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Reliability and Maintainability Symposium (2008)
Las Vegas, NV, USA
Jan. 28, 2008 to Jan. 31, 2008
ISBN: 978-1-4244-1460-4
TABLE OF CONTENTS
Papers
Front cover (PDF)
pp. c1
Clifford H. Lange , Novellus Systems Inc., USA
Ayako Flint , Novellus Systems Inc., USA
pp. v-vi
pp. viii
pp. ix
pp. xiii-xvii
pp. xviii
Author index (PDF)
pp. xix-xxi
Huairui Guo , ReliaSoft Corporation, USA
Adamantios Mettas , ReliaSoft Corporation, USA
Arai Monteforte , ReliaSoft Corporation, USA
pp. 1-7
John D. Andrews , Loughborough University, UK
Darren R. Prescott , Loughborough University, UK
Rasa Remenyte-Prescott , Loughborough University, UK
pp. 8-14
Satoshi Matsumoto , Kyoto University, Japan
Takehisa Kohda , Kyoto University, Japan
pp. 15-20
Dong Liu , National University of Defense Technology, China
Chunyuan Zhang , National University of Defense Technology, China
Weiyan Xing , China Huayin Ordnance Test Center, China
Rui Li , National University of Defense Technology, China
pp. 21-26
Bruno Castanier , Ecole des Mines de Nantes / IRCCyN, France
pp. 25-30
P.V.N. Prasad , Osmania University, India
K.R.M. Rao , Osmania University, India
pp. 31-36
Murad Hamada , Cessna Aircraft Company, USA
pp. 37-41
Tony Halim , National University of Singapore, Singapore
pp. 54-58
Michael Ciemian , AAI Corporation, USA
pp. 59-63
Aravindan Balasubramanian , Technische Universiteit Eindhoven, The Netherlands
Peter Sonnemans , Technische Universiteit Eindhoven, The Netherlands
Martin Newby , City University London, UK
pp. 64-69
Ken Gee , NASA Ames Research Center, USA
Donovan Mathias , NASA Ames Research Center, USA
pp. 70-73
Susie Go , NASA Ames Research Center, USA
Ken Gee , NASA Ames Research Center, USA
Donovan L. Mathias , NASA Ames Research Center, USA
pp. 74-79
Ming Li , Mantech SRS, USA
pp. 86-90
Jinsuk Lee , Department of Industrial Engineering, Arizona State University, USA
Rong Pan , Department of Industrial Engineering, Arizona State University, USA
pp. 91-96
Jianmin Gao , State Key Lab. for Manufacturing Systems Engineering, Xi'an Jiaotong University, China
Guo Li , State Key Lab. for Manufacturing Systems Engineering, Xi'an Jiaotong University, China
pp. 97-102
Scott W. Yates , Australian Defence Materiel Organisation, Australia
pp. 103-107
Meng-Lai Yin , California State Polytechnic University, USA
pp. 108-113
Abderafi Charki , LASQUO, University of Angers, France
Fabrice Guerin , LASQUO, University of Angers, France
Amel Demri , LASQUO, University of Angers, France
pp. 114-119
Huairui Guo , ReliaSoft Corporation, USA
Rong Pan , Arizona State University, USA
pp. 120-125
Ana Maria Cao Paz , University of Vigo, Spain
Santiago Fernandez-Gomez , Apple, Inc., USA
Maria Luisa Soria , Tudor-Exide, Global R&D Centre, Spain
pp. 126-131
Aravindan Balasubramanian , Eindhoven University of Technology, The Netherlands
Kostas Kevrekedis , Eindhoven University of Technology, The Netherlands
Peter J.M. Sonnemans , Eindhoven University of Technology, The Netherlands
pp. 132-136
Tieling Zhang , Hitachi Global Storage Technology, Singapore
Yiming Wang , Beijing Institute of Graphic Communication, China
Min Xie , National University of Singapore, Singapore
pp. 143-148
Dominik J. Domis , Fraunhofer Institute Experimental Software Engineering, Germany
Rasmus Adler , Fraunhofer Institute Experimental Software Engineering, Germany
