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Multi-Chip Module Conference, IEEE (1997)
Santa Cruz, CA
Feb. 4, 1997 to Feb. 5, 1997
ISBN: 0-8186-7789-9
TABLE OF CONTENTS
Foreword (PDF)
pp. viii
SESSION I: Flip-Chip I: Moderator: Don Bouldin, University of Tennessee
Richard B. Brown , The University of Michigan, Ann Arbor
Mini Nanua , The University of Michigan, Ann Arbor
Ronald J. Lomax , The University of Michigan, Ann Arbor
pp. 2
P. Dehkordi , Tennessee Univ., Knoxville, TN, USA
K. Ramamurthi , Tennessee Univ., Knoxville, TN, USA
D. Bouldin , Tennessee Univ., Knoxville, TN, USA
H. Davidson , Tennessee Univ., Knoxville, TN, USA
pp. 8
Alan Glaser , North Carolina State University, Raleigh, NC
Srisai Rao , North Carolina State University, Raleigh, NC
Toby Schaffer , North Carolina State University, Raleigh, NC
pp. 13
SESSION II: Mixed Signal MCMs: Moderator: Peter Ivei, University of Sheffield
M.J. Degerstrom , Special Purpose Process. Dev. Group, Mayo Found., Rochester, MN, USA
W.L. Walters , Special Purpose Process. Dev. Group, Mayo Found., Rochester, MN, USA
M.E. Vickberg , Special Purpose Process. Dev. Group, Mayo Found., Rochester, MN, USA
P.J. Riemer , Special Purpose Process. Dev. Group, Mayo Found., Rochester, MN, USA
E.L.H. Amundsen , Special Purpose Process. Dev. Group, Mayo Found., Rochester, MN, USA
B.K. Gilbert , Special Purpose Process. Dev. Group, Mayo Found., Rochester, MN, USA
pp. 20
Yee L. Low , Bell Laboratories, Lucent Technologies
Robert C. Frye , Bell Laboratories, Lucent Technologies
pp. 27
N. Klemmer , Ericsson Res. & Dev., Research Triangle Park, NC, USA
pp. 33
Claus Habiger , Electronics Laboratory, ETH Zuerich
Andreas Thiel , Electronics Laboratory, ETH Zuerich
pp. 38
E.A. Logan , nCHIP Inc., San Jose, CA, USA
D. Tuckerman , nCHIP Inc., San Jose, CA, USA
pp. 44
SESSION III: MCM Design and CAD: Moderator: Wayne Dai, University of California, Santa Cruz
T.C. Chang , Electron. Res. & Service Organ., Ind. Technol. Res. Inst., Hsinchu, Taiwan
R.-W. Chien , Electron. Res. & Service Organ., Ind. Technol. Res. Inst., Hsinchu, Taiwan
E.D. Wang , Electron. Res. & Service Organ., Ind. Technol. Res. Inst., Hsinchu, Taiwan
T. J. Gabara , Electron. Res. & Service Organ., Ind. Technol. Res. Inst., Hsinchu, Taiwan
K.L. Tai , Electron. Res. & Service Organ., Ind. Technol. Res. Inst., Hsinchu, Taiwan
R.C. Frye , Electron. Res. & Service Organ., Ind. Technol. Res. Inst., Hsinchu, Taiwan
pp. 52
E. Shragowitz , Quad Design Technol., Camarillo, CA, USA
H. Chen , Quad Design Technol., Camarillo, CA, USA
pp. 58
A.M. Madni , Intelligent Syst. Technol. Inc., USA
C.C. Madni , Intelligent Syst. Technol. Inc., USA
pp. 63
Y. Jiang , CFD Res. Corp., Huntsville, AL, USA
Z.Q. Tan , CFD Res. Corp., Huntsville, AL, USA
pp. 73
Dongsheng Wang , University of California, Berkeley, CA, USA
pp. 89
SESSION IV:
SESSION V: Interconnect Analysis and Simulation: Moderator: S. Muddhu, Silicon Graphics
Ke Wu , Ecole Polytechnique de Montreal, Montreal, Canada
Wei Hong , University of California, Santa Cruz, CA, USA
Wayne Wei-Ming Dai , University of California, Santa Cruz, CA, USA
pp. 98
Andrew B. Kahng , University of California, Los Angeles, California, USA
Kei Masuko , University of California, Los Angeles, California, USA
Sudhakar Muddu , MIPS Technologies, Silicon Graphics, Inc., California, USA
pp. 102
Wayne Dai , University of California Santa Cruz, California, USA
Jinsong Zhao , University of California Santa Cruz, California, USA
King L. Tai , Lucent Technologies Bell Labs, New Jersey, USA
pp. 108
Michel S. Nakhla , Carleton University, Ottawa, Canada
Anand Veluswami , Mite1 Corp., Kanata, Canada
pp. 114
SESSION VI: Flip-Chip II: Moderator: Peter Ivey, University of Shemeld
Peyman Dehkordi , The University of Tennessee, Tennessee, USA
Donald Bouldin , The University of Tennessee, Tennessee, USA
pp. 120
Xiaowen Liu , Cascade Design Automation, WA, USA
Mark Rossman , Cascade Design Automation, WA, USA
Phiroze Parakh , The University of Michigan, MI, USA
Todd Basso , The University of Michigan, MI, USA
Ray Farbarik , Cascade Design Automation, WA, USA
pp. 125
R. Miracky , Microelectron. & Comput. Technol. Corp., Austin, TX, USA
J. Reed , Microelectron. & Comput. Technol. Corp., Austin, TX, USA
B. Lunceford , Microelectron. & Comput. Technol. Corp., Austin, TX, USA
M. Wang , Microelectron. & Comput. Technol. Corp., Austin, TX, USA
D. Cobb , Microelectron. & Comput. Technol. Corp., Austin, TX, USA
I. Yee , Microelectron. & Comput. Technol. Corp., Austin, TX, USA
pp. 130
J. Peltier , Inf. Sci. Inst., Univ. of Southern California, Marina del Rey, CA, USA
P. Franzon , Inf. Sci. Inst., Univ. of Southern California, Marina del Rey, CA, USA
W. Hansford , Inf. Sci. Inst., Univ. of Southern California, Marina del Rey, CA, USA
J. Schaeffer , Inf. Sci. Inst., Univ. of Southern California, Marina del Rey, CA, USA
pp. 133
SESSION VII: Test, Technology and Infrasitructure: Moderator: Chung Ho, Micromodule Systems
K. Sasidhar , Packaging Research Center Georgia Institute of Technology
A. Chatterjee , Packaging Research Center Georgia Institute of Technology
M. Swaminathan , Packaging Research Center Georgia Institute of Technology
pp. 138
Hubert Werkmann , Institute for Microelectronics Stuttgart
Bernd Hufflinger , Institute for Microelectronics Stuttgart
pp. 150
SESSION VIII: Optical MCMs: Moderator: Paul Kohl, Georgia Tech
R. Rosier , North Carolina Univ., Charlotte, NC, USA
A. Krishnamoorthy , North Carolina Univ., Charlotte, NC, USA
F. Kiamilev , North Carolina Univ., Charlotte, NC, USA
C. Hull , North Carolina Univ., Charlotte, NC, USA
R. Farbarik , North Carolina Univ., Charlotte, NC, USA
R. Oettel , North Carolina Univ., Charlotte, NC, USA
G. Aplin , North Carolina Univ., Charlotte, NC, USA
pp. 163
SESSION IX: Wrap Up Panel: Organizer and Moderator: Steve Leanheart, GTE
Author Index (PDF)
pp. 171
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