ISBN: 0-7803-8581-0

Bernd Koenemann, Cadence Design Systems

Robert Madge, LSI Logic

Benoit Provost, Intel Corporation. Hillsboro, OR, USA

Chee How Lim, Intel Corporation. Hillsboro, OR, USA

Mo Bashir, Intel Corporation. Hillsboro, OR, USA

Ali Muhtaroglu, Intel Corporation. Hillsboro, OR, USA

Tiffany Huang, Intel Corporation. Santa Clara, CA, USA

Kathy Tian, Intel Corporation. Santa Clara, CA, USA

Mubeen Atha, Intel Corporation. Santa Clara, CA, USA

Cangsang Zhao, Intel Corporation. Santa Clara, CA, USA

Harry Muljono, Intel Corporation. Santa Clara, CA, USA

J. Zeng, Freescale Semiconductor Inc., Austin, TX

M. Abadir, Freescale Semiconductor Inc., Austin, TX

A. Kolhatkar, Freescale Semiconductor Inc., Austin, TX

G. Vandling, Cadence Design Systems, Endicott, NY

L. Wang, University of California, Santa Barbara, CA

J. Abraham, University of Texas at Austin, Austin, TX

David M. Wu, Intel Corporation

Mike Lin, Intel Corporation

Madhukar Reddy, Intel Corporation

Talal Jaber, Intel Corporation

Anil Sabbavarapu, Intel Corporation

Larry Thatcher, Intel Corporation

Valentin Gherman, Universitat Stuttgart, Germany

Hans-Joachim Wunderlich, Universitat Stuttgart, Germany

Harald Vranken, Philips Research, Netherlands

Friedrich Hapke, Philips Semiconductors, Germany

Michael Wittke, Philips Semiconductors, Germany

Michael Garbers, Philips Semiconductors, Germany

Liyang Lai, University of Illinois at Urbana-Champaign

Janak H. Patel, University of Illinois at Urbana-Champaign

Thomas Rinderknecht, Mentor Graphics Corp., OR

Wu-Tung Cheng, Mentor Graphics Corp., OR

Omar Khan, Rutgers University

Michael L. Bushnell, Rutgers University

Takahiro J. Yamaguchi, Advantest Laboratories, Ltd., Sendai, Miyagi, Japan

Masahiro Ishida, Advantest Laboratories, Ltd., Sendai, Miyagi, Japan

Kiyotaka Ichiyama, Advantest Laboratories, Ltd., Sendai, Miyagi, Japan

Mani Soma, University of Washington, Seattle, WA

Krawinkel Christian, Advantest Corporation, Gunma, Japan

Katsuaki Ohsawa, Advantest Corporation, Gunma, Japan

Masao Sugai, Advantest Corporation, Gunma, Japan

Karen Taylor, University of Washington, Seattle, WA

Bryan Nelson, University of Washington, Seattle, WA

Alan Chong, University of Washington, Seattle, WA

Hieu Nguyen, University of Washington, Seattle, WA

Henry Lin, University of Washington, Seattle, WA

Mani Soma, University of Washington, Seattle, WA

Hosam Haggag, Santa Clara Design Center, National Semiconductor, Santa Clara, CA

Jeff Huard, Tacoma Design Center, National Semiconductor, Federal Way, WA

Jim Braatz, Tacoma Design Center, National Semiconductor, Federal Way, WA

Stephen Sunter, LogicVision, Inc.

Aubin Roy, LogicVision, Inc.

J-F Cote, LogicVision, Inc.

