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2012 IEEE International Test Conference
Anaheim, CA, USA USA
November 05-November 08
ISBN: 978-1-4673-1594-4
Table of Contents
Papers
J. Solecki, Poznań University of Technology 60-965 Poznań, Poland
J. Tyszer, Poznań University of Technology 60-965 Poznań, Poland
G. Mrugalski, Mentor Graphics Corporation Wilsonville, OR 97070, USA
N. Mukherjee, Mentor Graphics Corporation Wilsonville, OR 97070, USA
J. Rajski, Mentor Graphics Corporation Wilsonville, OR 97070, USA
pp. 1-9
Masahiro Ishida, Advantest Corporation, Meiwa-machi, Ora-gun, Gunma, 370-0718, Japan
Kiyotaka Ichiyama, Advantest Corporation, Meiwa-machi, Ora-gun, Gunma, 370-0718, Japan
Daisuke Watanabe, Advantest Corporation, Meiwa-machi, Ora-gun, Gunma, 370-0718, Japan
Masayuki Kawabata, Advantest Corporation, Meiwa-machi, Ora-gun, Gunma, 370-0718, Japan
Toshiyuki Okayasu, Advantest Corporation, Meiwa-machi, Ora-gun, Gunma, 370-0718, Japan
pp. 1-10
Nathan Kupp, Department of Electrical Engineering, Yale University, New Haven, CT 06511
Yiorgos Makris, Department of Electrical Engineering, The University of Texas at Dallas, Richardson, TX 75080
pp. 1-10
D. Czysz, Mentor Graphics Corporation Wilsonville, OR 97070, USA
J. Rajski, Mentor Graphics Corporation Wilsonville, OR 97070, USA
J. Tyszer, Poznań University of Technology, 60-965 Poznań, Poland
pp. 1-10
F. Hapke, Mentor Graphics Hamburg Germany
M. Reese, AMD, Inc., Austin, Texas, USA
J. Rivers, AMD, Inc., Austin, Texas, USA
A. Over, AMD, Inc., Austin, Texas, USA
V. Ravikumar, AMD, Pte Ltd. Singapore Singapore
W. Redemund, Mentor Graphics Hamburg Germany
A. Glowatz, Mentor Graphics Hamburg Germany
J. Schloeffel, Mentor Graphics Hamburg Germany
J. Rajski, Mentor Graphics, Wilsonville, Oregon, USA
pp. 1-9
Mukesh Agrawal, Electrical & Computer Engineering, Duke University, Durham, NC 27708, USA
Michael Richter, Intel Mobile Communications, Am Campeon 10-12, 85579, Neubiberg, Germany
Krishnendu Chakrabarty, Electrical & Computer Engineering, Duke University, Durham, NC 27708, USA
pp. 1-10
Weichi Ding, Altera Corporation, San Jose, CA, USA
Mingde Pan, Altera Corporation, San Jose, CA, USA
Wilson Wong, Altera Corporation, San Jose, CA, USA
Daniel Chow, Altera Corporation, San Jose, CA, USA
Mike Peng Li, Altera Corporation, San Jose, CA, USA
Sergey Shumarayev, Altera Corporation, San Jose, CA, USA
pp. 1-7
Allan Ecker, University of Washington, Seattle, USA
Ken Blakkan, University of Washington, Seattle, USA
Mani Soma, University of Washington, Seattle, USA
pp. 1-10
Xian Wang, Georgia Institute of Technology
Hyun Woo Choi, SAMSUNG Group
Thomas Moon, Georgia Institute of Technology
Nicholas Tzou, Georgia Institute of Technology
Abhijit Chatterjee, Georgia Institute of Technology
pp. 1-10
Ming Gao, Electrical and Computer Engineering Department, University of California, Santa Barbara, California 93106, U. S. A.
Peter Lisherness, Electrical and Computer Engineering Department, University of California, Santa Barbara, California 93106, U. S. A.
