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IEEE International Conference on Test, 2005.
Austin, TX, USA
November 08-November 08
ISBN: 0-7803-9038-5
Table of Contents
Papers
E. Armengaud, ECS Group, Vienna Univ. of Technol., Austria
F. Rothensteiner, ECS Group, Vienna Univ. of Technol., Austria
A. Steininger, ECS Group, Vienna Univ. of Technol., Austria
pp. 8 pp.-8
A. Zjajo, Philips Res. Labs., Eindhoven, Netherlands
H.J. Bergveld, Philips Res. Labs., Eindhoven, Netherlands
R. Schuttert, Philips Res. Labs., Eindhoven, Netherlands
J.P. de Gyvez, Philips Res. Labs., Eindhoven, Netherlands
pp. 8 pp.-83
B. Lee, Dept. of ECE, California Univ., USA
null Hui Li, Dept. of ECE, California Univ., USA
L.-C. Wang, Dept. of ECE, California Univ., USA
pp. 10 pp.-100
N. Tendolkar, Somerset Design Center, Freescale Semicond., USA
D. Belete, Somerset Design Center, Freescale Semicond., USA
A. Razdan, Somerset Design Center, Freescale Semicond., USA
H. Reyes, Somerset Design Center, Freescale Semicond., USA
B. Schwarz, Somerset Design Center, Freescale Semicond., USA
M. Sullivan, Somerset Design Center, Freescale Semicond., USA
pp. 9 pp.-128
C. Jacobsen, Agilent Technol., USA
T. Saye, Agilent Technol., USA
T. Trader, Agilent Technol., USA
pp. 7 pp.-172
T.J. Yamaguchi, Advantest Labs., Ltd., Miyagi, Japan
M. Ishida, Advantest Labs., Ltd., Miyagi, Japan
pp. 10 pp.-235
S. Bhattacharya, Sch. of ECE, Georgia Inst. of Technol., Atlanta, GA, USA
R. Senguttuvan, Sch. of ECE, Georgia Inst. of Technol., Atlanta, GA, USA
A. Chatterjee, Sch. of ECE, Georgia Inst. of Technol., Atlanta, GA, USA
pp. 10 pp.-245
J. Rearick, Agilent Technol., Fort Collins, CO, USA
R. Rodgers, Agilent Technol., Fort Collins, CO, USA
pp. 8 pp.-273
K. van Kaam, Philips Res. Labs., Eindhoven, Netherlands
B. Vermeulen, Philips Res. Labs., Eindhoven, Netherlands
H.J. Bergveld, Philips Res. Labs., Eindhoven, Netherlands
pp. 10 pp.-283
O. Caty, Sun Microsystems, Inc., Sunnyvale, CA, USA
P. Dahlgren, Sun Microsystems, Inc., Sunnyvale, CA, USA
I. Bayraktaroglu, Sun Microsystems, Inc., Sunnyvale, CA, USA
pp. 10 pp.-293
S. Guramurthy, Comput. Eng. Res. Center, Texas Univ., Austin, TX, USA
S. Vasudevan, Comput. Eng. Res. Center, Texas Univ., Austin, TX, USA
J.A. Abraham, Comput. Eng. Res. Center, Texas Univ., Austin, TX, USA
pp. 10 pp.-303
R. Madge, LSI Logic Corp., Gresham, OR, USA
B. Benware, LSI Logic Corp., Gresham, OR, USA
M. Ward, LSI Logic Corp., Gresham, OR, USA
pp. 10 pp.-332
S. Davidson, Sun Microsyst., Inc., Sunnyvale, CA, USA
pp. 10 pp.-342
Z. Conroy, Cisco Syst. Inc., San Jose, CA, USA
G. Richmond, Cisco Syst. Inc., San Jose, CA, USA
null Xinli Gu, Cisco Syst. Inc., San Jose, CA, USA
B. Eklow, Cisco Syst. Inc., San Jose, CA, USA
pp. 7 pp.-349
A.S. Mudlapur, Dept. of Electr.&Comput. Eng., Auburn Univ., AL, USA
V.D. Agrawal, Dept. of Electr.&Comput. Eng., Auburn Univ., AL, USA
A.D. Singh, Dept. of Electr.&Comput. Eng., Auburn Univ., AL, USA
pp. 9 pp.-358
null Dong Hyun Baik, Dept. of Electr.&Comput. Eng., Wisconsin-Madison Univ., Madison, WI, USA
K.K. Saluja, Dept. of Electr.&Comput. Eng., Wisconsin-Madison Univ., Madison, WI, USA
pp. 10 pp.-368
S.T. Arasu, ASIC Dept., Texas Instrum. India, Bangalore, India