Benjamin M. Mauck, Intel Corporation, Hillsboro, OR, USA

Vishnumohan Ravichandran, Intel Corporation, Hillsboro, OR, USA

Usman Azeez Mughal, Intel Corporation, Hillsboro, OR, USA

Ad J. Van de Goor, Delft University of Technology, Netherlands

Said Hamdioui, Philips Semiconductor R&D, France

Rob Wadsworth, ST Microlelctronics, Carrollton, TX

Chin-Lung Su, National Tsing Hua University Hsinchu, Taiwan

Rei-Fu Huang, National Tsing Hua University Hsinchu, Taiwan

Cheng-Wen Wu, National Tsing Hua University Hsinchu, Taiwan

Chien-Chung Hung, Industrial Technology Research Institute Hsinchu, Taiwan

Ming-Jer Kao, Industrial Technology Research Institute Hsinchu, Taiwan

Yeong-Jar Chang, SoC Technology Center, Industrial Technology Research Institute Hsinchu, Taiwan

Wen-Ching Wu, SoC Technology Center, Industrial Technology Research Institute Hsinchu, Taiwan

Stas Polonsky, IBM T.J. Watson Research Center, NY

Keith A. Jenkins, IBM T.J. Watson Research Center, NY

Alan Weger, IBM T.J. Watson Research Center, NY

Shinho Cho, Silla University, S. Korea

Peilin Song, IBM T.J. Watson Research Center, Yorktown Heights, NY

Franco Stellari, IBM T.J. Watson Research Center, Yorktown Heights, NY

Alan J. Weger, IBM T.J. Watson Research Center, Yorktown Heights, NY

Tian Xia, University of Vermont, Burlington, VT

Vijay Reddy, Texas Instruments Inc.

John Carulli, Texas Instruments Inc.

Anand Krishnan, Texas Instruments Inc.

William Bosch, Texas Instruments Inc., Stafford, TX

Brendan Burgess, Texas Instruments Inc., Stafford, TX

Heon C. Kim, Cisco Systems, Inc.

Hong-Shin Jun, Cisco Systems, Inc.

Xinli Gu, Cisco Systems, Inc.

Sung S. Chung, Cisco Systems, Inc.

Kendrick Baker, Raytheon Company, Plano, TX

Mehrdad Nourani, University of Texas at Dallas, Richardson, TX

Hong-Shin Jun, Cisco Systems, Inc., Tasman Drive San Jose, CA

Sung S. Chung, Cisco Systems, Inc., Tasman Drive San Jose, CA

Sang H. Baeg, Cisco Systems, Inc., Tasman Drive San Jose, CA

Manu Rehani, LSI Logic Corporation

David Abercrombie, LSI Logic Corporation

Robert Madge, LSI Logic Corporation

Jim Teisher, LSI Logic Corporation

Jason Saw, Invantest Corporation, San Jose, CA, USA

Jonathan Hops, Semiconductor Test, Teradyne Inc., Boston, MA

Brian Swing, Semiconductor Test, Teradyne Inc., Boston, MA

Brian Phelps, Semiconductor Test, Teradyne Inc., Boston, MA

Bruce Sudweeks, Semiconductor Test, Teradyne Inc., Boston, MA

John Pane, Semiconductor Test, Teradyne Inc., Boston, MA

James Kinslow, Semiconductor Test, Teradyne Inc., Boston, MA

Peter Patten, Agilent Technologies, Germany

Robert Madge, LSI Logic Corporation, Gresham, Oregon

Brady Benware, LSI Logic Corporation, Ft. Collins, Colorado

Ritesh Turakhia, LSI Logic Corporation, Ft. Collins, Colorado

Robert Daasch, Portland State University, Portland, Oregon

Chris Schuermyer, Portland State University, Portland, Oregon

Jens Ruffler, Portland State University, Portland, Oregon

Bram Kruseman, Philips Research, Netherlands

Ananta K. Majhi, Philips Research, Netherlands

Guido Gronthoud, Philips Research, Netherlands

Stefan Eichenberger, Philips Semiconductor, Netherlands

Wangqi Qiu, Texas A&M University, College Station, TX

Jing Wang, Texas A&M University, College Station, TX

D. M. H. Walker, Texas A&M University, College Station, TX

Divya Reddy, Texas Instruments, Inc.

Zhuo Li, Dept. of Electrical Engineering, Texas A&M University, College Station, TX

Weiping Shi, Dept. of Electrical Engineering, Texas A&M University, College Station, TX

Hari Balachandran, Texas Instruments, Inc.