Kwang-Ting (Tim) Cheng, Electrical and Computer Engineering Department, University of California, Santa Barbara, California 93106, U. S. A.
pp. 1-7
Adam B. Kinsman, Department of Electrical and Computer Engineering, McMaster University, Hamilton, ON, L8S 4K1, Canada
Ho Fai Ko, Department of Electrical and Computer Engineering, McMaster University, Hamilton, ON, L8S 4K1, Canada
Nicola Nicolici, Department of Electrical and Computer Engineering, McMaster University, Hamilton, ON, L8S 4K1, Canada
pp. 1-10
Shoji Kojima, ADVANTEST Corporation, 336-1, Ohwa, Meiwa-machi, Ora-gun, Gunma 370-0718, Japan
Yasuyuki Arai, ADVANTEST Corporation, 336-1, Ohwa, Meiwa-machi, Ora-gun, Gunma 370-0718, Japan
Tasuku Fujibe, ADVANTEST Corporation, 336-1, Ohwa, Meiwa-machi, Ora-gun, Gunma 370-0718, Japan
Tsuyoshi Ataka, ADVANTEST Corporation, 336-1, Ohwa, Meiwa-machi, Ora-gun, Gunma 370-0718, Japan
Atsushi Ono, ADVANTEST Corporation, 336-1, Ohwa, Meiwa-machi, Ora-gun, Gunma 370-0718, Japan
Ken-ichi Sawada, ADVANTEST Corporation, 336-1, Ohwa, Meiwa-machi, Ora-gun, Gunma 370-0718, Japan
Daisuke Watanabe, ADVANTEST Corporation, 336-1, Ohwa, Meiwa-machi, Ora-gun, Gunma 370-0718, Japan
pp. 1-9
David C. Keezer, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia, USA
Te-Hui Chen, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia, USA
Carl E. Gray, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia, USA
Hyun Woo Choi, Samsung Electronics Corp., Suwon, Korea
Sungyeol Kim, Samsung Electronics Corp., Suwon, Korea
Seongkwan Lee, Samsung Electronics Corp., Suwon, Korea
Hosun Yoo, Samsung Electronics Corp., Suwon, Korea
pp. 1-11
Nathan Kupp, Department of Electrical Engineering, Yale University, New Haven, CT 06511
Ke Huang, Department of Electrical Engineering, The University of Texas at Dallas, Richardson, TX 75080
John Carulli, Texas Instruments Inc., 12500 TI Boulevard, MS 8741, Dallas, TX 75243
Yiorgos Makris, Department of Electrical Engineering, The University of Texas at Dallas, Richardson, TX 75080
pp. 1-8
B. Seshadri, Nvidia, Santa Clara, CA, USA
P. Gupta, Nvidia, Santa Clara, CA, USA
Y. T. Lin, Nvidia, Santa Clara, CA, USA
B. Cory, Nvidia, Santa Clara, CA, USA
pp. 1-7
Nik Sumikawa, University of California, Santa Barbara
Jeff Tikkanen, University of California, Santa Barbara
Li-C. Wang, University of California, Santa Barbara
LeRoy Winemberg, Freescale Semiconductor, Inc
Magdy S. Abadir, Freescale Semiconductor, Inc
pp. 1-10
X. Wen, Kyushu Institute of Technology, Iizuka, Fukuoka 820-8502, Japan
Y. Nishida, Kyushu Institute of Technology, Iizuka, Fukuoka 820-8502, Japan
K. Miyase, Kyushu Institute of Technology, Iizuka, Fukuoka 820-8502, Japan
S. Kajihara, Kyushu Institute of Technology, Iizuka, Fukuoka 820-8502, Japan
P. Girard, LIRMM, 161 rue Ada, 34095 Montpellier, France
M. Tehranipoor, University of Connecticut, Storrs, CT 06296, USA
L.-T. Wang, SynTest Technologies, Inc., Sunnyvale, CA 94086, USA
pp. 1-10
Yuta Yamato, Nara Institute of Science and Technology, Ikoma, Japan
Tomokazu Yoneda, Nara Institute of Science and Technology, Ikoma, Japan
Kazumi Hatayama, Nara Institute of Science and Technology, Ikoma, Japan
Michiko Inoue, Nara Institute of Science and Technology, Ikoma, Japan
