark
C B Madsen, Dept. of Archit., Design, & Media Technol., Aalborg Univ., Aalborg, Denmark
pp. 103-110
P Lincoln, Dept. of Comput. Sci., Univ. of North Carolina at Chapel Hill, Chapel Hill, NC, USA
G Welch, Dept. of Comput. Sci., Univ. of North Carolina at Chapel Hill, Chapel Hill, NC, USA
H Fuchs, Dept. of Comput. Sci., Univ. of North Carolina at Chapel Hill, Chapel Hill, NC, USA
pp. 115-118
H Matsukura, Tokyo Univ. of Agric. & Technol., Koganei, Japan
T Nihei, Dept. of Mech. Syst. Eng., Tokyo Univ. of Agric. & Technol., Koganei, Japan
H Ishida, Dept. of Mech. Syst. Eng., Tokyo Univ. of Agric. & Technol., Koganei, Japan
pp. 119-122
G Cirio, INRIA Rennes, Rennes, France
M Marchal, INSA/INRIA Rennes, Rennes, France
Aure´lien Le Gentil, INRIA Rennes, Rennes, France
Anatole Le´cuyer, INRIA Rennes, Rennes, France
pp. 123-126
T Narumi, Grad. Sch. of Eng., Univ. of Tokyo, Tokyo, Japan
T Kajinami, Grad. Sch. of Inf. Sci. & Technol., Univ. of Tokyo, Tokyo, Japan
S Nishizaka, Grad. Sch. of Inf. Sci. & Technol., Univ. of Tokyo, Tokyo, Japan
T Tanikawa, Grad. Sch. of Inf. Sci. & Technol., Univ. of Tokyo, Tokyo, Japan
M Hirose, Grad. Sch. of Inf. Sci. & Technol., Univ. of Tokyo, Tokyo, Japan
pp. 127-130
M Miyaura, Univ. of Tokyo, Tokyo, Japan
T Narumi, Univ. of Tokyo, Tokyo, Japan
K Nishimura, Univ. of Tokyo, Tokyo, Japan
T Tanikawa, Univ. of Tokyo, Tokyo, Japan
M Hirose, Univ. of Tokyo, Tokyo, Japan
pp. 139-142
K Petkov, Comput. Sci. Dept., Stony Brook Univ., Stony Brook, NY, USA
C Papadopoulos, Comput. Sci. Dept., Stony Brook Univ., Stony Brook, NY, USA
Min Zhang, Comput. Sci. Dept., Stony Brook Univ., Stony Brook, NY, USA
A E Kaufman, Comput. Sci. Dept., Stony Brook Univ., Stony Brook, NY, USA
Xianfeng Gu, Comput. Sci. Dept., Stony Brook Univ., Stony Brook, NY, USA
pp. 143-150
C T Neth, Max Planck Inst. for Biol. Cybern., Reutlingen Univ., Reutlingen, Germany
J L Souman, Max Planck Inst. for Biol. Cybern., Tu¨bingen, Germany
D Engel, Max Planck Inst. for Biol. Cybern., Tu¨bingen, Germany
U Kloos, Reutlingen Univ., Reutlingen, Germany
Heinrich H Bu¨lthoff, Dept. of Brain & Cognitive Eng., Korea Univ., Seoul, South Korea
B J Mohler, Max Planck Inst. for Biol. Cybern., Tu¨bingen, Germany
pp. 151-158
M E Latoschik, Intell. Graphics Group, Univ. of Bayreuth, Bayreuth, Germany
H Tramberend, Beuth Univ. of Appl. Sci., Berlin, Germany
pp. 171-174
Shen Fangyang, State Key Lab. of VR Tech & Syst., Beihang Univ., Beijing, China
Shen Yue, Trauma Center, Third Mil. Med. Univ., Chongqing, China
Qi Yue, State Key Lab. of VR Tech & Syst., Beihang Univ., Beijing, China
pp. 179-182
T Korah, Nokia Res. Center Hollywood, Hollywood, CA, USA
J Wither, Nokia Res. Center Hollywood, Hollywood, CA, USA
Yun-Ta Tsai, Nokia Res. Center Hollywood, Hollywood, CA, USA
R Azuma, Nokia Res. Center Hollywood, Hollywood, CA, USA
pp. 183-186
Quan-Zen Ang, Centre for Intell. Syst. Res., Deakin Univ., Geelong, VIC, Australia
B Horan, Centre for Intell. Syst. Res., Deakin Univ., Geelong, VIC, Australia
Z Najdovski, Centre for Intell. Syst. Res., Deakin Univ., Geelong, VIC, Australia
S Nahavandi, Centre for Intell. Syst. Res., Deakin Univ., Geelong, VIC, Australia
pp. 189-190
D Araque, Davinci Res. Group, Nueva Granada Mil. Univ., Bogota, Colombia