Saravanan Padmanaban, Intel Corporation, Hillsboro, OR

Spyros Tragoudas, Southern Illinois University, Carbondale, IL

Haihua Yan, Auburn University, Auburn, AL

Adit D. Singh, Auburn University, Auburn, AL

Ashwin Raghunathan, University of Texas at Austin, TX

Ji Hwan Chun, University of Texas at Austin, TX

Jacob A. Abraham, University of Texas at Austin, TX

Abhijit Chatterjee, Georgia Institute of Technology

Abhishek Singh, University of Maryland, Baltimore County

Chintan Patel, University of Maryland, Baltimore County

Jim Plusquellic, University of Maryland, Baltimore County

Foster Dai, Auburn University, Auburn, AL

Charles Stroud, Auburn University, Auburn, AL

Dayu Yang, Auburn University, Auburn, AL

Shuying Qi, Auburn University, Auburn, AL

Geert Seuren, Philips Research Electronics Design, Netherlands

Tom Waayers, Philips Research Electronics Design, Netherlands

Bram Kruseman, Philips Research Laboratories, Netherlands

Ananta Majhi, Philips Research Laboratories, Netherlands

Camelia Hora, Philips Research Laboratories, Netherlands

Stefan Eichenberger, Philips Semiconductors, Netherlands

Johan Meirlevede, Philips Semiconductors, Netherlands

C. Schuermyer, LSI Logic Corporation, Gresham, OR

J. Ruffler, LSI Logic Corporation, Gresham, OR

R. Daasch, LSI Logic Corporation, Gresham, OR

Phil Nigh, IBM Technology and Systems Group

Anne Gattiker, IBM Austin Research Lab

Chintan Patel, University of Maryland, Baltimore, MD

Abhishek Singh, University of Maryland, Baltimore, MD

Jim Plusquellic, University of Maryland, Baltimore, MD

Matthew L. King, University of Wisconsin - Madison

Kewal K. Saluja, University of Wisconsin - Madison

Bo Yang, Polytechnic University, Brooklyn, NY

Kaijie Wu, Polytechnic University, Brooklyn, NY

Ramesh Karri, Polytechnic University, Brooklyn, NY

C. P. Ravikumar, Texas Instrument (India)

G. Hetherington, Texas Instrument Ltd, United Kingdom

Kenneth M. Butler, Texas Instruments Inc., Dallas

Jayashree Saxena, Texas Instruments Inc., Dallas

Tony Fryars, Texas Instruments Inc., Dallas

Graham Hetherington, Texas Instruments Inc., Dallas

Kenneth P. Parker, Agilent Technologies, Loveland, CO

R. Schuttert, Philips Research, Netherlands

D.C.L. Van Geest, Philips Research, Netherlands

A. Kumar, Indian Institute of Technology, Delhi, India

Carlos Michel, Hewlett-Packard Company, Jalisco, Mexico

Rosa D. Reinosa, Hewlett-Packard Company, Palo Alto, California, USA

Amit Verma, Rapiscan Security Products

Charles Robinson, Teradyne Inc.

Steve Butkovich, Cisco Systems, Inc.