C.P. Ravikumar, ASIC Dept., Texas Instrum. India, Bangalore, India
pp. 9 pp.-377
null Ying-Yen Chen, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
null Min-Pin Kuo, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
null Jing-Jia Liou, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 8 pp.-394
L. Zhang, Texas Instruments, Inc., Dallas, TX, USA
D. Heaton, Texas Instruments, Inc., Dallas, TX, USA
H. Largey, Texas Instruments, Inc., Dallas, TX, USA
pp. 7 pp.-411
E. Acar, Duke Univ., Durham, NC, USA
S. Ozev, Duke Univ., Durham, NC, USA
pp. 9 pp.-429
J. Sweeney, IBM RF&Analog Test Dev., Essex Junction, VT, USA
A. Tsefrekas, IBM RF&Analog Test Dev., Essex Junction, VT, USA
pp. 9 pp.-446
C.V. Sellathamby, Scanimetrics Inc. RTF, Edmonton, Alta., Canada
M.M. Reja, Scanimetrics Inc. RTF, Edmonton, Alta., Canada
null Lin Fu, Scanimetrics Inc. RTF, Edmonton, Alta., Canada
B. Bai, Scanimetrics Inc. RTF, Edmonton, Alta., Canada
E. Reid, Scanimetrics Inc. RTF, Edmonton, Alta., Canada
S.H. Slupsky, Scanimetrics Inc. RTF, Edmonton, Alta., Canada
pp. 6 pp.-452
null Zhanglei Wang, Dept. of Electr.&Comput. Eng., Duke Univ., Durham, NC, USA
K. Chakrabarty, Dept. of Electr.&Comput. Eng., Duke Univ., Durham, NC, USA
pp. 10 pp.-486
null Fei Su, Dept. of Electr.&Comput. Eng., Duke Univ., Durham, NC, USA
W. Hwang, Dept. of Electr.&Comput. Eng., Duke Univ., Durham, NC, USA
pp. 10 pp.-496
null Woo Cheol Chung, Dept. of Electr.&Comput. Eng., Virginia Polytech. Inst.&State Univ., USA
D.S. Ha, Dept. of Electr.&Comput. Eng., Virginia Polytech. Inst.&State Univ., USA
pp. 10 pp.-506
M. Nourani, Center for Integrated Circuits&Syst., Texas Univ., Dallas, TX, USA
A. Radhakrishnan, Center for Integrated Circuits&Syst., Texas Univ., Dallas, TX, USA
pp. 10 pp.-516
Y. Zorian, Virage Logic, Corp., Fremont, CA, USA
A. Yessayan, Virage Logic, Corp., Fremont, CA, USA
pp. 10 pp.-552
G. Maston, Synopsys Inc., Mountain View, CA, USA
pp. 8 pp.-560
M. Arai, Tokyo Metropolitan Univ., Japan
S. Fukumoto, Tokyo Metropolitan Univ., Japan
K. Iwasaki, Tokyo Metropolitan Univ., Japan
pp. 10 pp.-570
null Seongmoon Wang, NEC Labs. America, Princeton, NJ, USA
K.J. Balakrishnan, NEC Labs. America, Princeton, NJ, USA
S.T. Chakradhar, NEC Labs. America, Princeton, NJ, USA
pp. 10 pp.-580
null Zhanglei Wang, Dept. of Electr.&Comput. Eng., Duke Univ., Durham, NC, USA
K. Chakrabarty, Dept. of Electr.&Comput. Eng., Duke Univ., Durham, NC, USA
pp. 10 pp.-590
A.M. Amory, UFRGS, Inst. de Informatica, Porto Alegre, Brazil
E. Briao, UFRGS, Inst. de Informatica, Porto Alegre, Brazil
E. Cota, UFRGS, Inst. de Informatica, Porto Alegre, Brazil
M. Lubaszewski, UFRGS, Inst. de Informatica, Porto Alegre, Brazil
pp. 9 pp.-599
null Qiang Xu, Dept. of Electr.&Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
N. Nicolici, Dept. of Electr.&Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
pp. 10 pp.-609
T. Waayers, Philips Res. Labs., High Tech Campus, Eindhoven, Netherlands
R. Morren, Philips Res. Labs., High Tech Campus, Eindhoven, Netherlands
pp. 10 pp.-619
K.P. Parker, Agilent Technol., Loveland, CO, USA
pp. 9 pp.-636
Y. Cai, Agere Syst., Allentown, PA, USA
A. Bhattacharyya, Agere Syst., Allentown, PA, USA
J. Martone, Agere Syst., Allentown, PA, USA
A. Verma, Agere Syst., Allentown, PA, USA
