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1996 IEEE Multi-Chip Module Conference (MCMC '96)
Santa Cruz, CA
February 06-February 07
ISBN: 0-8186-7286-2
Table of Contents
Keynote Address
Discussion Session I: Infrastructure Issues
Session II: New MCM Applications
L. Licciardi, CSELT, Centro Studi e Laboratori Telecomunicazioni
M. Peretti, CSELT, Centro Studi e Laboratori Telecomunicazioni
L. Pilati, CSELT, Centro Studi e Laboratori Telecomunicazioni
J.J. Ichai, IBM Montpellier Technologies
F. Martin, IBM Montpellier Technologies
P.Y. Urena, IBM Montpellier Technologies
pp. 0010
K.-H. Becks, University of Wuppertal
E.H.M. Heijne, University of Wuppertal
P. Middelkamp, University of Wuppertal
L. Scharfetter, University of Wuppertal
W. Snoeys, University of Wuppertal
pp. 0016
G. Bolotin, Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
pp. 0020
Session III: Flip-Chip MCMs
Flip Chip Overview (Abstract)
P.A. Magill, MCNC, Research Triangle Park, NC, USA
P.A. Deane, MCNC, Research Triangle Park, NC, USA
J.D. Mis, MCNC, Research Triangle Park, NC, USA
G.A. Rinne, MCNC, Research Triangle Park, NC, USA
pp. 0028
Hirofumi Nakamura, NEC Corporation, Production Material Engineering Laboratories
Masamoto Tago, NEC Corporation, Production Material Engineering Laboratories
Manabu Bonkohara, NEC Corporation, Production Material Engineering Laboratories
Akihiro Dohya, NEC Corporation, Production Material Engineering Laboratories
Ikushi Morisaki, NEC Corporation, Production Material Engineering Laboratories
Yoshimasa Katou, NEC Corporation, Production Material Engineering Laboratories
pp. 0034
Julia L. F. Goldstein, nCHIP, Inc., 1971 N. Capitol Avenue, San Jose, CA 95132 USA
Elizabeth A. Logan, nCHIP, Inc., 1971 N. Capitol Avenue, San Jose, CA 95132 USA
Belinda S. Fernandez, nCHIP, Inc., 1971 N. Capitol Avenue, San Jose, CA 95132 USA
pp. 0039
Session IV: Mixed-Signal MCMs
Ken Sienski, E-Systems, Garland Division, 1200 Jupiter Road, Garland, Texas 75042
Calvin Field, E-Systems, Garland Division, 1200 Jupiter Road, Garland, Texas 75042
Clint Schreiner, E-Systems, Garland Division, 1200 Jupiter Road, Garland, Texas 75042
Mark Chivers, E-Systems, Garland Division, 1200 Jupiter Road, Garland, Texas 75042