R Diaz, Davinci Res. Group, Nueva Granada Mil. Univ., Bogota, Colombia
B Perez-Gutierrez, Davinci Res. Group, Nueva Granada Mil. Univ., Bogota, Colombia
A J Uribe, Mech. Project Design Dept., Campinas State Univ., Campinas, Brazil
pp. 191-192
Y Ariyakul, Grad. Sch. of Sci. & Eng., Tokyo Inst. of Technol., Tokyo, Japan
T Nakamoto, Grad. Sch. of Sci. & Eng., Tokyo Inst. of Technol., Tokyo, Japan
pp. 193-194
J Bertram, Knowledge Media Res. Center, Germany
J Moskaliuk, Univ. of Tuebingen, Tubingen, Germany
U Cress, Knowledge Media Res. Center, Germany
pp. 195-196
M Bordegoni, Dipt. di Meccanica, Politec. di Milano, Milano, Italy
F Ferrise, Dipt. di Meccanica, Politec. di Milano, Milano, Italy
J Lizaranzu, Dipt. di Meccanica, Politec. di Milano, Milano, Italy
pp. 197-198
Nguyen-Thong Dang, Inst. of Movement Sci., Univ. of Aix-Marseille II, Marseille, France
V Perrot, Inst. of Movement Sci., Univ. of Aix-Marseille II, Marseille, France
D Mestre, Inst. of Movement Sci., Univ. of Aix-Marseille II, Marseille, France
pp. 199-200
T Doat, LIMSI, CNRS, Orsay, France
E Parizot, APC, Paris Diderot Univ., Paris, France
J-M Vezien, LIMSI, CNRS, Orsay, France
pp. 201-202
T Duckworth, Univ. of Salford, Manchester, UK
D J Roberts, Univ. of Salford, Manchester, UK
pp. 203-204
M Elfarargy, Bibliotheca Alexandrina, Alexandria, Egypt
M Nagi, Bibliotheca Alexandrina, Alexandria, Egypt
N Adly, Bibliotheca Alexandrina, Alexandria, Egypt
pp. 205-206
S Ganapathy, Intel Corp., Santa Clara, CA, USA
G J Anderson, Intel Corp., Santa Clara, CA, USA
I V Kozintsev, Intel Corp., Santa Clara, CA, USA
pp. 207-208
J´ero^me Grosjean, LSIIT, Univ. de Strasbourg, Strasbourg, France
J´ero^me Simonin, HOLO 3, France
E Galin, LIRIS, Univ. Lumiere Lyon 2, Lyon, France
Ste´phane Me´rillou, XLIM, Univ. de Limoges, Limoges, France
pp. 209-210
Jaewon Ha, Comput. Sci. Dept., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
Jinki Jung, Comput. Sci. Dept., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
ByungOk Han, Comput. Sci. Dept., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
Kyusung Cho, Comput. Sci. Dept., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
H S Yang, Comput. Sci. Dept., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
pp. 211-212
J A Jones, Mississippi State Univ., Mississippi State, MS, USA
J E Swan, Mississippi State Univ., Mississippi State, MS, USA
G Singh, Mississippi State Univ., Mississippi State, MS, USA
S R Ellis, NASA Ames Res. Center, Ames, IA, USA
pp. 215-216
S Kamuro, Univ. of Tokyo, Tokyo, Japan
K Minamizawa, Keio Univ., Hiyoshi, Japan
S Tachi, Keio Univ., Hiyoshi, Japan
pp. 217-218
Crystian Wendel M Leao, Inf. Center, Fed. Univ. of Pernambuco, Recife, Brazil
Joao Paulo Lima, Inf. Center, Fed. Univ. of Pernambuco, Recife, Brazil
V Teichrieb, Inf. Center, Fed. Univ. of Pernambuco, Recife, Brazil
E S Albuquerque, Inf. Inst., Fed. Univ. of Goias, Goia´s, Brazil
J Kelner, Inf. Center, Fed. Univ. of Pernambuco, Recife, Brazil
pp. 219-220
Jae Yeol Lee, Chonnam Nat. Univ., Gwangju, South Korea
Min Seok Kim, Chonnam Nat. Univ., Gwangju, South Korea
Dong Woo Seo, Chonnam Nat. Univ., Gwangju, South Korea
Chil-Woo Lee, Chonnam Nat. Univ., Gwangju, South Korea