pp. 1-8
Matthias Sauer, Albert-Ludwigs-University Freiburg Georges-K¨ohler-Allee 051 79110 Freiburg, Germany
Stefan Kupferschmid, Albert-Ludwigs-University Freiburg Georges-K¨ohler-Allee 051 79110 Freiburg, Germany
Alexander Czutro, Albert-Ludwigs-University Freiburg Georges-K¨ohler-Allee 051 79110 Freiburg, Germany
Ilia Polian, University of Passau, Innstraße 43, 94032 Passau, Germany
Sudhakar Reddy, University of Iowa, 5324 Seamans Center, Iowa City, United States
Bernd Becker, Albert-Ludwigs-University Freiburg Georges-K¨ohler-Allee 051 79110 Freiburg, Germany
pp. 1-8
Takahiro Nakajima, Advantest Corporation, Meiwa-machi, Ora-gun, Gunma, 370-0718, Japan
Takeshi Yaguchi, Advantest Corporation, Meiwa-machi, Ora-gun, Gunma, 370-0718, Japan
Hajime Sugimura, Advantest Corporation, Meiwa-machi, Ora-gun, Gunma, 370-0718, Japan
pp. 1-10
Nicholas Tzou, School of Electrical and Computer Engineering, Georgia Institute of Technology
Debesh Bhatta, School of Electrical and Computer Engineering, Georgia Institute of Technology
Sen-Wen Hsiao, School of Electrical and Computer Engineering, Georgia Institute of Technology
Hyun Woo Choi, School of Electrical and Computer Engineering, Georgia Institute of Technology
Abhijit Chatterjee, School of Electrical and Computer Engineering, Georgia Institute of Technology
pp. 1-10
Masahiro Ishida, Advantest Corporation, Meiwa-machi, Gunma, 370-0718, Japan
Toru Nakura, VLSI Design and Education Center, the University of Tokyo, Tokyo, 113-0032, Japan
Toshiyuki Kikkawa, VLSI Design and Education Center, the University of Tokyo, Tokyo, 113-0032, Japan
Takashi Kusaka, Advantest Corporation, Meiwa-machi, Gunma, 370-0718, Japan
Satoshi Komatsu, VLSI Design and Education Center, the University of Tokyo, Tokyo, 113-0032, Japan
Kunihiro Asada, VLSI Design and Education Center, the University of Tokyo, Tokyo, 113-0032, Japan
pp. 1-10
Jong Chul Lee, Department of Electrical and Computer Engineering, University of Arizona, Tucson, AZ
Faycel Kouteib, Department of Electrical and Computer Engineering, University of Arizona, Tucson, AZ
Roman Lysecky, Department of Electrical and Computer Engineering, University of Arizona, Tucson, AZ
pp. 1-10
Rafal Baranowski, ITI, University of Stuttgart, Pfaffenwaldring 47, D-70569, Stuttgart, Germany
Michael A. Kochte, ITI, University of Stuttgart, Pfaffenwaldring 47, D-70569, Stuttgart, Germany
Hans-Joachim Wunderlich, ITI, University of Stuttgart, Pfaffenwaldring 47, D-70569, Stuttgart, Germany
pp. 1-9
Min Li, Bradley Department of Electrical and Computer Engineering, Virginia Tech, Blacksburg, VA 24061, USA
Kelson Gent, Bradley Department of Electrical and Computer Engineering, Virginia Tech, Blacksburg, VA 24061, USA
Michael S. Hsiao, Bradley Department of Electrical and Computer Engineering, Virginia Tech, Blacksburg, VA 24061, USA
pp. 1-8
Sreenivaas S. Muthyala, Computer Engineering Research Center, Department of Electrical and Computer Engineering, University of Texas, Austin, TX 78712
Nur A. Touba, Computer Engineering Research Center, Department of Electrical and Computer Engineering, University of Texas, Austin, TX 78712
pp. 1-7
Haithem Ayari, LIRMM - CNRS/Univ. Montpellier 2, 161 rue Ada, 34392 Montpellier, France
