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Proceedings of the 1989 ACM/IEEE conference on Supercomputing
Reno, Nevada, United States
November 12-November 17
ISBN: 0-89791-341-8
Table of Contents
Front Matter
Papers
P. J. Burns, Colorado State University, Dept. of Mech. Engr. and Univ. Computer Center, Fort Collins, CO
M. Christon, Colorado State University, Dept. of Mech. Engr. and Univ. Computer Center, Fort Collins, CO
R. Schweitzer, Colorado State University, Dept. of Mech. Engr. and Univ. Computer Center, Fort Collins, CO
O. M. Lubeck, Computing and Communications Division, Los Alamos National Laboratory, Los Alamos, NM
H. J. Wasserman, Computing and Communications Division, Los Alamos National Laboratory, Los Alamos, NM
pp. 10-20
J. S. Clary, General Dynamics Corp., Data Systems Diivision/Central Center, Fort Worth, Texas
G. A. Howell, General Dynamics Corp., Fort Worth Division, Fort Worth, Texas
Jr. S. L. Karman, General Dynamics Corp., Fort Worth Division, Fort Worth, Texas
pp. 32-41
L. Dagum, Department of Aeronautics and Astronautics, Stanford University, Stanford, California
pp. 42-49
G. S. Deiwert, NASA Ames Research Center, Moffett Field, CA
pp. 51-57
G. C. Fox, Caltech Concurrent Computation Program, Mail Code 206-49, Pasadena, California
P. Hipes, Caltech Concurrent Computation Program, Mail Code 206-49, Pasadena, California
J. Salmon, Caltech Concurrent Computation Program, Mail Code 206-49, Pasadena, California
pp. 58-69
K. Fujii, High Speed Aerodynamics Division, The Institute of Space and Astronautical Science, Yoshinodai 3-1-1,Sagamihara, Kanagawa, 229 Japan
Y. Tamura, High Speed Aerodynamics Division, The Institute of Space and Astronautical Science, Yoshinodai 3-1-1,Sagamihara, Kanagawa, 229 Japan
pp. 71-80
H. Greiss, Cray Research Inc., Ottawa, Ontario, Canada
D. Mukhedkar, Ecole Polytechnigue, Montreal, Quebec, Canada
P. J. Lagace, Norwich University, Norwich, Vermont
pp. 86-95
J. L. Gustafson, Sandia National Laboratories, Albuquerque, NM
R. E. Benner, Sandia National Laboratories, Albuquerque, NM
M. P. Sears, Sandia National Laboratories, Albuquerque, NM
T. D. Sullivan, Sandia National Laboratories, Albuquerque, NM
pp. 96-105
R. Jakob, Electrical & Computer Engineering Dept., University of Colorado
J. J. Hack, National Center for Atmospheric Research, Boulder, Colorado
pp. 106-112
P. Kutler, Chief, Fluid Dynamics Division, NASA Ames Research Center, Moffett Field, CA
pp. 113-122
J. Z. C. Lai, Department of Information Engineering, Feng Chia University, Taichung, Taiwan, ROC
M. Chao, Department of Information Engineering, Feng Chia University, Taichung, Taiwan, ROC
pp. 123-132
D. Lee, Naval Underwater Systems Center, New London, CT
M. H. Schultz, Computer Science Department, Yale University, P.O.Box 2158, Yale Station, New Haven, CT
F. Saied, Department of Computer Science, University of Illinois at Urbana-Champaign, 1304 W. Springfield Avenue, Urbana, IL
pp. 133-140
P. Olsson, Department of Scientific Computing, Uppsala University, Uppsala, Sweden and Department of Computer Science, Yale University, New Haven, CT
S. L. Johnsson, Thinking Machines Corp., 245 First Street, Cambridge, MA and Departments of Computer Science and Electrical Engineering, Yale University, New Haven, CT
pp. 141-151
I. Parberry, Department of Computer Science, 333 Whitmore Laboratory, The Pennsylvania State University, University Park, Pa.
