• N
  • NEMS
  • 2009
  • 2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems
Advanced Search 
2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems
Shenzhen, China
January 05-January 08
ISBN: 978-1-4244-4629-2
Table of Contents
Papers
Lidong Du, State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100080, China
Zhan Zhao, State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100080, China
Cheng Pang, State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100080, China
Zhen Fang, State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100080, China
Yonghong Liu, State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100080, China
Youjun Han, Institute of Meteorology, PLA University of Science&Technology, Nanjing 211101, China
pp. 1-4
Haitao Ding, National Key Laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking University, Beijing 100871, China
Zhenchuan Yang, National Key Laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking University, Beijing 100871, China
Guizhen Yan, National Key Laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking University, Beijing 100871, China
pp. 5-8
Yu Ling-min, School of electronic and information Engineering, Xi'an Jiao Tong University, China
Zhu Chang-chun, School of electronic and information Engineering, Xi'an Jiao Tong University, China
pp. 9-12
Shubin Yan, National Key Laboratory For Electronic Measurement Technology, North University Of China, China
Yingzhan Yan, National Key Laboratory For Electronic Measurement Technology, North University Of China, China
Zhe Ji, National Key Laboratory For Electronic Measurement Technology, North University Of China, China
Baohua Wang, National Key Laboratory For Electronic Measurement Technology, North University Of China, China
Shaohui Wang, National Key Laboratory For Electronic Measurement Technology, North University Of China, China
Guoqing Jiang, National Key Laboratory For Electronic Measurement Technology, North University Of China, China
Jijun Xiong, National Key Laboratory For Electronic Measurement Technology, North University Of China, China
Xiongying Ye, State Key Laboratory of Precision Measurement Technology and Instruments, Tsinghua University, China
Zhaoying Zhou, State Key Laboratory of Precision Measurement Technology and Instruments, Tsinghua University, China
Wendong Zhang, National Key Laboratory For Electronic Measurement Technology, North University Of China, China
pp. 13-16
Xingli Zhang, Harbin Institute of Technology, Research Center of Satellite technology, China
Zhaowei Sun, Harbin Institute of Technology, Research Center of Satellite technology, China
Guoqiang Wu, Harbin Institute of Technology, Research Center of Satellite technology, China
pp. 17-20
Xudong Zou, National Key Laboratory of Nano/Micro Fabrication Technology Institute of Microelectronics, Peking University, Beijing, 100871, China
Kenle Chen, National Key Laboratory of Nano/Micro Fabrication Technology Institute of Microelectronics, Peking University, Beijing, 100871, China
Hualiang Zhang, ECE Department, University of Arizona, 1230 E. Speedway Blvd., Tucson, 85721, USA
Jinwen Zhang, National Key Laboratory of Nano/Micro Fabrication Technology Institute of Microelectronics, Peking University, Beijing, 100871, China
pp. 21-24
Dong-Ming Fang, Institute of Microelectronics, Peking University, Beijing, China
Hai-Xia Zhang, Institute of Microelectronics, Peking University, Beijing, China
Xiao-Lin Zhao, Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong University, China
pp. 25-28
Shao-Chun Sun, School of Aerospace Science and Engineering, Beijing Institute of Technology, China
Geng-Chen Shi, School of Aerospace Science and Engineering, Beijing Institute of Technology, China
pp. 33-36
Jinghui Xu, Micro and Nano Electromechanical System Laboratory, Northwestern Polytechnical University, Xi'an 710072, China
Weizheng Yuan, Micro and Nano Electromechanical System Laboratory, Northwestern Polytechnical University, Xi'an 710072, China
Honglong Chang, Micro and Nano Electromechanical System Laboratory, Northwestern Polytechnical University, Xi'an 710072, China
Binghe Ma, Micro and Nano Electromechanical System Laboratory, Northwestern Polytechnical University, Xi'an 710072, China
pp. 37-40
Michael Kraft, School of Electronics and Computer Science, Southampton University, UK
Haitao Ding, Institute of Microelectronics, Peking University, China
pp. 41-46
Hao Ruican, School of Mechanical, Electronic and Control Engineering, Beijing Jiaotong University, China
Li Decai, School of Mechanical, Electronic and Control Engineering, Beijing Jiaotong University, China
pp. 47-50
Zhaoxin Geng, Institute of Microelectronics, Peking University, Beijing, China
Qing Li, School of Sciences, Changchun University of Science and Technology, China
Wei Wang, Institute of Microelectronics, Peking University, Beijing, China
Zhihong Li, Institute of Microelectronics, Peking University, Beijing, China
pp. 51-54
Bian Tian, State Key Laboratory for Mechanical Manufacturing System, Institute of Precision Engineering, Xi'an, Jiaotong University, 710049, China
Yulong Zhao, State Key Laboratory for Mechanical Manufacturing System, Institute of Precision Engineering, Xi'an, Jiaotong University, 710049, China
Zhuangde Jiang, State Key Laboratory for Mechanical Manufacturing System, Institute of Precision Engineering, Xi'an, Jiaotong University, 710049, China
Ling Zhang, State Key Laboratory for Mechanical Manufacturing System, Institute of Precision Engineering, Xi'an, Jiaotong University, 710049, China
Nansheng Liao, State Key Laboratory for Mechanical Manufacturing System, Institute of Precision Engineering, Xi'an, Jiaotong University, 710049, China
Yuanhao Liu, State Key Laboratory for Mechanical Manufacturing System, Institute of Precision Engineering, Xi'an, Jiaotong University, 710049, China
Chao Meng, State Key Laboratory for Mechanical Manufacturing System, Institute of Precision Engineering, Xi'an, Jiaotong University, 710049, China
pp. 55-58
Kai Yang, Lab of Silicon Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, China
Zhigang Li, Lab of Silicon Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, China
Yupeng Jing, Lab of Silicon Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, China
Dapeng Chen, Lab of Silicon Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, China
Tianchun Ye, Lab of Silicon Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, China
pp. 59-62
Nor Zaidi Haron, Computer Engineering Laboratory, Delft University of Technology, Mekelweg 4, 2628 CD, the Netherlands
Said Hamdioui, Computer Engineering Laboratory, Delft University of Technology, Mekelweg 4, 2628 CD, the Netherlands
Sorin Cotofana, Computer Engineering Laboratory, Delft University of Technology, Mekelweg 4, 2628 CD, the Netherlands
pp. 63-68
Tsung-Han Tsai, Department of Mechanical Engineering, National Taiwan University, Taipei, Taiwan
Dar-Sun Liou, Department of Mechanical Engineering, National Taiwan University, Taipei, Taiwan
Ping-Hei Chen, Department of Mechanical Engineering, National Taiwan University, Taipei, Taiwan
Chin-Ting Yang, Department of Mechanical and Computer-aided Engineering, St. John's University, Taipei, Taiwan
pp. 69-74
Tao Chen, State Key Laboratory of Robotics and System, Robotics Institute, Harbin Institute of Technology, 150080, CHINA
Liguo Chen, State Key Laboratory of Robotics and System, Robotics Institute, Harbin Institute of Technology, 150080, CHINA
Baixu Liu, State Key Laboratory of Robotics and System, Robotics Institute, Harbin Institute of Technology, 150080, CHINA
Jiachou Wang, State Key Laboratory of Robotics and System, Robotics Institute, Harbin Institute of Technology, 150080, CHINA
Xinxin Li, State Key Lab of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 200050, CHINA
pp. 75-79
Fengtian Han, Department of precision instruments and mechanology, Tsinghua University, China
Zhenbin Fu, Department of precision instruments and mechanology, Tsinghua University, China
Jingxin Dong, Department of precision instruments and mechanology, Tsinghua University, China
pp. 80-85
Yibin Gong, State Key Laboratories of Transducer Technology, National Key Laboratory of Microsystem Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of
Huamin Gao, State Key Laboratories of Transducer Technology, National Key Laboratory of Microsystem Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of
Xiang Liu, State Key Laboratories of Transducer Technology, National Key Laboratory of Microsystem Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of
Wenping Liu, State Key Laboratories of Transducer Technology, National Key Laboratory of Microsystem Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of
Tie Li, State Key Laboratories of Transducer Technology, National Key Laboratory of Microsystem Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of
Ping Zhou, State Key Laboratories of Transducer Technology, National Key Laboratory of Microsystem Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of
Yuelin Wang, State Key Laboratories of Transducer Technology, National Key Laboratory of Microsystem Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of
pp. 86-89
Min Miao, National Key Laboratory of Micro/Nano Fabrication Technology, Peking University, Beijing, 100871, China
Yufeng Jin, National Key Laboratory of Micro/Nano Fabrication Technology, Peking University, Beijing, 100871, China
Hongguang Liao, National Key Laboratory of Micro/Nano Fabrication Technology, Peking University, Beijing, 100871, China
Liwei Zhao, National Key Laboratory of Micro/Nano Fabrication Technology, Peking University, Beijing, 100871, China
Yunhui Zhu, National Key Laboratory of Micro/Nano Fabrication Technology, Peking University, Beijing, 100871, China
Xin Sun, National Key Laboratory of Micro/Nano Fabrication Technology, Peking University, Beijing, 100871, China
Yunxia Guo, National Key Laboratory of Micro/Nano Fabrication Technology, Peking University, Beijing, 100871, China
pp. 90-93
Julien Arcamone, CNM-IMB, Campus UAB, 08193 Bellaterra (Barcelona), Spain
Marc Sansa, CNM-IMB, Campus UAB, 08193 Bellaterra (Barcelona), Spain
Jaume Verd, Dept. Enginyeria Electronica. Universitat Autónoma de Barcelona. ETSE-UAB., 08193 Bellaterra, Spain
Arantxa Uranga, Dept. Enginyeria Electronica. Universitat Autónoma de Barcelona. ETSE-UAB., 08193 Bellaterra, Spain
Gabriel Abadal, Dept. Enginyeria Electronica. Universitat Autónoma de Barcelona. ETSE-UAB., 08193 Bellaterra, Spain
Nuria Barniol, Dept. Enginyeria Electronica. Universitat Autónoma de Barcelona. ETSE-UAB., 08193 Bellaterra, Spain
Marc A.F. van den Boogaart, Microsystems Laboratory (LMIS1), EPFL, CH-1015 Lausanne, Switzerland
Juergen Brugger, Microsystems Laboratory (LMIS1), EPFL, CH-1015 Lausanne, Switzerland
Francesc Perez-Murano, CNM-IMB, Campus UAB, 08193 Bellaterra (Barcelona), Spain
pp. 94-97
X. Chen, State Key Lab. of Transducer Tech., Inst. of Electronics, Chinese Academy of Sciences, 100190 Beijing, China
D. F. Cui, State Key Lab. of Transducer Tech., Inst. of Electronics, Chinese Academy of Sciences, 100190 Beijing, China
L.L. Zhang, State Key Lab. of Transducer Tech., Inst. of Electronics, Chinese Academy of Sciences, 100190 Beijing, China
pp. 98-101
Hai Liu, National Key Laboratory of Nano/Micro Fabrication Technology, Key Laboratory for Thin Film and Microfabrication of the Ministry of Education, Research Institute of Micro/Nano Scien
Xiaohang Chen, National Key Laboratory of Nano/Micro Fabrication Technology, Key Laboratory for Thin Film and Microfabrication of the Ministry of Education, Research Institute of Micro/Nano Scien
Dong Xu, National Key Laboratory of Nano/Micro Fabrication Technology, Key Laboratory for Thin Film and Microfabrication of the Ministry of Education, Research Institute of Micro/Nano Scien
Zhongyu Hou, National Key Laboratory of Nano/Micro Fabrication Technology, Key Laboratory for Thin Film and Microfabrication of the Ministry of Education, Research Institute of Micro/Nano Scien
Yafei Zhang, National Key Laboratory of Nano/Micro Fabrication Technology, Key Laboratory for Thin Film and Microfabrication of the Ministry of Education, Research Institute of Micro/Nano Scien
pp. 102-105
Wenli Zhou, Department of Electronic Science and Technology, Huazhong University of Science and Technology, Wuhan, China
Sanping Wan, Department of Electronic Science and Technology, Huazhong University of Science and Technology, Wuhan, China
Chao Zhu, School of Chemistry and Environment Engineering, Jianghan University, Wuhan, China
pp. 106-111
Tan D. Tran, MEMS and Microsystems Department, College of Technology, VNUH, VIETNAM
Minh D. Nguyen, Inorganic Materials Science, MESA+ Institute for Nanotechnology, University of Twente, NETHERLANDS
Long T. Nguyen, MEMS and Microsystems Department, College of Technology, VNUH, VIETNAM
Tue H. Huynh, Bac Ha International University, VIETNAM
Thuy P. Nguyen, MEMS and Microsystems Department, College of Technology, VNUH, VIETNAM
pp. 112-115
Haibo Yu, Robotics Laboratory, Shenyang Institute of Automation, Chinese Academy of Sciences, China
Niandong Jiao, Robotics Laboratory, Shenyang Institute of Automation, Chinese Academy of Sciences, China
Zaili Dong, Robotics Laboratory, Shenyang Institute of Automation, Chinese Academy of Sciences, China
Yanli Qu, Robotics Laboratory, Shenyang Institute of Automation, Chinese Academy of Sciences, China
Wen J. Li, Robotics Laboratory, Shenyang Institute of Automation, Chinese Academy of Sciences, China
Yuechao Wang, Robotics Laboratory, Shenyang Institute of Automation, Chinese Academy of Sciences, China
pp. 116-120
Haijun Zhang, College of Electrical Engineering, Zhejiang University, China
Changsheng Zhu, College of Electrical Engineering, Zhejiang University, China
Qin Yang, College of Mechanical-Electrical Engineering, Jiaxing University, China
pp. 121-125
Liqiang Xie, College of Mechatronics Engineering and Automation, National University of Defense Technology, Changsha, China
Dingbang Xiao, College of Mechatronics Engineering and Automation, National University of Defense Technology, Changsha, China
Haoxu Wang, College of Mechatronics Engineering and Automation, National University of Defense Technology, Changsha, China
Xuezhong Wu, College of Mechatronics Engineering and Automation, National University of Defense Technology, Changsha, China
Shengyi Li, College of Mechatronics Engineering and Automation, National University of Defense Technology, Changsha, China
pp. 126-129
Yi Liu, MEMS Research Center, Institute of Microelectronics Peking University, Beijing 100871, China
Yaquan Tang, MEMS Research Center, Institute of Microelectronics Peking University, Beijing 100871, China
Xiaomei Yu, MEMS Research Center, Institute of Microelectronics Peking University, Beijing 100871, China
pp. 130-133
Dong Ying, Department of Precision Instruments and Mechanology, Tsinghua University, China
Gao Wei, Department of Precision Instruments and Mechanology, Tsinghua University, China
You Zheng, Department of Precision Instruments and Mechanology, Tsinghua University, China
pp. 134-138
Haitao Cheng, State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, China
Heng Yang, State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, China
Yuelin Wang, State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, China
pp. 139-142
Hua Sun, College of Automation, Harbin Engineering University, China
Haixu Zhou, College of Automation, Harbin Engineering University, China
Xiang Li, College of Automation, Harbin Engineering University, China
Yanhui Wei, College of Automation, Harbin Engineering University, China
Xiao Li, College of Automation, Harbin Engineering University, China
pp. 143-146
Huiqi He, Bioengineering Graduate Program, The Hong Kong University of Science and Technology, Hong Kong
Donald C. Chang, Dept of Biology, The Hong Kong University of Science and Technology, Hong Kong
Yi-Kuen Lee, Dept of Mechanical Engineering, The Hong Kong University of Science and Technology, Hong Kong
pp. 147-151
Kenle Chen, National key laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking University, Beijing 100871, China
Yueyang Dai, School of software and microelectronics, Peking University, Beijing 100871, China
Xudong Zou, National key laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking University, Beijing 100871, China
Jinwen Zhang, National key laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking University, Beijing 100871, China
pp. 152-155
Lingyun Wang, Dept. of Mechanical and Electrical Engineering, Xiamen Univ., Fujian, CHINA
Yibo Zeng, Dept. of Mechanical and Electrical Engineering, Xiamen Univ., Fujian, CHINA
Wenwang Li, Dept. of Mechanical and Electrical Engineering, Xiamen Univ., Fujian, CHINA
Daoheng Sun, Dept. of Mechanical and Electrical Engineering, Xiamen Univ., Fujian, CHINA
pp. 156-159
Qijun Xiao, Research Institute of Micro/Nanometer Science and Technology, Shanghai Jiaotong University, China
Wenyuan Chen, Research Institute of Micro/Nanometer Science and Technology, Shanghai Jiaotong University, China
Gaoyin Ma, Research Institute of Micro/Nanometer Science and Technology, Shanghai Jiaotong University, China
Feng Cui, Research Institute of Micro/Nanometer Science and Technology, Shanghai Jiaotong University, China
Shengyong Li, Research Institute of Micro/Nanometer Science and Technology, Shanghai Jiaotong University, China
Weiping Zhang, Research Institute of Micro/Nanometer Science and Technology, Shanghai Jiaotong University, China
pp. 160-163
Jia-Hong Zhang, Key Laboratory of MEMS of Ministry of Education, Southeast University, China
Qing-An Huang, Key Laboratory of MEMS of Ministry of Education, Southeast University, China
Hong Yu, Key Laboratory of MEMS of Ministry of Education, Southeast University, China
pp. 164-167
Chi-Yuan Lee, Department of Mechanical Engineering, Yuan Ze Fuel Cell Center, Yuan Ze University, Taoyuan, Taiwan, R.O.C.