Florence Azais, LIRMM - CNRS/Univ. Montpellier 2, 161 rue Ada, 34392 Montpellier, France
Serge Bernard, LIRMM - CNRS/Univ. Montpellier 2, 161 rue Ada, 34392 Montpellier, France
Mariane Comte, LIRMM - CNRS/Univ. Montpellier 2, 161 rue Ada, 34392 Montpellier, France
Vincent Kerzerho, LIRMM - CNRS/Univ. Montpellier 2, 161 rue Ada, 34392 Montpellier, France
Olivier Potin, LIRMM - CNRS/Univ. Montpellier 2, 161 rue Ada, 34392 Montpellier, France
Michel Renovell, LIRMM - CNRS/Univ. Montpellier 2, 161 rue Ada, 34392 Montpellier, France
pp. 1-9
Zhongjun Yu, Iowa State University, Ames, IA, USA
Degang Chen, Iowa State University, Ames, IA, USA
pp. 1-10
Gerald Hilber, Institute for Integrated Circuits, Johannes Kepler University, Linz, Austria
Dominik Gruber, Institute for Integrated Circuits, Johannes Kepler University, Linz, Austria
Michael Sams, Institute for Integrated Circuits, Johannes Kepler University, Linz, Austria
Timm Ostermann, Institute for Integrated Circuits, Johannes Kepler University, Linz, Austria
pp. 1-7
Franco Stellari, IBM T.J. Watson Research Center, Yorktown Height, NY
Thomas Cowell, IBM System and Technology Group, Hopewell Junction, NY
Peilin Song, IBM T.J. Watson Research Center, Yorktown Height, NY
Michael Sorna, IBM System and Technology Group, Hopewell Junction, NY
Zeynep Toprak Deniz, IBM T.J. Watson Research Center, Yorktown Height, NY
John F. Bulzacchelli, IBM T.J. Watson Research Center, Yorktown Height, NY
Nandita A. Mitra, IBM System and Technology Group, Hopewell Junction, NY
pp. 1-7
Xiaoxin Fan, Department of ECE University of Iowa Iowa City, IA 52242, USA
Huaxing Tang, Mentor Graphics, 8005 SW Boeckman RD, Wilsonville, OR 97070, USA
Yu Huang, Mentor Graphics, 8005 SW Boeckman RD, Wilsonville, OR 97070, USA
Wu-Tung Cheng, Mentor Graphics, 8005 SW Boeckman RD, Wilsonville, OR 97070, USA
Sudhakar M. Reddy, Department of ECE University of Iowa Iowa City, IA 52242, USA
Brady Benware, Mentor Graphics, 8005 SW Boeckman RD, Wilsonville, OR 97070, USA
pp. 1-10
Yu-Hsiang Lin, Electrical Engineering Department, National Tsing Hua University, Taiwan
Shi-Yu Huang, Electrical Engineering Department, National Tsing Hua University, Taiwan
Kun-Han (Hans) Tsai, Silicon Test Solutions, Mentor Graphics
Wu-Tung Cheng, Silicon Test Solutions, Mentor Graphics
Stephen Sunter, Silicon Test Solutions, Mentor Graphics
pp. 1-10
Brandon Noia, Duke University, Dept. Electrical and Computer Engineering, Durham, NC 27708, USA
Shreepad Panth, Georgia Institute of Technology, Dept. Electrical and Computer Engineering, Atlanta, GA 30332, USA
Krishnendu Chakrabarty, Duke University, Dept. Electrical and Computer Engineering, Durham, NC 27708, USA
Sung Kyu Lim, Georgia Institute of Technology, Dept. Electrical and Computer Engineering, Atlanta, GA 30332, USA
pp. 1-8
Sergej Deutsch, Cadence Design Systems, Munich, Germany
Brion Keller, Cadence Design Systems, Endicott, NY, USA
Vivek Chickermane, Cadence Design Systems, Endicott, NY, USA
Subhasish Mukherjee, Cadence Design Systems, Noida, India
Navdeep Sood, Cadence Design Systems, Noida, India
Sandeep Kumar Goel, TSMC, San Jose, CA, USA
Ji-Jan Chen, TSMC HsinChu, Taiwan
Ashok Mehta, TSMC, San Jose, CA, USA
