Partnering with customer to achieve high yield

J. Wang

doi:10.1109/TEST.2005.1584130

I
ITC
2005
IEEE International Conference on Test, 2005.
Abstract - Partnering with customer to achieve high yield

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IEEE International Conference on Test, 2005.

Partnering with customer to achieve high yield

Austin, TX, USA

November 08-November 08

ISBN: 0-7803-9038-5

	ASCII Text	x
	J. Wang, "Partnering with customer to achieve high yield," 2012 IEEE International Test Conference, pp. 1 pp.-1315, IEEE International Conference on Test, 2005., 2005.

	BibTex	x
	@article{ 10.1109/TEST.2005.1584130, author = {J. Wang}, title = {Partnering with customer to achieve high yield}, journal ={2012 IEEE International Test Conference}, volume = {0}, year = {2005}, isbn = {0-7803-9038-5}, pages = {1 pp.-1315}, doi = {http://doi.ieeecomputersociety.org/10.1109/TEST.2005.1584130}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - CONF JO - 2012 IEEE International Test Conference TI - Partnering with customer to achieve high yield SN - 0-7803-9038-5 SP1 pp. EP1315 A1 - J. Wang, PY - 2005 KW - 90 nm KW - nanometer technology KW - TSMC advanced failure analysis KW - defect localization KW - foundry business model KW - defect density improvement VL - 0 JA - 2012 IEEE International Test Conference ER -

J. Wang, Taiwan Semicond. Manuf. Co., Hsinchu, OR, Taiwan

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/TEST.2005.1584130

Even at increasing process challenge with nanometer technology at 90nm, TSMC is able to achieve much faster defect density improvement than previous generations of technologies. One of the main reasons for faster 90nm yield ramp is TSMC's Advanced Failure Analysis infrastructure that is being established over time and has become sophisticated and rigorous recently. More importantly, the strong partnership between TSMC and its customers makes the defect localization much more efficiently. And the strong partnership with customers is the key for the overall success of foundry business model.

Index Terms:

90 nm, nanometer technology, TSMC advanced failure analysis, defect localization, foundry business model, defect density improvement

Citation:

J. Wang, "Partnering with customer to achieve high yield," itc, pp.1 pp.-1315, IEEE International Conference on Test, 2005., 2005

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