W. Burchanowski, Agere Syst., Allentown, PA, USA
pp. 8 pp.-651
Y. Cai, Agere Syst., Allentown, PA, USA
L. Fang, Agere Syst., Allentown, PA, USA
R. Ratemo, Agere Syst., Allentown, PA, USA
pp. 9 pp.-660
M. Lin, Dept. of Electr.&Comput. Eng., California Univ., Santa Barbara, CA, USA
null Kwang-Ting Cheng, Dept. of Electr.&Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 10 pp.-670
J.M. Carulli, Texas Instruments Inc., Dallas, TX, USA
T.J. Anderson, Texas Instruments Inc., Dallas, TX, USA
pp. 8 pp.-686
T.L. McLaurin, ARM Inc., Austin, TX, USA
F. Frederick, ARM Inc., Austin, TX, USA
R. Slobodnik, ARM Inc., Austin, TX, USA
pp. 10 pp.-716
J. Remmers, Plexus Design Solutions, Inc., Sudbury, MA, USA
D. Lee, Plexus Design Solutions, Inc., Sudbury, MA, USA
pp. 9 pp.-725
Z. Stanojevic, Intel Corp., Santa Clara, CA, USA
null Ruifeng Guo, Intel Corp., Santa Clara, CA, USA
S. Mitra, Intel Corp., Santa Clara, CA, USA
S. Venkataraman, Intel Corp., Santa Clara, CA, USA
pp. 9 pp.-734
B. Keller, Cadence Design Syst., Inc., Endicott, NY, USA
T. Bartenstein, Cadence Design Syst., Inc., Endicott, NY, USA
pp. 9 pp.-743
null Yu Huang, Mentor Graphics Corp., Wilsonville, OR, USA
null Wu-Tung Cheng, Mentor Graphics Corp., Wilsonville, OR, USA
J. Rajski, Mentor Graphics Corp., Wilsonville, OR, USA
pp. 8 pp.-751
null Yuxin Tian, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
M.R. Grimaila, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
null Weiping Shi, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
M.R. Mercer, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 9 pp.-770
null Kyoung Youn Cho, Departments of Electr. Eng.&Comput. Sci., Stanford Univ., CA, USA
S. Mitra, Departments of Electr. Eng.&Comput. Sci., Stanford Univ., CA, USA
E.J. McCluskey, Departments of Electr. Eng.&Comput. Sci., Stanford Univ., CA, USA
pp. 7 pp.-777
B.G. Van Treuren, Lucent Technol. Inc., New Jersey, NJ, USA
B.E. Peterson, Lucent Technol. Inc., New Jersey, NJ, USA
J.M. Miranda, Lucent Technol. Inc., New Jersey, NJ, USA
pp. 10 pp.-787
J. Ferry, ATE Operations Div., Teradyne, Inc., North Reading, MA, USA
J. Scesnak, ATE Operations Div., Teradyne, Inc., North Reading, MA, USA
S. Shaikh, ATE Operations Div., Teradyne, Inc., North Reading, MA, USA
pp. 10 pp.-807
null Jin-Fu Li, Dept. of Electr. Eng., National Central Univ., Jungli, Taiwan
pp. 8 pp.-833
A. Benso, Dipt. di Automatica e Informatica, Politecnico di Torino, Italy
A. Bosio, Dipt. di Automatica e Informatica, Politecnico di Torino, Italy
S. Di Carlo, Dipt. di Automatica e Informatica, Politecnico di Torino, Italy
G. Di Natale, Dipt. di Automatica e Informatica, Politecnico di Torino, Italy
P. Prinetto, Dipt. di Automatica e Informatica, Politecnico di Torino, Italy
pp. 8 pp.-841
M. Suda, ADVANTEST Corp., Gunma, Japan
K. Yamamoto, ADVANTEST Corp., Gunma, Japan
T. Okayasu, ADVANTEST Corp., Gunma, Japan
S. Kantake, ADVANTEST Corp., Gunma, Japan
S. Sudou, ADVANTEST Corp., Gunma, Japan
D. Watanabe, ADVANTEST Corp., Gunma, Japan
pp. 9 pp.-866
A. Ohshima, Japan Product Dev., Center Credence Syst., Kanagawa-ken, Japan
T. Nomura, Japan Product Dev., Center Credence Syst., Kanagawa-ken, Japan
pp. 9 pp.-875
T. Adachi, Advantest R&D Center Inc., Santa Clara, CA, USA
