loading...
  • M
  • MCMC
  • 1997
  • 1997 IEEE Multi-Chip Module Conference (MCMC '97)
Advanced Search 
1997 IEEE Multi-Chip Module Conference (MCMC '97)
Santa Cruz, CA
February 04-February 05
ISBN: 0-8186-7789-9
Table of Contents
SESSION I: Flip-Chip I: Moderator: Don Bouldin, University of Tennessee
Ronald J. Lomax, The University of Michigan, Ann Arbor
Richard B. Brown, The University of Michigan, Ann Arbor
Mini Nanua, The University of Michigan, Ann Arbor
Timothy D. Strong, The University of Michigan, Ann Arbor
pp. 2
P. Dehkordi, Tennessee Univ., Knoxville, TN, USA
K. Ramamurthi, Tennessee Univ., Knoxville, TN, USA
D. Bouldin, Tennessee Univ., Knoxville, TN, USA
H. Davidson, Tennessee Univ., Knoxville, TN, USA
pp. 8
Toby Schaffer, North Carolina State University, Raleigh, NC
Alan Glaser, North Carolina State University, Raleigh, NC
Srisai Rao, North Carolina State University, Raleigh, NC
Paul Franzon, North Carolina State University, Raleigh, NC
pp. 13
SESSION II: Mixed Signal MCMs: Moderator: Peter Ivei, University of Sheffield
R.L. Thompson, Special Purpose Process. Dev. Group, Mayo Found., Rochester, MN, USA
M.J. Degerstrom, Special Purpose Process. Dev. Group, Mayo Found., Rochester, MN, USA
W.L. Walters, Special Purpose Process. Dev. Group, Mayo Found., Rochester, MN, USA
M.E. Vickberg, Special Purpose Process. Dev. Group, Mayo Found., Rochester, MN, USA
P.J. Riemer, Special Purpose Process. Dev. Group, Mayo Found., Rochester, MN, USA
E.L.H. Amundsen, Special Purpose Process. Dev. Group, Mayo Found., Rochester, MN, USA
B.K. Gilbert, Special Purpose Process. Dev. Group, Mayo Found., Rochester, MN, USA
pp. 20
N. Klemmer, Ericsson Res. & Dev., Research Triangle Park, NC, USA
J. Hartung, Ericsson Res. & Dev., Research Triangle Park, NC, USA
pp. 33
Andreas Thiel, Electronics Laboratory, ETH Zuerich
Claus Habiger, Electronics Laboratory, ETH Zuerich
Gerhard Troester, Electronics Laboratory, ETH Zuerich
pp. 38
C.-M. Lin, nCHIP Inc., San Jose, CA, USA
E.A. Logan, nCHIP Inc., San Jose, CA, USA
D. Tuckerman, nCHIP Inc., San Jose, CA, USA
pp. 44
SESSION III: MCM Design and CAD: Moderator: Wayne Dai, University of California, Santa Cruz
S. J. Yang, Electron. Res. & Service Organ., Ind. Technol. Res. Inst., Hsinchu, Taiwan
T.C. Chang, Electron. Res. & Service Organ., Ind. Technol. Res. Inst., Hsinchu, Taiwan
R.-W. Chien, Electron. Res. & Service Organ., Ind. Technol. Res. Inst., Hsinchu, Taiwan
E.D. Wang, Electron. Res. & Service Organ., Ind. Technol. Res. Inst., Hsinchu, Taiwan
T. J. Gabara, Electron. Res. & Service Organ., Ind. Technol. Res. Inst., Hsinchu, Taiwan
K.L. Tai, Electron. Res. & Service Organ., Ind. Technol. Res. Inst., Hsinchu, Taiwan
R.C. Frye, Electron. Res. & Service Organ., Ind. Technol. Res. Inst., Hsinchu, Taiwan
pp. 52
H. Chen, Quad Design Technol., Camarillo, CA, USA
E. Shragowitz, Quad Design Technol., Camarillo, CA, USA
J. Lee, Quad Design Technol., Camarillo, CA, USA
pp. 58
A. J. Przekwas, CFD Res. Corp., Huntsville, AL, USA
Y. Jiang, CFD Res. Corp., Huntsville, AL, USA
Z.Q. Tan, CFD Res. Corp., Huntsville, AL, USA
pp. 73
Dongsheng Wang, University of California, Berkeley, CA, USA
Ernest S. Kuh, University of California, Berkeley, CA, USA
pp. 89
SESSION IV:
The Best Road to Integration? Single Chip or Multi-Chip?