Shuo-Jen Lee, Department of Mechanical Engineering, Yuan Ze Fuel Cell Center, Yuan Ze University, Taoyuan, Taiwan, R.O.C.
Yuh-Chung Hu, Department of Mechanical and Electro-Mechanical Engineering, National ILan University, Taiwan, R.O.C.
Chen-Hen Lin, Department of Mechanical Engineering, Yuan Ze Fuel Cell Center, Yuan Ze University, Taoyuan, Taiwan, R.O.C.
Yu-Ming Lee, Department of Mechanical Engineering, Yuan Ze Fuel Cell Center, Yuan Ze University, Taoyuan, Taiwan, R.O.C.
Wei-Yuan Fan, Department of Mechanical Engineering, Yuan Ze Fuel Cell Center, Yuan Ze University, Taoyuan, Taiwan, R.O.C.
pp. 168-171
Chi-Yuan Lee, Department of Mechanical Engineering, Yuan Ze Fuel Cell Center, Yuan Ze University, Taoyuan, Taiwan, R.O.C.
Shuo-Jen Lee, Department of Mechanical Engineering, Yuan Ze Fuel Cell Center, Yuan Ze University, Taoyuan, Taiwan, R.O.C.
Wen-Pin Shih, Department of Mechanical Engineering, National Taiwan University, Taipei, Taiwan, R.O.C.
Chen-Hen Lin, Department of Mechanical Engineering, Yuan Ze Fuel Cell Center, Yuan Ze University, Taoyuan, Taiwan, R.O.C.
Chi-Chung Chang, Department of Mechanical Engineering, Yuan Ze Fuel Cell Center, Yuan Ze University, Taoyuan, Taiwan, R.O.C.
Pei-Zen Chang, Institute of Applied Mechanics, National Taiwan University, Taipei, Taiwan, R.O.C.
pp. 172-175
Siva Penmetsa, Institute for Micromanufacturing, Louisiana Tech University, USA
Tianhua Zhang, Institute for Micromanufacturing, Louisiana Tech University, USA
Zhongcheng Gong, Institute for Micromanufacturing, Louisiana Tech University, USA
Tae-woo Lee, Center for Computation Technology, Louisiana State University, USA
Long Que, Institute for Micromanufacturing, Louisiana Tech University, USA
pp. 176-180
Tianhua Zhang, Institute for Micromanufacturing, Louisiana Tech University, USA
Zhongcheng Gong, Institute for Micromanufacturing, Louisiana Tech University, USA
Long Que, Institute for Micromanufacturing, Louisiana Tech University, USA
pp. 181-184
Wang Ya-Zhou, Department of Applied Chemistry, School of Science, Northwestern Polytechnical University, Xi'an 710072, China
Chen Li-Xin, Department of Applied Chemistry, School of Science, Northwestern Polytechnical University, Xi'an 710072, China
Song Jia-Le, Department of Applied Chemistry, School of Science, Northwestern Polytechnical University, Xi'an 710072, China
pp. 185-189
Hai-feng Zhang, MEMS Center, Harbin Institute of Technology, 150001, China
Xiao-wei Liui, MEMS Center, Harbin Institute of Technology, 150001, China
Zhi-cheng Peng, MEMS Center, Harbin Institute of Technology, 150001, China
Xi-Lian Wang, MEMS Center, Harbin Institute of Technology, 150001, China
Wei Wang, MEMS Center, Harbin Institute of Technology, 150001, China
Yu-feng Chen, No 1 flight college of Air Force, Harbin, 150048, China
pp. 190-193
Xiuling Zhang, Department of Chemistry, Dezhou University, 253011, China
Feng Jin, Department of Physics, Dezhou University, 253011, China
Jianxin Xing, Department of Biology, Dezhou University, 253011, China
pp. 194-197
Xuejiao Fan, Institute of Microelectronics, Peking University, Beijing 100871, China
Dacheng Zhang, Institute of Microelectronics, Peking University, Beijing 100871, China
pp. 198-201
Pingan Zhao, ASIC and System State Key Lab, Department of Microelectronics, Fudan University, China
Yinqing Li, ASIC and System State Key Lab, Department of Microelectronics, Fudan University, China
Xiangyu Zeng, ASIC and System State Key Lab, Department of Microelectronics, Fudan University, China
Jia Zhou, ASIC and System State Key Lab, Department of Microelectronics, Fudan University, China
Yiping Huang, ASIC and System State Key Lab, Department of Microelectronics, Fudan University, China
Ran Liu, ASIC and System State Key Lab, Department of Microelectronics, Fudan University, China
pp. 202-205
Weihua Li, National Key Laboratory of Mechatronics Engineering and Control, Beijing Institute of Technology, 100081, China
Wenzhong Lou, National Key Laboratory of Mechatronics Engineering and Control, Beijing Institute of Technology, 100081, China
Xin Li, National Key Laboratory of Mechatronics Engineering and Control, Beijing Institute of Technology, 100081, China
Rongsen Hong, National Key Laboratory of Mechatronics Engineering and Control, Beijing Institute of Technology, 100081, China
Liang Hu, National Key Laboratory of Mechatronics Engineering and Control, Beijing Institute of Technology, 100081, China
pp. 206-210
Wei-Hsin Gau, Department of Mechatronic Engineering, Huafan University, Taiwan
Shin-Chun Huang, Department of Mechatronic Engineering, Huafan University, Taiwan
Yuh-Chung Hu, Department of Mechanical and Electro-Mechanical Engineering, Ilan University, Taiwan
pp. 211-214
Xu Zhao, Inst. of Robotics and Automatic Information System, Nankai University, Tianjin, China
Xin Zhao, Inst. of Robotics and Automatic Information System, Nankai University, Tianjin, China
Guizhang Lu, Inst. of Robotics and Automatic Information System, Nankai University, Tianjin, China
pp. 215-218
Chen-Hsun Weng, Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan 701
Chih-Chia Huang, Department of Chemistry, National Cheng Kung University, Tainan, Taiwan 701
Chen-Sheng Yeh, Department of Chemistry, National Cheng Kung University, Tainan, Taiwan 701
Gwo-Bin Lee, Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan 701
pp. 219-222
Dar-Bin Shieh, Institute of Oral Medicine and Center for Micro/Nano Science and Technology and Institute of Basic Medical Sciences, National Cheng Kung University, Tainan, Taiwan
Chia-Chun Hsieh, Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan
Song-Bin Huang, Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan
Gwo-Bin Lee, Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan
pp. 223-226
Sung-Yi Yang, Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan
Fong-Yu Cheng, Department of Chemistry, National Cheng Kung University, Tainan, Taiwan
Chen-Sheng Yeh, Department of Chemistry, National Cheng Kung University, Tainan, Taiwan
Huan-Yao Lei, Department of Microbiology and Immunology, National Cheng Kung University, Tainan, Taiwan
Gwo-Bin Lee, Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan
pp. 227-230
Song Xing, Key Lab of Fundamental Science for National Defense, School of Instrument Science and Opto-electronics Engineering, Beijing University of Aeronautics and Astronautics, China
Dong Haifeng, Key Lab of Fundamental Science for National Defense, School of Instrument Science and Opto-electronics Engineering, Beijing University of Aeronautics and Astronautics, China
Fang Jiancheng, Key Lab of Fundamental Science for National Defense, School of Instrument Science and Opto-electronics Engineering, Beijing University of Aeronautics and Astronautics, China
pp. 231-234
Liang Hu, National Key Laboratory of Mechatronics Engineering and Control, Beijing Institute of Technology, 100081, China
Wen-zhong Lou, National Key Laboratory of Mechatronics Engineering and Control, Beijing Institute of Technology, 100081, China
Renlong Song, National Key Laboratory of Mechatronics Engineering and Control, Beijing Institute of Technology, 100081, China
Chao Gao, National Key Laboratory of Mechatronics Engineering and Control, Beijing Institute of Technology, 100081, China
Xin Li, National Key Laboratory of Mechatronics Engineering and Control, Beijing Institute of Technology, 100081, China
pp. 235-237
Yang Yang, Key Laboratory of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, China
Jing Liu, Graduate School of Chinese Academy of Sciences, Beijing, China
pp. 238-243
Yang Yang, Key Laboratory of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, China
Jing Liu, Key Laboratory of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, China
pp. 244-248
Chi-Chang Lin, Institute of Biomedical Engineering, Tainan 701, Taiwan
Chen-Yuan Yu, Institute of Biomedical Engineering, Tainan 701, Taiwan
Ying-Mei Yang, Institute of Biomedical Engineering, Tainan 701, Taiwan
Yung-Ming Chu, Institute of Biomedical Engineering, Tainan 701, Taiwan
Hong-Ping Lin, Department of Chemistry, Tainan 701, Taiwan
Hsien-Chang Chang, Institute of Biomedical Engineering, Tainan 701, Taiwan
pp. 249-252
Jianbing Xie, Micro and Nano Electromechanical System Laboratory, Northwestern Polytechnical University, Xi'an, China
Weizheng Yuan, Micro and Nano Electromechanical System Laboratory, Northwestern Polytechnical University, Xi'an, China
Honglong Chang, Micro and Nano Electromechanical System Laboratory, Northwestern Polytechnical University, Xi'an, China
pp. 253-256
Yunhuan Zheng, Nano Technology Laboratory, Shanghai Institute of Microsystem and Information Technology, China
Jianzhang Wu, Nano Technology Laboratory, Shanghai Institute of Microsystem and Information Technology, China
Jianbo Shao, Nano Technology Laboratory, Shanghai Institute of Microsystem and Information Technology, China
Qinghui Jin, Nano Technology Laboratory, Shanghai Institute of Microsystem and Information Technology, China
Jianlong Zhao, Nano Technology Laboratory, Shanghai Institute of Microsystem and Information Technology, China
pp. 257-260
Wenzhong LOU, National Key Laboratory of Mechatronics Engineering and Control, Beijing Institute of Technology, 100081, China
Renlong SONG, National Key Laboratory of Mechatronics Engineering and Control, Beijing Institute of Technology, 100081, China
Yunjian Liu, System Engineering Research Institute of Engineering Equipment, 100081 Beijing, China
Xiaosong Liu, National Key Laboratory of Mechatronics Engineering and Control, Beijing Institute of Technology, 100081, China
Weihua Li, National Key Laboratory of Mechatronics Engineering and Control, Beijing Institute of Technology, 100081, China
Wanfeng Lin, National Key Laboratory of Mechatronics Engineering and Control, Beijing Institute of Technology, 100081, China
pp. 261-264
Zhigang Che, State Key Laboratory of Digital Manufacturing Equipment&Technology, Huazhong University of Science&Technology, Wuhan, China
Liangcai Xiong, State Key Laboratory of Digital Manufacturing Equipment&Technology, Huazhong University of Science&Technology, Wuhan, China
Tielin Shi, State Key Laboratory of Digital Manufacturing Equipment&Technology, Huazhong University of Science&Technology, Wuhan, China
Zirong Tang, State Key Laboratory of Digital Manufacturing Equipment&Technology, Huazhong University of Science&Technology, Wuhan, China
Huayang Cheng, State Key Laboratory of Digital Manufacturing Equipment&Technology, Huazhong University of Science&Technology, Wuhan, China
Likun Yang, Wuhan Huagong Laser Engineering Co., Ltd, Wuhan, China
pp. 265-269
Cheng Pang, State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100190, China
Zhan Zhao, State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100190, China
Jiangang Zhang, State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100190, China
Li Shi, Graduate University of Chinese Academy of Sciences, Beijing 100039, China
Lidong Du, State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100190, China
Zhen Fang, State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100190, China
Yonghong Liu, State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100190, China
pp. 270-273
C.K. Chung, Dep't of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan, ROC
W.T. Chang, Dep't of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan, ROC
pp. 274-277
Zhongcheng Gong, Institute for Micromanufacturing, Louisiana Tech University, USA
Krithika Nagarajan, School of Biological Science, Louisiana Tech University, USA
Siva Penmetsa, Institute for Micromanufacturing, Louisiana Tech University, USA
David Mills, Institute for Micromanufacturing, Louisiana Tech University, USA
Long Que, Institute for Micromanufacturing, Louisiana Tech University, USA
pp. 278-281
Gaoyin Ma, National Key Laboratory of Nano/Micro Fabrication Technology, Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, Research Institute of Micro/Nan
Wenyuan Chen, National Key Laboratory of Nano/Micro Fabrication Technology, Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, Research Institute of Micro/Nan
Qijun Xiao, National Key Laboratory of Nano/Micro Fabrication Technology, Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, Research Institute of Micro/Nan
Weiping Zhang, National Key Laboratory of Nano/Micro Fabrication Technology, Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, Research Institute of Micro/Nan
Feng Cui, National Key Laboratory of Nano/Micro Fabrication Technology, Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, Research Institute of Micro/Nan
Kai Li, National Key Laboratory of Nano/Micro Fabrication Technology, Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, Research Institute of Micro/Nan
pp. 282-285
Yan Cui, Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, China
Huilin Chen, Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, China
Jinsong Xia, Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, China
Jiaxin Zhao, Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, China
Jing Wang, School of Electron and information Engineering, Dalian University of Technology, China
Liding Wang, Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, China
pp. 286-290
Yipeng Lu, Shanghai Jiaotong University, China
Weiping Zhang, Shanghai Jiaotong University, China
Xiaosheng Wu, Shanghai Jiaotong University, China
Wenyuan Chen, Shanghai Jiaotong University, China
Feng Cui, Shanghai Jiaotong University, China
pp. 291-294
Sun Jizhou, State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing, China
Bian Chao, State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing, China
Qu Lan, State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing, China
Xia Shanhong, State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing, China
pp. 295-298
Zhuangde Jiang, State Key Laboratory for Manufacturing Systems Engineering, Xi'an Jiaotong University, Shaanxi, China
Fengxia Zhao, State Key Laboratory for Manufacturing Systems Engineering, Xi'an Jiaotong University, Shaanxi, China
Weixuan Jing, State Key Laboratory for Manufacturing Systems Engineering, Xi'an Jiaotong University, Shaanxi, China
Philip D. Prewett, School of Mechanical Engineering, University of Birmingham, Edgbaston, UK
Kyle Jiang, School of Mechanical Engineering, University of Birmingham, Edgbaston, UK
pp. 299-303
Xiaosheng Wu, Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong University, China
Wenyuan Chen, Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong University, China
Weiping Zhang, Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong University, China
