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2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems
Micro solid state silicon plate wind velocity sensor
Shenzhen, China
January 05-January 08
ISBN: 978-1-4244-4629-2
| ASCII Text | x | ||
| Lidong Du, Zhan Zhao, Cheng Pang, Zhen Fang, Yonghong Liu, Youjun Han, "Micro solid state silicon plate wind velocity sensor," International Conference on Nano/Micro Engineered and Molecular Systems, pp. 1-4, 2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2009. | |||
| BibTex | x | ||
| @article{ 10.1109/NEMS.2009.5068513, author = { Lidong Du and Zhan Zhao and Cheng Pang and Zhen Fang and Yonghong Liu and Youjun Han}, title = {Micro solid state silicon plate wind velocity sensor}, journal ={International Conference on Nano/Micro Engineered and Molecular Systems}, volume = {0}, year = {2009}, isbn = {978-1-4244-4629-2}, pages = {1-4}, doi = {http://doi.ieeecomputersociety.org/10.1109/NEMS.2009.5068513}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, } | |||
| RefWorks Procite/RefMan/Endnote | x | ||
| TY - CONF JO - International Conference on Nano/Micro Engineered and Molecular Systems TI - Micro solid state silicon plate wind velocity sensor SN - 978-1-4244-4629-2 SP1 EP4 A1 - Lidong Du, A1 - Zhan Zhao, A1 - Cheng Pang, A1 - Zhen Fang, A1 - Yonghong Liu, A1 - Youjun Han, PY - 2009 VL - 0 JA - International Conference on Nano/Micro Engineered and Molecular Systems ER - | |||
A wind velocity sensor using the torque of cantilever to measure the velocity of wind is presented in this paper. It consists of a thin silicon plate and two short cantilevers which connect with the plate and silicon substrate and will bend when wind blow to the plate. The wind velocity is obtained by measuring the strain caused by the deflection of the cantilevers. The designed sensor was simulated with ANSYS software using the model solid92 and analyzed with fluid mechanics principle and material mechanics principle. It is fabricated using MEMS surface and body micromachining process. By testing the designed sensor within small wind tunnel the results of calculation and simulation are validated. When the input voltage is 0.5V we obtain a sensor capable of high sensitivity 60µv/(m/s) at the high wind velocity.
Citation:
Lidong Du, Zhan Zhao, Cheng Pang, Zhen Fang, Yonghong Liu, Youjun Han, "Micro solid state silicon plate wind velocity sensor," nems, pp.1-4, 2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2009
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