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- 2009 3rd ACM/IEEE International Symposium on Networks-on-Chip
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2009 3rd ACM/IEEE International Symposium on Networks-on-Chip
La Jolla, CA, USA
May 10-May 13
ISBN: 978-1-4244-4142-6
Table of Contents
 | Papers |
Rickard Holsmark, Dept. of Electronics and Computer Engineering, Jönköping University, Sweden
Shashi Kumar, Dept. of Electronics and Computer Engineering, Jönköping University, Sweden
Maurizio Palesi, Dept. of Computer Science and Telecommunications Engineering, University of Catania, Italy
Andres Mejia, Dept. of Computing Engineering, Technical University of Valencia, Spain
pp. 2-11
Adan Kohler, Institut für Technische Informatik, Universität Stuttgart, Germany
Martin Radetzki, Institut für Technische Informatik, Universität Stuttgart, Germany
pp. 22-31
Wei Song, School of Computer Science, University of Manchester, M13 9PL UK
Doug Edwards, School of Computer Science, University of Manchester, M13 9PL UK
Jose Luis Nunez-Yanez, Department of Electrical and Electronic Engineering, Bristol University, BS8 1UB UK
Sohini Dasgupta, School of Computer Science, University of Manchester, M13 9PL UK
pp. 32-37
Keun Sup Shim, Computer Science and Artificial Intelligence Laboratory, Massachusetts Institute of Technology, USA
Myong Hyon Cho, Computer Science and Artificial Intelligence Laboratory, Massachusetts Institute of Technology, USA
Michel Kinsy, Computer Science and Artificial Intelligence Laboratory, Massachusetts Institute of Technology, USA
Tina Wen, Computer Science and Artificial Intelligence Laboratory, Massachusetts Institute of Technology, USA
Mieszko Lis, Computer Science and Artificial Intelligence Laboratory, Massachusetts Institute of Technology, USA
G. Edward Suh, Computer Science and Artificial Intelligence Laboratory, Massachusetts Institute of Technology, USA
Srinivas Devadas, Computer Science and Artificial Intelligence Laboratory, Massachusetts Institute of Technology, USA
pp. 38-43
Yue Qian, School of Computer Science, National University of Defense Technology, China
Zhonghai Lu, Dept. of Electronic, Computer and Software Systems, Royal Institute of Technology (KTH), Sweden
Wenhua Dou, School of Computer Science, National University of Defense Technology, China
pp. 44-53
Bo Fu, Dept. of Electrical and Computer Engineering, University of Rochester, NY 14627, USA
David Wolpert, Dept. of Electrical and Computer Engineering, University of Rochester, NY 14627, USA
Paul Ampadu, Dept. of Electrical and Computer Engineering, University of Rochester, NY 14627, USA
pp. 54-63
Lei Wang, Department of Computer Science and Engineering, Texas A&M University, College Station, 77843 USA
Yuho Jin, Department of Computer Science and Engineering, Texas A&M University, College Station, 77843 USA
Hyungjun Kim, Department of Computer Science and Engineering, Texas A&M University, College Station, 77843 USA
Eun Jung Kim, Department of Computer Science and Engineering, Texas A&M University, College Station, 77843 USA
pp. 64-73
S. Suboh, HPCL, GWU, Washington DC. 20052, USA
pp. 74-79
Pavel Ghosh, Department of Computer Science and Engineering, Arizona State University, Tempe, USA
Arunabha Sen, Department of Computer Science and Engineering, Arizona State University, Tempe, USA
pp. 80-85
Rudy Beraha, Qualcomm Corp. Research and Development, San Diego, California 92121, USA
Isask'har Walter, Electrical Engineering Department, Technion - Israel Institute of Technology, Haifa 32000, Israel
Israel Cidon, Electrical Engineering Department, Technion - Israel Institute of Technology, Haifa 32000, Israel