Yipeng Lu, Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong University, China
Feng Cui, Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong University, China
Xiaolin Zhao, Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong University, China
pp. 304-309
Yinhong Dai, Dept. of Mechanical and Electrical Engineering, Xiamen University, China, 361005
Donghang Chen, Dept. of Mechanical and Electrical Engineering, Xiamen University, China, 361005
Lingyun Wang, Dept. of Mechanical and Electrical Engineering, Xiamen University, China, 361005
Daoheng Sun, Dept. of Mechanical and Electrical Engineering, Xiamen University, China, 361005
pp. 310-313
Yu-Cheng Ou, Department of Mechanical&Electro-Mechanical Engineering, Tamkang University, Tamsui, Taiwan
Chih-Wen Hsu, Department of Mechanical&Electro-Mechanical Engineering, Tamkang University, Tamsui, Taiwan
Lung-Jieh Yang, Department of Mechanical&Electro-Mechanical Engineering, Tamkang University, Tamsui, Taiwan
Hsieh-Cheng Han, Institute of Microbiology and Biochemistry, National Taiwan University, Taiwan
Yi-Wen Liu, Institute of Microbiology and Biochemistry, National Taiwan University, Taiwan
Chien-Yuan Chen, Institute of Microbiology and Biochemistry, National Taiwan University, Taiwan
pp. 314-318
Chenying Yang, School of Public Health, Peking University Health Science Centre, Beijing, 100191, China
Wei Wang, Institute of Microelectronics, National Key Laboratory of Micro/Nano Fabri-cation Technology, Beijing, 100871, China
Zhihong Li, Institute of Microelectronics, National Key Laboratory of Micro/Nano Fabri-cation Technology, Beijing, 100871, China
pp. 319-322
Jing Wang, School of Science, Dalian Fisheries University, China
Bing Qu, School of Science, Dalian Fisheries University, China
Yan Ming Su, School of Science, Dalian Fisheries University, China
Chao Pan, School of Science, Dalian Fisheries University, China
Wei Guo Cai, School of Science, Dalian Fisheries University, China
pp. 323-326
Ke Tao, Department of Electronic Science and Technology, Nankai University, China
Dexian Zhang, Department of Electronic Science and Technology, Nankai University, China
Yun Sun, Institute of Photo-electronics Thin Film Devices and Technique, Nankai University, China
Linshen Wang, Department of Electronic Science and Technology, Nankai University, China
Jingfang Zhao, Department of Electronic Science and Technology, Nankai University, China
Ying Xue, Department of Electronic Science and Technology, Nankai University, China
Yuanjian Jiang, Department of Electronic Science and Technology, Nankai University, China
Hongkun Cai, Department of Electronic Science and Technology, Nankai University, China
Yanping Sui, Department of Electronic Science and Technology, Nankai University, China
Jin Wang, Department of Electronic Science and Technology, Nankai University, China
pp. 327-330
Jin Wang, Department of Electronic Science and Technology, Nankai University, Tianjin, China, 300071
Guofeng Li, Department of Electronic Science and Technology, Nankai University, Tianjin, China, 300071
Yiyi Liu, Department of Electronic Science and Technology, Nankai University, Tianjin, China, 300071
Yi Lu, Department of Electronic Science and Technology, Nankai University, Tianjin, China, 300071
Xianhu Gao, Department of Electronic Science and Technology, Nankai University, Tianjin, China, 300071
Yong Zhang, Department of Electronic Science and Technology, Nankai University, Tianjin, China, 300071
Ke Tao, Department of Electronic Science and Technology, Nankai University, Tianjin, China, 300071
pp. 331-334
Yi Jae Lee, Department of Electronic Engineering, Kwangwoon University, Seoul, Korea
Jung Doo Kim, Department of Electronic Engineering, Kwangwoon University, Seoul, Korea
Jae Yeong Park, Department of Electronic Engineering, Kwangwoon University, Seoul, Korea
pp. 335-338
Dingbang Xiao, Laboratory of Microsystem, National University of Defense Technology, China
Liqiang Xie, Laboratory of Microsystem, National University of Defense Technology, China
Zhanqiang Hou, Laboratory of Microsystem, National University of Defense Technology, China
Xuezhong Wu, Laboratory of Microsystem, National University of Defense Technology, China
Shengyi Li, Laboratory of Microsystem, National University of Defense Technology, China
pp. 339-342
Xiuling Ji, School of Aerospace Science and Engineering, Beijing Institute of Technology, China
Yunjian Liu, System Engineering Research Institute of Engineering Equipment, China
Wenzhong Lou, School of Aerospace Science and Engineering, Beijing Institute of Technology, China
pp. 343-347
Kashif Naeem, Department of Urban and Civil Engineering, Shenzhen Graduate School of Harbin Institute of Technology, 518055, China
Ouyang Feng, Department of Urban and Civil Engineering, Shenzhen Graduate School of Harbin Institute of Technology, 518055, China
pp. 348-352
Ping Tang, Institute of Chemical Engineering Process and Machinery, Zhejiang University, Hangzhou, 310027, China
Jian Yang, Institute of Chemical Engineering Process and Machinery, Zhejiang University, Hangzhou, 310027, China
Jianjun Ye, Institute of Chemical Engineering Process and Machinery, Zhejiang University, Hangzhou, 310027, China
Jinyang Zheng, Institute of Chemical Engineering Process and Machinery, Zhejiang University, Hangzhou, 310027, China
Chikong Lam, Department of Mechanical Engineering, University of California, Berkeley, 94704, U.S.A.
Ieong Wong, Department of Mechanical and Aerospace Engineering, University of California, Los Angeles, 90095, U.S.A.
Yanbao Ma, Department of Mechanical and Aerospace Engineering, University of California, Los Angeles, 90095, U.S.A.
pp. 353-358
Kuan-Yu Chen, Mechanical&Electro-Mechanical Engineering, National Formosa University, Yunlin, Taiwan 632
Ju-Nan Kuo, Department of Automation Engineering, National Formosa University, Yunlin, Taiwan 632
pp. 363-366
Guangmei Zhai, Department of Electronic Science and Technology, Huazhong University of Science and Technology, China
Daoli Zhang, Department of Electronic Science and Technology, Huazhong University of Science and Technology, China
Lin Yuan, Department of Electronic Science and Technology, Huazhong University of Science and Technology, China
Jianbing Zhang, Department of Electronic Science and Technology, Huazhong University of Science and Technology, China
pp. 367-370
Jia Hao Zhao, State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instrument and Mechanics, Tsinghua University, Beijing, 100084, China
Shi Jie Yu, State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instrument and Mechanics, Tsinghua University, Beijing, 100084, China
Ke Li, State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instrument and Mechanics, Tsinghua University, Beijing, 100084, China
Ying Dong, State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instrument and Mechanics, Tsinghua University, Beijing, 100084, China
Qin Zhou, State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instrument and Mechanics, Tsinghua University, Beijing, 100084, China
Zheng You, State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instrument and Mechanics, Tsinghua University, Beijing, 100084, China
pp. 371-375
Guanggui Cheng, Center of Micro/Nano Sciece and Technology, Jiangsu University, Zhenjiang, China
Jianning Ding, Center of Micro/Nano Sciece and Technology, Jiangsu University, Zhenjiang, China
Biao Kan, Center of Micro/Nano Sciece and Technology, Jiangsu University, Zhenjiang, China
Junziong Wang, Center of Micro/Nano Sciece and Technology, Jiangsu University, Zhenjiang, China
Ningyi Yuan, Institute of Energy, Jiangsu Polytechnic University, Changzhou, China
pp. 376-379
Khashayar Babaei Gavan, Kavli Institute of NanoScience, TU Delft, The Netherlands
Joost van der Heijden, Kavli Institute of NanoScience, TU Delft, The Netherlands
Emile W. J. M. van der Drift, Kavli Institute of NanoScience, TU Delft, The Netherlands
Herre S. J. van der Zant, Kavli Institute of NanoScience, TU Delft, The Netherlands
pp. 380-384
Hung-Chia Lin, Institute of NanoEnineering and MicroSystems, National Tsing Hua University, Hsinchu, Taiwan, R.O.C.
Yi-Ju Liu, Institute of NanoEnineering and MicroSystems, National Tsing Hua University, Hsinchu, Taiwan, R.O.C.
Da-Jeng Yao, Institute of NanoEnineering and MicroSystems, National Tsing Hua University, Hsinchu, Taiwan, R.O.C.
pp. 385-389
Fei-Bin Hsiao, National Cheng Kung University, Institute of Nanotechnology and Microsystems Engineering, Taiwan
Yung-Chun Lee, National Cheng Kung University, Institute of Nanotechnology and Microsystems Engineering, Taiwan
Lee Chang Hsiang, National Cheng Kung University, Institute of Nanotechnology and Microsystems Engineering, Taiwan
pp. 390-395
Weiping Chen, MEMS Center, Harbin Institute of Technology, China
Xiaoliang Chen, MEMS Center, Harbin Institute of Technology, China
Guoguang Zheng, MEMS Center, Harbin Institute of Technology, China
Xiaowei Liu, MEMS Center, Harbin Institute of Technology, China
Haifeng Zhang, MEMS Center, Harbin Institute of Technology, China
pp. 396-399
Hamed Sadeghian, Structural Optimization and Computational Mechanics Group, Department of Precision and Microsystems, Delft University of Technology, Netherlands
Chung Kai Yang, Electronic Instrumentation Laboratory, Department of Microelectronics, Delft University of Technology, Netherlands
Khashayar Babaei Gavan, Kavli Institute of Nanoscience, Delft University of Technology, Netherlands
Hans Goosen, Structural Optimization and Computational Mechanics Group, Department of Precision and Microsystems, Delft University of Technology, Netherlands
Emile van der Drift, Kavli Institute of Nanoscience, Delft University of Technology, Netherlands
Here van der Zant, Kavli Institute of Nanoscience, Delft University of Technology, Netherlands
Paddy J. French, Electronic Instrumentation Laboratory, Department of Microelectronics, Delft University of Technology, Netherlands
Andre Bossche, Electronic Instrumentation Laboratory, Department of Microelectronics, Delft University of Technology, Netherlands
Fred van Keulen, Structural Optimization and Computational Mechanics Group, Department of Precision and Microsystems, Delft University of Technology, Netherlands
pp. 400-403
Jinhui Lan, Department of Measurement and Control Technologies, School of Information Engineering, University of Science and Technology Beijing, China
Yuqiao Shi, Department of Measurement and Control Technologies, School of Information Engineering, University of Science and Technology Beijing, China
pp. 404-408
Aimiao Qin, Key laboratory of new processing technology for nonferrous metals and materials, ministry of education, Department of Materials and Chemistry Engineering, Guilin University of Tech
Yuzi Liu, School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332 USA
Zhong Lin Wang, School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332 USA
pp. 409-412
J.N. Ding, Jiangsu Polytechnic University, Changzhou 213016, China
H.S. Qi, Center of Micro and Nano Science and Technology, Jiangsu University, Zhenjiang, China
N.Y. Yuan, Jiangsu Polytechnic University, Changzhou 213016, China
Y.L. He, Jiangsu Polytechnic University, Changzhou 213016, China
G.G. Cheng, Center of Micro and Nano Science and Technology, Jiangsu University, Zhenjiang, China
pp. 413-415
Sen Yao, Interdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology, Yokohama, Japan
Shunji Goto, Interdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology, Yokohama, Japan
Junpei Sakurai, Precision and Intelligence Laboratory, Tokyo Institute of Technology, Yokohama, Japan
Tadahiko Shinshi, Precision and Intelligence Laboratory, Tokyo Institute of Technology, Yokohama, Japan
Minoru Uehara, Hitachi Metals Ltd., Tokyo, Japan
Hitoshi Yamamoto, Hitachi Metals Ltd., Tokyo, Japan
pp. 416-419
Zongwei Niu, School of Mechanical Engineering, Shandong University of Technology, Zibo, 255049, China
Zhiyong Li, School of Mechanical Engineering, Shandong University of Technology, Zibo, 255049, China
Li Li, School of Mechanical Engineering, Shandong University of Technology, Zibo, 255049, China
Rongguo Hou, School of Mechanical Engineering, Shandong University of Technology, Zibo, 255049, China
pp. 420-423
Zongwei Niu, School of Mechanical Engineering, Shandong University of Technology, Zibo, 255049, China
Zhiyong Li, School of Mechanical Engineering, Shandong University of Technology, Zibo, 255049, China
Li Li, School of Mechanical Engineering, Shandong University of Technology, Zibo, 255049, China
Rongguo Hou, School of Mechanical Engineering, Shandong University of Technology, Zibo, 255049, China
pp. 424-427
Gang Zhao, National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Microelectronics, Peking University, Beijing, China
Wen Li, National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Microelectronics, Peking University, Beijing, China
Guanrong Tang, National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Microelectronics, Peking University, Beijing, China
Jing Chen, National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Microelectronics, Peking University, Beijing, China
pp. 428-431
Yue Chen, MEMS Research Center, Institute of Microelectronics, Peking University, China, 100871
Xiuhan Li, School of Electronics and Information Engineering, Beijing Jiaotong University, China, 100044
Dongming Fang, MEMS Research Center, Institute of Microelectronics, Peking University, China, 100871
Quan Yuan, MEMS Research Center, Institute of Microelectronics, Peking University, China, 100871
Haixia Zhang, MEMS Research Center, Institute of Microelectronics, Peking University, China, 100871
pp. 432-435
Jinxing Wang, Institute of Electronic Materials and Devices, Hannover Leibniz University, Germany
Apurba Laha, Institute of Electronic Materials and Devices, Hannover Leibniz University, Germany
Andreas Fissel, Information Technology Laboratory, Hannover Leibniz University, Germany
Dominik Schwendt, Institute of Electronic Materials and Devices, Hannover Leibniz University, Germany
Rytis Dargis, Information Technology Laboratory, Hannover Leibniz University, Germany
Tatsuro Watahiki, Paul-Drude-Institut für Festkörperelektronik, Germany
Roman Shayduk, Paul-Drude-Institut für Festkörperelektronik, Germany
Wolfgang Braun, Paul-Drude-Institut für Festkörperelektronik, Germany
Tianmo Liu, College of Materials Science and Engineering, Chongqing University, China
H. Jorg Osten, Institute of Electronic Materials and Devices, Hannover Leibniz University, Germany
pp. 436-440
