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Multi-Chip Module Conference, IEEE (1996)
Santa Cruz, CA
Feb. 6, 1996 to Feb. 7, 1996
ISBN: 0-8186-7286-2
TABLE OF CONTENTS
Foreword (PDF)
pp. ix
Keynote Address
W.D. Baker , Wireless Access Inc., USA
pp. 0002
Discussion Session I: Infrastructure Issues
Session II: New MCM Applications
M. Peretti , CSELT, Centro Studi e Laboratori Telecomunicazioni
L. Pilati , CSELT, Centro Studi e Laboratori Telecomunicazioni
J.J. Ichai , IBM Montpellier Technologies
F. Martin , IBM Montpellier Technologies
L. Licciardi , CSELT, Centro Studi e Laboratori Telecomunicazioni
pp. 0010
E.H.M. Heijne , University of Wuppertal
P. Middelkamp , University of Wuppertal
L. Scharfetter , University of Wuppertal
W. Snoeys , University of Wuppertal
pp. 0016
G. Bolotin , Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
pp. 0020
Session III: Flip-Chip MCMs
Flip Chip Overview (Abstract)
P.A. Magill , MCNC, Research Triangle Park, NC, USA
P.A. Deane , MCNC, Research Triangle Park, NC, USA
J.D. Mis , MCNC, Research Triangle Park, NC, USA
G.A. Rinne , MCNC, Research Triangle Park, NC, USA
pp. 0028
Masamoto Tago , NEC Corporation, Production Material Engineering Laboratories
Manabu Bonkohara , NEC Corporation, Production Material Engineering Laboratories
Akihiro Dohya , NEC Corporation, Production Material Engineering Laboratories
Hirofumi Nakamura , NEC Corporation, Production Material Engineering Laboratories
Yoshimasa Katou , NEC Corporation, Production Material Engineering Laboratories
pp. 0034
Elizabeth A. Logan , nCHIP, Inc., 1971 N. Capitol Avenue, San Jose, CA 95132 USA
Julia L. F. Goldstein , nCHIP, Inc., 1971 N. Capitol Avenue, San Jose, CA 95132 USA
pp. 0039
T. D. Yuan , IBM Microelectronics, 1580 route 52, MS 81A , Hopewell Junction, New York 12533
pp. 0044
Session IV: Mixed-Signal MCMs
Ken Sienski , E-Systems, Garland Division, 1200 Jupiter Road, Garland, Texas 75042
Calvin Field , E-Systems, Garland Division, 1200 Jupiter Road, Garland, Texas 75042
Clint Schreiner , E-Systems, Garland Division, 1200 Jupiter Road, Garland, Texas 75042
Mark Chivers , E-Systems, Garland Division, 1200 Jupiter Road, Garland, Texas 75042
