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The 6th International Conference on Parallel Interconnects
Anchorage, Alaska
October 17-October 19
ISBN: 0-7695-0440-X
Table of Contents
Session I: System Demonstrations: Chair: Marc Christensen, Applied Photonics, Inc.
Shinji Nishimura, RWCP Tsukuba Research Center
Tomohiro Kudoh, RWCP Tsukuba Research Center
Hiroaki Nishi, RWCP Tsukuba Research Center
Katsuyoshi Harasawa, Hitachi Communication Systems Inc.
Nobuhiro Matsudaira, Hitachi Communication Systems Inc.
Shigeto Akutsu, Hitachi Communication Systems Inc.
Koji Tasyo, Synagetech Inc.
Hideharu Amano, Keio University
pp. 5
Xuezhe Zheng, University of California at San Diego
Philippe J. Marchand, University of California at San Diego
Dawei Huang, University of California at San Diego
Sadik C. Esener, University of California at San Diego
pp. 13
Session II: Smart Pixel-Based Technology and Concepts: Chair: A. Cox, Honeywell Technology Center
George J. Simonis, Army Research Laboratory
John Pham, Army Research Laboratory
Paul H. Shen, Army Research Laboratory
Jagadeesh Pamulapati, Army Research Laboratory
Jiang Liu, Army Research Laboratory
Peter Newman, Army Research Laboratory
W. Lawler, Army Research Laboratory
Joseph Mait, Army Research Laboratory
Wayne Chang, Army Research Laboratory
Bikash Koley, University of Maryland at College Park
K. Amarnath, University of Maryland at College Park
S.S. Saini, University of Maryland at College Park
M. Datta, University of Maryland at College Park
L. Wasiczko, University of Maryland at College Park
Mario Dagenais, University of Maryland at College Park
Dennis Prather, University of Delaware
pp. 43
Session III: Massively Parallel Computing: Chair: Mark Neifeld, University of Arizona
D.Y. Zinoviev, State University of New York at Stony Brook
L. Wittie, State University of New York at Stony Brook
pp. 65
Klaus D. Maier, Friedrich-Schiller-University
Clemens Beckstein, Friedrich-Schiller-University
Reinhard Blickhan, Friedrich-Schiller-University
Werner Erhard, Friedrich-Schiller-University
Dietmar Fey, Friedrich-Schiller-University
pp. 73
Session IV: Modeling and Simulation: Chair: Joseph Mait, US Army Research Lab
Jose A. Martinez, University of Pittsburgh
Steven P. Levitan, University of Pittsburgh
Timothy P. Kurzweg, University of Pittsburgh
Eric N. Reiss, University of Pittsburgh
Michael T. Shomsky, University of Pittsburgh
Donald M. Chiarulli, University of Pittsburgh
Philippe J. Marchand, University of California at San Diego
pp. 98
Session V: Algorithms: Chair: William Terrell, Troika Design, Inc.
Session VI: Interconnect Technologies and Packaging: Chair: Rick Lytel, SUN Microsystems
Michael R. Feldman, Digital Optics Corporation
Hongtao Han, Digital Optics Corporation
Jared Stack, Digital Optics Corporation
Jay Mathews, Digital Optics Corporation
pp. 141
Session VII: Parallel Links: Chair: Krishnan Venkitakrishnan, HP Labs
D. Kuhl, Infineon Technologies AG
K. Drögemüller, Infineon Technologies AG
J. Blank, Infineon Technologies AG
M. Ehlert, Infineon Technologies AG
T. Kraeker, Infineon Technologies AG
J. Höhn, Infineon Technologies AG
D. Klix, Infineon Technologies AG
V. Plickert, Infineon Technologies AG
L. Melchior, Infineon Technologies AG
P. Hildebrandt, Infineon Technologies AG
M. Heinemann, Infineon Technologies AG
A. Beier, Infineon Technologies AG
L. Leininger, Infineon Technologies AG
H.-D. Wolf, Infineon Technologies AG
T. Wipiejewski, Osram Opto-Semiconductors
R. Engel, Siemens AG, ICP Communication Cables
pp. 187
D. Tolmie, Los Alamos National Laboratory
T.M. Boorman, Los Alamos National Laboratory
A. DuBois, Los Alamos National Laboratory
D. DuBois, Los Alamos National Laboratory
I. Philp, Los Alamos National Laboratory
W. Feng, Los Alamos National Laboratory and Purdue University
pp. 194
Session VIII: Networks: Chair: Ahmed Louri, University of Arizona
Hyo Jung Song, University of California at San Diego
Andrew Chien, University of California at San Diego
pp. 205
Enrique V. Carrera, Federal University of Rio de Janeiro
Ricardo Bianchini, Federal University of Rio de Janeiro and University of Rochester
pp. 213
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