Yi Zhou, National Key Laboratory of Micro/Nano Fabrication Technology, Inst. of Microelectronics, Peking University, Beijing, 100871, China
Fei Ding, National Key Laboratory of Micro/Nano Fabrication Technology, Inst. of Microelectronics, Peking University, Beijing, 100871, China
Chao Ni, National Key Laboratory of Micro/Nano Fabrication Technology, Inst. of Microelectronics, Peking University, Beijing, 100871, China
Wei Wang, National Key Laboratory of Micro/Nano Fabrication Technology, Inst. of Microelectronics, Peking University, Beijing, 100871, China
Wengang Wu, National Key Laboratory of Micro/Nano Fabrication Technology, Inst. of Microelectronics, Peking University, Beijing, 100871, China
pp. 441-444
Shailesh Madisetti, Institute for Micromanufacturing, Louisiana Tech University, USA
Zhiguo Zheng, Chemistry Department, Louisiana Tech University, USA
Zhongcheng Gong, Institute for Micromanufacturing, Louisiana Tech University, USA
Siva Penmetsa, Institute for Micromanufacturing, Louisiana Tech University, USA
Yuri Lvov, Institute for Micromanufacturing, Louisiana Tech University, USA
Long Que, Institute for Micromanufacturing, Louisiana Tech University, USA
pp. 445-448
Qinglong Zheng, Department of Electrical and Computer Engineering, Wayne State University, Detroit, Michigan, U.S.A
Zhuo Wang, Department of Electrical and Computer Engineering, Wayne State University, Detroit, Michigan, U.S.A
Yong Xu, Department of Electrical and Computer Engineering, Wayne State University, Detroit, Michigan, U.S.A
pp. 449-453
Sewan Park, School of Electrical Engineering and Computer Science, Seoul National University, Republic of Korea
Joonyeop Lee, School of Electrical Engineering and Computer Science, Seoul National University, Republic of Korea
Hyeon Cheol Kim, School of Electrical Engineering, University of Ulsan, Republic of Korea
Kukjin, School of Electrical Engineering and Computer Science, Seoul National University, Republic of Korea
pp. 454-457
Yuguang Li, Department of Polymer Material, Shanghai University, 201800, China
Liping Wang, Department of Polymer Material, Shanghai University, 201800, China
Beilei Gu, Department of Polymer Material, Shanghai University, 201800, China
Haiyan Mao, Department of Polymer Material, Shanghai University, 201800, China
Hefeng Hu, Department of Polymer Material, Shanghai University, 201800, China
Li Liu, Department of Polymer Material, Shanghai University, 201800, China
Ying Gu, Department of electronic information materials, Shanghai University, 201800, China
Yiben Xia, Department of electronic information materials, Shanghai University, 201800, China
pp. 458-462
Huiqi He, Bioengineering Graduate Program, The Hong Kong University of Science and Technology, Hong Kong
Donald C. Chang, Dept of Biology, The Hong Kong University of Science and Technology, Hong Kong
Yi-Kuen Lee, Dept of Mechanical Engineering, The Hong Kong University of Science and Technology, Hong Kong
pp. 463-467
Chaohui Wang, School of Mechanical Engineering (Xi'an Jiaotong University), Shaanxi 7100049, China
Peng Ye, School of Mechanical Engineering (Xi'an Jiaotong University), Shaanxi 7100049, China
Kerun Lee, School of Mechanical Engineering (Xi'an Jiaotong University), Shaanxi 7100049, China
Jingju Wang, School of Mechanical Engineering (Xi'an Jiaotong University), Shaanxi 7100049, China
Jing Wang, School of Mechanical Engineering (Xi'an Jiaotong University), Shaanxi 7100049, China
pp. 468-471
Lei Nie, School of Mechanical Science&Engineering, Huazhong University of Science and Technology, Wuhan, China
Tielin Shi, School of Mechanical Science&Engineering, Huazhong University of Science and Technology, Wuhan, China
Zirong Tang, School of Mechanical Science&Engineering, Huazhong University of Science and Technology, Wuhan, China
Shiyuan Liu, School of Mechanical Science&Engineering, Huazhong University of Science and Technology, Wuhan, China
Guanglan Liao, School of Mechanical Science&Engineering, Huazhong University of Science and Technology, Wuhan, China
pp. 472-475
Xuezhong Wu, School of Mechatronics Engineering and Automation, National University of Defense Technology, Changsha, Hunan, China
Peitao Dong, School of Mechatronics Engineering and Automation, National University of Defense Technology, Changsha, Hunan, China
Zhaoze li, School of Mechatronics Engineering and Automation, National University of Defense Technology, Changsha, Hunan, China
Shengyi Li, School of Mechatronics Engineering and Automation, National University of Defense Technology, Changsha, Hunan, China
Qinghui Liu, School of Mechatronics Engineering and Automation, National University of Defense Technology, Changsha, Hunan, China
Chao Xu, School of Aerospace and Material Engineering, National University of Defense Technology, Changsha, Hunan, China
Hong Wan, School of Aerospace and Material Engineering, National University of Defense Technology, Changsha, Hunan, China
pp. 476-479
Jing Zhang, National Laboratory of Analog Integrated Circuits, Chongqing 400060, 48China
Kaizhou Tan, National Laboratory of Analog Integrated Circuits, Chongqing 400060, 48China
Siliu Xu, National Laboratory of Analog Integrated Circuits, Chongqing 400060, 48China
Zhengfan Zhang, National Laboratory of Analog Integrated Circuits, Chongqing 400060, 48China
Yukui Liu, National Laboratory of Analog Integrated Circuits, Chongqing 400060, 48China
Guangbing Chen, National Laboratory of Analog Integrated Circuits, Chongqing 400060, 48China
Kaicheng Li, National Laboratory of Analog Integrated Circuits, Chongqing 400060, 48China
Heming Zhang, Xidian University, Xi an 710071, China
Huiyong Hu, Xidian University, Xi an 710071, China
pp. 480-484
T. W. Chang, Institute of Electro-Optical Engineering, Chang Gung University, Kweisan, Taoyuan 333, Taiwan R.O.C.
T. J. Chung, Institute of Electro-Optical Engineering, Chang Gung University, Kweisan, Taoyuan 333, Taiwan R.O.C.
T. Ru, Institute of Electro-Optical Engineering, Chang Gung University, Kweisan, Taoyuan 333, Taiwan R.O.C.
T. E. Nee, Institute of Electro-Optical Engineering, Chang Gung University, Kweisan, Taoyuan 333, Taiwan R.O.C.
H. C. Lu, Institute of Electro-Optical Engineering, Chang Gung University, Kweisan, Taoyuan 333, Taiwan R.O.C.
G. M. Wu, Institute of Electro-Optical Engineering, Chang Gung University, Kweisan, Taoyuan 333, Taiwan R.O.C.
pp. 485-488
Guangyi Shi, The Key Laboratory of Integrated Microsystems, Shenzhen Graduate School of Peking University, China
Yuexian Zoui, The Key Laboratory of Integrated Microsystems, Shenzhen Graduate School of Peking University, China
Yufeng Jin, The Key Laboratory of Integrated Microsystems, Shenzhen Graduate School of Peking University, China
Yali Zheng, The Key Laboratory of Integrated Microsystems, Shenzhen Graduate School of Peking University, China
Wen J. Li, Cerntre of Micro and Nano Systems, The Chinese University of Hong Kong, HKSAR China
pp. 489-493
Li Zhang, State Key Lab of Optical Technologies for Microfabrication, Institute of Optics and Electronics, Chinese Academy of Sciences, Chengdu, China
Jun Yao, State Key Lab of Optical Technologies for Microfabrication, Institute of Optics and Electronics, Chinese Academy of Sciences, Chengdu, China
Dajia Wang, State Key Lab of Optical Technologies for Microfabrication, Institute of Optics and Electronics, Chinese Academy of Sciences, Chengdu, China
Hongsheng Zhong, Department of Electronic Engineering, University of Electronic Science and Technology of China, Chengdu, China
pp. 494-497
Xuebin Lu, MEMS Center, Harbin Institute of Technology, China
Xiaowei Liu, MEMS Center, Harbin Institute of Technology, China
Rongyan Chuai, Information Science and Engineering School, Shenyang University of Technology, China
Changzhi Shi, MEMS Center, Harbin Institute of Technology, China
Mingxue Huo, MEMS Center, Harbin Institute of Technology, China
Weiping Chen, MEMS Center, Harbin Institute of Technology, China
pp. 498-501
Liang Yin, Department of Microelectronics, Harbin Institute of Technology, Harbin, Heilongjiang, China
Xiaowei Liu, Department of Microelectronics, Harbin Institute of Technology, Harbin, Heilongjiang, China
Wei Chen, Department of Microelectronics, Harbin Institute of Technology, Harbin, Heilongjiang, China
Weiping Chen, Department of Microelectronics, Harbin Institute of Technology, Harbin, Heilongjiang, China
Zhiping Zhou, Department of Microelectronics, Harbin Institute of Technology, Harbin, Heilongjiang, China
pp. 502-505
Xu Mao, National Key Laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking University, Beijing 100871, China
Zhenchuan Yang, National Key Laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking University, Beijing 100871, China
Zhihong Li, National Key Laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking University, Beijing 100871, China
Guizhen Yan, National Key Laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking University, Beijing 100871, China
pp. 506-509
Yuntao Liu, MEMS Center of Harbin Institute of Technology, Harbin, China
Xiaowei Liu, MEMS Center of Harbin Institute of Technology, Harbin, China
Liang Yin, MEMS Center of Harbin Institute of Technology, Harbin, China
Weiping Chen, MEMS Center of Harbin Institute of Technology, Harbin, China
Qun Wu, MEMS Center of Harbin Institute of Technology, Harbin, China
pp. 510-513
Gang Zhao, National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Microelectronics, Peking University, Beijing, China
Yao Tian, National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Microelectronics, Peking University, Beijing, China
Qiong Shu, National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Microelectronics, Peking University, Beijing, China
Jing Chen, National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Microelectronics, Peking University, Beijing, China
pp. 514-517
Chen-Chieh Liao, Mechanical&Electro-Mechanical Engineering, National Formosa University, Yunlin, Taiwan 632
Ju-Nan Kuo, Department of Automation Engineering, National Formosa University, Yunlin, Taiwan 632
pp. 518-521
Qingzhou Li, School of Aerospace Science and Engineering, Beijing Institute of Technology, China
Ping Song, School of Aerospace Science and Engineering, Beijing Institute of Technology, China
Kejie Li, School of Aerospace Science and Engineering, Beijing Institute of Technology, China
pp. 522-526
C.K. Chung, Dep't of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan 701, ROC
T.R. Shih, Dep't of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan 701, ROC
B.H. Wu, Center for Micro/Nano Technology Research, National Cheng Kung University, Tainan, Taiwan 701, ROC
pp. 527-530
Chuanwei Zhang, State Key Lab of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, China
Shiyuan Liu, State Key Lab of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, China
Tielin Shi, Division of Optoelectronic Materials and Micro-Nano Manufacture, Wuhan National Laboratory for Optoelectronics, China
pp. 531-534
C.K. Chung, Dep't of Mechanical Engineering, and Center for Micro/Nano Technology Research, National Cheng Kung University, Tainan, Taiwan 701, ROC
T.R. Shih, Dep't of Mechanical Engineering, and Center for Micro/Nano Technology Research, National Cheng Kung University, Tainan, Taiwan 701, ROC
B.H. Wu, Industrial Technology Research Institute, Tainan, Taiwan 701, ROC
pp. 535-538
Jenn-Sen Lin, Department of Mechanical Engineering, National United University, Taiwan, Republic of China
Shin-Pon Ju, Department of Mechanical and Electro-Mechanical Engineering; National Sun-Yat-Sen University, Kaohsiung, Taiwan, Republic of China
Shih-Wen Yung, Department of Material Science and Engineering, National United University, Taiwan, Republic of China
Wen-Shian Wu, Department of Mechanical and Electro-Mechanical Engineering; National Sun-Yat-Sen University, Kaohsiung, Taiwan, Republic of China
Meng-Hsiung Weng, Department of Mechanical and Electro-Mechanical Engineering; National Sun-Yat-Sen University, Kaohsiung, Taiwan, Republic of China
Wen-Jay Lee, Department of Mechanical and Electro-Mechanical Engineering; National Sun-Yat-Sen University, Kaohsiung, Taiwan, Republic of China
pp. 539-542
Guo L. Sun, State Key Laboratory for Manufacturing Systems Engineering (Xi'an Jiaotong University), Xi'an Shaanxi 710049, China
Hai R. Wang, State Key Laboratory for Manufacturing Systems Engineering (Xi'an Jiaotong University), Xi'an Shaanxi 710049, China
Zhuang D. Jiang, State Key Laboratory for Manufacturing Systems Engineering (Xi'an Jiaotong University), Xi'an Shaanxi 710049, China
Xian N. Gao, State Key Laboratory for Manufacturing Systems Engineering (Xi'an Jiaotong University), Xi'an Shaanxi 710049, China
Tian S. Yin, State Key Laboratory for Manufacturing Systems Engineering (Xi'an Jiaotong University), Xi'an Shaanxi 710049, China
Guo Q. Han, State Key Laboratory for Manufacturing Systems Engineering (Xi'an Jiaotong University), Xi'an Shaanxi 710049, China
pp. 543-546
Shuhua Wei, Microelectronic Center, College of Information Engineering, North China University of Technology, Beijing, China
Jinzhao Zhang, Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing, China
Li Han, Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing, China
pp. 547-550
C.K. Chung, Dep't of Mechanical Engineering, and Center for Micro/Nano Technology Research, National Cheng Kung University, Tainan, Taiwan 701, ROC
Y.L. Chang, Dep't of Mechanical Engineering, and Center for Micro/Nano Technology Research, National Cheng Kung University, Tainan, Taiwan 701, ROC
T.S. Chen, Dep't of Mechanical Engineering, and Center for Micro/Nano Technology Research, National Cheng Kung University, Tainan, Taiwan 701, ROC
pp. 551-554
Yumei. Xing, National Key Laboratory of Micro /Nano Fabrication Technology, Key Laboratory for Thin Film and Microfabrication, Technology of Ministry of Education, Research Institute of Micro/N
Yigui Li, National Key Laboratory of Micro /Nano Fabrication Technology, Key Laboratory for Thin Film and Microfabrication, Technology of Ministry of Education, Research Institute of Micro/N
Junfeng Zhang, National Key Laboratory of Micro /Nano Fabrication Technology, Key Laboratory for Thin Film and Microfabrication, Technology of Ministry of Education, Research Institute of Micro/N
Gaoyang Gao, National Key Laboratory of Micro /Nano Fabrication Technology, Key Laboratory for Thin Film and Microfabrication, Technology of Ministry of Education, Research Institute of Micro/N
pp. 555-558
Fubo Rao, State Key Laboratories of Transducer Technology, National Key Laboratory of Microsystem Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of