pp. 152-161
D. E. Platt, IBM Resea.rch Division, T. J. Watson Research Center, Yorktown Heights, New York
A. R. Rossi, IBM Resea.rch Division, T. J. Watson Research Center, Yorktown Heights, New York
J. W. Wells, IBM Resea.rch Division, T. J. Watson Research Center, Yorktown Heights, New York
J. Becker, IBM Resea.rch Division, T. J. Watson Research Center, Yorktown Heights, New York
pp. 162-174
J. Signorini, Département d'Informatique, Université Paris-8, 2, Rue de la Liberté 93526 Saint-Denis - France
pp. 175-186
T. Tsuda, Department of Information Science, Kyoto University, Kyoto, Japan
Y. Kunieda, Department of Information Science, Kyoto University, Kyoto, Japan
P. Atipas, Department of Information Science, Kyoto University, Kyoto, Japan
pp. 187-196
C.-J. Wang, Department of Electrical and Computer Engineering, University of Colorado, Colorado Springs, CO
C.-H. Wu, Department of Electrical and Computer Engineering, University of Colorado, Colorado Springs, CO
S. Sivasindaram, Department of Electrical and Computer Engineering, University of Colorado, Colorado Springs, CO
pp. 197-204
C.-H. Wu, Department of Electrical Engineering, Auburn University, Auburn, AL
C.-J. Wang, Department of Electrical and Computer Engineering, University of Colorado, Colorado Springs, CO
pp. 205-214
X. Zhang, Thinking Machines Corporation, 245 First Street, Cambridge, MA and Brandeis University, 415 South Street, Walthham, MA
D. Waltz, Thinking Machines Corporation, 245 First Street, Cambridge, MA and Brandeis University, 415 South Street, Walthham, MA
J. P. Mesirov, Thinking Machines Corporation
pp. 215-223
R. C. Agarwal, I.B.M. Research Division, Thomas J. Watson Research Center, Yorktown Hts., New York
F. G. Gustavson, I.B.M. Research Division, Thomas J. Watson Research Center, Yorktown Hts., New York
pp. 225-233
D. H. Bailey, NASA Ames Research Center, Moffett Field, CA
pp. 234-242
J. R. Baker, Department of Electrical Engineering and Computer Sciences, University of California, Berkeley and Research Medicine and Radiation Biophysics Division, Lawrence Berkeley Laboratory
pp. 243-247
J. R. Bischof, Mathematics and Computer Science Division, Argonne National Laboratory, 9700 S. Cass Avenue, Argonne, IL
pp. 248-256
M. A. Johnson, Applications Technology Center, IBM Corporation, Neighborhood Road, Kingston, NY
S. Chang, Applications Technology Center, IBM Corporation, Neighborhood Road, Kingston, NY
pp. 257-265
A. N. Choudhary, Coordinated Science Laboratory, University of Illinois, 1101 W. Springfield, Urbana IL
J. H. Pater, Coordinated Science Laboratory, University of Illinois, 1101 W. Springfield, Urbana IL
pp. 266-275
H. Y. J. Chuang, Computer Science Department, University of Pittsburgh, Pittsburgh, PA
L. Chen, Mathematics Department, Yangzhou Teachers College, Yangzhou, China
pp. 276-282
M. Evett, Dept. of Computer Science, University of Maryland, College Park, MD
L. Spector, Dept. of Computer Science, University of Maryland, College Park, MD
J. Hendler, Dept. of Computer Science, University of Maryland, College Park, MD
pp. 283-293
A. K. Iyengar, Laboratory for Computer Science, Massachusetts Institute of Technology, Cambridge, MA
pp. 304-313
J. E. Jang, Oregon Advanced Computing Institute(OACIS)and Department of Computer Science, Oregon State University, Corvallis, OR
S. W. Choi, Oregon Advanced Computing Institute(OACIS)and Department of Computer Science, Oregon State University, Corvallis, OR
W. K. Cho, Oregon Advanced Computing Institute(OACIS)and Department of Computer Science, Oregon State University, Corvallis, OR
pp. 314-325
S. L. Johnsson, Thinking Machines Corp., 245 First Street, Cambridge, MA and Department of Computer Science, Yale University, New Haven, CT
T. Harris, Thinking Machines Corp., 245 First Street, Cambridge, MA
K. K. Mathur, Thinking Machines Corp., 245 First Street, Cambridge, MA
pp. 326-332
C. Levit, NASA Ames Research Center, Mail Stop T045-1, Moffett Field, CA
pp. 333-336
K. K. Mathur, Thinking Machines Corp., 245 First Street, Cambridge, MA and Department of Computer Science, Yale University, New Haven, CT
S. L. Johnsson, Thinking Machines Corp., 245 First Street, Cambridge, MA
pp. 337-343
S.-J. Oh, Electronics and Telecommunications Research Institute, Daejun, Korea 302-350
M. Suk, Dept. of Electrical and Computer Eng., Link Hall, Syracuse University, Syracuse, NY
pp. 344-350
P. M. Pardalos, Department of Computer Science, 333 Whitmore Laboratory, The Pennsylvania State University, University Park, Pa.