Jae Sung Kim, KISTI, Daejeon, South Korea
Sang Min Lee, KISTI, Daejeon, South Korea
pp. 221-222
Julien-Charles Le´vesque, Defense R&D Canada, Valcartier, QC, Canada
D Laurendeau, Comput. Vision & Syst. Lab., Univ. Laval, Quebec City, QC, Canada
M Mokhtari, Defense R&D Canada, Valcartier, QC, Canada
pp. 223-224
P Martin, V&AR VENISE team, CNRS, Orsay, France
P Bourdot, V&AR VENISE team, CNRS, Orsay, France
pp. 225-226
M Mengoni, Dept. of Mech., Polytech. Univ. of Marche, Marche, Italy
B Colaiocco, Dept. of Mech., Polytech. Univ. of Marche, Marche, Italy
M Peruzzini, Dept. of Mech., Polytech. Univ. of Marche, Marche, Italy
M Germani, Dept. of Mech., Polytech. Univ. of Marche, Marche, Italy
pp. 227-228
M Mokhtari, Defence R&D Canada-Valcartier, Quebec City, QC, Canada
E Boivin, Defence R&D Canada-Valcartier, Quebec City, QC, Canada
D Laurendeau, Dept of Electr. & Comput. Eng., Laval Univ., Quebec City, QC, Canada
S Comtois, Dept of Electr. & Comput. Eng., Laval Univ., Quebec City, QC, Canada
D Ouellet, Dept of Electr. & Comput. Eng., Laval Univ., Quebec City, QC, Canada
J Levesque, Dept of Electr. & Comput. Eng., Laval Univ., Quebec City, QC, Canada
E Ouellet, Dept of Electr. & Comput. Eng., Laval Univ., Quebec City, QC, Canada
pp. 229-230
Shinya Nishizaka, Graduate School of Information Science and Technology, The University of Tokyo, Japan
Takuji Narumi, Graduate School of Engineering, The University of Tokyo, Japan
Tomohiro Tanikawa, Graduate School of Information Science and Technology, The University of Tokyo, Japan
Michitaka Hirose, Graduate School of Information Science and Technology, The University of Tokyo, Japan
pp. 231-232
L Phillips, Univ. of Minnesota, Minneapolis, MN, USA
V Interrante, Univ. of Minnesota, Minneapolis, MN, USA
pp. 235-236
Raghavi Sakpal, Univ. of North Carolina, Charlotte, NC, USA
Dale-Marie Wilson, Univ. of North Carolina, Charlotte, NC, USA
pp. 237-238
W R Sherman, Indiana Univ., Bloomington, IN, USA
P O'Leary, Idaho Nat. Lab., Idaho Falls, ID, USA
E T Whiting, Idaho Nat. Lab., Idaho Falls, ID, USA
pp. 239-240
G Singh, Mississippi State Univ., Mississippi State, MS, USA
J Edward Swan, Mississippi State Univ., Mississippi State, MS, USA
J A Jones, Mississippi State Univ., Mississippi State, MS, USA
pp. 241-242
R Skarbez, Univ. of North Carolina at Chapel Hill, Chapel Hill, NC, USA
A Kotranza, Univ. of Florida, Gainesville, FL, USA
F P Brooks, Univ. of North Carolina at Chapel Hill, Chapel Hill, NC, USA
B Lok, Univ. of Florida, Gainesville, FL, USA
M C Whitton, Univ. of North Carolina at Chapel Hill, Chapel Hill, NC, USA
pp. 243-244
A Steinemann, ICVR - Innovation Center Virtual Reality, ETH Zurich, Zurich, Switzerland
S Tschudi, ICVR - Innovation Center Virtual Reality, ETH Zurich, Zurich, Switzerland
A Kunz, ICVR - Innovation Center Virtual Reality, ETH Zurich, Zurich, Switzerland
pp. 245-246
E A Suma, USC Inst. for Creative Technol., CA, USA
B Lange, USC Inst. for Creative Technol., CA, USA
A Rizzo, USC Inst. for Creative Technol., CA, USA
D M Krum, USC Inst. for Creative Technol., CA, USA
M Bolas, USC Inst. for Creative Technol., CA, USA
pp. 247-248
M Fischbach, Intell. Graphics Group, Univ. of Bayreuth, Bayreuth, Germany
D Wiebusch, Intell. Graphics Group, Univ. of Bayreuth, Bayreuth, Germany