Frank Lee, TSMC HsinChu, Taiwan
Erik Jan Marinissen, IMEC, Kapeldreef 75, B-3001 Leuven, Belgium
pp. 1-10
Igor Aleksejev, Testonica Lab OÜ, Tallinn, Estonia
Artur Jutman, Tallinn Univ. of Technology, Dept. of Comp. Engineering, Tallinn, Estonia
Sergei Devadze, Tallinn Univ. of Technology, Dept. of Comp. Engineering, Tallinn, Estonia
Sergei Odintsov, Testonica Lab OÜ, Tallinn, Estonia
Thomas Wenzel, Goepel Electronic GmbH, Jena, Germany
pp. 1-10
Zoe Conroy, Cisco Systems Inc., 170 West Tasman, Drive, San Jose, CA95134, USA
James Grealish, Intel® Corporation 5200 NE Elam Young, Parkway, Hillsboro, OR 97124, USA
Harrison Miles, Corelis, Inc., 13100 Alondra, Blvd, Cerritos, CA 90703, USA
Anthony J. Suto, Teradyne Inc., 700 Riverpark Drive, North Reading, MA 01864, USA
Alfred Crouch, Asset InterTech Inc, 2001 N. Central Expy, Richardson, TX 75080, USA
Skip Meyers, Hewlett Packard Co, 800 Foothills Blvd, Roseville, CA 95747, USA
pp. 1-10
Tze-Hsin Wu, Department of Electrical Engineering, National Tsing Hua University, Hsinchu, Taiwan 30013, ROC
Po-Yuan Chen, Department of Electrical Engineering, National Tsing Hua University, Hsinchu, Taiwan 30013, ROC
Mincent Lee, Department of Electrical Engineering, National Tsing Hua University, Hsinchu, Taiwan 30013, ROC
Bin-Yen Lin, Department of Electrical Engineering, National Tsing Hua University, Hsinchu, Taiwan 30013, ROC
Cheng-Wen Wu, Department of Electrical Engineering, National Tsing Hua University, Hsinchu, Taiwan 30013, ROC
Chen-Hung Tien, Test Program Development Department, Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, Taiwan 30077, ROC
Hung-Chih Lin, Test Program Development Department, Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, Taiwan 30077, ROC
Hao Chen, Test Program Development Department, Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, Taiwan 30077, ROC
Ching-Nen Peng, Test Program Development Department, Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, Taiwan 30077, ROC
Min-Jer Wang, Test Program Development Department, Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, Taiwan 30077, ROC
pp. 1-9
Hao-Yu Yang, Department of Electronics Engineering & Institute of Electronics, National Chiao Tung University, Hsinchu, Taiwan
Chen-Wei Lin, Department of Electronics Engineering & Institute of Electronics, National Chiao Tung University, Hsinchu, Taiwan
Hung-Hsin Chen, Department of Electronics Engineering & Institute of Electronics, National Chiao Tung University, Hsinchu, Taiwan
Mango C.-T. Chao, Department of Electronics Engineering & Institute of Electronics, National Chiao Tung University, Hsinchu, Taiwan
Ming-Hsien Tu, Department of Electronics Engineering & Institute of Electronics, National Chiao Tung University, Hsinchu, Taiwan
Shyh-Jye Jou, Department of Electronics Engineering & Institute of Electronics, National Chiao Tung University, Hsinchu, Taiwan
Ching-Te Chuang, Department of Electronics Engineering & Institute of Electronics, National Chiao Tung University, Hsinchu, Taiwan
pp. 1-10
L. B. Zordan, LIRMM - Université Montpellier II / CNRS, Montpellier, France
A. Bosio, LIRMM - Université Montpellier II / CNRS, Montpellier, France
L. Dilillo, LIRMM - Université Montpellier II / CNRS, Montpellier, France