A. Pramanick, Advantest R&D Center Inc., Santa Clara, CA, USA
M. Elston, Advantest R&D Center Inc., Santa Clara, CA, USA
pp. 9 pp.-890
P. Wohl, Synopsys Inc., Mountain View, CA, USA
J.A. Waicukauski, Synopsys Inc., Mountain View, CA, USA
S. Patel, Synopsys Inc., Mountain View, CA, USA
F. DaSilva, Synopsys Inc., Mountain View, CA, USA
T.W. Williams, Synopsys Inc., Mountain View, CA, USA
R. Kapur, Synopsys Inc., Mountain View, CA, USA
pp. 10 pp.-925
S. Chidambaram, Dept. of Electr.&Comput. Eng., Southern Illinois Univ., Carbondale, IL, USA
D. Kagaris, Dept. of Electr.&Comput. Eng., Southern Illinois Univ., Carbondale, IL, USA
pp. 10 pp.-935
null Bin Xue, Dept. of Comput. Sci., Texas A&M Univ., College Station, TX, USA
D.M.H. Walker, Dept. of Comput. Sci., Texas A&M Univ., College Station, TX, USA
pp. 10 pp.-963
B.S. Gill, Dept. of Electr. Eng.&Comput. Sci., Case Western Reserve Univ., Cleveland, OH, USA
C. Papachristou, Dept. of Electr. Eng.&Comput. Sci., Case Western Reserve Univ., Cleveland, OH, USA
F.G. Wolff, Dept. of Electr. Eng.&Comput. Sci., Case Western Reserve Univ., Cleveland, OH, USA
pp. 9 pp.-972
M. Meterelliyoz, Sch. of Electr.&Comput. Eng., Purdue Univ., West Lafayette, IN, USA
H. Mahmoodi, Sch. of Electr.&Comput. Eng., Purdue Univ., West Lafayette, IN, USA
K. Roy, Sch. of Electr.&Comput. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 10 pp.-991
I. Robertson, Texas Instruments, Inc., Dallas, TX, USA
G. Hetherington, Texas Instruments, Inc., Dallas, TX, USA
T. Leslie, Texas Instruments, Inc., Dallas, TX, USA
pp. 8 pp.-999
I. Parulkar, Scalable Syst. Group, Sun Microsystems, Inc., Santa Clara, CA, USA
D. Huang, Scalable Syst. Group, Sun Microsystems, Inc., Santa Clara, CA, USA
L. Chua, Scalable Syst. Group, Sun Microsystems, Inc., Santa Clara, CA, USA
D. Doblar, Scalable Syst. Group, Sun Microsystems, Inc., Santa Clara, CA, USA
pp. 9 pp.-1008
null Feng Shi, Electr. Eng. Dept., Yale Univ., New Haven, CT, USA
null Yiorgos Makris, Electr. Eng. Dept., Yale Univ., New Haven, CT, USA
pp. 10 pp.-1018
null Xiaoqing Wen, Dept. of Comput. Sci.&Eng., Kyushu Inst. of Technol., Iizuka, Japan
Y. Yamashita, Dept. of Comput. Sci.&Eng., Kyushu Inst. of Technol., Iizuka, Japan
S. Morishima, Dept. of Comput. Sci.&Eng., Kyushu Inst. of Technol., Iizuka, Japan
S. Kajihara, Dept. of Comput. Sci.&Eng., Kyushu Inst. of Technol., Iizuka, Japan
pp. 10 pp.-1028
N.S. Saluja, Dept. of Electr.&Comput. Eng., Colorado Univ., Boulder, CO, USA
pp. 10 pp.-1038
I. Polian, Albert-Ludwigs-Univ., Freiburg, Germany
J.P. Hayes, Albert-Ludwigs-Univ., Freiburg, Germany
S. Kundu, Albert-Ludwigs-Univ., Freiburg, Germany
B. Becker, Albert-Ludwigs-Univ., Freiburg, Germany
pp. 10 pp.-1048
null Chong Zhao, Dept. of Electr.&Comput. Eng., California Univ. at San Diego, La Jolla, CA, USA
null Xiaoliang Bai, Dept. of Electr.&Comput. Eng., California Univ. at San Diego, La Jolla, CA, USA
null Sujit Dey, Dept. of Electr.&Comput. Eng., California Univ. at San Diego, La Jolla, CA, USA
pp. 10 pp.-1058
A. Dutta, Dept. of Electr.&Comput. Eng., Texas Univ., Austin, TX, USA
N.A. Touba, Dept. of Electr.&Comput. Eng., Texas Univ., Austin, TX, USA
pp. 8 pp.-1066
R. Arnold, Infineon Technol. AG, Munich, Germany
A. Leininger, Infineon Technol. AG, Munich, Germany
