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2008 Annual Reliability and Maintainability Symposium
Las Vegas, NV, USA
January 28-January 31
ISBN: 978-1-4244-1460-4
Table of Contents
Papers
Clifford H. Lange, Novellus Systems Inc., USA
Ayako Flint, Novellus Systems Inc., USA
pp. v-vi
Author index (PDF)
pp. xix-xxi
Takehisa Kohda, Kyoto University, Japan
Satoshi Matsumoto, Kyoto University, Japan
Masaki Nakagawa, Mitsubishi Chemical Group, Science&Technology Research Center, Inc., Japan
pp. 15-20
Dong Liu, National University of Defense Technology, China
Chunyuan Zhang, National University of Defense Technology, China
Weiyan Xing, China Huayin Ordnance Test Center, China
Rui Li, National University of Defense Technology, China
pp. 21-26
Bruno Castanier, Ecole des Mines de Nantes / IRCCyN, France
Thomas G. Yeung, Ecole des Mines de Nantes / IRCCyN, France
pp. 25-30
Tony Halim, National University of Singapore, Singapore
Loon-Ching Tang, National University of Singapore, Singapore
pp. 54-58
Aravindan Balasubramanian, Technische Universiteit Eindhoven, The Netherlands
Kostas Kevrekidis, Technische Universiteit Eindhoven, The Netherlands
Peter Sonnemans, Technische Universiteit Eindhoven, The Netherlands
Martin Newby, City University London, UK
pp. 64-69
Donovan L. Mathias, NASA Ames Research Center, USA
Susie Go, NASA Ames Research Center, USA
Ken Gee, NASA Ames Research Center, USA
Scott Lawrence, NASA Ames Research Center, USA
pp. 74-79
Ming Li, Mantech SRS, USA
Paula S. Pruessner, NASA Goddard Space Flight Center, USA
pp. 86-90
Jinsuk Lee, Department of Industrial Engineering, Arizona State University, USA
Rong Pan, Department of Industrial Engineering, Arizona State University, USA
pp. 91-96
Guo Li, State Key Lab. for Manufacturing Systems Engineering, Xi'an Jiaotong University, China
Jianmin Gao, State Key Lab. for Manufacturing Systems Engineering, Xi'an Jiaotong University, China
Fumin Chen, State Key Lab. for Manufacturing Systems Engineering, Xi'an Jiaotong University, China
pp. 97-102
Amel Demri, LASQUO, University of Angers, France
Abderafi Charki, LASQUO, University of Angers, France
Fabrice Guerin, LASQUO, University of Angers, France
Herve Christofol, CPNI, University of Angers, France
pp. 114-119
Peter J.M. Sonnemans, Eindhoven University of Technology, The Netherlands
Aravindan Balasubramanian, Eindhoven University of Technology, The Netherlands
Kostas Kevrekedis, Eindhoven University of Technology, The Netherlands
Martin J. Newby, City University London, UK
pp. 132-136
Tieling Zhang, Hitachi Global Storage Technology, Singapore
Yiming Wang, Beijing Institute of Graphic Communication, China
Min Xie, National University of Singapore, Singapore
pp. 143-148
Rasmus Adler, Fraunhofer Institute Experimental Software Engineering, Germany
Dominik J. Domis, Fraunhofer Institute Experimental Software Engineering, Germany
Marc Furster, Fraunhofer Institute Experimental Software Engineering, Germany
Mario Trapp, Fraunhofer Institute Experimental Software Engineering, Germany
pp. 149-154
Zdenek Vintr, Czech University of Defence, Czech Republic
Michal Vintr, Brno University of Technology, Czech Republic
pp. 155-160
John Z. Gyekenyesi, N&R Engineering, USA
Bill Strack, N&R Engineering, USA
Edward J. Zampino, NASA Glenn Research Center, USA
Shantaram S. Pai, NASA Glenn Research Center, USA
pp. 161-165
Guillaume Poncelin, Eurocopter, France
Jean-Pierre Derain, Eurocopter, France
Aline Cauvin, University of Marseille, France
Denis Dufrene, ENSAM Aix-en-Provence, France
pp. 175-180
James B. Farmer, Strategic Technology Institute, Inc., USA
Paul M. Ellner, Army Materiel Systems Analysis Activity, USA
pp. 212-217
Calin Florin Baban, University of Oradea, Romania
Marius Baban, University of Oradea, Romania
Ioan Eugen Radu, University of Oradea, Romania
pp. 218-223
Tommie M. Lindquist, Royal Institute of Technology (KTH), Sweden
Lina Bertling, Royal Institute of Technology (KTH), Sweden
pp. 231-237
Maxime Monnin, LAMIH, University of Valenciennes, France
Benoit Iung, CRAN, Nancy University, France
Olivier Senechal, LAMIH, University of Valenciennes, France
Pascal Lelan, DGA, France
pp. 238-243
Jason L. Cook, US Army - Armament Research Development Engineering Center, USA
Jose Emmanuel Ramirez-Marquez, Stevens Institute of Technology, USA
pp. 244-248
Nobuyuki Wakai, Toshiba Corporation Semiconductor Company, Japan
Yuji Kobira, Toshiba Corporation Semiconductor Company, Japan
Hidemitsu Egawa, Toshiba Corporation Semiconductor Company, Japan
pp. 261-266
Bahman Honari, CTVR, Institute of Technology Sligo, Ireland
John Donovan, CTVR, Institute of Technology Sligo, Ireland
Toby Joyce, CTVR, Alcatel-Lucent Technologies, Ireland
Simon Wilson, CTVR, Department of Statistics, Trinity College, Ireland
pp. 267-271
Christian Maisch, Institute of Machine Components, Universitaet Stuttgart, Germany
Bernd Bertsche, Institute of Machine Components, Universitaet Stuttgart, Germany
Bernd-Robert Hohn, Gear Research Centre (FZG), Technical University of Munich, Germany