Tie Li, State Key Laboratories of Transducer Technology, National Key Laboratory of Microsystem Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of
Yuelin Wang, State Key Laboratories of Transducer Technology, National Key Laboratory of Microsystem Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of
pp. 559-562
Yuexian Zou, The Key Laboratory of Integrated Microsystems, Shenzhen Graduate School of Peking University, China
Guangyi Shi, The Key Laboratory of Integrated Microsystems, Shenzhen Graduate School of Peking University, China
Yufeng Jin, The Key Laboratory of Integrated Microsystems, Shenzhen Graduate School of Peking University, China
Yali Zheng, The Key Laboratory of Integrated Microsystems, Shenzhen Graduate School of Peking University, China
pp. 563-566
Fei Ding, National Key Laboratory of Micro/Nano Fabrication Technology, Institution of Microelectronics, Peking University, Beijing, China, 100871
Wenxuan Yu, National Key Laboratory of Micro/Nano Fabrication Technology, Institution of Microelectronics, Peking University, Beijing, China, 100871
Tingting Yu, National Key Laboratory of Micro/Nano Fabrication Technology, Institution of Microelectronics, Peking University, Beijing, China, 100871
Chao Ni, National Key Laboratory of Micro/Nano Fabrication Technology, Institution of Microelectronics, Peking University, Beijing, China, 100871
Ruyan Tang, National Key Laboratory of Micro/Nano Fabrication Technology, Institution of Microelectronics, Peking University, Beijing, China, 100871
Wengang Wu, National Key Laboratory of Micro/Nano Fabrication Technology, Institution of Microelectronics, Peking University, Beijing, China, 100871
pp. 567-571
Weiwei Xiang, Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei, China
Li Wen, Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei, China
Hai Wang, Department of Mechanical Engineering, Anhui University of Technology and Science, Wuhu, China
Qiuping Zhang, Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei, China
Jiaru Chu, Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei, China
pp. 572-576
Li Wen, Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei, China
Qiuping Zhang, Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei, China
Hai Wang, Department of Mechanical Engineering, Anhui University of Technology and Science, Wuhu, China
Jiaru Chu, Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei, China
pp. 577-580
Lujun Zhang, Electronic Instrumentation Laboratory, Delft University of Technology, the Netherlands
Andre Bossche, Electronic Instrumentation Laboratory, Delft University of Technology, the Netherlands
pp. 581-584
Yeon H. Kwak, Bio-medical Research Center, Korea Electronics Technology Institute, Korea
Soon S. Park, Bio-medical Research Center, Korea Electronics Technology Institute, Korea
Sung M. Hong, Bio-medical Research Center, Korea Electronics Technology Institute, Korea
pp. 585-588
Dezhi Wu, Dept. of Mechanical&Electrical Engineering, Xiamen University, 361005, China
Lingyun Wang, Dept. of Mechanical&Electrical Engineering, Xiamen University, 361005, China
Daoheng Sun, Dept. of Mechanical&Electrical Engineering, Xiamen University, 361005, China
pp. 589-592
Di Wang, Chemistry Department of Science School, Harbin Institute of Technology, 150001, China
Xiaodong Chen, School of Economic and management, Harbin Institute of Technology, 150001, China
Qun Zhang, Chemistry Department of Science School, Harbin Institute of Technology, 150001, China
Yu Liu, Chemistry Department of Science School, Harbin Institute of Technology, 150001, China
Jincheng Liu, National Key Laboratory of Tunable Laser Technology, Harbin Institute of Technology, 150001, China
Lijiang Hu, Chemistry Department of Science School, Harbin Institute of Technology, 150001, China
pp. 593-596
Lan Qu, State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, China
Chao Bian, State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, China
Jizhou Sun, State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, China
Zhenxing Ren, State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, China
Jinghong Han, State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, China
Shanhong Xia, State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, China
pp. 597-600
D. Wu, National Key Laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking University, China
H.Y. Mao, National Key Laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking University, China
W.G. Wu, National Key Laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking University, China
pp. 601-604
Yu Liu, Chemistry Department of Science School, Harbin Institute of Technology, 150001, China
Zushun Lu, Chemistry Department of Science School, Harbin Institute of Technology, 150001, China
Xiaodong Chen, School of Economic and management, Harbin Institute of Technology, 150001, China
Di Wang, Chemistry Department of Science School, Harbin Institute of Technology, 150001, China
Jincheng Liu, National Key Laboratory of Tunable Laser Technology, Harbin Institute of Technology, 150001, China
Lijiang Hu, Chemistry Department of Science School, Harbin Institute of Technology, 150001, China
pp. 605-608
Ki-Young Dong, College of Engineering, Korea University, Anam-dong, Seongbuk-gu, Seoul 136-713, Republic of Korea
Youngmin, College of Engineering, Korea University, Anam-dong, Seongbuk-gu, Seoul 136-713, Republic of Korea
Seung-IL Moon, College of Engineering, Korea University, Anam-dong, Seongbuk-gu, Seoul 136-713, Republic of Korea
Jinwoo Lee, College of Engineering, Korea University, Anam-dong, Seongbuk-gu, Seoul 136-713, Republic of Korea
Jinnil Choi, College of Engineering, Korea University, Anam-dong, Seongbuk-gu, Seoul 136-713, Republic of Korea
Byeong-Kwon Ju, Display and Nanosystem Laboratory, School of Electrical Engineering, College of Engineering, Korea University, 5-1, Anam-Dong, Seongbuk-Gu, Seoul 136-713, Korea
pp. 609-611
Ahra Lee, Advanced device engineering division, University Science and Technology, Korea
SangChul Lee, BSG co., LTD. Korea
Sungsik Lee, Advanced i-MEMS team, Electrical Telecommunication Research Institute, Korea
Chang Han Je, Advanced i-MEMS team, Electrical Telecommunication Research Institute, Korea
Sunghae Jung, Advanced i-MEMS team, Electrical Telecommunication Research Institute, Korea
Myoung-Lae Lee, Advanced i-MEMS team, Electrical Telecommunication Research Institute, Korea
Gunn Hwang, Advanced i-MEMS team, Electrical Telecommunication Research Institute, Korea
Byoung-Gon Yu, Advanced i-MEMS team, Electrical Telecommunication Research Institute, Korea
Chang Auck Choi, Advanced i-MEMS team, Electrical Telecommunication Research Institute, Korea
pp. 612-615
Jun Xu, The School of Automation, Harbin University of Science and Technology, China
Bo You, The School of Automation, Harbin University of Science and Technology, China
Xin Li, Computer Center, Harbin University of Science and Technology, China
Jing Ma, The School of Automation, Harbin University of Science and Technology, China
pp. 616-619
Junfeng Zhang, Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, National Key Laboratory of Micro/Nano Fabrication Technology, Research Institute of Micro/Nan
YiGui Li, Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, National Key Laboratory of Micro/Nano Fabrication Technology, Research Institute of Micro/Nan
Chun Hui, Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, National Key Laboratory of Micro/Nano Fabrication Technology, Research Institute of Micro/Nan
Yumei Xing, Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, National Key Laboratory of Micro/Nano Fabrication Technology, Research Institute of Micro/Nan
Yang Gao, Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, National Key Laboratory of Micro/Nano Fabrication Technology, Research Institute of Micro/Nan
pp. 620-623
Jie Gong, School of Mechanical Science&Engineering, Huazhong University of Science and Technology, Wuhan, China
Zirong Tang, School of Mechanical Science&Engineering, Huazhong University of Science and Technology, Wuhan, China
Tielin Shi, School of Mechanical Science&Engineering, Huazhong University of Science and Technology, Wuhan, China
Guanglan Liao, School of Mechanical Science&Engineering, Huazhong University of Science and Technology, Wuhan, China
Lei Nie, School of Mechanical Science&Engineering, Huazhong University of Science and Technology, Wuhan, China
Shiyuan Liu, School of Mechanical Science&Engineering, Huazhong University of Science and Technology, Wuhan, China
pp. 624-627
Lukasz S. Pakula, Electronic Instrumentation Laboratory, Delft University of Technology, The Netherlands
Vijayekumar Rajaraman, Electronic Instrumentation Laboratory, Delft University of Technology, The Netherlands
Patrick J. French, Electronic Instrumentation Laboratory, Delft University of Technology, The Netherlands
pp. 628-631
Yuexian Zou, The Key Laboratory of Integrated Microsystems, Shenzhen Graduate School of Peking University, China
Yali Zheng, The Key Laboratory of Integrated Microsystems, Shenzhen Graduate School of Peking University, China
Yufeng Jin, The Key Laboratory of Integrated Microsystems, Shenzhen Graduate School of Peking University, China
Guangyi Shi, The Key Laboratory of Integrated Microsystems, Shenzhen Graduate School of Peking University, China
pp. 632-636
Chi-Yuan Lee, Department of Mechanical Engineering, Yuan Ze Fuel Cell Center, Yuan Ze University, Taoyuan, Taiwan, R.O.C.
Shuo-Jen Lee, Department of Mechanical Engineering, Yuan Ze Fuel Cell Center, Yuan Ze University, Taoyuan, Taiwan, R.O.C.
Yu-Ming Lee, Department of Mechanical Engineering, Yuan Ze Fuel Cell Center, Yuan Ze University, Taoyuan, Taiwan, R.O.C.
Kuan-Yu Chu, Department of Mechanical Engineering, Yuan Ze Fuel Cell Center, Yuan Ze University, Taoyuan, Taiwan, R.O.C.
pp. 637-640
Hsiao-Yeh Chu, Micro and Precision Manufacturing Center&Mechanical Engineering Department, Kun Shan University. Taiwan, R.O.C.
Ming-Hang Weng, Metal Industries Research&Development Centre. Taiwan, R.O.C.
Ru-Yuan Yang, Department of Materials Engineering, National Ping Tung University of Science&Technology. Taiwan, R.O.C.
Chien-Wei Huang, Department of Mechanical and Electro-Mechanical Engineering, National Sun Yat-sen University. Taiwan, R.O.C.
Chia-Hsing Li, Micro and Precision Manufacturing Center&Mechanical Engineering Department, Kun Shan University. Taiwan, R.O.C.
pp. 641-644
Chakravarthy Yamarthy, Department of Electrical Engineering University of Louisville, KY, USA
Shamus McNamara, Department of Electrical Engineering University of Louisville, KY, USA
pp. 645-648
M. D. Nguyen, Inorganic Materials Science, Faculty of Science and Technology, MESA+ Institute for Nanotechnology, University of Twente, P.O. Box 217, 7500 AE Enschede, The Netherlands
R. J. A. Steenwelle, Inorganic Materials Science, Faculty of Science and Technology, MESA+ Institute for Nanotechnology, University of Twente, P.O. Box 217, 7500 AE Enschede, The Netherlands
P. M. te Riele, Inorganic Materials Science, Faculty of Science and Technology, MESA+ Institute for Nanotechnology, University of Twente, P.O. Box 217, 7500 AE Enschede, The Netherlands
J. M. Dekkers, Inorganic Materials Science, Faculty of Science and Technology, MESA+ Institute for Nanotechnology, University of Twente, P.O. Box 217, 7500 AE Enschede, The Netherlands
D. H. A. Blank, Inorganic Materials Science, Faculty of Science and Technology, MESA+ Institute for Nanotechnology, University of Twente, P.O. Box 217, 7500 AE Enschede, The Netherlands
G. Rijnders, Inorganic Materials Science, Faculty of Science and Technology, MESA+ Institute for Nanotechnology, University of Twente, P.O. Box 217, 7500 AE Enschede, The Netherlands
pp. 649-652
Yuping Zhang, State Key Laboratory of Bioelectronics, School of Biological Science&Medical Engineering, Southeast University, Nanjing 210096, China
Yanyan Wang, State Key Laboratory of Bioelectronics, School of Biological Science&Medical Engineering, Southeast University, Nanjing 210096, China
Lanxin Lv, State Key Laboratory of Bioelectronics, School of Biological Science&Medical Engineering, Southeast University, Nanjing 210096, China
Shancheng Yan, State Key Laboratory of Bioelectronics, School of Biological Science&Medical Engineering, Southeast University, Nanjing 210096, China
Haitao Wang, State Key Laboratory of Bioelectronics, School of Biological Science&Medical Engineering, Southeast University, Nanjing 210096, China
Yong Zhang, State Key Laboratory of Bioelectronics, School of Biological Science&Medical Engineering, Southeast University, Nanjing 210096, China
Dan Zhu, State Key Laboratory of Bioelectronics, School of Biological Science&Medical Engineering, Southeast University, Nanjing 210096, China
Ningping Huang, State Key Laboratory of Bioelectronics, School of Biological Science&Medical Engineering, Southeast University, Nanjing 210096, China
Zhongdang Xiao, State Key Laboratory of Bioelectronics, School of Biological Science&Medical Engineering, Southeast University, Nanjing 210096, China
pp. 653-656
Rawat Jaisutti, Department of Physics, Faculty of Science, Mahidol University, Thailand
Wittawat Yamwong, Thai Microelectronics Center, National Electronics and Computer Technology Center, NSTDA, Thailand
Sirapat Pratontep, National Nanotechnology Center, National Science and Technology Development Agency, Thailand
Tanakorn Osotchan, Department of Physics, Faculty of Science, Mahidol University, Thailand
pp. 657-660
Zhuangde Jiang, State Key Lab for Manufacturing Systems Engineering, Xi'an Jiaotong University, Shaanxi, China
Libo Zhao, State Key Lab for Manufacturing Systems Engineering, Xi'an Jiaotong University, Shaanxi, China
Yulong Zhao, State Key Lab for Manufacturing Systems Engineering, Xi'an Jiaotong University, Shaanxi, China
Philip D. Prewett, School of Mechanical Engineering, University of Birmingham, Edgbaston, UK
Kyle Jiang, School of Mechanical Engineering, University of Birmingham, Edgbaston, UK
pp. 661-665
Jianjun Ye, Institute of Chemical Engineering Process and Machinery, Zhejiang University, Hangzhou, 310027, China
Jian Yang, Institute of Chemical Engineering Process and Machinery, Zhejiang University, Hangzhou, 310027, China
Jinyang Zheng, Institute of Chemical Engineering Process and Machinery, Zhejiang University, Hangzhou, 310027, China
Ping Xu, Institute of Applied Mechanics, Zhejiang University, Hangzhou, 310027, China
Chikong Lam, Department of Mechanical Engineering, University of California, Berkeley, 94704, U.S.A.