pp. 9 pp.-1075
G. Maston, Synopsys Inc., Mountain View, CA, USA
J. Villar, Synopsys Inc., Mountain View, CA, USA
pp. 6 pp.-1081
null Manish Sharma, Mentor Graphics Corp., Wilsonville, OR, USA
null Wu-Tung Cheng, Mentor Graphics Corp., Wilsonville, OR, USA
pp. 9 pp.-1098
null Hung-Mao Lin, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
J.C.-M. Li, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 9 pp.-1117
null Saibal Mukhopadhyay, Dept. of ECE, Purdue Univ., West Lafayette, IN, USA
null Kunhyuk Kang, Dept. of ECE, Purdue Univ., West Lafayette, IN, USA
null Hamid Mahmoodi, Dept. of ECE, Purdue Univ., West Lafayette, IN, USA
null Kaushik Roy, Dept. of ECE, Purdue Univ., West Lafayette, IN, USA
pp. 10 pp.-1135
null Kuen-Jong Lee, Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
null Tong-Yu Hsieh, Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 9 pp.-1144
K. Yamasaki, Renesas Technol. Corp., Tokyo, Japan
I. Suzuki, Renesas Technol. Corp., Tokyo, Japan
A. Kobayashi, Renesas Technol. Corp., Tokyo, Japan
K. Horie, Renesas Technol. Corp., Tokyo, Japan
Y. Kobayashi, Renesas Technol. Corp., Tokyo, Japan
H. Aoki, Renesas Technol. Corp., Tokyo, Japan
pp. 10 pp.-1154
null Xiaogang Du, Mentor Graphics, Wilsonville, OR, USA
N. Mukherjee, Mentor Graphics, Wilsonville, OR, USA
null Wu-Tung Cheng, Mentor Graphics, Wilsonville, OR, USA
pp. 9 pp.-1173
H. Okawara, Agilent Technol. Int. Japan Ltd., Tokyo, Japan
pp. 8 pp.-1181
Y. Sato, Semicond. Technol. Acad. Res. Center, Yokohama, Japan
S. Hamada, Semicond. Technol. Acad. Res. Center, Yokohama, Japan
T. Maeda, Semicond. Technol. Acad. Res. Center, Yokohama, Japan
A. Takatori, Semicond. Technol. Acad. Res. Center, Yokohama, Japan
Y. Nozuyama, Semicond. Technol. Acad. Res. Center, Yokohama, Japan
pp. 9 pp.-1210
S. Irajpour, Dept. of EE - Syst., Southern California Univ., Los Angeles, CA, USA
S.K. Gupta, Dept. of EE - Syst., Southern California Univ., Los Angeles, CA, USA
M.A. Breuer, Dept. of EE - Syst., Southern California Univ., Los Angeles, CA, USA
pp. 9 pp.-1219
U. Kerst, Berlin Univ. of Technol., Germany
R. Schlangen, Berlin Univ. of Technol., Germany
A. Kabakow, Berlin Univ. of Technol., Germany
pp. 9 pp.-1244
A. Syed, Credence Syst. Corp., San Jose, CA, USA
R. Herlein, Credence Syst. Corp., San Jose, CA, USA
B. Cain, Credence Syst. Corp., San Jose, CA, USA
F. Sauk, Credence Syst. Corp., San Jose, CA, USA
pp. 7 pp.-1251
null Kundu, Dept. of Electr.&Comput. Eng., Massachusetts Univ., Amherst, MA, USA
pp. 1 pp.-1268
N. Vijaykrishnan, Dept. of Comput. Sci.&Eng., Pennsylvania State Univ., University Park, PA, USA
pp. 2 pp.-1271
S. Davidson, Sun Microsystems, Inc., Sunnyvale, CA, USA
pp. 1 pp.-1283
N.A. Touba, Dept. of Electr.&Comput. Eng., Texas Univ., Austin, TX, USA
pp. 2 pp.-1293
Y. Zorian, Virage Logic Corp., Fremont, CA, USA
pp. 2 pp.-1302
C. Force, Texas Instrum., Inc., Dallas, TX, USA
pp. 2 pp.-1305
N. Tamarapalli, Mentor Graphics Corp., Wilsonville, OR, USA
pp. 1 pp.-1312
J. Wang, Taiwan Semicond. Manuf. Co., Hsinchu, OR, Taiwan
pp. 1 pp.-1315
C. Holzwarth, Synopsys, Inc., Sunnyvale, CA, USA
pp. 2 pp.-1318
J.L. Roehr, Analog Devices, Inc., Wilmington, MA, USA
pp. 1 pp.-1320
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