ISBN: 0-7695-2182-7

Russell Klein, Mentor Graphics

James Paris, Mentor Graphics Corp.

Vishy Lakshmanan, LSI Logic Corporation

Krzysztof (Kris) Iniewski, University of Alberta

Shahriar Mirabbasi, University of British Columbia

Ashraf Salem, Mentor Graphics

Carey Robertson, Mentor Graphics Corp.

Brian Marshall, Mentor Graphics Corp.

Shi Minghua, Hong Kong University of Science and Technology

Amine Bermak, Hong Kong University of Science and Technology

Sofiane Brahim-Belhouari, Hong Kong University of Science and Technology

Yat-Fong Yung, Hong Kong University of Science and Technology

Amine Bermak, Hong Kong University of Science and Technology

Alexandre Chureau, ?cole Polytechnique de Montr?al, Canada

Yvon Savaria, ?cole Polytechnique de Montr?al, Canada

El Mostapha Aboulhamid, Universit? de Montr?al, Canada

Luc Charest, Universit? de Montr?al

El Mostapha Aboulhamid, Universit? de Montr?al

Guy Bois, ?cole Polytechnique de Montr?al

L-P. Lafrance, ?cole Polytechnique de Montr?al

Y. Savaria, ?cole Polytechnique de Montr?al

Samy Meftali, LIFL

Jean-Luc Dekeyser, LIFL

W. Zhang, University of Calgary, Canada

G. A. Jullien, University of Calgary, Canada

V. S. Dimitrov, University of Calgary, Canada

Kuo-Hsing Cheng, National Central University, Taiwan

Shun-Wen Cheng, tku, Taiwan

Chan-Wei Huang, National Central University, Taiwan

Attif A. Ibrahem, ERI, Cairo, Egypt

Hamed A. Elsimary, ERI, Cairo, Egypt

Aly E. Salama, Cairo University, Cairo, Egypt

Yonghong Yang, University of Western Ontario, Canada

Z. Abid, University of Western Ontario, Canada

Wei Wang, University of Western Ontario, Canada

Wei Wang, The University of Western Ontario, London, Canada

M. N. S. Swamy, Concordia University, Montreal, Canada

M. O. Ahmad, Concordia University, Montreal, Canada

Bijan Alizadeh, University of Tehran, Iran

Zainalabedin Navabi, University of Tehran, Iran

S?bastien Regimbal, ?cole Polytechnique de Montr?al, Canada

Yvon Savaria, ?cole Polytechnique de Montr?al, Canada

Guy Bois, ?cole Polytechnique de Montr?al, Canada

N. Gorse, Universit? de Montr?al

E. M. Aboulhamid, Universit? de Montr?al

Y. Savaria, Ecole Polytechnique de Montr?al

Shizhong Mei, Northwestern Univeristy, Evanston, IL

Jamil Kawa, Synopsys, Inc., Mountain View, CA

Charles Chiang, Synopsys, Inc., Mountain View, CA

Yehea I. Ismail, Northwestern Univeristy, Evanston, IL

R. Rashidzadeh, University of Windsor, Ontario, Canada

M. Ahmadi, University of Windsor, Ontario, Canada

W. C. Miller, University of Windsor, Ontario, Canada

D. Morin, ?cole Polytechnique de Montr?al, Canada

F. Normandin, ?cole Polytechnique de Montr?al, Canada

M.-E. Grandmaison, ?cole Polytechnique de Montr?al, Canada

H. Dang, ?cole Polytechnique de Montr?al, Canada

Y. Savaria, ?cole Polytechnique de Montr?al, Canada

M. Sawan, ?cole Polytechnique de Montr?al, Canada

Hung Tien Bui, ?cole Polytechnique de Montr?al

Yvon Savaria, ?cole Polytechnique de Montr?al

R. Chebli, ?cole Polytechnique de Montr?al

M. Sawan, ?cole Polytechnique de Montr?al

Masud H. Chowdhury, Northwestern University, Evanston, IL

Yehea I. Ismail, Northwestern University, Evanston, IL

Donghoon Han, Georgia Institute of Technology, Atlanta

Abhijit Chatterjee, Georgia Institute of Technology, Atlanta

S. M. Rezaul Hasan, University of Sharjah, United Arab Emirates

Y. Ibrahim, University of Windsor, Canada

G. A. Jullien, University of Windsor, Canada

W. C. Miller, University of Windsor, Canada

Tamer S. Mohamed, University of Calgary, Canada

Wael Badawy, University of Calgary, Canada

Deng Lei, Dept. of Computer Science and Engineering Harbin Institute of Technology, China

Gao Wen, Chinese Academy of Science, Beijing, China

Hu Ming Zeng, Dept. of Computer Science and Engineering Harbin Institute of Technology, China

Ji Zhen Zhou, Dept. of Computer Science and Engineering Harbin Institute of Technology, China