J. V. Crouse, Department of Computer Science, 333 Whitmore Laboratory, The Pennsylvania State University, University Park, Pa.
pp. 351-360
S. Patil, Center for Reliable and High Performance Computing, Coordinated Science Laboratory, University of Illinois, Urbana, IL
P. Banerjee, Center for Reliable and High Performance Computing, Coordinated Science Laboratory, University of Illinois, Urbana, IL
C. Polychronopoulos, Center for Supercomputing, Research and Development, Talbot Laboratory, University of Illinois, Urbana, IL
pp. 361-370
P. Sadayappan, Department of Computer and Information Science, The Ohio State University, Columbus, Ohio
S. K. Rao, AT&T Bell Laboratories, Holmdel, New Jersey
pp. 371-379
D. J. Shakshober, Digital Equipment Corporation, BXB2-2/G08, 60 Codman Hill Road, Boxboro, Ma
pp. 380-388
W. Shu, Department of Computer Science, Yale University, New Haven, CT
L. V. Kale, Department of Computer Science, University of Illinois, Urbana, IL
pp. 389-398
S. G. Ziavras, Department of Electrical Engineering and Computer Science, George Washington University, Washington, D.C. and Center For Automation Research, University of Maryland, College Park, MD
pp. 399-408
R. E. Anderson, Livermore Computer Center, Lawrence Livermore National Laboratory, Livermore, CA
pp. 410-415
H. Dietz, School of Electrical Engineering, Purdue University, West Lafayette, IN
T. Schwederski, School of Electrical Engineering, Purdue University, West Lafayette, IN and Institute for Microelectronics Stuttgart, Allmandring 30 a, 7000 Stuttgart 80, FRG.
M. O'Keefe, School of Electrical Engineering, Purdue University, West Lafayette, IN
A. Zaafrani, School of Electrical Engineering, Purdue University, West Lafayette, IN
pp. 416-425
K. Ghose, Department of Computer Science, State University of New York, Binghamton, NY
K. R. Desai, Department of Computer Science, State University of New York, Binghamton, NY
pp. 426-435
T. Gross, School of Computer Science, Carncgic-Mellon University, Pittsburgh, PA
pp. 436-445
A. Huang, AT&T Bell Laboratories, Crawfords Corner Road, 4G-514, Holmdel, New Jersey
pp. 446-449
L. Kohn, Intel Corporation, Santa Clara, CA
N. Margulis, Intel Corporation, Santa Clara, CA
pp. 450-456
R. Manner, Physics Institute, University of Heidelberg, Heidelberg, West Germany
R. Horner, Institute for Theoretical Physics, University of Heidelberg, Heidelberg, West Germany
R. Hauser, Physics Institute, University of Heidelberg, Heidelberg, West Germany
A. Genthner, Physics Institute, University of Heidelberg, Heidelberg, West Germany
pp. 457-465
D. E. Marquardt, Santa Clara University, Department of Electrical Engineering and Computer Science, Santa Clara, California
H. S. Alkhatib, Santa Clara University, Department of Electrical Engineering and Computer Science, Santa Clara, California
pp. 466-475
Y. K. Park, Aerospace Technology Center, Allied-Signal Aerospace Company, Columbia, MD and Samsung Electronics, Seoul, Korea
C. Walter, Aerospace Technology Center, Allied-Signal Aerospace Company, Columbia, MD
H. Yee, Aerospace Technology Center, Allied-Signal Aerospace Company, Columbia, MD