Avinoam Kolodny, Electrical Engineering Department, Technion - Israel Institute of Technology, Haifa 32000, Israel
pp. 86
Marco A. Z. Alves, Informatics Institute, Universidade Federal do Rio Grande do Sul, RS, Brazil
Lucas M. Schnorr, Informatics Institute, Universidade Federal do Rio Grande do Sul, RS, Brazil
pp. 87
Evgeni Krimer, Department of Electrical and Computer Engineering, University of Texas at Austin, USA
Mattan Erez, Department of Electrical and Computer Engineering, University of Texas at Austin, USA
Isaac Keslassy, Department of Electrical Engineering, Technion-Israel Institute of Technology, Israel
Avinoam Kolodny, Department of Electrical Engineering, Technion-Israel Institute of Technology, Israel
Isask'har Walter, Department of Electrical Engineering, Technion-Israel Institute of Technology, Israel
pp. 88
Avinash Karanth Kodi, School of Electrical Engineering and Computer Science, Ohio University, Athens, 45701, USA
Randy Morris, School of Electrical Engineering and Computer Science, Ohio University, Athens, 45701, USA
Ahmed Louri, Electrical and Computer Engineering, University of Arizona, Tucson, 85721, USA
Xiang Zhang, Electrical and Computer Engineering, University of Arizona, Tucson, 85721, USA
pp. 90
Ajay Joshi, Department of EECS, Massachusetts Institute of Technology, Cambridge, USA
Fred Chen, Department of EECS, Massachusetts Institute of Technology, Cambridge, USA
pp. 91
Yuan Xie, Pennsylvania State University, USA
pp. 93-102
Gilbert Hendry, Lightwave Research Laboratory, Columbia University, New York, 10027, USA
Shoaib Kamil, Computer Science Department, University of California, Berkeley, 94720, USA
Aleksandr Biberman, Lightwave Research Laboratory, Columbia University, New York, 10027, USA
Johnnie Chan, Lightwave Research Laboratory, Columbia University, New York, 10027, USA
Benjamin G. Lee, Lightwave Research Laboratory, Columbia University, New York, 10027, USA
Marghoob Mohiyuddin, Computer Science Department, University of California, Berkeley, 94720, USA
Ankit Jain, Computer Science Department, University of California, Berkeley, 94720, USA
Keren Bergman, Lightwave Research Laboratory, Columbia University, New York, 10027, USA
Luca P. Carloni, Computer Science Department, Columbia University, New York, 10027, USA
John Kubiatowicz, Computer Science Department, University of California, Berkeley, 94720, USA
Leonid Oliker, CRD/NERSC, Lawrence Berkeley National Laboratory, Berkeley, CA 94720, USA
John Shalf, CRD/NERSC, Lawrence Berkeley National Laboratory, Berkeley, CA 94720, USA
pp. 104-113
Awet Yemane Weldezion, School of Information and Communication Technologies, Department of Electronics, Computer, and Software Systems, KTH Royal Institute of Technology, Electrum 229, Kista SE 16440, Sw
Matt Grange, Centre for Microsystems Engineering, Department of Engineering, Lancaster University, LA1 4YW, UK
Dinesh Pamunuwa, Centre for Microsystems Engineering, Department of Engineering, Lancaster University, LA1 4YW, UK
Zhonghai Lu, School of Information and Communication Technologies, Department of Electronics, Computer, and Software Systems, KTH Royal Institute of Technology, Electrum 229, Kista SE 16440, Sw
Axel Jantsch, School of Information and Communication Technologies, Department of Electronics, Computer, and Software Systems, KTH Royal Institute of Technology, Electrum 229, Kista SE 16440, Sw
Roshan Weerasekera, Centre for Microsystems Engineering, Department of Engineering, Lancaster University, LA1 4YW, UK
Hannu Tenhunen, Centre for Microsystems Engineering, Department of Engineering, Lancaster University, LA1 4YW, UK
pp. 114-123
Ajay Joshi, Department of EECS, Massachusetts Institute of Technology, Cambridge, USA