Ieong Wong, Department of Mechanical and Aerospace Engineering, University of California, Los Angeles, 90095, U.S.A.
Yanbao Ma, Department of Mechanical and Aerospace Engineering, University of California, Los Angeles, 90095, U.S.A.
pp. 666-671
Henan Ni, Research Institute of Micro/Nano Science and Technology, Shanghai Jiaotong University, 200030, China
Liangcai Wu, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 200050, China
Zhitang Song, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 200050, China
Chun Hui, College of Life Science Biotechnology, Shanghai Jiaotong University, 200030, China
pp. 672-675
Xin Xu, IMEP-LAHC, Minatec, Grenoble Institute of technology, 3 PARVIS LOUIS NEEL, 38016, France
Bogdan Bercu, IMEP-LAHC, Minatec, Grenoble Institute of technology, 3 PARVIS LOUIS NEEL, 38016, France
Francois Lime, IMEP-LAHC, Minatec, Grenoble Institute of technology, 3 PARVIS LOUIS NEEL, 38016, France
Laurent Montes, IMEP-LAHC, Minatec, Grenoble Institute of technology, 3 PARVIS LOUIS NEEL, 38016, France
pp. 676-681
Huajun Fang, Institute of Microelectronics, Tsinghua University, Beijing, China
Xingming Liu, Institute of Microelectronics, Tsinghua University, Beijing, China
Litian Liu, Institute of Microelectronics, Tsinghua University, Beijing, China
pp. 682-685
Chang-Zhi Shi, Department of Microelectronics, Harbin Institute of Technology, 150001, China
Xiao-Wei Liu, Department of Microelectronics, Harbin Institute of Technology, 150001, China
Rong-Yan Chuai, Information Science and Engineering School, Shenyang University of Technology, 110023, China
pp. 686-689
Shiyou Xu, Active Nanomaterials and Devices Laboratory, Mechanical department, Stevens Institute of Technology, Hoboken, NJ 07030, USA
Yong Shi, Active Nanomaterials and Devices Laboratory, Stevens Institute of Technology. Castle Point on Hudson, NJ 07029, USA
pp. 690-693
Surachai Pengmanayol, Center of Nanoscience and Nanotechnology, Faculty of Science, Mahidol University, Bangkok 10400, Thailand
Tanakorn Osotchan, Center of Nanoscience and Nanotechnology, Faculty of Science, Mahidol University, Bangkok 10400, Thailand
pp. 694-697
Dongbing Geng, School of Material Science and Technology, Wuhan University of Technology (WHUT), China
Liming Zeng, School of Material Science and Technology, Wuhan University of Technology (WHUT), China
Yi Li, Aerospace Research Institute of Materials and Processing Technology (ARIMT), China
pp. 698-702
Ji-Hong Kim, Department of Electrical Engineering, Korea University, Korea
Sung-Min Hong, Korea Electronics Technology Institute, Korea
Jang-Sub Lee, Korea Electronics Technology Institute, Korea
Byung-Moo Moon, Department of Electrical Engineering, Korea University, Korea
Kunnyun Kim, Korea Electronics Technology Institute, Korea
pp. 703-706
C. C. Su, Department of Mechanical Engineering, National Taiwan University, Taipei, Taiwan
C. H. Li, Department of Mechanical Engineering, National Taiwan University, Taipei, Taiwan
N. K. Chang, Department of Mechanical Engineering, National Taiwan University, Taipei, Taiwan
T. C. Wu, Department of Mechanical Engineering, National Taiwan University, Taipei, Taiwan
S. H. Chang, Department of Mechanical Engineering, National Taiwan University, Taipei, Taiwan
pp. 707-710
Amir Farrokh Payam, Device Modelling and Simulation Lab, School of Electrical&Computer Engineering, University of Tehran, Iran
Morteza Fathipour, Device Modelling and Simulation Lab, School of Electrical&Computer Engineering, University of Tehran, Iran
Mohammad Java Yazdanpanah, School of Electrical&Computer Engineering, University of Tehran, Iran
pp. 711-716
Amir Farrokh Payam, Device Modelling and Simulation Lab, School of Electrical&Computer Engineering, University of Tehran, Iran
Mohammad Javad Yazdanpanah, School of Electrical&Computer Engineering, University of Tehran, Iran
Morteza Fathipour, Device Modelling and Simulation Lab, School of Electrical&Computer Engineering, University of Tehran, Iran
pp. 717-721
Guo Q. Han, State Key Laboratory for Manufacturing Systems Engineering, Xi'an Shaanxi 710049, China
Zhuang D. Jiang, State Key Laboratory for Manufacturing Systems Engineering, Xi'an Shaanxi 710049, China
Wei X. Jing, State Key Laboratory for Manufacturing Systems Engineering, Xi'an Shaanxi 710049, China
Hai R. Wang, State Key Laboratory for Manufacturing Systems Engineering, Xi'an Shaanxi 710049, China
Guo L. Sun, State Key Laboratory for Manufacturing Systems Engineering, Xi'an Shaanxi 710049, China
Ming Z. Zhu, State Key Laboratory for Manufacturing Systems Engineering, Xi'an Shaanxi 710049, China
pp. 722-725
Jing-Hui Wang, 1Mechanical and Electro-Mechanical Engineering, National Sun Yat-sen University, Taiwan
Meng-Ku Chi, 1Mechanical and Electro-Mechanical Engineering, National Sun Yat-sen University, Taiwan
Lung-Ming Fu, Graduate Institute of Materials Engineering, National Pingtung University of Science and Technology, Taiwan
Che-Hsin Lin, 1Mechanical and Electro-Mechanical Engineering, National Sun Yat-sen University, Taiwan
pp. 726-730
Hailin Cong, Department of Biomedical Engineering, University of California, Davis, USA
Tingrui Pan, Department of Biomedical Engineering, University of California, Davis, USA
pp. 731-734
Hailin Cong, Biomedical Engineering Department, University of California, Davis, USA
Alexander Revzin, Biomedical Engineering Department, University of California, Davis, USA
Tingrui Pan, Biomedical Engineering Department, University of California, Davis, USA
pp. 735-738
Wei Tang, The institute of microelectronic, Peking University, China
Zhe Chen, The institute of microelectronic, Peking University, China
Haixia Zhang, The institute of microelectronic, Peking University, China
pp. 739-742
Pin Lv, Institute of Microelectronics, Peking University, Beijing 100871, China
Zhe Chen, Institute of Microelectronics, Peking University, Beijing 100871, China
Alice H.X. Zhang, Institute of Microelectronics, Peking University, Beijing 100871, China
pp. 743-746
Tzong-Shyng. Leu, Institute of Aeronautics and Astronautics, National Cheng Kung University, Tainan, Taiwan
Horng-Jiann Song, Institute of Aeronautics and Astronautics, National Cheng Kung University, Tainan, Taiwan
pp. 747-750
Chun-Ping Jen, Department of Mechanical Engineering, National Chung Cheng University, Chia-yi, Taiwan
Ching-Te Huang, Department of Mechanical Engineering, National Chung Cheng University, Chia-yi, Taiwan
Yun-Hung Lu, Department of Mechanical Engineering, National Chung Cheng University, Chia-yi, Taiwan
pp. 751-753
Deyong Chen, 1nstitute of Electronics, Chinese Academy of Sciences, State Key Laboratories of Transducer Technology, Beijing, China
Zhengwei Wu, 1nstitute of Electronics, Chinese Academy of Sciences, State Key Laboratories of Transducer Technology, Beijing, China
Xiaojing Shi, 1nstitute of Electronics, Chinese Academy of Sciences, State Key Laboratories of Transducer Technology, Beijing, China
Junbo Wang, 1nstitute of Electronics, Chinese Academy of Sciences, State Key Laboratories of Transducer Technology, Beijing, China
Lei Liu, 1nstitute of Electronics, Chinese Academy of Sciences, State Key Laboratories of Transducer Technology, Beijing, China
pp. 754-757
Guang He, School of Aerospace Science and Engineering, Beijing Institute of Technology, BIT, China
Geng-Chen Shi, School of Aerospace Science and Engineering, Beijing Institute of Technology, BIT, China
pp. 758-762
Kui Zou, National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Microelectronics, Peking University, Beijing 100871, China
Xiuhan Li, School of Electronics and Information Engineering, Beijing Jiaotong University, China, 100044
Haixia Zhang, National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Microelectronics, Peking University, Beijing 100871, China
pp. 763-766
Yung-Chun Lee, Department of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan
Pin-Chang Chen, Department of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan
Hung-Yi Lin, Mechanical and System Research Laboratory, ITRI, Hsinchu, Taiwan
pp. 767-770
Yunguang Ji, Dept. of Mechanical Engineering, The University of Akron, Ohio, USA
Yueh-Jaw Lin, Dept. of Mechanical Engineering, The University of Texas at Tyler, 75799 USA
Alper Buldum, Dept. of Physics, The University of Akron, Ohio, USA
pp. 771-774
Yung-Chun Lee, Department of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan
Yi-Chien Lin, Department of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan
Chen-Hui Tsai, Department of Aeronautics and Astronautics, National Cheng Kung University, Tainan, Taiwan
pp. 775-778
Yung-Chun Lee, Department of Nanotechnology and Microsystems Engineering, National Cheng Kung University, Tainan, Taiwan
Hsueh-Liang Chen, Department of Nanotechnology and Microsystems Engineering, National Cheng Kung University, Tainan, Taiwan
Chun-Hung Chen, Department of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan
Hung-Yi Lin, Mechanical and System Research Laboratory, ITRI, Hsinchu, Taiwan
pp. 779-782
C.K. Chung, Dep't of Mechanical Engineering and Center for Micro/Nano Science and Technology, National Cheng Kung University, Tainan, Taiwan 701, ROC
J.J. Jhu, Dep't of Mechanical Engineering and Center for Micro/Nano Science and Technology, National Cheng Kung University, Tainan, Taiwan 701, ROC
pp. 783-786
Shou-Ping Hsu, Dept. of Refrigeration, Air Conditioning and energy engineering, National Chin-Yi University of Technology, Taiwan
Kao-Feng Yarn, Dept. of Electronic Engineering, Far East University, Taiwan
Win-Jet Luo, Dept. of Refrigeration, Air Conditioning and energy engineering, National Chin-Yi University of Technology, Taiwan
I-Ting Hsieh, Dept. of Electronic Engineering, Far East University, Taiwan
Hong-Jun Ye, Dept. of Refrigeration, Air Conditioning and energy engineering, National Chin-Yi University of Technology, Taiwan
Meng-Hua Chung, Dept. of Refrigeration, Air Conditioning and energy engineering, National Chin-Yi University of Technology, Taiwan
pp. 787-792
Chi-Chang Lin, Institute of Biomedical Engineering, National Cheng Kung University, Tainan 701, Taiwan
Ying-Mei Yang, Institute of Biomedical Engineering, National Cheng Kung University, Tainan 701, Taiwan
Hsien-Chang Chang, Institute of Biomedical Engineering, National Cheng Kung University, Tainan 701, Taiwan
pp. 793-796
Xian Huang, Mechanical Engineering Department, Columbia University, New York, USA
Siqi Li, Chemistry and Biochemistry Department, University of South Carolina, Columbia, USA
Jerome Schultz, Bioengineering Department, University of California, Riverside, USA
Qian Wang, Chemistry and Biochemistry Department, University of South Carolina, Columbia, USA
Qiao Lin, Mechanical Engineering Department, Columbia University, New York, USA
pp. 797-802
Chengkuo Lee, Institute of Microelectronics (IME), Agency for Science, Technology and Research (A*STAR), Singapore 117685
Jin Xie, Institute of Microelectronics (IME), Agency for Science, Technology and Research (A*STAR), Singapore 117685
pp. 803-807
Chengkuo Lee, Department of Electrical and Computer Eng., National University of Singapore, 117576, Republic of Singapore
Wenfeng Xiang, Department of Electrical and Computer Eng., National University of Singapore, 117576, Republic of Singapore
Jayaraj Thillaigovindan, Department of Electrical and Computer Eng., National University of Singapore, 117576, Republic of Singapore
Fu-Li Hsiao, Department of Electrical and Computer Eng., National University of Singapore, 117576, Republic of Singapore
pp. 808-812
Yan-li Qu, The State Key Laboratory of Robotics, Shenyang Institute of Automation, Chinese Academy of Sciences, China
Zai-li Dong, The State Key Laboratory of Robotics, Shenyang Institute of Automation, Chinese Academy of Sciences, China
Steve C. H. Tung, The State Key Laboratory of Robotics, Shenyang Institute of Automation, Chinese Academy of Sciences, China
Wen J. Li, The State Key Laboratory of Robotics, Shenyang Institute of Automation, Chinese Academy of Sciences, China
pp. 813-817
Zhen Chen, College of Chemistry and Molecular Engineering, Peking University, Beijing, CHINA
Yu Zhao, Institute of Microelectronics, Peking University, Beijing, CHINA
Wei Wang, Institute of Microelectronics, Peking University, Beijing, CHINA
Zhihong Li, Institute of Microelectronics, Peking University, Beijing, CHINA
pp. 818-821
Michael Junkin, Aerospace and Mechanical Engineering Department, University of Arizona, Tucson, 85721, USA
Donna D. Zhang, Department of Pharmacology and Toxicology, University of Arizona, Tucson, 85721, USA
Pak Kin Wong, Aerospace and Mechanical Engineering Department, University of Arizona, Tucson, 85721, USA
pp. 822-826
Mandy L. Y. Sin, Department of Aerospace and Mechanical Engineering, University of Arizona, Tucson, USA
Vinay Gidwani, Department of Biochemistry and Molecular Biophysics, University of Arizona, Tucson, USA
Vincent Gau, Genefluidics, Inc, Monterey Park, California, USA
Pak Kin Wong, Department of Aerospace and Mechanical Engineering, University of Arizona, Tucson, USA
pp. 827-831
Vinay Gidwani, Department of Biochemistry and Molecular Biophysics, University of Arizona, USA
Yi Lu, Department of Computer Science, University of Arizona, USA
Donna D. Zhang, Department of Pharmacology and Toxicology, University of Arizona, USA
Pak Kin Wong, Department of Aerospace and Mechanical Engineering, University of Arizona, USA
pp. 832-836
Guanghui Bai, Applied chemistry department, Xi'an University of Architecture&Technology, China
Wei Teng, Applied chemistry department, Xi'an University of Architecture&Technology, China
Xianggang Wang, Applied chemistry department, Xi'an University of Architecture&Technology, China
Hui Zhang, Pingshuo coal industry company, Shanxi, China
Peng Xu, Applied chemistry department, Xi'an University of Architecture&Technology, China
pp. 837-842
Sumana Kladsomboon, Department of Physics and Center of Nanoscience and Nanotechnology, Faculty of Science, Mahidol University, Bangkok, 10400, Thailand
Sirapat Pratontep, National Nanotechnology Center, Thailand Science Park, Pathumthani 12120, Thailand
Theeraporn Puntheeranurak, Department of Physics and Center of Nanoscience and Nanotechnology, Faculty of Science, Mahidol University, Bangkok, 10400, Thailand
Teerakiat Kerdcharoen, Department of Physics and Center of Nanoscience and Nanotechnology, Faculty of Science, Mahidol University, Bangkok, 10400, Thailand