Rochit Rajsuman, Advantest America Corporation

Masuda Noriyuki, Advantest Corporation, Gunma, Japan

Ankan Pramanick, Advantest America R&D Center Inc., Santa Clara, CA

Ramachandran Krishnaswamy, Advantest America R&D Center Inc., Santa Clara, CA

Mark Elston, Advantest America R&D Center Inc., Santa Clara, CA

Toshiaki Adachi, Advantest America R&D Center Inc., Santa Clara, CA

Harsanjeet Singh, Advantest America R&D Center Inc., Santa Clara, CA

Bruce Parnas, Advantest America R&D Center Inc., Santa Clara, CA

David Dowding, Agilent Technologies, Inc. Loveland, CO. USA

Ernie Wahl, Agere Systems Allentown, PA. USA

Don Organ, Inovys Corporation Pleasanton, CA. USA

Subhasish Mitra, Intel Corporation Folsom, CA

Steven S. Lumetta, Univ. of Illinois, Urbana-Champaign

Michael Mitzenmacher, Harvard University

Yuyi Tang, University of Stuttgart, Germany

Hans-Joachim Wunderlich, University of Stuttgart, Germany

Harald Vranken, Philips Research Laboratories, The Netherlands

Friedrich Hapke, Philips Semiconductors GmbH, Hamburg, Germany

Michael Wittke, Philips Semiconductors GmbH, Hamburg, Germany

Piet Engelke, Albert-Ludwigs-University, Germany

Ilia Polian, Albert-Ludwigs-University, Germany

Bernd Becker, Albert-Ludwigs-University, Germany

Vivek Chickermane, Cadence Design Systems, Endicott, NY, USA

Brian Foutz, Cadence Design Systems, Endicott, NY, USA

Brion Keller, Cadence Design Systems, Endicott, NY, USA

Jason G. Brown, Carnegie Mellon University, Pittsburgh PA

R. D. (Shawn) Blanton, Carnegie Mellon University, Pittsburgh PA

Wenjing Rao, UC San Diego

Alex Orailoglu, UC San Diego

Ramesh Karri, India Polytechnic University, India

Jing Huang, Northeastern University Boston, MA

Mehdi Baradaran Tahoori, Northeastern University Boston, MA

Fabrizio Lombardi, Northeastern University Boston, MA

Irith Pomeranz, Purdue University, W. Lafayette, IN

Srikanth Venkataraman, Intel Corporation, Hillsboro, OR

Sudhakar M. Reddy, University of Iowa, Iowa City, IA

Grzegorz Mrugalski, Mentor Graphics Corporation, Wilsonville, OR

Chen Wang, Mentor Graphics Corporation, Wilsonville, OR

Artur Pogiel, Poznan University of Technology, Poland

Jerzy Tyszer, Poznan University of Technology, Poland

Janusz Rajski, Mentor Graphics Corporation, Wilsonville, OR

T. Vogels, Carnegie Mellon University, Pittsburgh, PA

T. Zanon, Carnegie Mellon University, Pittsburgh, PA

R. Desineni, Carnegie Mellon University, Pittsburgh, PA

R. D. Blanton, Carnegie Mellon University, Pittsburgh, PA

W. Maly, Carnegie Mellon University, Pittsburgh, PA

J. G. Brown, Carnegie Mellon University, Pittsburgh, PA

J. E. Nelson, Carnegie Mellon University, Pittsburgh, PA

Y. Fei, Carnegie Mellon University, Pittsburgh, PA

X. Huang, Carnegie Mellon University, Pittsburgh, PA

P. Gopalakrishnan, Carnegie Mellon University, Pittsburgh, PA

M. Mishra, Carnegie Mellon University, Pittsburgh, PA

V. Rovner, Carnegie Mellon University, Pittsburgh, PA

S. Tiwary, Carnegie Mellon University, Pittsburgh, PA

Brion Keller, Cadence Design Systems, Inc Endicott, NY

Mick Tegethoff, Cadence Design Systems, Inc Endicott, NY

Thomas Bartenstein, Cadence Design Systems, Inc Endicott, NY

Vivek Chickermane, Cadence Design Systems, Inc Endicott, NY

Xinli Gu, Cisco Systems, Inc., San Jose, CA

Cyndee Wang, Cisco Systems, Inc., San Jose, CA

Abby Lee, Cisco Systems, Inc., San Jose, CA

Bill Eklow, Cisco Systems, Inc., San Jose, CA

Kun-Han Tsai, Mentor Graphics Corporation, Wilsonville, OR

Jan A. Tofte, Mentor Graphics Corporation, Wilsonville, OR

Mark Kassab, Mentor Graphics Corporation, Wilsonville, OR

Janusz Rajski, Mentor Graphics Corporation, Wilsonville, OR

Pamela Gillis, IBM Corporation Essex Junction, VT

Francis Woytowich, IBM Corporation Essex Junction, VT

Andrew Ferko, IBM Corporation Essex Junction, VT

Kevin McCauley, Cadence Design Systems Endicott, NY

Saghir A Shaikh, Intel Corporation, San Diego, CA

Juha Hakkinen, Electrical and Information Engineering, Electronics Laboratory, University of Oulu, Finland