P. Girard, LIRMM - Université Montpellier II / CNRS, Montpellier, France
A. Todri, LIRMM - Université Montpellier II / CNRS, Montpellier, France
A. Virazel, LIRMM - Université Montpellier II / CNRS, Montpellier, France
N. Badereddine, Intel Mobile Communications, Sophia Antipolis, France
pp. 1-10
Yun-Chao Yu, Department of Electrical Engineering, National Central University, Taoyuan, Taiwan 320
Che-Wei Chou, Department of Electrical Engineering, National Central University, Taoyuan, Taiwan 320
Jin-Fu Li, Department of Electrical Engineering, National Central University, Taoyuan, Taiwan 320
Chih-Yen Lo, Department of Electrical Engineering, National Central University, Taoyuan, Taiwan 320
Ding-Ming Kwai, Department of Electrical Engineering, National Central University, Taoyuan, Taiwan 320
Yung-Fa Chou, Department of Electrical Engineering, National Central University, Taoyuan, Taiwan 320
Cheng-Wen Wu, Department of Electrical Engineering, National Central University, Taoyuan, Taiwan 320
pp. 1-9
Matthew Beckler, Department of Electrical and Computer Engineering, Carnegie Mellon University, Pittsburgh, PA 15213
R. D. (Shawn) Blanton, Department of Electrical and Computer Engineering, Carnegie Mellon University, Pittsburgh, PA 15213
pp. 1-10
Yasuo Sato, Kyushu Institute of Technology, Fukuoka, Japan
Seiji Kajihara, Kyushu Institute of Technology, Fukuoka, Japan
Tomokazu Yoneda, Nara Institute of Science and Technology, Nara, Japan
Kazumi Hatayama, Nara Institute of Science and Technology, Nara, Japan
Michiko Inoue, Nara Institute of Science and Technology, Nara, Japan
Yukiya Miura, Tokyo Metropolitan University, Tokyo, Japan
Satosni Untake, Oita University, Oita, Japan
Takumi Hasegawa, Hitachi Ltd., Information & Telecommunication Systems Company, Hardware MONOZUKURI Division, Tokyo, Japan
Motoyuki Sato, Hitachi Ltd., Information & Telecommunication Systems Company, Hardware MONOZUKURI Division, Tokyo, Japan
Kotaro Shimamura, Hitachi Ltd., Hitachi Research Laboratory, Ibaraki, Japan
pp. 1-10
Mohammad Mirza-Aghatabar, Ming Hsieh Department of Electrical Engineering, University of Southern California, Los Angeles, CA USA
Melvin A. Breuer, Ming Hsieh Department of Electrical Engineering, University of Southern California, Los Angeles, CA USA
Sandeep K. Gupta, Ming Hsieh Department of Electrical Engineering, University of Southern California, Los Angeles, CA USA
pp. 1-10
Somayeh Sadeghi-Kohan, School of Electrical and Computer Engineering College of Engineering, University of Tehran, Iran
Majid Namaki-Shoushtari, School of Electrical and Computer Engineering College of Engineering, University of Tehran, Iran
Fatemeh Javaheri, School of Electrical and Computer Engineering College of Engineering, University of Tehran, Iran
Zainalabedin Navabi, School of Electrical and Computer Engineering College of Engineering, University of Tehran, Iran
pp. 1-9
Shahrzad Mirkhani, Computer Engineering Research Center, The University of Texas at Austin, Austin, TX 78712
Jacob A. Abraham, Computer Engineering Research Center, The University of Texas at Austin, Austin, TX 78712
Toai Vo, Cisco Systems Inc., San Jose, CA 95134
Hongshin Jun, Cisco Systems Inc., San Jose, CA 95134