A Giebler-Schubert, Intell. Graphics Group, Univ. of Bayreuth, Bayreuth, Germany
M E Latoschik, Intell. Graphics Group, Univ. of Bayreuth, Bayreuth, Germany
S Rehfeld, Beuth Univ. of Appl. Sci. Berlin, Berlin, Germany
H Tramberend, Beuth Univ. of Appl. Sci. Berlin, Berlin, Germany
pp. 255-256
Jian Gu, KEIO-NUS CUTE center, Nat. Univ. of Singapore, Singapore, Singapore
Nai Li, Fac. of Arts & Social, Sci., Nat. Univ. of Singapore, Singapore, Singapore
H Been-Lirn Duh, Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore, Singapore
pp. 257-258
C W M Leao, Virtual Reality & Multimedia Res. Group, Fed. Univ. of Pernambuco, Recife, Brazil
Joao P Lima, Virtual Reality & Multimedia Res. Group, Fed. Univ. of Pernambuco, Recife, Brazil
V Teichrieb, Virtual Reality & Multimedia Res. Group, Fed. Univ. of Pernambuco, Recife, Brazil
E S Albuquerque, Inf. Inst., Fed. Univ. of Goias, Goias, Brazil
J Kelner, Virtual Reality & Multimedia Res. Group, Fed. Univ. of Pernambuco, Recife, Brazil
pp. 259-260
Zhiqiang Luo, Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore
Weiting Yang, Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore
Zhong Qiang Ding, Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore
Lili Liu, Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore
I-Ming Chen, Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore
Song Huat Yeo, Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore
Keck Voon Ling, Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
H B.-L Duh, Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore, Singapore
pp. 261-262
N Magnenat-Thalmann, MIRALab, Univ. of Geneva, Geneva, Switzerland
P Volino, MIRALab, Univ. of Geneva, Geneva, Switzerland
B Kevelham, MIRALab, Univ. of Geneva, Geneva, Switzerland
M Kasap, MIRALab, Univ. of Geneva, Geneva, Switzerland
Qui Tran, Inst. for Media Innovation, NTU, Singapore, Singapore
M Are´valo, MIRALab, Univ. of Geneva, Geneva, Switzerland
G Priya, Inst. for Media Innovation, NTU, Singapore, Singapore
N Cadi, MIRALab, Univ. of Geneva, Geneva, Switzerland
pp. 263-264
MetaCookie+ (Abstract)
T Narumi, Grad. Sch. of Eng., Univ. of Tokyo, Tokyo, Japan
S Nishizaka, Grad. Sch. of Inf. Sci. & Technol., Univ. of Tokyo, Tokyo, Japan
T Kajinami, Grad. Sch. of Inf. Sci. & Technol., Univ. of Tokyo, Tokyo, Japan
T Tanikawa, Grad. Sch. of Inf. Sci. & Technol., Univ. of Tokyo, Tokyo, Japan
M Hirose, Grad. Sch. of Inf. Sci. & Technol., Univ. of Tokyo, Tokyo, Japan
pp. 265-266
S Nishizaka, Grad. Sch. of Inf. Sci. & Technol., Univ. of Tokyo, Tokyo, Japan
T Narumi, Grad. Sch. of Eng., Univ. of Tokyo, Tokyo, Japan
T Tanikawa, Grad. Sch. of Inf. Sci. & Technol., Univ. of Tokyo, Tokyo, Japan
M Hirose, Grad. Sch. of Inf. Sci. & Technol., Univ. of Tokyo, Tokyo, Japan
pp. 267-268
R T Smith, Wearable Comput. Lab., Univ. of South Australia, Adelaide, SA, Australia
M R Marner, Wearable Comput. Lab., Univ. of South Australia, Adelaide, SA, Australia
B H Thomas, Wearable Comput. Lab., Univ. of South Australia, Adelaide, SA, Australia
pp. 269-270
Random dot markers (Abstract)
Hideaki Uchiyama, Keio University
Hideo Saito, Keio University
pp. 271-272
Panels (PDF)
pp. 273-276
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