Pekka Syri, Electrical and Information Engineering, Electronics Laboratory, University of Oulu, Finland

Juha-Veikko Voutilainen, Optoelectronics and Measurement Techniques Laboratory, University of Oulu, Finland

Markku Moilanen, Optoelectronics and Measurement Techniques Laboratory, University of Oulu, Finland

Jeff Rearick, Agilent Technologies ASIC Product Division Fort Collins, CO

Sylvia Patterson, Agilent Technologies ASIC Product Division Fort Collins, CO

Krista Dorner, Agilent Technologies ASIC Product Division Fort Collins, CO

Masashi Shimanouchi, Credence Systems, Baytech Drive, San Jose, CA

Ahmed Rashid Syed, Credence Systems Corporation, Baytech Dr. San Jose, CA

A.T. Sivaram, Credence Inc Intel, Baytech Drive, San Jose, CA

Pascal Pierra, Credence Inc Intel, Baytech Drive, San Jose, CA

Shida Sheibani, Credence Inc Intel, Baytech Drive, San Jose, CA

Nancy Wang-Lee, Intel Corporation, Chandler, AZ

Jorge E. Solorzano, Intel Corporation, Chandler, AZ

Lily Tran, Intel Corporation, Chandler, AZ

Feng Shi, Yale University New Haven, CT

Yiorgos Makris, Yale University New Haven, CT

Kameshwar Chandrasekar, Virginia Tech, Blacksburg, VA

Michael S. Hsiao, Virginia Tech, Blacksburg, VA

Junwu Zhang, Rutgers University, Piscataway, NJ

Michael L. Bushnell, Rutgers University, Piscataway, NJ

Vishwani D. Agrawal, Auburn University, AL

Dave Mark, xilinx.com Logic Dr. San Jose, CA

Jenny Fan, xilinx.com Logic Dr. San Jose, CA

Mehdi Baradaran Tahoori, Northeastern University Boston, MA

Subhasish Mitra, Intel Corporation Sacramento, CA

Mehdi Baradaran Tahoori, Northeastern University Boston, MA

A. Cabbibo, LSI Logic Corporation, Gresham, Oregon

J. Conder, LSI Logic Corporation, Gresham, Oregon

M. Jacobs, LSI Logic Corporation, Gresham, Oregon

Leendert M. Huisman, IBM Microelectronics, Essex Junction, VT

Maroun Kassab, IBM Microelectronics, Essex Junction, VT

Leah Pastel, IBM Microelectronics, Essex Junction, VT

M. Enamul Amyeen, Intel Corporation, Hillsboro, OR

Srikanth Venkataraman, Intel Corporation, Hillsboro, OR

Ajay Ojha, Intel Corporation, Hillsboro, OR

Sangbong Lee, Intel Corporation, Hillsboro, OR

Sandip Kundu, Design Technology, Intel Corporation

T. M. Mak, Design Technology, Intel Corporation

Rajesh Galivanche, Design Technology, Intel Corporation

Bart Vermeulen, Philips Research Laboratories, Netherlands

Camelia Hora, Philips Research Laboratories, Netherlands

Bram Kruseman, Philips Research Laboratories, Netherlands

Erik Jan Marinissen, Philips Research Laboratories, Netherlands

Robert Van Rijsinge, Philips Semiconductors - ATO, Nijmegen, Netherlands

Alfred L. Crouch, Chief Scientist, Inovys Corporation

Bill Eklow, Cisco Systems Inc., San Jose CA,

Anoosh Hosseini, Cisco Systems Inc., San Jose CA,

Chi Khuong, Cisco Systems Inc., San Jose CA,

Shyam Pullela, Cisco Systems Inc., San Jose CA

Toai Vo, Cisco Systems Inc., San Jose CA

Hien Chau, Cisco Systems Inc., San Jose CA

Chen-Huan Chiang, Lucent Technologies, Holmdel, NJ