T. Roden, Aerospace Technology Center, Allied-Signal Aerospace Company, Columbia, MD
S. Berkovich, Aerospace Technology Center, Allied-Signal Aerospace Company, Columbia, MD
pp. 476-484
B. J. Rodriquez, Dept. S10E, Bldg 710-l, IBM Corporation, Poughkeepsie, NY
H. F. Jordan, Dept. of Electrical and Computer Engg., University of Colorado, Boulder, CO
pp. 485-494
T. Shirakawa, Institute of Engineering Mechanics
T. Hoshino, Institute of Engineering Mechanics
Y. Oyanagi, Institute of Information Sciences
Y. Iwasaki, Institute of PiIysics, University of Tsukuba, Tsukuba, Ibaraki 305, JAPAN
T. Yoshie, Institute of PiIysics, University of Tsukuba, Tsukuba, Ibaraki 305, JAPAN
pp. 495-504
R. R. Shively, AT&T Bell Laboratories, Whippany, New Jersey
E. B. Morgan, AT&T Bell Laboratories, Whippany, New Jersey
T. W. Copley, AT&T Bell Laboratories, Whippany, New Jersey
A. L. Gorin, AT&T Bell Laboratories, Whippany, New Jersey
pp. 505-509
R. Di Antonio, IBM European Center for Scientific and Engineering Computing, Via Giorgione 159, 00147 Rome, Italy
J. Eilert, IBM DSD Technical Computing Center, Neighborhood Road, Kingston (NY)
M. Vitaletti, IBM European Center for Scientific and Engineering Computing, Via Giorgione 159, 00147 Rome, Italy
pp. 511-520
D. Arapattu, Department of Computer Science, Indiana University, Bloomington, Indiana
D. Gannon, Department of Computer Science, Indiana University, Bloomington, Indiana
pp. 521-530
E. Ayguadé, Departament d'Arquitectura de Computadors, Universitat Politècnica de Catalunya, Pau Gargallo, 5, 08028-Barcelona SPAIN
J. Labarta, Departament d'Arquitectura de Computadors, Universitat Politècnica de Catalunya, Pau Gargallo, 5, 08028-Barcelona SPAIN
J. Torres, Departament d'Arquitectura de Computadors, Universitat Politècnica de Catalunya, Pau Gargallo, 5, 08028-Barcelona SPAIN
P. Borensztejn, Departament d'Arquitectura de Computadors, Universitat Politècnica de Catalunya, Pau Gargallo, 5, 08028-Barcelona SPAIN
pp. 531-539
V. Balasundaram, Department of Computer Science, Rice University
K. Kennedy, Department of Computer Science, Rice University
U. Kremer, Department of Computer Science, Rice University
K. McKinley, Department of Computer Science, Rice University
J. Subhlok, Department of Computer Science, Rice University
pp. 540-550
L. Bic, Department of Information and Computer Science, University of California at Irvine
M. D. Nagel, Department of Information and Computer Science, University of California at Irvine
J. M. A. Roy, Department of Information and Computer Science, University of California at Irvine
pp. 551-556
K. M. Chandy, California Institute of Technology
S. Taylor, California Institute of Technology
pp. 557-561
A. Chatterjee, Microelectronics and Computer Technology Corporation (MCC)
pp. 562-567
D. Y. Cheng, Evans & Sutherland Computer Division, 1808 N. Shoreline Blvd., Mountain View, CA
pp. 568-573
T. W. Crockett, Institute for Computer Applications in Science and Engineering
pp. 574-579
P. A. Emrath, Center for Supercomputing Research and Development, University of Illinois at Urbana-Champaign, 305 Talbot Laboratory, 104 South Wright Street, Urbana, Illinois