pp. 0050
D. Dromgoole, AT&T Bell Labs., Mesquite, TX, USA
A. Lotfi, AT&T Bell Labs., Mesquite, TX, USA
A. Feygenson, AT&T Bell Labs., Mesquite, TX, USA
R. Frye, AT&T Bell Labs., Mesquite, TX, USA
B.J. Han, AT&T Bell Labs., Mesquite, TX, USA
K. Tai, AT&T Bell Labs., Mesquite, TX, USA
pp. 0055
Philip Pieters, IMEC, Kapeldreef 75, 3001 Leuven, Belgium
Steven Brebels, IMEC, Kapeldreef 75, 3001 Leuven, Belgium
Eric Beyne, IMEC, Kapeldreef 75, 3001 Leuven, Belgium
pp. 0061
L. Guerin, Institute for Micro- and Optoelectronics, Swiss Federal Institute of Technology
R. Sachot, Institute for Micro- and Optoelectronics, Swiss Federal Institute of Technology
M. Dutoit, Institute for Micro- and Optoelectronics, Swiss Federal Institute of Technology
pp. 0073
Session V: Poster Session
J. Oliver, CNM Institute, University Autonoma of Barcelona, Spain.
H. Kerkhoff, MESA Institute. University of Twente
pp. 0080
Jennifer Peltier, The MIDAS Service, Information Sciences Institute
Wes Hansford, The MIDAS Service, Information Sciences Institute
pp. 0086
Roni Khazaka, Dept. of Electronics, Carleton University, Ottawa, Canada
Michel Nakhla, Dept. of Electronics, Carleton University, Ottawa, Canada
Q.J. Zhang, Dept. of Electronics, Carleton University, Ottawa, Canada
Juliusz Poltz, OptEM Engineering Inc., Calgary, Canada
pp. 0095
Thomas-Michael Winkel, Laboratorium fuer Informationtechnologie, University of Hannover
Lohit Sagar Dutta, Laboratorium fuer Informationtechnologie, University of Hannover
Hartmut Grabinski, Laboratorium fuer Informationtechnologie, University of Hannover
Enno Grotelueschen, Laboratorium fuer Informationtechnologie, University of Hannover
pp. 0099
Wei Hong, Board of Studies in Computer Engineering, University of California, Santa Cruz
Weikai Sun, Board of Studies in Computer Engineering, University of California, Santa Cruz
Wayne Wei-Ming Dai, Board of Studies in Computer Engineering, University of California, Santa Cruz
pp. 0105
Jun Dong Cho, Dept. of Electr. Eng., Sung Kyun Kwan Univ., Suwon, South Korea
pp. 0111
Tianxiong Xue, EECS Dept., Univ. of CA at Berkeley
Ernest S. Kuh, EECS Dept., Univ. of CA at Berkeley
Qinjian Yu, Dept. of Electrical Engineering, Nanjing University of Science and Technology
pp. 0117
J.P. Parkerson, High Density Electron. Center, Arkansas Univ., Fayetteville, AR, USA
L.W. Schaper, High Density Electron. Center, Arkansas Univ., Fayetteville, AR, USA
pp. 0123
D. A. Benson, Sandia National Laboratories,
R. T. Mitchell, Sandia National Laboratories,
M. R. Tuck, Sandia National Laboratories,
D. R. Adkins, Sandia National Laboratories,
D. W. Palmer, Sandia National Laboratories,
pp. 0127
Session VI: Electrical Design
Claudio Truzzi, IMEC, Kapeldreef 75, 3001 Leuven, Belgium
Eric Beyne, IMEC, Kapeldreef 75, 3001 Leuven, Belgium
Edwin Ringoot, IMEC, Kapeldreef 75, 3001 Leuven, Belgium
pp. 0132
Heinz Blennemann, Silicon Graphics Inc., Mountain View, CA
Yao-Chao Yang, Silicon Graphics Inc., Mountain View, CA
Ron Nikel, Silicon Graphics Inc., Mountain View, CA
pp. 0138
Michael D. Glover, High Density Electronics Center (HiDEC) University of Arkansas
Leonard W. Schaper, High Density Electronics Center (HiDEC) University of Arkansas
pp. 0143
Session VII: Design Optimization
Qing Zhu, RN5-09, Microprocessor Technology, Intel Corporation, Santa Clara, CA95052
Wayne W.M. Dai, Computer Engineering Department, University of California, Santa Cruz, CA 95064
pp. 0160
Session VIII: Computer-Aided Design
Joe G. Xi, Computer Engineering Board of Studies, University of California, Santa Cruz
Wayne W.M. Dai, Computer Engineering Board of Studies, University of California, Santa Cruz
pp. 0166
Session IX: Advances in MCM Technology
R.A. Shick, Adv. Technol. Group, BFGoodrich, Brecksville, OH, USA
B.L. Goodall, Adv. Technol. Group, BFGoodrich, Brecksville, OH, USA
L.H. McIntosh, Adv. Technol. Group, BFGoodrich, Brecksville, OH, USA
S. Jayaraman, Adv. Technol. Group, BFGoodrich, Brecksville, OH, USA
P.A. Kohl, Adv. Technol. Group, BFGoodrich, Brecksville, OH, USA
S.A. Bidstrup-Allen, Adv. Technol. Group, BFGoodrich, Brecksville, OH, USA
N.R. Grove, Adv. Technol. Group, BFGoodrich, Brecksville, OH, USA
pp. 0182
Session X: Modeling of Interconnect
Thomas-Michael Winkel, Laboratorium fuer Informationtechnologie, University of Hannover
Lohit Sagar Dutta, Laboratorium fuer Informationtechnologie, University of Hannover
Hartmut Grabinski, Laboratorium fuer Informationtechnologie, University of Hannover
pp. 0190
Andrew B. Kahng, 4651 Boelter Hall, Dept. of CS, UCLA, Los Angeles, CA 90095-1596.
Sudhakar Muddu, 4651 Boelter Hall, Dept. of CS, UCLA, Los Angeles, CA 90095-1596.
pp. 0202
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