Paul J. Wheatley, Lucent Technologies, Holmdel, NJ

Kenneth Y. Ho, Lucent Technologies, Whippany, NJ

Ken L. Cheung, Lucent Technologies, Whippany, NJ

Yujun Zhang, Chinese Academy of Sciences. Beijing, China

Zhongcheng Li, Chinese Academy of Sciences. Beijing, China

Mohamed M. Hafed, DFT MicroSystems Canada Inc.

Antonio H. Chan, DFT MicroSystems Canada Inc.

Geoffrey Duerden, DFT MicroSystems Canada Inc.

Bardia Pishdad, DFT MicroSystems Canada Inc.

Clarence Tam, DFT MicroSystems Canada Inc.

Sebastien Laberge, DFT MicroSystems Canada Inc.

Gordon W. Roberts, DFT MicroSystems Canada Inc.

A.T. Sivaram, Credence Inc Baytech Drive, San Jose, CA

Masashi Shimanouchi, Credence Inc Baytech Drive, San Jose, CA

Howard Maassen, Credence Inc Baytech Drive, San Jose, CA

Robert Jackson, Credence Inc Baytech Drive, San Jose, CA

D.C. Keezer, Georgia Institute of Technology

D. Minier, IBM Canada

F. Binette, IBM Canada

Hans T. Heineken, Ample Communications Inc. Sacramento, CA

Jitendra B. Khare, Ample Communications Inc. Sacramento, CA

Bernd Laquai, Agilent Technologies, Boeblingen, Germany

K. Nikila, Texas Instruments Pvt. Ltd., Bangalore, India

Rubin A. Parekhji, Texas Instruments Pvt. Ltd., Bangalore, India

Erkan Acar, Duke University, Durham, NC

Sule Ozev, Duke University, Durham, NC

Dana Brown, IBM Corporation Essex Junction, VT, USA

John Ferrario, IBM Corporation Essex Junction, VT, USA

Randy Wolf, IBM Corporation Essex Junction, VT, USA

Jing Li, IBM Corporation Essex Junction, VT, USA

Jayendra Bhagat, IBM Corporation Essex Junction, VT, USA

Soumendu Bhattacharya, Georgia Institute of Technology, Atlanta, GA

Abhijit Chatterjee, Georgia Institute of Technology, Atlanta, GA

Alper Sen, The University of Texas at Austin

Vijay K. Garg, The University of Texas at Austin

Jacob A. Abraham, The University of Texas at Austin

Jayanta Bhadra, Motorola Inc.

Qingwei Wu, Virginia Tech, Blacksburg, VA

Michael S. Hsiao, Virginia Tech, Blacksburg, VA

Geeng-Wei Lee, National Chiao Tung University, Hsinchu, Taiwan

Juinn-Dar Huang, National Chiao Tung University, Hsinchu, Taiwan

Jing-Yang Jou, National Chiao Tung University, Hsinchu, Taiwan

Chun-Yao Wang, National Chiao Tung University, Hsinchu, Taiwan

Charles Stroud, Auburn University, Alabama USA

John Sunwoo, Auburn University, Alabama USA

Srinivas Garimella, Auburn University, Alabama USA

Jonathan Harris, Auburn University, Alabama USA

Jeff Remmers, Plexus Design Solutions, Inc., Sudbury, MA

Moe Villalba, Plexus Design Solutions, Inc., Sudbury, MA

Richard Fisette, Mentor Graphics Corporation, Waltham, MA

CJ Clark, Intellitech Corporation, Durham, NH

Mike Ricchetti, ATI Research, Inc., Marlborough, MA

Liviu Miclea, Department of Automation , Technical University of Cluj-Napoca, Romania

Szilard Enyedi, Department of Automation , Technical University of Cluj-Napoca, Romania

Gavril Toderean, Department of Telecommunications,Technical University of Cluj-Napoca, Romania