Mohammed Sayed, University of Calgary, Canada

Wael Badawy, University of Calgary, Canada

Liu Ling-zhi, Shanghai Jiao Tong University

Qiu Lin, Shanghai Jiao Tong University

Rong Meng-tian, Shanghai Jiao Tong University

Jiang Li, Shanghai Jiao Tong University

Victor H. S. Ha, Samsung Electronics Co., Ltd., Korea

Sung-Kyu Choi, Samsung Electronics Co., Ltd., Korea

Jong-Gu Jeon, Samsung Electronics Co., Ltd., Korea

Geon-Hyoung Lee, Samsung Electronics Co., Ltd., Korea

Won-Kap Jang, Samsung Electronics Co., Ltd., Korea

Woo-Sung Shim, Samsung Electronics Co., Ltd., Korea

Hongkyu Kim, Georgia Institute of Technology

D. Scott Wills, Georgia Institute of Technology

Linda M. Wills, Georgia Institute of Technology

Yung-Chi Chang, National Taiwan University, Taipei

Chih-Wei Hsu, National Taiwan University, Taipei

Liang-Gee Chen, National Taiwan University, Taipei

Sherif G. Aly, General Dynamics, Cairo, Egypt

Ashraf M. Salem, Mentor Graphics Egypt, Cairo, Egypt

Jean Pierre David, Universit? de Montr?al

?tienne Bergeron, Universit? de Montr?al

M. W. El-Kharashi, Ain Shams University

M. H. El-Malaki, Mentor Graphics Egypt

S. Hammad, Mentor Graphics Egypt

A. Salem, Mentor Graphics Egypt

A. Wahdan, Ain Shams University

Ashwin K. Kumaraswamy, University of Edinburgh, UK

Ahmet T. Erdogan, University of Edinburgh, UK

Indrajit Atluri, University of Edinburgh, UK

Jan Lundgren, Mid Sweden University, Sweden

Trond Ytterdal, Norwegian Univ. of Science and Tech., Trondheim, Norway

Kristian Vonbun, Norwegian Univ. of Science and Tech., Trondheim, Norway

Mattias O'Nils, Mid Sweden University, Sweden

Milan Pastrnak, LogicaCMG Nederland B.V., Eindhoven, The Netherlands; University of Technology Eindhoven, Eindhoven, The Netherlands

Peter Poplavko, University of Technology Eindhoven, Eindhoven, The Netherlands

Peter N. H. de With, LogicaCMG Nederland B.V., Eindhoven, The Netherlands; University of Technology Eindhoven, Eindhoven, The Netherlands

Dirk S. Farin, University of Technology Eindhoven, Eindhoven, The Netherlands

K. Iniewski, University of Alberta, Canada

V. Axelrad, Sequoia Design Systems, Woodside, CA

A. Shibkov, Sequoia Design Systems, Woodside, CA

A. Balasinski, Cypress Semiconductor, San Jose, CA

M. Syrzycki, Simon Fraser University, Canada

Mikael Olausson, Linkopings universitet, Sweden

Anders Edman, Linkopings universitet, Sweden

Dake Liu, Linkopings universitet, Sweden

Keh-Jeng Chang, National Tsing Hua University, Hsin-Chu, Taiwan

K. Ola Andersson, Link?ping University, Sweden

Mark Vesterbacka, Link?ping University, Sweden

Erik S?ll, Link?ping University, Sweden

Mark Vesterbacka, Link?ping University, Sweden

Iman Y. Taha, University of Windsor

M. Ahmadi, University of Windsor

W. C. Miller, University of Windsor

Sherif Hammouda, Mentor Graphics Egypt, Cairo, Egypt; University of Calgary, Alberta

Mohamed Dessouky, Ain Shams University, Cairo, Egypt

Mohamed Tawfik, Mentor Graphics Egypt, Cairo, Egypt

Wael Badawy, University of Calgary, Alberta

Mountassar Maamoun, Blida University, Algeria

Boualem Laichi, USTHB, Algiers, Algeria

Abdelhalim Benbelkacem, LSIC Laboratory, Algiers, Algeria

Daoud Berkani, Signal & Communications Laboratory, Algiers, Algeria

K. Iniewski, University of Alberta, Canada

R. Badalone, Diablo Technologies, Canada

M. Lapointe, Diablo Technologies, Canada

M. Syrzycki, Simon Fraser University, Canada

Partha Pratim Pande, University of British Columbia, Canada

Cristian Grecu, University of British Columbia, Canada

Michael Jones, University of British Columbia, Canada

Andr? Ivanov, University of British Columbia, Canada

Res Saleh, University of British Columbia, Canada

Tina Lindkvist, Link?pings Universitet, Sweden

Jacob L?fvenberg, Link?pings Universitet, Sweden

Henrik Ohlsson, Link?pings Universitet, Sweden

Kenny Johansson, Link?pings Universitet, Sweden

Lars Wanhammar, Link?pings Universitet, Sweden

Neal K. Bambha, University of Maryland

Shuvra S. Bhattacharyya, University of Maryland

Daniel Wiklund, Link?ping University, Sweden

Sumant Sathe, Link?ping University, Sweden

Dake Liu, Link?ping University, Sweden

Jacob L?fvenberg, Link?pings Universitet, Sweden

J. L. Silva, Centro Universit?rio Eur?pides de Mar?ilia - UNIVEM, Brazil

K. A. P. Costa, Universidade do Sagrado Cora??o, Brazil

Azeddien M. Sllame, Al-Fateh University, Tripoli, Libya

Xizhi Li, The CKC honored School of Zhejiang University, P.R. China

Tiecai Li, Harbin Institute of Technology

S. A. Rahim, University of Calgary

L. E. Turner, University of Calgary

Pascal Nsame, Department of EE Ecole Polytechnique, Montreal, QC, Canada

Yvon Savaria, Department of EE Ecole Polytechnique, Montreal, QC, Canada

Holly Pekau, University of Calgary

Joshua K. Nakaska, University of Calgary

Jim Kulyk, University of Calgary

Grant McGibney, University of Calgary

James W. Haslett, University of Calgary

K. Iniewski, University of Alberta, Canada

M. Syrzycki, Simon Fraser University, Canada

S. Magierowski, University of Calgary, Canada

Richard Hobson, Cogent ChipWare Inc. and Simon Fraser University

Allan Dyck, Cogent ChipWare Inc. and Simon Fraser University

Keith Cheung, Cogent ChipWare Inc. and Simon Fraser University