loading...
  • M
  • MICRO
  • 1996
  • 29th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO'96)
Advanced Search 
29th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO'96)
Paris, FRANCE
December 02-December 04
ISBN: 0-8186-7641-8
Table of Contents
Preface (PDF)
pp. viii
Session 1
T.M. Conte, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
S.W. Sathaye, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
S. Banerjia, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
pp. 4
J.O. Bondi, Semicond. Group, Texas Instrum. Inc., Dallas, TX, USA
A.K. Nanda, Semicond. Group, Texas Instrum. Inc., Dallas, TX, USA
S. Dutta, Semicond. Group, Texas Instrum. Inc., Dallas, TX, USA
pp. 14
Eric Rotenberg, University of Wisconsin - Madison
Jim Smith, University of Wisconsin - Madison
Steve Bennett, Intel Corporation
pp. 24
Session 2
Thomas M. Conte, North Carolina State University
Kishore N. Menezes, North Carolina State University
Mary Ann Hirsch, North Carolina State University
pp. 36
C. Chekuri, Dept. of Comput. Sci., Stanford Univ., CA, USA
R. Johnson, Dept. of Comput. Sci., Stanford Univ., CA, USA
R. Motwani, Dept. of Comput. Sci., Stanford Univ., CA, USA
B. Natarajan, Dept. of Comput. Sci., Stanford Univ., CA, USA
B.R. Rau, Dept. of Comput. Sci., Stanford Univ., CA, USA
M. Schlansker, Dept. of Comput. Sci., Stanford Univ., CA, USA
pp. 58
Session 3
Cheng-Hsueh A. Hsieh, University of Illinois at Urbana-Champaign
John C. Gyllenhaal, University of Illinois at Urbana-Champaign
Wen-mei W. Hwu, University of Illinois at Urbana-Champaign
pp. 90
Session 4
R. Johnson, Hewlett-Packard Co., Palo Alto, CA, USA
M. Schlansker, Hewlett-Packard Co., Palo Alto, CA, USA
pp. 100
Daniel M. Lavery, University of Illinois at Urbana-Champaign
Wen-mei W. Hwu, University of Illinois at Urbana-Champaign
pp. 126
Session 5
E. Jacobsen, Wisconsin Univ., Madison, WI, USA
E. Rotenberg, Wisconsin Univ., Madison, WI, USA
J.E. Smith, Wisconsin Univ., Madison, WI, USA
pp. 142
Scott Mahlke, Hewlett-Packard Laboratories
Balas Natarajan, Hewlett-Packard Laboratories
pp. 153
Session 6
T.M. Conte, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
S. Banerjia, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
S.Y. Larin, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
K.N. Menezes, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
S.W. Sathaye, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
pp. 201
Session 7
S.S. Pinter, IBM Sci. & Technol., MATAM Adv. Technol. Center, Haifa, Israel
A. Yoaz, IBM Sci. & Technol., MATAM Adv. Technol. Center, Haifa, Israel
pp. 214
Y. Sazeides, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
S. Vassiliadis, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
J.E. Smith, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 238
Session 8
M.E. Wolf, Silicon Graphics Comput. Syst., Mountain View, CA, USA
D.E. Maydan, Silicon Graphics Comput. Syst., Mountain View, CA, USA
Ding-Kai Chen, Silicon Graphics Comput. Syst., Mountain View, CA, USA
pp. 274
Session 9
Eric Schnarr, University of Wisconsin?Madison
James R. Larus, University of Wisconsin?Madison
pp. 288
Session 10
Joseph A. Fisher, Hewlett-Packard Laboratories
Paolo Faraboschi, Hewlett-Packard Laboratories
Giuseppe Desoli, Hewlett-Packard Laboratories
pp. 324
Usage of this product signifies your acceptance of the Terms of Use.