Mario Trapp , Fraunhofer Institute Experimental Software Engineering, Germany
pp. 149-154
Zdenek Vintr , Czech University of Defence, Czech Republic
Michal Vintr , Brno University of Technology, Czech Republic
pp. 155-160
Bill Strack , N&R Engineering, USA
Edward J. Zampino , NASA Glenn Research Center, USA
John Z. Gyekenyesi , N&R Engineering, USA
pp. 161-165
Doug Farel , Ops A La Carte, LLC, USA
pp. 171-174
Jean-Pierre Derain , Eurocopter, France
Aline Cauvin , University of Marseille, France
Denis Dufrene , ENSAM Aix-en-Provence, France
pp. 175-180
Bryan LeBlanc , Raytheon Integrated Defense Systems, USA
pp. 187-192
Robert H. Mueller , Ops A La Carte&Marisan Group, USA
pp. 200-205
James B. Farmer , Strategic Technology Institute, Inc., USA
pp. 212-217
Calin Florin Baban , University of Oradea, Romania
Marius Baban , University of Oradea, Romania
Ioan Eugen Radu , University of Oradea, Romania
pp. 218-223
Enrique Lopez Droguett , Federal University of Pernambuco, Brazil
Ali Mosleh , University of Maryland, USA
pp. 224-230
Tommie M. Lindquist , Royal Institute of Technology (KTH), Sweden
pp. 231-237
Benoit Iung , CRAN, Nancy University, France
Olivier Senechal , LAMIH, University of Valenciennes, France
Maxime Monnin , LAMIH, University of Valenciennes, France
pp. 238-243
Jason L. Cook , US Army - Armament Research Development Engineering Center, USA
pp. 244-248
David H. Rose , Quanterion Solutions Inc., USA
pp. 249-254
Yuji Kobira , Toshiba Corporation Semiconductor Company, Japan
Hidemitsu Egawa , Toshiba Corporation Semiconductor Company, Japan
pp. 261-266
Bahman Honari , CTVR, Institute of Technology Sligo, Ireland
Toby Joyce , CTVR, Alcatel-Lucent Technologies, Ireland
Simon Wilson , CTVR, Department of Statistics, Trinity College, Ireland
pp. 267-271
Bernd Bertsche , Institute of Machine Components, Universitaet Stuttgart, Germany
Bernd-Robert Hohn , Gear Research Centre (FZG), Technical University of Munich, Germany
Christian Maisch , Institute of Machine Components, Universitaet Stuttgart, Germany
pp. 272-277
Zhong-Lai Wang , University of Electronic Science and Technology of China, China
Hong-Zhong Huang , University of Electronic Science and Technology of China, China
pp. 278-282
Robert Bergman , Relex, USA
Suprasad V. Amari , CRE, Relex, USA
Ming J. Zuo , University of Alberta, Canada
pp. 283-288
Paulo Renato A. Firmino , Federal University of Pernambuco, Brazil
Enrique Lopez Droguett , Federal University of Pernambuco, Brazil
Marcio das Chagas Moura , Federal University of Pernambuco, Brazil
pp. 289-294
Meng-Lai Yin , California State Polytechnic University, USA
John Angus , Claremont Graduate University, USA
pp. 295-300
Alban Peronne , ALSTOM Transport Information Solutions, France
Pierre Dersin , ALSTOM Transport Information Solutions, France
pp. 301-306
Peter S. Zarubin , Quanterion Solutions, Inc. USA
Seymour Morris , Quanterion Solutions, Inc. USA
David Nicholls , Quanterion Solutions, Inc. USA
pp. 322-327
Hong-Zhong Huang , University of Electronic Science and Technology of China, China
Yu Liu , University of Electronic Science and Technology of China, China
pp. 328-333
Alexander Usynin , University of Tennessee, USA
Aleksey Urmanov , Sun Microsystems, USA
pp. 334-340
Tim Bedford , University of Strathclyde, UK
Richard Denning , United Kingdom Ministry of Defence, UK
Matthew Revie , University of Strathclyde, UK
Lesley Walls , University of Strathclyde, UK
