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IEEE International Conference on Test, 2005.
Achieving higher yield through diagnosis-the ASIC perspective
Austin, TX, USA
November 08-November 08
ISBN: 0-7803-9038-5
| ASCII Text | x | ||
| C. Schuermyer, "Achieving higher yield through diagnosis-the ASIC perspective," 2012 IEEE International Test Conference, pp. 2 pp.-1309, IEEE International Conference on Test, 2005., 2005. | |||
| BibTex | x | ||
| @article{ 10.1109/TEST.2005.1584126, author = {C. Schuermyer}, title = {Achieving higher yield through diagnosis-the ASIC perspective}, journal ={2012 IEEE International Test Conference}, volume = {0}, year = {2005}, isbn = {0-7803-9038-5}, pages = {2 pp.-1309}, doi = {http://doi.ieeecomputersociety.org/10.1109/TEST.2005.1584126}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, } | |||
| RefWorks Procite/RefMan/Endnote | x | ||
| TY - CONF JO - 2012 IEEE International Test Conference TI - Achieving higher yield through diagnosis-the ASIC perspective SN - 0-7803-9038-5 SP2 pp. EP1309 A1 - C. Schuermyer, PY - 2005 KW - 90 nm KW - ASIC yield diagnosis KW - particle related defects KW - device model matching KW - pattern related yield limiters KW - ASIC IP KW - foundry models VL - 0 JA - 2012 IEEE International Test Conference ER - | |||
Yield learning is more important to ASIC vendors than ever. The high cost of developing a 90 nm ASIC will result in a smaller number of high volume devices. Achieving yield goals during production ramp can be the difference between product success and failure. Yield and Product engineers are faced with all of the traditional fabrication issues, like particle related defects and device model matching, which have always made yield learning a challenge. Several new trends are taking hold with sub-130 nm processing that will make yield learning even more of a challenge in the future.
Index Terms:
90 nm, ASIC yield diagnosis, particle related defects, device model matching, pattern related yield limiters, ASIC IP, foundry models
Citation:
C. Schuermyer, "Achieving higher yield through diagnosis-the ASIC perspective," itc, pp.2 pp.-1309, IEEE International Conference on Test, 2005., 2005
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