S. Chosh, Center for Supercomputing Research and Development, University of Illinois at Urbana-Champaign, 305 Talbot Laboratory, 104 South Wright Street, Urbana, Illinois
D. A. Padua, Center for Supercomputing Research and Development, University of Illinois at Urbana-Champaign, 305 Talbot Laboratory, 104 South Wright Street, Urbana, Illinois
pp. 580-588
Y. Gaur, Center for Supercomputing Research and Development, University of Illinois at Urbana-Champaign, Urbana-Illinois
V. A. Guarna, Center for Supercomputing Research and Development, University of Illinois at Urbana-Champaign, Urbana-Illinois
D. Jablonowski, Center for Supercomputing Research and Development, University of Illinois at Urbana-Champaign, Urbana-Illinois
pp. 589-596
P.-K. Hsiung, Department of Electrical and Computer Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania
R. H. P. Dunn, Department of Arts, Carnegie Mellon University, Pittsburgh, Pennsylvania
pp. 597-606
D. Klappholz, Department of Electrical Engineerlng and Computer Science, Stevens Institute of Technology, Castle Point Station, Hohoken, NJ
X. Kong, Department of Electrical Engineerlng and Computer Science, Stevens Institute of Technology, Castle Point Station, Hohoken, NJ
A. D. Kalis, Department of Electrical Engineerlng and Computer Science, Stevens Institute of Technology, Castle Point Station, Hohoken, NJ
pp. 607-615
P. Mehrotra, Institute for Computer Applications in Science and Engineering, NASA Langley Research Center, Hampton, VA
J. van Rosendale, Institute for Computer Applications in Science and Engineering, NASA Langley Research Center, Hampton, VA
pp. 616-626
C. M. Pancake, Department of Computer Science and Engineering, Auburn University, Auburn, Alabama
S. Utter, Cornell National Supercomputer Facility, Cornell University, Ithaca, New York
pp. 627-636
J. Ramanujam, Department of Computer and Information Science, The Ohio State University, Columbus, Ohio
P. Sadayappan, Department of Computer and Information Science, The Ohio State University, Columbus, Ohio
pp. 637-646
V. Watson, NASA Ames Research Center, Moffett Field, CA
G. Bancroft, Sterling Software
T. Plessel, Sterling Software
F. Merritt, Sterling Software
P. P. Walatka, Sterling Software
pp. 647-654
M. Wolfe, Oregon Graduate Center
pp. 655-664
Y. Wu, Sequent Computer Systems, Inc, Beaverton, OR
T. Lewis, Oregon State University, Corvallis, OR
pp. 665-674
H. Yamana, School of Science and Engineering, Waseda University, c/o Prof. Yoichi MURAOKA, 3-4-1, Okubo, Shinjuku-ku, Tokyo, 169 JAPAN
T. Hagiwara, NEC Corp., Tokyo, JAPAN
J. Kohdate, NEC Corp., Tokyo, JAPAN
Y. Muraoka, NEC Corp., Tokyo, JAPAN
pp. 675-684
A. Bettison, Softway Pty Ltd, 79 Myrtle St, Chippendale NSW 2008, Australia
F. Adcock, Softway Pty Ltd, 79 Myrtle St, Chippendale NSW 2008, Australia
P. Chubb, Softway Pty Ltd, 79 Myrtle St, Chippendale NSW 2008, Australia
A. Gollan, Softway Pty Ltd, 79 Myrtle St, Chippendale NSW 2008, Australia
C. Maltby, Softway Pty Ltd, 79 Myrtle St, Chippendale NSW 2008, Australia
pp. 686-692
M. Bishop, Department of Mathematics and Computer Science, Dartmouth College, Hanover, NH
pp. 693-698
C. Hein, Building 145-2, GE Advanced Technology Laboratories (ATL), Rt. 38, Moorestown Corporate Center, Moorestown, NJ
