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2012 IEEE International Test Conference (ITC 2012 ) (2012)
Anaheim, CA
Nov. 5, 2012 to Nov. 8, 2012
ISBN: 978-1-4673-1594-4
TABLE OF CONTENTS
Papers
Awards (Abstract)
pp. 4
[Copyright notice] (Abstract)
pp. ii
Welcome message (Abstract)
pp. 1
[Front cover] (Abstract)
pp. 1
Keynote address (Abstract)
pp. 8-10
J. Rajski , Mentor Graphics Corporation Wilsonville, OR 97070, USA
pp. 1-9
[Title page] (Abstract)
pp. 1
pp. 5
pp. 13-18
Table of contents (Abstract)
pp. iii-xiii
pp. 7
Steering committee (Abstract)
pp. 2-3
Toshiyuki Okayasu , Advantest Corporation, Meiwa-machi, Ora-gun, Gunma, 370-0718, Japan
pp. 1-10
Ming Gao , Electr. & Comput. Eng. Dept., Univ. of California, Santa Barbara, Santa Barbara, CA, USA
P. Lisherness , Electr. & Comput. Eng. Dept., Univ. of California, Santa Barbara, Santa Barbara, CA, USA
Kwang-Ting Cheng , Electr. & Comput. Eng. Dept., Univ. of California, Santa Barbara, Santa Barbara, CA, USA
pp. 1-7
Papers
J. Tyszer , Poznań University of Technology, 60-965 Poznań, Poland
pp. 1-10
J. Rajski , Mentor Graphics, Wilsonville, Oregon, USA
pp. 1-9
Krishnendu Chakrabarty , Electrical & Computer Engineering, Duke University, Durham, NC 27708, USA
pp. 1-10
Mani Soma , University of Washington, Seattle, USA
pp. 1-10
Kwang-Ting (Tim) Cheng , Electrical and Computer Engineering Department, University of California, Santa Barbara, California 93106, U. S. A.
pp. 1-7
Nicola Nicolici , Department of Electrical and Computer Engineering, McMaster University, Hamilton, ON, L8S 4K1, Canada
pp. 1-10
Daisuke Watanabe , ADVANTEST Corporation, 336-1, Ohwa, Meiwa-machi, Ora-gun, Gunma 370-0718, Japan
pp. 1-9
Hosun Yoo , Samsung Electronics Corp., Suwon, Korea
pp. 1-11
Yiorgos Makris , Department of Electrical Engineering, The University of Texas at Dallas, Richardson, TX 75080
pp. 1-8
Magdy S. Abadir , Freescale Semiconductor, Inc
pp. 1-10
L.-T. Wang , SynTest Technologies, Inc., Sunnyvale, CA 94086, USA
pp. 1-10
Michiko Inoue , Nara Institute of Science and Technology, Ikoma, Japan
pp. 1-8
Bernd Becker , Albert-Ludwigs-University Freiburg Georges-K¨ohler-Allee 051 79110 Freiburg, Germany
pp. 1-8
Hajime Sugimura , Advantest Corporation, Meiwa-machi, Ora-gun, Gunma, 370-0718, Japan
pp. 1-10
Abhijit Chatterjee , School of Electrical and Computer Engineering, Georgia Institute of Technology
pp. 1-10
Kunihiro Asada , VLSI Design and Education Center, the University of Tokyo, Tokyo, 113-0032, Japan
pp. 1-10
Roman Lysecky , Department of Electrical and Computer Engineering, University of Arizona, Tucson, AZ
pp. 1-10
Hans-Joachim Wunderlich , ITI, University of Stuttgart, Pfaffenwaldring 47, D-70569, Stuttgart, Germany
pp. 1-9
Michael S. Hsiao , Bradley Department of Electrical and Computer Engineering, Virginia Tech, Blacksburg, VA 24061, USA
pp. 1-8
Nur A. Touba , Computer Engineering Research Center, Department of Electrical and Computer Engineering, University of Texas, Austin, TX 78712
pp. 1-7
J. E. Colburn , NVIDIA Corp.
pp. 1-10
Michel Renovell , LIRMM - CNRS/Univ. Montpellier 2, 161 rue Ada, 34392 Montpellier, France
pp. 1-9
Degang Chen , Iowa State University, Ames, IA, USA
pp. 1-10
Timm Ostermann , Institute for Integrated Circuits, Johannes Kepler University, Linz, Austria
pp. 1-7
Nandita A. Mitra , IBM System and Technology Group, Hopewell Junction, NY
pp. 1-7
Brady Benware , Mentor Graphics, 8005 SW Boeckman RD, Wilsonville, OR 97070, USA
pp. 1-10
Stephen Sunter , Silicon Test Solutions, Mentor Graphics
pp. 1-10
Sung Kyu Lim , Georgia Institute of Technology, Dept. Electrical and Computer Engineering, Atlanta, GA 30332, USA
pp. 1-8
Kenneth P. Parker , Agilent Technologies Inc. Loveland, Colorado, USA
pp. 1-6
Thomas Wenzel , Goepel Electronic GmbH, Jena, Germany
pp. 1-10
Skip Meyers , Hewlett Packard Co, 800 Foothills Blvd, Roseville, CA 95747, USA
pp. 1-10
Michele Portolan , Bell Labs France, Nozay, France
pp. 1-6
Min-Jer Wang , Test Program Development Department, Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, Taiwan 30077, ROC
pp. 1-9
Ching-Te Chuang , Department of Electronics Engineering & Institute of Electronics, National Chiao Tung University, Hsinchu, Taiwan
pp. 1-10
N. Badereddine , Intel Mobile Communications, Sophia Antipolis, France
pp. 1-10
Cheng-Wen Wu , Department of Electrical Engineering, National Central University, Taoyuan, Taiwan 320
pp. 1-9
R. D. (Shawn) Blanton , Department of Electrical and Computer Engineering, Carnegie Mellon University, Pittsburgh, PA 15213
pp. 1-10
Kotaro Shimamura , Hitachi Ltd., Hitachi Research Laboratory, Ibaraki, Japan
pp. 1-10
Sandeep K. Gupta , Ming Hsieh Department of Electrical Engineering, University of Southern California, Los Angeles, CA USA
pp. 1-10
Zainalabedin Navabi , School of Electrical and Computer Engineering College of Engineering, University of Tehran, Iran
pp. 1-9
Bill Eklow , Cisco Systems Inc., San Jose, CA 95134
pp. 1-10
Christophe Kelma , NXP Semiconductors, 2 esplanade Anton Philips, Campus Effiscience, Colombelles BP20000, 14906 Caen, France
pp. 1-8
Cedric Mayor , Presto Engineering - Grenoble - France
pp. 1-8
Xavier Jorda , Centro Nacional de Microelectrónica, Bellaterra, Spain
pp. 1-8
Shuichi Inage , ADVANTEST Corporation 336-1, Ohwa, Meiwa-machi, Ora-gun, Gunma 370-0718 Japan
pp. 1-7
Jinlei Liu , Advantest America Inc. Cupertino, CA, USA
pp. 1-9
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