Bill Eklow, Cisco Systems Inc., San Jose, CA 95134
pp. 1-10
A. Khare, Nvidia Graphics, Bangalore, India
P. Kishore, Nvidia Graphics, Bangalore, India
S. Reddy, Nvidia Graphics, Bangalore, India
K. Rajan, Nvidia Graphics, Bangalore, India
A. Sanghani, Nvidia Graphics, Santa Clara, United States
pp. 1-8
Vinayak Kamath, University of California, Santa Barbara
Wen Chen, University of California, Santa Barbara
Nik Sumikawa, University of California, Santa Barbara
Li-C. Wang, University of California, Santa Barbara
pp. 1-10
Louay Abdallah, TIMA Laboratory (CNRS-Grenoble INP-UJF), 46 Av. Félix Viallet, 38031 Grenoble, France
Haralampos-G. Stratigopoulos, TIMA Laboratory (CNRS-Grenoble INP-UJF), 46 Av. Félix Viallet, 38031 Grenoble, France
Salvador Mir, TIMA Laboratory (CNRS-Grenoble INP-UJF), 46 Av. Félix Viallet, 38031 Grenoble, France
Christophe Kelma, NXP Semiconductors, 2 esplanade Anton Philips, Campus Effiscience, Colombelles BP20000, 14906 Caen, France
pp. 1-8
Matthieu Dubois, CEA-LETI - Grenoble - France
Emeric De Foucauld, CEA-LETI - Grenoble - France
Christopher Mounet, CEA-LETI - Grenoble - France
Serigne Dia, Presto Engineering - Grenoble - France
Cedric Mayor, Presto Engineering - Grenoble - France
pp. 1-8
Josep Altet, Electronic Engineering Department, Universitat Politècnica de Catalunya, Barcelona, Spain
Diego Mateo, Electronic Engineering Department, Universitat Politècnica de Catalunya, Barcelona, Spain
Didac Gomez, Electronic Engineering Department, Universitat Politècnica de Catalunya, Barcelona, Spain
Xavier Perpina, Centro Nacional de Microelectrónica, Bellaterra, Spain
Miquel Vellvehi, Centro Nacional de Microelectrónica, Bellaterra, Spain
Xavier Jorda, Centro Nacional de Microelectrónica, Bellaterra, Spain
pp. 1-8
Motoo Ueda, ADVANTEST Corporation 336-1, Ohwa, Meiwa-machi, Ora-gun, Gunma 370-0718 Japan
Shinichi Ishikawa, ADVANTEST Corporation 336-1, Ohwa, Meiwa-machi, Ora-gun, Gunma 370-0718 Japan
Masaru Goishi, ADVANTEST Corporation 336-1, Ohwa, Meiwa-machi, Ora-gun, Gunma 370-0718 Japan
Satoru Kitagawa, ADVANTEST Corporation 336-1, Ohwa, Meiwa-machi, Ora-gun, Gunma 370-0718 Japan
Hiroshi Araki, ADVANTEST Corporation 336-1, Ohwa, Meiwa-machi, Ora-gun, Gunma 370-0718 Japan
Shuichi Inage, ADVANTEST Corporation 336-1, Ohwa, Meiwa-machi, Ora-gun, Gunma 370-0718 Japan
pp. 1-7
Takashi Ito, Rohde & Schwarz Japan, Tokyo, Japan
Hideo Okawara, Advantest Corporation, Tokyo, Japan
Jinlei Liu, Advantest America Inc. Cupertino, CA, USA
pp. 1-9
Xiaoxiao Wang, Freescale Semiconductor
Dat Tran, Freescale Semiconductor
Saji George, Freescale Semiconductor
LeRoy Winemberg, Freescale Semiconductor
Nisar Ahmed, Freescale Semiconductor
Steve Palosh, Freescale Semiconductor
Allan Dobin, Freescale Semiconductor
Mohammad Tehranipoor, ECE Department, University of Connecticut
pp. 1-9
Michail Maniatakos, EE Department Yale University
Maria K. Michael, ECE Department University of Cyprus
Yiorgos Makris, EE Department, University of Texas at Dallas
pp. 1-8
Nik Sumikawa, University of California, Santa Barbara
Li-C. Wang, University of California, Santa Barbara
Magdy S. Abadir, Freescale Semiconductor, Inc
pp. 1-10
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