pp. 704-712
R. Hoebelheinrich, Computer Network Engineering, Computing and Communications Division, Los Alamos National Laboratory, Los Alamos, New Mexico
R. Thomsen, Computer Network Engineering, Computing and Communications Division, Los Alamos National Laboratory, Los Alamos, New Mexico
pp. 713-720
W. T. C. Kramer, NAS Systems Division, NASA Ames Research Center, Moffett Field, CA
J. M. Crawer, NAS Systems Division, NASA Ames Research Center, Moffett Field, CA
pp. 721-731
J. Lekashman, NASA Ames Research Center, Mail Stop 258-5, Moffett Field, Ca
pp. 732-736
J. Murai, University of Tokyo, 2-11-16 Yayoi, Bunkyoku, Tokyo 113 Japan
H. Kusumoto, Electrotechnical Laboratory, 1-1-4 Umezono, Tsukuba City, Ibaraki 305 Japan
S. Yamaguchi, 0saka University, 1-1 Machikaneyama, Toyonaka City, Osaka 560 Japan
A. Kato, Tokyo Institute of Technology, 2-12-1 Okayama, Meguroku, Tokyo 152 Japan
pp. 737-746
H. Nishino, NEC Corporation
S. Naka, NEC Corporation
K. Ikumi, NEC Corporation
W. Leslie, HNSX Supercomputers, INC.
pp. 747-756
P. Beadle, Integrated Systems Laboratory, Swiss Federal Institute of Technology, 8093 Zurich, Switzerland
C. Pommerell, Integrated Systems Laboratory, Swiss Federal Institute of Technology, 8093 Zurich, Switzerland
M. Annaratone, Integrated Systems Laboratory, Swiss Federal Institute of Technology, 8093 Zurich, Switzerland
pp. 765-774
D. A. Calahan, Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbox, MI
pp. 775-778
R. A. Fatoohi, Sterling Software, NASA Ames Research Center, Moffett Field, California
pp. 779-788
W. P. Goodwin, E-Systems, Inc., Greenville Division, Greenville, Texas
S. K. Das, Department of Computer Science, University of North Texas, Denton, Texas
pp. 789-796
J. Helin, Tampere University of Technology, P.O.B. 527, 331Ol Tampere, FINLAND
K. Kaski, Tampere University of Technology, P.O.B. 527, 331Ol Tampere, FINLAND
pp. 797-808
S. L. Johnsson, Thinking Machines Corp., 245 First Street, Cambridge, MA
R. L. Krawitz, Thinking Machines Corp., 245 First Street, Cambridge, MA
R. Frye, Thinking Machines Corp., 245 First Street, Cambridge, MA
D. MacDonald, Thinking Machines Corp., 245 First Street, Cambridge, MA
pp. 809-819
H. Nobayashi, Institute for Supercomputing Research, 8F Recruit Kachidoki Bldg., 2-11 Kachidoki, Chuo-ku, Tokyo 104 Japan
C. Eoyang, Institute for Supercomputing Research, 8F Recruit Kachidoki Bldg., 2-11 Kachidoki, Chuo-ku, Tokyo 104 Japan
pp. 820-825
P. Tang, Institute for Supercomputing Research (ISR), 8F Recruit Kachidoki Bldg., 2-11 Kachidoki, Chuo-ku, Tokyo 104 Japan
R. H. Mendez, Institute for Supercomputing Research (ISR), 8F Recruit Kachidoki Bldg., 2-11 Kachidoki, Chuo-ku, Tokyo 104 Japan
pp. 826-831
J. R. Zirbas, Myrias Research Corporation, #900, 10611 - 98 Avenue, Edmonton, Alberta, Canada T5K 2P7
D. J. Reble, Myrias Research Corporation, #900, 10611 - 98 Avenue, Edmonton, Alberta, Canada T5K 2P7
R. E. vanKooten, Myrias Research Corporation, #900, 10611 - 98 Avenue, Edmonton, Alberta, Canada T5K 2P7
pp. 832-841
Back Matter
Back Matter (PDF)
pp. 847-849
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