Christopher Batten, Department of EECS, Massachusetts Institute of Technology, Cambridge, USA
Yong-Jin Kwon, Department of EECS, University of California, Berkeley, USA
Scott Beamer, Department of EECS, University of California, Berkeley, USA
Imran Shamim, Department of EECS, Massachusetts Institute of Technology, Cambridge, USA
Krste Asanovic, Department of EECS, University of California, Berkeley, USA
pp. 124-133
Pascal Vivet, CEA, LETI, MINATEC, F38054 GRENOBLE Cedex 9, FRANCE
pp. 153-162
Martti Forsell, VTT, Platform Architectures, Box 1100, FI-90571 Oulu, Finland
pp. 163-172
Ran Manevich, Electrical Engineering Department, Technion - Israel Institute of Technology, Israel
Isask'har Walter, Electrical Engineering Department, Technion - Israel Institute of Technology, Israel
Israel Cidon, Electrical Engineering Department, Technion - Israel Institute of Technology, Israel
Avinoam Kolodny, Electrical Engineering Department, Technion - Israel Institute of Technology, Israel
pp. 173-182
Nicola Concer, Dipartimento di Scienze dell'Informazione, Università di Bologna, Italy
Luciano Bononi, Dipartimento di Scienze dell'Informazione, Università di Bologna, Italy
Luca P. Carloni, Computer Science Department, Columbia University in the City of New York, USA
pp. 193-202
Anh T. Tran, Department of Electrical and Computer Engineering, University of California - Davis, USA
Dean N. Truong, Department of Electrical and Computer Engineering, University of California - Davis, USA
Bevan M. Baas, Department of Electrical and Computer Engineering, University of California - Davis, USA
pp. 214-223
Paul Teehan, University of British Columbia, Vancouver, Canada
pp. 234-243
Daniele Ludovici, Computer Engineering Lab., Delft University of Technology, The Netherlands
Luca Benini, Computer Engineering Lab., Delft University of Technology, The Netherlands
pp. 244-249
Young Hoon Kang, University of Southern California / Information Sciences Institute, USA
Taek-Jun Kwon, University of Southern California / Information Sciences Institute, USA
Jeff Draper, University of Southern California / Information Sciences Institute, USA
pp. 250-255
Marcos Herve, Universidade Federal do Rio Grande do Sul, PPGC - PGMICRO - Instituto de Informática / Escola de Engenharia, P.O. Box 15064, ZIP 91501-970, Porto Alegre, Brazil
Erika Cota, Universidade Federal do Rio Grande do Sul, PPGC - PGMICRO - Instituto de Informática / Escola de Engenharia, P.O. Box 15064, ZIP 91501-970, Porto Alegre, Brazil
Fernanda Lima Kastensmidt, Universidade Federal do Rio Grande do Sul, PPGC - PGMICRO - Instituto de Informática / Escola de Engenharia, P.O. Box 15064, ZIP 91501-970, Porto Alegre, Brazil
Marcelo Lubaszewski, Universidade Federal do Rio Grande do Sul, PPGC - PGMICRO - Instituto de Informática / Escola de Engenharia, P.O. Box 15064, ZIP 91501-970, Porto Alegre, Brazil
pp. 256-265
Ying-Cherng Lan, Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, ROC
Shih-Hsin Lo, Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, ROC
Yueh-Chi Lin, Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, ROC
Yu-Hen Hu, Department of Electrical and Computer Engineering, University of Wisconsin, Madison, WI53706, USA
Sao-Jie Chen, Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, ROC
pp. 266-275
Prabhat Kumar, Northwestern University, 2145 Sheridan Road, Evanston, IL, USA
Yan Pan, Northwestern University, 2145 Sheridan Road, Evanston, IL, USA
Gokhan Memik, Northwestern University, 2145 Sheridan Road, Evanston, IL, USA
Alok Choudhary, Northwestern University, 2145 Sheridan Road, Evanston, IL, USA
pp. 276-285
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