pp. 0050
D. Dromgoole , AT&T Bell Labs., Mesquite, TX, USA
A. Lotfi , AT&T Bell Labs., Mesquite, TX, USA
A. Feygenson , AT&T Bell Labs., Mesquite, TX, USA
R. Frye , AT&T Bell Labs., Mesquite, TX, USA
B.J. Han , AT&T Bell Labs., Mesquite, TX, USA
K. Tai , AT&T Bell Labs., Mesquite, TX, USA
pp. 0055
Steven Brebels , IMEC, Kapeldreef 75, 3001 Leuven, Belgium
Eric Beyne , IMEC, Kapeldreef 75, 3001 Leuven, Belgium
pp. 0061
Greg Miller , Harris Semiconductor, Melbourne, Florida
pp. 0067
R. Sachot , Institute for Micro- and Optoelectronics, Swiss Federal Institute of Technology
L. Guerin , Institute for Micro- and Optoelectronics, Swiss Federal Institute of Technology
pp. 0073
Session V: Poster Session
J. Oliver , CNM Institute, University Autonoma of Barcelona, Spain.
H. Kerkhoff , MESA Institute. University of Twente
pp. 0080
Jennifer Peltier , The MIDAS Service, Information Sciences Institute
pp. 0086
Michel Nakhla , Dept. of Electronics, Carleton University, Ottawa, Canada
Q.J. Zhang , Dept. of Electronics, Carleton University, Ottawa, Canada
Juliusz Poltz , OptEM Engineering Inc., Calgary, Canada
pp. 0095
Lohit Sagar Dutta , Laboratorium fuer Informationtechnologie, University of Hannover
Hartmut Grabinski , Laboratorium fuer Informationtechnologie, University of Hannover
Enno Grotelueschen , Laboratorium fuer Informationtechnologie, University of Hannover
pp. 0099
Weikai Sun , Board of Studies in Computer Engineering, University of California, Santa Cruz
Wei Hong , Board of Studies in Computer Engineering, University of California, Santa Cruz
pp. 0105
Jun Dong Cho , Dept. of Electr. Eng., Sung Kyun Kwan Univ., Suwon, South Korea
pp. 0111
Tianxiong Xue , EECS Dept., Univ. of CA at Berkeley
Ernest S. Kuh , EECS Dept., Univ. of CA at Berkeley
Qinjian Yu , Dept. of Electrical Engineering, Nanjing University of Science and Technology
pp. 0117
J.P. Parkerson , High Density Electron. Center, Arkansas Univ., Fayetteville, AR, USA
pp. 0123
R. T. Mitchell , Sandia National Laboratories,
M. R. Tuck , Sandia National Laboratories,
D. R. Adkins , Sandia National Laboratories,
D. A. Benson , Sandia National Laboratories,
pp. 0127
Session VI: Electrical Design
Claudio Truzzi , IMEC, Kapeldreef 75, 3001 Leuven, Belgium
Edwin Ringoot , IMEC, Kapeldreef 75, 3001 Leuven, Belgium
pp. 0132
Yao-Chao Yang , Silicon Graphics Inc., Mountain View, CA
Heinz Blennemann , Silicon Graphics Inc., Mountain View, CA
pp. 0138
Michael D. Glover , High Density Electronics Center (HiDEC) University of Arkansas
Leonard W. Schaper , High Density Electronics Center (HiDEC) University of Arkansas
pp. 0143
Session VII: Design Optimization
Qing Zhu , RN5-09, Microprocessor Technology, Intel Corporation, Santa Clara, CA95052
Wayne W.M. Dai , Computer Engineering Department, University of California, Santa Cruz, CA 95064
pp. 0160
Session VIII: Computer-Aided Design
Joe G. Xi , Computer Engineering Board of Studies, University of California, Santa Cruz
pp. 0166
Session IX: Advances in MCM Technology
B.L. Goodall , Adv. Technol. Group, BFGoodrich, Brecksville, OH, USA
L.H. McIntosh , Adv. Technol. Group, BFGoodrich, Brecksville, OH, USA
S. Jayaraman , Adv. Technol. Group, BFGoodrich, Brecksville, OH, USA
P.A. Kohl , Adv. Technol. Group, BFGoodrich, Brecksville, OH, USA
R.A. Shick , Adv. Technol. Group, BFGoodrich, Brecksville, OH, USA
N.R. Grove , Adv. Technol. Group, BFGoodrich, Brecksville, OH, USA
pp. 0182
Session X: Modeling of Interconnect
Thomas-Michael Winkel , Laboratorium fuer Informationtechnologie, University of Hannover
Lohit Sagar Dutta , Laboratorium fuer Informationtechnologie, University of Hannover
Hartmut Grabinski , Laboratorium fuer Informationtechnologie, University of Hannover
pp. 0190
M. Celik , University of Arizona
A.C. Cangellaris , University of Arizona
A. Deutsch , Thomas J. Watson Research Center
pp. 0196
Andrew B. Kahng , 4651 Boelter Hall, Dept. of CS, UCLA, Los Angeles, CA 90095-1596.
pp. 0202
Author Index (PDF)
pp. 0208
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