Hans-Philipp Otto, Gear Research Centre (FZG), Technical University of Munich, Germany
pp. 272-277
Zhong-Lai Wang, University of Electronic Science and Technology of China, China
Li Du, University of Electronic Science and Technology of China, China
Hong-Zhong Huang, University of Electronic Science and Technology of China, China
pp. 278-282
Marcio das Chagas Moura, Federal University of Pernambuco, Brazil
Paulo Renato A. Firmino, Federal University of Pernambuco, Brazil
Enrique Lopez Droguett, Federal University of Pernambuco, Brazil
Carlos Magno Jacinto, PETROBRAS-CENPES, Brazil
pp. 289-294
Meng-Lai Yin, California State Polytechnic University, USA
John Angus, Claremont Graduate University, USA
pp. 295-300
Pierre Dersin, ALSTOM Transport Information Solutions, France
Alban Peronne, ALSTOM Transport Information Solutions, France
Cassim Arroum, ENSEIRB/ALSTOM Transport Information Solutions, France
pp. 301-306
H. Dussault, SUNY Institute of Technology, USA
Peter S. Zarubin, Quanterion Solutions, Inc. USA
Seymour Morris, Quanterion Solutions, Inc. USA
David Nicholls, Quanterion Solutions, Inc. USA
pp. 322-327
Yu Liu, University of Electronic Science and Technology of China, China
Hong-Zhong Huang, University of Electronic Science and Technology of China, China
Hoang Pham, Rutgers University, USA
pp. 328-333
Alexander Usynin, University of Tennessee, USA
J. Wesley Hines, University of Tennessee, USA
Aleksey Urmanov, Sun Microsystems, USA
pp. 334-340
Tim Bedford, University of Strathclyde, UK
Richard Denning, United Kingdom Ministry of Defence, UK
Matthew Revie, University of Strathclyde, UK
Lesley Walls, University of Strathclyde, UK
pp. 341-346
Jennifer Akers, CRE, Relex Software Corporation, USA
Robert Bergman, Relex Software Corporation, USA
Suprasad V. Amari, CRE, Relex Software Corporation, USA
Liudong Xing, University of Massachusetts - Dartmouth, USA
pp. 347-353
Liudong Xing, University of Massachusetts - Dartmouth, USA
Wendai Wang, Applied Materials, USA
pp. 354-358
Jianmin Gao, State Key Lab. for Manufacturing Sys. Eng., Xi'an Jiaotong University, China
Guo Li, State Key Lab. for Manufacturing Sys. Eng., Xi'an Jiaotong University, China
Zhiyong Gao, State Key Lab. for Manufacturing Sys. Eng., Xi'an Jiaotong University, China
pp. 359-364
Mei Rong, System Engineering, Beijing University of Aeronautics and Astronautics, China
Tingdi Zhao, System Engineering, Beijing University of Aeronautics and Astronautics, China
Yang Yu, System Engineering, Beijing University of Aeronautics and Astronautics, China
pp. 365-370
Jianxiong Chen, Emerson Climate Technologies, USA
Wenzhen Yan, Emerson Climate Technologies, USA
pp. 381-385
Bo Yang, University of Electronic Science and Technology of China, China
Huajun Hu, University of Electronic Science and Technology of China, China
Jun Zhou, University of Electronic Science and Technology of China, China
pp. 393-398
Bo Yang, University of Electronic Science and Technology of China, China
Suchang Guo, University of Electronic Science and Technology of China, China
Ning Ning, University of Electronic Science and Technology of China, China
Hong-Zhong Huang, University of Electronic Science and Technology of China, China
pp. 405-410
Katrina Groth, Center for Risk and Reliability, University of Maryland, USA
Dongfeng Zhu, Center for Risk and Reliability, University of Maryland, USA
Ali Mosleh, Center for Risk and Reliability, University of Maryland, USA
pp. 411-416
J. M. Block, Saab Aerotech, Ground Support Services, Sweden
T. Tyrberg, Saab Aerotech, Ground Support Services, Sweden
pp. 417-422
Jeffrey Banks, Applied Research Laboratory at Pennsylvania State University, USA
Karl Reichard, Applied Research Laboratory at Pennsylvania State University, USA
Michael Drake, BAE Systems, USA
pp. 423-427
Pingjian Yu, University of Arkansas, USA
Joon Jin Song, University of Arkansas, USA
C. Richard Cassady, University of Arkansas, USA
pp. 428-433
Steffen Nebel, Institute of Machine Components, Universitaet Stuttgart, Germany
Bernd Bertsche, Institute of Machine Components, Universitaet Stuttgart, Germany
pp. 434-439
J. Wesley Hines, Nuclear Engineering, University of Tennessee, USA
Dustin R. Garvey, Nuclear Engineering, University of Tennessee, USA
pp. 469-474
Estelle Deloux, IRCCyN / Ecole des Mines de Nantes, France
Bruno Castanier, IRCCyN / Ecole des Mines de Nantes, France
Christophe Berenguer, Université de Technologie de Troyes / CNRS, France
pp. 496-501
Haitao Liao, Wichita State University, USA
Peng Wang, Hamilton Sundstrand Power Systems, USA
Tongdan Jin, Texas A&M International University, USA
Sunny Repaka, Wichita State University, USA
pp. 502-507
F. Chris Sautter, University of Alabama in Huntsville, USA
Patrick W. Jemison, University of Alabama in Huntsville, USA
Christopher M. Goes, University of Alabama in Huntsville, USA
Jerod M. Wooten, University of Alabama in Huntsville, USA
pp. 508-513
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