SESSION V: Interconnect Analysis and Simulation: Moderator: S. Muddhu, Silicon Graphics
Xiaohong Jiang, Ecole Polytechnique de Montreal, Montreal, Canada
Ke Wu, Ecole Polytechnique de Montreal, Montreal, Canada
Wei Hong, University of California, Santa Cruz, CA, USA
Wayne Wei-Ming Dai, University of California, Santa Cruz, CA, USA
pp. 98
Andrew B. Kahng, University of California, Los Angeles, California, USA
Kei Masuko, University of California, Los Angeles, California, USA
Sudhakar Muddu, MIPS Technologies, Silicon Graphics, Inc., California, USA
pp. 102
Jinsong Zhao, University of California Santa Cruz, California, USA
Wayne Dai, University of California Santa Cruz, California, USA
Robert C. Frye, Lucent Technologies Bell Labs, New Jersey, USA
King L. Tai, Lucent Technologies Bell Labs, New Jersey, USA
pp. 108
SESSION VI: Flip-Chip II: Moderator: Peter Ivey, University of Shemeld
Peyman Dehkordi, The University of Tennessee, Tennessee, USA
Chandra Tan, The University of Tennessee, Tennessee, USA
Donald Bouldin, The University of Tennessee, Tennessee, USA
pp. 120
Ray Farbarik, Cascade Design Automation, WA, USA
Xiaowen Liu, Cascade Design Automation, WA, USA
Mark Rossman, Cascade Design Automation, WA, USA
Phiroze Parakh, The University of Michigan, MI, USA
Todd Basso, The University of Michigan, MI, USA
Richard Brown, The University of Michigan, MI, USA
pp. 125
I. Yee, Microelectron. & Comput. Technol. Corp., Austin, TX, USA
R. Miracky, Microelectron. & Comput. Technol. Corp., Austin, TX, USA
J. Reed, Microelectron. & Comput. Technol. Corp., Austin, TX, USA
B. Lunceford, Microelectron. & Comput. Technol. Corp., Austin, TX, USA
M. Wang, Microelectron. & Comput. Technol. Corp., Austin, TX, USA
D. Cobb, Microelectron. & Comput. Technol. Corp., Austin, TX, USA
G. Caldwell, Microelectron. & Comput. Technol. Corp., Austin, TX, USA
pp. 130
W. Hansford, Inf. Sci. Inst., Univ. of Southern California, Marina del Rey, CA, USA
J. Peltier, Inf. Sci. Inst., Univ. of Southern California, Marina del Rey, CA, USA
P. Franzon, Inf. Sci. Inst., Univ. of Southern California, Marina del Rey, CA, USA
S. Lipa, Inf. Sci. Inst., Univ. of Southern California, Marina del Rey, CA, USA
J. Schaeffer, Inf. Sci. Inst., Univ. of Southern California, Marina del Rey, CA, USA
pp. 133
SESSION VII: Test, Technology and Infrasitructure: Moderator: Chung Ho, Micromodule Systems
K. Sasidhar, Packaging Research Center Georgia Institute of Technology
A. Chatterjee, Packaging Research Center Georgia Institute of Technology
M. Swaminathan, Packaging Research Center Georgia Institute of Technology
pp. 138
Hubert Werkmann, Institute for Microelectronics Stuttgart
Bernd Hufflinger, Institute for Microelectronics Stuttgart
pp. 150
SESSION VIII: Optical MCMs: Moderator: Paul Kohl, Georgia Tech
F. Kiamilev, North Carolina Univ., Charlotte, NC, USA
R. Rosier, North Carolina Univ., Charlotte, NC, USA
A. Krishnamoorthy, North Carolina Univ., Charlotte, NC, USA
J. Rieve, North Carolina Univ., Charlotte, NC, USA
C. Hull, North Carolina Univ., Charlotte, NC, USA
R. Farbarik, North Carolina Univ., Charlotte, NC, USA
R. Oettel, North Carolina Univ., Charlotte, NC, USA
G. Aplin, North Carolina Univ., Charlotte, NC, USA
pp. 163
SESSION IX: Wrap Up Panel: Organizer and Moderator: Steve Leanheart, GTE
Usage of this product signifies your acceptance of the Terms of Use.