pp. 341-346
Robert Bergman , Relex Software Corporation, USA
Jennifer Akers , CRE, Relex Software Corporation, USA
Liudong Xing , University of Massachusetts - Dartmouth, USA
pp. 347-353
Liudong Xing , University of Massachusetts - Dartmouth, USA
Wendai Wang , Applied Materials, USA
pp. 354-358
Guo Li , State Key Lab. for Manufacturing Sys. Eng., Xi'an Jiaotong University, China
Jianmin Gao , State Key Lab. for Manufacturing Sys. Eng., Xi'an Jiaotong University, China
pp. 359-364
Tingdi Zhao , System Engineering, Beijing University of Aeronautics and Astronautics, China
Mei Rong , System Engineering, Beijing University of Aeronautics and Astronautics, China
pp. 365-370
Mike Silverman , Ops A La Carte LLC, USA
Fred Schenkelberg , Ops A La Carte LLC, USA
Craig Hillman , DfR Solutions, USA
pp. 375-380
Jianxiong Chen , Emerson Climate Technologies, USA
pp. 381-385
Nathaniel Ozarin , The Omnicon Group Inc., USA
pp. 386-392
Bo Yang , University of Electronic Science and Technology of China, China
Huajun Hu , University of Electronic Science and Technology of China, China
Jun Zhou , University of Electronic Science and Technology of China, China
pp. 393-398
Walter Schilling , University of Toledo, USA
Mansoor Alam , University of Toledo, USA
pp. 399-404
Suchang Guo , University of Electronic Science and Technology of China, China
Ning Ning , University of Electronic Science and Technology of China, China
Hong-Zhong Huang , University of Electronic Science and Technology of China, China
pp. 405-410
Katrina Groth , Center for Risk and Reliability, University of Maryland, USA
Ali Mosleh , Center for Risk and Reliability, University of Maryland, USA
pp. 411-416
J. M. Block , Saab Aerotech, Ground Support Services, Sweden
T. Tyrberg , Saab Aerotech, Ground Support Services, Sweden
pp. 417-422
Jeffrey Banks , Applied Research Laboratory at Pennsylvania State University, USA
Karl Reichard , Applied Research Laboratory at Pennsylvania State University, USA
Michael Drake , BAE Systems, USA
pp. 423-427
Joon Jin Song , University of Arkansas, USA
Pingjian Yu , University of Arkansas, USA
pp. 428-433
Steffen Nebel , Institute of Machine Components, Universitaet Stuttgart, Germany
pp. 434-439
James A. McLinn , CRE, USA
pp. 446-451
Jay Bennett , Telcordia Technologies, USA
pp. 452-455
John B. Bowles , University of South Carolina, USA
William Hanczaryk , Winthrop University, USA
pp. 463-468
J. Wesley Hines , Nuclear Engineering, University of Tennessee, USA
Dustin R. Garvey , Nuclear Engineering, University of Tennessee, USA
pp. 469-474
Jie Gu , University of Maryland, USA
pp. 481-487
Gary J. Zukowski , Lockheed Martin MS2, USA
pp. 488-490
Estelle Deloux , IRCCyN / Ecole des Mines de Nantes, France
Bruno Castanier , IRCCyN / Ecole des Mines de Nantes, France
Christophe Berenguer , Université de Technologie de Troyes / CNRS, France
pp. 496-501
Peng Wang , Hamilton Sundstrand Power Systems, USA
Tongdan Jin , Texas A&M International University, USA
Haitao Liao , Wichita State University, USA
pp. 502-507
F. Chris Sautter , University of Alabama in Huntsville, USA
Patrick W. Jemison , University of Alabama in Huntsville, USA
Christopher M. Goes , University of Alabama in Huntsville, USA
Jerod M. Wooten , University of Alabama in Huntsville, USA
pp. 508-513
Page numbers (PDF)
pp. xxiv
pp. xxv
Back cover (PDF)
pp. c4
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