pp. 843-847
Drazen Fabris, Santa Clara Center for Nanostructures, Santa Clara University, USA
Tsutomu Saito, Santa Clara Center for Nanostructures, Santa Clara University, USA
Toshishige Yamada, Santa Clara Center for Nanostructures, Santa Clara University, USA
Xuhui Sun, Santa Clara Center for Nanostructures, Santa Clara University, USA
Patrick Wilhite, Santa Clara Center for Nanostructures, Santa Clara University, USA
Cary Y. Yang, Santa Clara Center for Nanostructures, Santa Clara University, USA
pp. 848-853
Cheng-Hsin Chunag, Department of Mechanical Engineering&Institute of Nanotechnology, Southern Taiwan University, Tainan, TAIWAN
Yu-Chi Chen, Department of Mechanical Engineering&Institute of Nanotechnology, Southern Taiwan University, Tainan, TAIWAN
You-Ming Hsu, Department of Mechanical Engineering&Institute of Nanotechnology, Southern Taiwan University, Tainan, TAIWAN
Huei-Sheng Huang, Department of Medical Laboratory Science and Biotechnology, National Cheng Kung University, Tainan, TAIWAN
Fei-Bin Hsiao, Department of Aeronautics and Astronautics, National Cheng Kung University, Tainan, TAIWAN
Chin-Hung Wang, Micro System Technology Center, Institute Technology Research Institute Southern, Tainan, TAIWAN
pp. 854-857
Tao Sun, School of Electronics and Computer Science, University of Southampton, United Kingdom
Soichiro Tsuda, School of Electronics and Computer Science, University of Southampton, United Kingdom
Klaus-Peter Zauner, School of Electronics and Computer Science, University of Southampton, United Kingdom
Hywel Morgan, School of Electronics and Computer Science, University of Southampton, United Kingdom
pp. 858-863
Sadollah Ebrahimi, Department of Physics, Islamic Azad University of Mahabad, Iran
Jamshid Sabbaghzadeh, NSTR institute, AEOI, Iran
Maryamalsadat Lajvardi, NSTR institute, AEOI, Iran
Iraj Hadi, NSTR institute, AEOI, Iran
pp. 864-867
Yuan Li, National Key Laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking University, Beijing 100871, China
Zhenchuan Yang, National Key Laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking University, Beijing 100871, China
Guizhen Yan, National Key Laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking University, Beijing 100871, China
pp. 868-871
Qiang Liu, National Key Laboratory of Nano/Micro Fabrication Technology Institute of Microelectronics, Peking University, Beijing, 100871, China
Bo Liu, National Key Laboratory of Nano/Micro Fabrication Technology Institute of Microelectronics, Peking University, Beijing, 100871, China
Zhihong Li, National Key Laboratory of Nano/Micro Fabrication Technology Institute of Microelectronics, Peking University, Beijing, 100871, China
pp. 872-876
Chi-Chang Lin, Institute of Biomedical Engineering, National Cheng Kung University, Taiwan
Chen-Yuan Yu, Institute of Biomedical Engineering, National Cheng Kung University, Taiwan
Ying-Mei Yang, Institute of Biomedical Engineering, National Cheng Kung University, Taiwan
Yan-Fu Chen, Institute of Biomedical Engineering, National Cheng Kung University, Taiwan
Hsien-Chang Chang, Institute of Biomedical Engineering, National Cheng Kung University, Taiwan
pp. 877-880
Jian Luo, School of Electronics and Computer Science, University of Southampton, UK. SO17, 1BJ
Haitao Ding, School of Electronics and Computer Science, University of Southampton, UK. SO17, 1BJ
Michael Kraft, School of Electronics and Computer Science, University of Southampton, UK. SO17, 1BJ
pp. 881-884
C.K. Chung, Dep't of Mechanical Engineering, and Center for Micro/Nano Technology Research, National Cheng Kung University, Tainan, Taiwan 701, ROC
T. C. Chen, Institute of Nanotechnology and Microsystems Engineering, National Cheng Kung University, Tainan, Taiwan 701, ROC
T.R. Shih, Dep't of Mechanical Engineering, and Center for Micro/Nano Technology Research, National Cheng Kung University, Tainan, Taiwan 701, ROC
W. T. Chang, Dep't of Mechanical Engineering, and Center for Micro/Nano Technology Research, National Cheng Kung University, Tainan, Taiwan 701, ROC
pp. 885-888
Qinghui Liu, School of Mechatronics and Automation, National University of Defense Technology, Changsha, China
Xuezhong Wu, School of Mechatronics and Automation, National University of Defense Technology, Changsha, China
Di Di, School of Mechatronics and Automation, National University of Defense Technology, Changsha, China
Peitao Dong, School of Mechatronics and Automation, National University of Defense Technology, Changsha, China
Dapeng Fan, School of Mechatronics and Automation, National University of Defense Technology, Changsha, China
pp. 889-892
Zhuxin Dong, Department of Mechanical Engineering, University of Arkansas, US
Uchechukwu C. Wejinya, Department of Mechanical Engineering, University of Arkansas, US
Wen J. Li, Centre for Micro and Nano Systems, The Chinese University of Hong Kong, Hong Kong SAR
pp. 893-897
Ding-jun Xu, Institute of Intelligent Machines, Chinese Academy of Science, Hefei, Anhui, China
Zheng-yong Zhang, Institute of Intelligent Machines, Chinese Academy of Science, Hefei, Anhui, China
Zhen Yu, Institute of Intelligent Machines, Chinese Academy of Science, Hefei, Anhui, China
pp. 898-903
Chia-Hsien Yeh, Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan
Po-Wen Lin, Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan
Qiaole Zhao, School of Electronic Science and Engineering, Southeast University, China
Tsung-Che Chou, Industrial Technology Research Institute South, Microsystems Technology center, Taiwan
Yu-Cheng Lin, Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan
pp. 904-906
Xianju Huang, National Key Laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking University, Beijing, 100871, CHINA
Yu Tang, National Key Laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking University, Beijing, 100871, CHINA
Renxin Wang, National Key Laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking University, Beijing, 100871, CHINA
Chuang Qian, National Key Laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking University, Beijing, 100871, CHINA
Wei Wang, National Key Laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking University, Beijing, 100871, CHINA
Zhihong Li, National Key Laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking University, Beijing, 100871, CHINA
pp. 907-910
Shenggui Wang, Pen-Tung Sah MEMS Research Center, Xiamen University, Fujian 361005, China
Liwei Lin, Pen-Tung Sah MEMS Research Center, Xiamen University, Fujian 361005, China
Hang Guo, Pen-Tung Sah MEMS Research Center, Xiamen University, Fujian 361005, China
pp. 911-914
Yi Zhang, Pen-Tung Sah MEMS Research Center, Xiamen University, Fujian 361005, China
Daqun Bao, Pen-Tung Sah MEMS Research Center, Xiamen University, Fujian 361005, China
Hang Guo, Pen-Tung Sah MEMS Research Center, Xiamen University, Fujian 361005, China
pp. 915-918
Yu Jin Kim, Department of Chemical and Biological Engineering, Chungju National University, 72 Daehak-ro, 380-702, South Korea
Il-Kyu Park, Department of Applied Chemistry&Biological Engineering, Chungnam National University, 220, Gung-dong, Yuseong-gu, Daejeon 305-764, South Korea
Jin Soo Kim, Department of Chemical and Biological Engineering, Chungju National University, 72 Daehak-ro, 380-702, South Korea
Joon Hwang, Department of Aeronautical&Mechanical Engineering, Chungju National University, 72 Daehak-ro, 380-702, South Korea
Eui-Sik Chung, Department of Mechanical Design Engineering, Hanbat National University, San 16-1, DuckMyoung-Dong, Yuseong-gu, Daejeon, 305-719, South Korea
Kang Moo Huh, Department of Applied Chemistry&Biological Engineering, Chungnam National University, 220, Gung-dong, Yuseong-gu, Daejeon 305-764, South Korea
Yong-kyu Lee, Department of Chemical and Biological Engineering, Chungju National University, 72 Daehak-ro, 380-702, South Korea
pp. 919-922
Anzhou Hou, College of Life Science Biotechnology, Shanghai Jiaotong University, CHINA
Henan Ni, Research Institute of Micro/Nano Science and Technology, Shanghai Jiaotong University, CHINA
Chun Hui, College of Life Science Biotechnology, Shanghai Jiaotong University, CHINA
Ailan Xu, Research Institute of Micro/Nano Science and Technology, Shanghai Jiaotong University, CHINA
pp. 923-925
Yanfeng Jiang, Microelectronic Center, College of Information Engineering, North China University of Technology, 100144, Beijing, China
Xiaobo Zhang, Microelectronic Center, College of Information Engineering, North China University of Technology, 100144, Beijing, China
Bing Yang, Microelectronic Center, College of Information Engineering, North China University of Technology, 100144, Beijing, China
pp. 926-929
Yi-feng Wang, Zhejiang University of Science and Technology, Hangzhou 30012, China
Rui-jin Wang, Zhejiang University of Science and Technology, Hangzhou 30012, China
Ling-na Wang, Zhejiang University of Science and Technology, Hangzhou 30012, China
pp. 930-934
Shengli Zhou, Centre for Micro and Nano Systems, N. T., Hong Kong SAR, China
Qing Shan, Centre for Micro and Nano Systems, N. T., Hong Kong SAR, China
Fei Fei, Centre for Micro and Nano Systems, N. T., Hong Kong SAR, China
Wen J. Li, Centre for Micro and Nano Systems, N. T., Hong Kong SAR, China
Chung Ping Kwong, Department of Mechanical and Automation Engineering, The Chinese University of Hong Kong, N. T., Hong Kong SAR, China
Patrick C. K. Wu, Hong Kong Applied Science and Technology Research Institute Company Limited, Shatin, N. T., Hong Kong SAR, China
Bojun Meng, Hong Kong Applied Science and Technology Research Institute Company Limited, Shatin, N. T., Hong Kong SAR, China
Christina K. H. Chan, Hong Kong Applied Science and Technology Research Institute Company Limited, Shatin, N. T., Hong Kong SAR, China
Jay Y. J. Liou, Hong Kong Applied Science and Technology Research Institute Company Limited, Shatin, N. T., Hong Kong SAR, China
pp. 935-940
Jeou-Long Lee, Department of Chemical and Material Engineering, Lunghwa University of Science and Technology, Taoyuan 333, Taiwan
Yung-Kang Shen, School of Dental Technology, Taipei Medical University, 110, Taiwan
Yi Lin, Department of Business Administration, Takming University of Science and Technology, Taipei 104, Taiwan
Ping-Tun Teng, School of Mechanical Engineering, Taiwan University of Science and Technology, Taipei 104, Taiwan
Chuan-Min Huang, Department of Mechanical and Mechatronic Engineering, National Taiwan Ocean University, Keelung 202, Taiwan
pp. 941-945
Yiting Yu, Micro and Nano Electromechanical System Laboratory, Northwestern Polytechnical University, Xi'an 710072, China
Weizheng Yuan, Micro and Nano Electromechanical System Laboratory, Northwestern Polytechnical University, Xi'an 710072, China
Bin Yan, Micro and Nano Electromechanical System Laboratory, Northwestern Polytechnical University, Xi'an 710072, China
Taiping Li, Micro and Nano Electromechanical System Laboratory, Northwestern Polytechnical University, Xi'an 710072, China
Lanlan Wang, Micro and Nano Electromechanical System Laboratory, Northwestern Polytechnical University, Xi'an 710072, China
pp. 946-949
S. Subramanian, Mechanical Engineering Department, Birla Institute of Technology and Science, Pilani, India
J. S. Rathore, Mechanical Engineering Department, Birla Institute of Technology and Science, Pilani, India
N. N. Sharma, Mechanical Engineering Department, Birla Institute of Technology and Science, Pilani, India
pp. 950-953
Benjaporn Treetharnmathurot, Department of Pharmaceutical Technology, Faculty of Pharmaceutical Sciences, Prince of Songkla University, Hat Yai, Songkhla, 90110, Thailand
Chitchamai Ovatlarnporn, Department of Pharmaceutical Chemistry, Faculty of Pharmaceutical Sciences, Prince of Songkla University, Hat Yai, Songkhla, 90110, Thailand
Juraithip Wungsinthaweekul, Department of Pharmacognosy and Pharmaceutical Botany, Faculty of Pharmaceutical Sciences, Prince of Songkla University, Hat Yai, Songkhla, 90110, Thailand
Ruedeekorn Wiwattanapatapee, Department of Pharmaceutical Technology, Faculty of Pharmaceutical Sciences, Prince of Songkla University, Hat Yai, Songkhla, 90110, Thailand
pp. 954-959
Yung-Chiang Chung, Graduate School of Mechanical-Electro Engineering, Ming Chi University of Technology, Taiwan
Yu-Cheng Lin, Department of Engineering Science, National Cheng Kung University, Taiwan
Chaung-Di Chueh, Graduate School of Mechanical-Electro Engineering, Ming Chi University of Technology, Taiwan
Chuan-You Ye, Graduate School of Mechanical-Electro Engineering, Ming Chi University of Technology, Taiwan
Li-Wei Lai, Graduate School of Mechanical-Electro Engineering, Ming Chi University of Technology, Taiwan
Wei-Chieh Liao, Graduate School of Mechanical-Electro Engineering, Ming Chi University of Technology, Taiwan
pp. 960-963
Ding Yuan, Department of Electronic Engineering, East China Normal University, Shanghai, 200241, China
Pengliang Ci, Department of Electronic Engineering, East China Normal University, Shanghai, 200241, China
Fei Tian, Department of Electronic Engineering, East China Normal University, Shanghai, 200241, China
Jing Shi, Department of Electronic Engineering, East China Normal University, Shanghai, 200241, China
Shaohui Xu, Department of Electronic Engineering, East China Normal University, Shanghai, 200241, China
Peisheng Xin, Department of Electronic Engineering, East China Normal University, Shanghai, 200241, China
Lianwei Wang, Department of Electronic Engineering, East China Normal University, Shanghai, 200241, China
pp. 964-969
Her-Terng Yau, Department of Electrical Engineering, Far East University, Tainan, Taiwan
Cheng-Chi Wang, Department of Mechanical Engineering, Far East University, Tainan, Taiwan
Ching-Chang Cho, Department of Mechanical, Engineering, National Cheng-Kung University, Tainan, Taiwan
Ming-Jyi Jang, Department of Automation and Control, Far East University, Tainan, Taiwan
pp. 970-974
Cheng-Chi Wang, Mechanical Engineering, Far East University, Taiwan
Her-Terng Yau, Electrical Engineering, Far East University, Taiwan
Yen-Liang Yeh, Automation and Control Engineering, Far East University, Taiwan
Ming-Jyi Jang, Automation and Control Engineering, Far East University, Taiwan
Jing-Fung Lin, Computer Application Engineering, Far East University, Taiwan
pp. 975-979
Ru Zhang, School of Science, Beijing University of Posts and Telecommunications, China
Ying Zhang, School of Science, Beijing University of Posts and Telecommunications, China
Peilin Lang, School of Science, Beijing University of Posts and Telecommunications, China
Yuwen Duan, School of Science, Beijing University of Posts and Telecommunications, China
pp. 980-982
Ping Peng, Wuhan National Laboratory for Optoelectronics, 430074, China
Tielin Shi, Wuhan National Laboratory for Optoelectronics, 430074, China
Guanglan Liao, Wuhan National Laboratory for Optoelectronics, 430074, China
Zirong Tang, Wuhan National Laboratory for Optoelectronics, 430074, China
Chang Liu, Wuhan National Laboratory for Optoelectronics, 430074, China
pp. 983-986
Zhong Cao, College of Chemistry and Biological Engineering, Changsha University of Science and Technology, 410114, China
Meng-Xue Zeng, College of Chemistry and Biological Engineering, Changsha University of Science and Technology, 410114, China
Ling Zhang, College of Chemistry and Biological Engineering, Changsha University of Science and Technology, 410114, China
Xi-Xi Huang, College of Chemistry and Biological Engineering, Changsha University of Science and Technology, 410114, China
Ming-Xing Wang, College of Chemistry and Biological Engineering, Changsha University of Science and Technology, 410114, China
Fu-Chun Gong, College of Chemistry and Biological Engineering, Changsha University of Science and Technology, 410114, China
Shu-Zhen Tan, College of Chemistry and Biological Engineering, Changsha University of Science and Technology, 410114, China
pp. 987-990
Shubin Yan, National Key Laboratory For Electronic Measurement Technology, Key Laboratory of Instrumentation Science Dynamic Measurement, North University of China, Taiyuan, China 030051
Baohua Wang, National Key Laboratory For Electronic Measurement Technology, Key Laboratory of Instrumentation Science Dynamic Measurement, North University of China, Taiyuan, China 030051
Yingzhan Yan, National Key Laboratory For Electronic Measurement Technology, Key Laboratory of Instrumentation Science Dynamic Measurement, North University of China, Taiyuan, China 030051
Nini Hao, Shandong University of Science and Tecnology, Qingdao, China, 266510
Shaohui Wang, National Key Laboratory For Electronic Measurement Technology, Key Laboratory of Instrumentation Science Dynamic Measurement, North University of China, Taiyuan, China 030051
Xiaohong Ren, National Key Laboratory For Electronic Measurement Technology, Key Laboratory of Instrumentation Science Dynamic Measurement, North University of China, Taiyuan, China 030051
Xiongying Ye, State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instruments and Mechanology, Tsinghua University, Beijing, China 100084
Zhaoying Zhou, State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instruments and Mechanology, Tsinghua University, Beijing, China 100084
Chenyang Xue, National Key Laboratory For Electronic Measurement Technology, Key Laboratory of Instrumentation Science Dynamic Measurement, North University of China, Taiyuan, China 030051
Jun Liu, National Key Laboratory For Electronic Measurement Technology, Key Laboratory of Instrumentation Science Dynamic Measurement, North University of China, Taiyuan, China 030051
pp. 991-995
Yuwen Duan, Key Laboratory of Optical Communication&Lightwave Technologies(Ministry of Education), School of Sciences Beijing University of Posts and Telecommunications, China
Ru Zhang, Key Laboratory of Optical Communication&Lightwave Technologies(Ministry of Education), School of Sciences Beijing University of Posts and Telecommunications, China
Peilin Lang, Key Laboratory of Optical Communication&Lightwave Technologies(Ministry of Education), School of Sciences Beijing University of Posts and Telecommunications, China
Ying Zhang, Key Laboratory of Optical Communication&Lightwave Technologies(Ministry of Education), School of Sciences Beijing University of Posts and Telecommunications, China
pp. 996-999
Xin Liu, National Kay Laboratory for Electronic Measurement Technology, North University of China, China
Chenyang Xue, National Kay Laboratory for Electronic Measurement Technology, North University of China, China
Shubin Yan, National Kay Laboratory for Electronic Measurement Technology, North University of China, China
Jijun Xiong, National Kay Laboratory for Electronic Measurement Technology, North University of China, China
Wendong Zhang, National Kay Laboratory for Electronic Measurement Technology, North University of China, China
pp. 1000-1003
Karan K. Mehta, Dept. of Electrical Engineering, UCLA, Los Angeles, CA 90095, USA
Ting-Hsiang Wu, Dept. of Electrical Engineering, UCLA, Los Angeles, CA 90095, USA
Eric P.Y. Chiou, Dept. of Mechanical Engineering, UCLA, Los Angeles, CA 90095, USA
pp. 1004-1007
Jun Liu, National Key Laboratory For Electronic Measurement Technology, Key Laboratory of Instrumentation Science Dynamic Measurement, North University of China, Taiyuan 030051, China
Guoqing Jiang, National Key Laboratory For Electronic Measurement Technology, Key Laboratory of Instrumentation Science Dynamic Measurement, North University of China, Taiyuan 030051, China
Shubin Yan, National Key Laboratory For Electronic Measurement Technology, Key Laboratory of Instrumentation Science Dynamic Measurement, North University of China, Taiyuan 030051, China
Shaohui Wang, National Key Laboratory For Electronic Measurement Technology, Key Laboratory of Instrumentation Science Dynamic Measurement, North University of China, Taiyuan 030051, China
Yingzhan Yan, National Key Laboratory For Electronic Measurement Technology, Key Laboratory of Instrumentation Science Dynamic Measurement, North University of China, Taiyuan 030051, China
Yanfeng Jing, National Key Laboratory For Electronic Measurement Technology, Key Laboratory of Instrumentation Science Dynamic Measurement, North University of China, Taiyuan 030051, China
Jijun Xiong, National Key Laboratory For Electronic Measurement Technology, Key Laboratory of Instrumentation Science Dynamic Measurement, North University of China, Taiyuan 030051, China
Xiongying Ye, State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instruments and Mechanology, Tsinghua University, Beijing 100084, China
Zhaoying Zhou, State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instruments and Mechanology, Tsinghua University, Beijing 100084, China
Wendong Zhang, National Key Laboratory For Electronic Measurement Technology, Key Laboratory of Instrumentation Science Dynamic Measurement, North University of China, Taiyuan 030051, China
pp. 1008-1012
Jing Wan, State key lab of ASIC and systems, Department of microelectronics, Fudan university, Shanghai 200433, China
Shao-Ren Deng, State key lab of ASIC and systems, Department of microelectronics, Fudan university, Shanghai 200433, China
Yifang Chen, Rutherford Appleton Laboratory, Chilton, Didcot, Oxon, OX11 0QX, UK
Ejaz Huq, Rutherford Appleton Laboratory, Chilton, Didcot, Oxon, OX11 0QX, UK
Ran Liu, State key lab of ASIC and systems, Department of microelectronics, Fudan university, Shanghai 200433, China
Xin-Ping Qu, State key lab of ASIC and systems, Department of microelectronics, Fudan university, Shanghai 200433, China
pp. 1013-1016
Min Nie, Department of Mechanical Engineering - Engineering Mechanics, Michigan Technological University, Houghton, USA
Pragnesh Patel, Department of Mechanical Engineering - Engineering Mechanics, Michigan Technological University, Houghton, USA
Kai Sun, Department of Materials Science and Engineering, University of Michigan, Ann Arbor, USA
Dennis Desheng Meng, Department of Mechanical Engineering - Engineering Mechanics, Michigan Technological University, Houghton, USA
pp. 1017-1020
Ryan Lemmens, Mechanical Engineering - Engineering Mechanics Department, Michigan Technological University, USA
Dennis Desheng Meng, Mechanical Engineering - Engineering Mechanics Department, Michigan Technological University, USA
pp. 1021-1025
Wei Qin, MEMS/NEMS Key Lab, Northwestern Polytechnical University, Xi'an, China
Weizheng Yuan, MEMS/NEMS Key Lab, Northwestern Polytechnical University, Xi'an, China
Honglong Chang, MEMS/NEMS Key Lab, Northwestern Polytechnical University, Xi'an, China
Liang Xue, MEMS/NEMS Key Lab, Northwestern Polytechnical University, Xi'an, China
Guangmin Yuan, MEMS/NEMS Key Lab, Northwestern Polytechnical University, Xi'an, China
pp. 1026-1030
Liang Xue, Micro and Nano Electromechanical Systems Laboratory, Northwestern Polytechnical University, Xi'an, 710072, China
Weizheng Yuan, Micro and Nano Electromechanical Systems Laboratory, Northwestern Polytechnical University, Xi'an, 710072, China
Honglong Chang, Micro and Nano Electromechanical Systems Laboratory, Northwestern Polytechnical University, Xi'an, 710072, China
Chengyu Jiang, Micro and Nano Electromechanical Systems Laboratory, Northwestern Polytechnical University, Xi'an, 710072, China
pp. 1031-1035
Yung-Chiang Chung, Graduate School of Mechanical-Electro Engineering, Ming Chi University of Technology, Taiwan
Yen-Wen Hu, Graduate School of Mechanical-Electro Engineering, Ming Chi University of Technology, Taiwan
Tsong-Long Hwang, Graduate Institute of Natural Products, Chang Gung University, Taiwan
Po-Wen Chen, Graduate School of Mechanical-Electro Engineering, Ming Chi University of Technology, Taiwan
Fong-Jian Sie, Graduate School of Mechanical-Electro Engineering, Ming Chi University of Technology, Taiwan
pp. 1036-1039
Yu Zhang, Centre for Micro and Nano Systems, The Chinese University of Hong Kong, Shatin, N.T., Hong Kong
Wen J. Li, Centre for Micro and Nano Systems, The Chinese University of Hong Kong, Shatin, N.T., Hong Kong
Osamu Tabata, Department of Micro Engineering, Kyoto University, Yoshida-Honmachi, Sakyo-ku, 606-8501, Japan
pp. 1040-1042
Peng Xiao, Department of Mechanical and Automation Engineering, Center for Micro and Nano Systems, CUHK, HK, China
Wen J. Li, Department of Mechanical and Automation Engineering, Center for Micro and Nano Systems, CUHK, HK, China
Ruxu Du, Department of Mechanical and Automation Engineering, Institute of Precision Engineering, CUHK, HK, China
pp. 1043-1047
Li Yang, Centre for Micro and Nano Systems, The Chinese University of Hong Kong, Hong Kong SAR, China
Mengxing Ouyang, Centre for Micro and Nano Systems, The Chinese University of Hong Kong, Hong Kong SAR, China
Wen J. Li, Centre for Micro and Nano Systems, The Chinese University of Hong Kong, Hong Kong SAR, China
pp. 1048-1053
2 (Abstract)
Jungil Park, School of Electrical Engineering, Korea University, Seoul, Korea
Sunyoung Ahn, Department of Nanophamaceutical and Life Science, Age-Related and Brain Disease Institute, Kyunghee University, Seoul, Korea
Youngmi Kim Pak, Department of Nanophamaceutical and Life Science, Age-Related and Brain Disease Institute, Kyunghee University, Seoul, Korea
James Jungho Pak, School of Electrical Engineering, Korea University, Seoul, Korea
pp. 1054-1057
Kang Wu, The State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instruments and Mechanology, Tsinghua University, Beijing, China
Xiongying Ye, The State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instruments and Mechanology, Tsinghua University, Beijing, China
Feng Chen, The State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instruments and Mechanology, Tsinghua University, Beijing, China
Litao Liu, The State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instruments and Mechanology, Tsinghua University, Beijing, China
Linrui Guo, Beijing Institute of Automatic Control Eqiupment, China
Zhaoying Zhou, The State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instruments and Mechanology, Tsinghua University, Beijing, China
pp. 1058-1061
Jin-Woo Kim, Department of Biological and Agricultural Engineering, University of Arkansas, Fayetteville, 72701, USA
Hyung-Mo Moon, Department of Biological and Agricultural Engineering, University of Arkansas, Fayetteville, 72701, USA
Steve Tung, Department of Mechanical Engineering, University of Arkansas, Fayetteville, 72701, USA
Hyun-Ho Lee, Department of Chemical Engineering, Myongji University, Yongin, Korea
pp. 1062-1064
Ju Seok Lee, The Cell and Molecular Biology Program, the University of Arkansas, Fayetteville, 72701 USA
Joon Jin Song, The Department of Mathematical Sciences, the University of Arkansas, Fayetteville, 72701 USA
Russell Deaton, The Department of Computer Science and Computer Engineering, the University of Arkansas, Fayetteville, 72701 USA
Jin-Woo Kim, The Cell and Molecular Biology Program, the University of Arkansas, Fayetteville, 72701 USA
pp. 1065-1068
Mi-Hyun Kang, MEMS&Nanotechnology Laboratory, Graduate school of Mechanical Engineering, Chonnam National University, Gwangju, Korea
Chang-Sin Park, MEMS&Nanotechnology Laboratory, Graduate school of Mechanical Engineering, Chonnam National University, Gwangju, Korea
Bo young Choi, MEMS&Nanotechnology Laboratory, School of Mechanical Systems Engineering, Chonnam National Universit, Gwangju, Korea
Dong-Weon Lee, MEMS&Nanotechnology Laboratory, School of Mechanical Systems Engineering, Chonnam National Universit, Gwangju, Korea
pp. 1069-1072
Jin Qiu, Spatial Photonics, Inc, Sunnyvale, CA, USA
Shawn Cunningham, WiSpry, Inc, Irvine, CA, USA
Arthur Morris, WiSpry, Inc, Irvine, CA, USA
pp. 1073-1078
Zhigang Wu, Department of Engineering Sciences, The Ângström Laboratory, Uppsala University, Sweden
Grzegorz Wicher, Department of Neuroscience, The Biomedical Center, Uppsala University, Sweden
Asa Fex Svenningsen, Department of Neuroscience, The Biomedical Center, Uppsala University, Sweden
Klas Hjort, Department of Engineering Sciences, The Ângström Laboratory, Uppsala University, Sweden
pp. 1079-1083
Shu Long, College of Chemistry and Biological Engineering, Changsha University of Science and Technology, 410114, China
Zhong Cao, College of Chemistry and Biological Engineering, Changsha University of Science and Technology, 410114, China
Yu-Ting Zhao, College of Chemistry and Biological Engineering, Changsha University of Science and Technology, 410114, China
Yi Zhou, College of Chemistry and Biological Engineering, Changsha University of Science and Technology, 410114, China
Ming-Xing Wang, College of Chemistry and Biological Engineering, Changsha University of Science and Technology, 410114, China
Yun-Lin Dai, College of Chemistry and Biological Engineering, Changsha University of Science and Technology, 410114, China