Alfredo Benso, Politecnico di Torino, Italy

Paolo Prinetto, Politecnico di Torino, Italy

David Resnick, Cray Inc., Chippewa Falls, WI

Fei Su, Duke University, Durham, NC

Krishnendu Chakrabarty, Duke University, Durham, NC

T. Balen, DELET-UFRGS, Univ. Fed. do Rio Grande do Sul Porto Alegre, Brazil

A. Jr. Andrade, DELET-UFRGS, Univ. Fed. do Rio Grande do Sul Porto Alegre, Brazil

F. Azais, Universite de Montpellier II Montpellier Cedex 5, France

M. Renovell, Universite de Montpellier II Montpellier Cedex 5, France

M. Lubaszewski, IMSE-CNM Inst. de Microelectr. De Sevilla Sevilla, Spain

Ali Muhtaroglu, Intel Corporation, Logic Technology Development, Hillsboro, OR

Benoit Provost, Intel Corporation, Logic Technology Development, Hillsboro, OR

Tawfik Rahal-Arabi, Intel Corporation, Logic Technology Development, Hillsboro, OR

Greg Taylor, Intel Corporation, Logic Technology Development, Hillsboro, OR

Sreejit Chakravarty, Intel Corporation, Santa Clara, USA

Eric W Savage, Intel Corporation, Santa Clara, USA

Eric N Tran, Intel Corporation, Santa Clara, USA

Laung-Terng Wang, SynTest Technologies, Inc., Sunnyvale , CA

Khader S. Abdel-Hafez, SynTest Technologies, Inc., Sunnyvale , CA

Shianling Wu, SynTest Technologies, Inc., Sunnyvale , CA

Xiaoqing Wen, Kyushu Institute of Technology, Japan

Hiroshi Furukawa, NEC Micro Systems, Ltd., Japan

Fei-Sheng Hsu, SynTest Technologies, Inc., Taiwan

Shyh-Horng Lin, SynTest Technologies, Inc., Taiwan

Sen-Wei Tsai, SynTest Technologies, Inc., Taiwan

Armin Wurtenberger, University of Innsbruck, Austria

Christofer S. Tautermann, University of Innsbruck, Austria

Sybille Hellebrand, University of Innsbruck, Austria

Kedarnath J. Balakrishnan, University of Texas, Austin, TX

Nur A. Touba, University of Texas, Austin, TX

Baris Arslan, University of California, San Diego

Alex Orailoglu, University of California, San Diego

C. Taillefer, McGill University, Canada

G.W. Roberts, McGill University, Canada

H. Mattes, Infineon Technologies Munich, Germany

Claus Dworski, Infineon Technologies, Villach, Austria

S. Sattler, Infineon Technologies Munich, Germany

Hideo Okawara, Agilent Technologies International Japan, Ltd. Tokyo, Japan

Jose Pineda de Gyvez, Philips Research Labs, Netherlands

Guido Gronthoud, Philips Research Labs, Netherlands

Cristiano Cenci, Philips Research Labs, Netherlands

Martin Posch, Philips Semiconductors Gratkorn Austria

Thomas Burger, Philips Semiconductors Gratkorn Austria

Manfred Koller, Philips Semiconductors Gratkorn Austria

Masaji Kume, Enterprise Server Division, Hitachi Ltd.

Katsutoshi Uehara, Enterprise Server Division, Hitachi Ltd.

Minoru Itakura, Enterprise Server Division, Hitachi Ltd.

Hideo Sawamoto, Enterprise Server Division, Hitachi Ltd.

Toru Kobayashi, Micro Device Division, Hitachi Ltd.

Masatoshi Hasegawa, Micro Device Division, Hitachi Ltd.

Hideki Hayashi, Hitachi ULSI Systems Co. Ltd.

Robert C. Aitken, Artisan Components, Caspian Court Sunnyvale, CA, USA

Andrei Pavlov, University of Waterloo, Waterloo, ON, Canada

Manoj Sachdev, University of Waterloo, Waterloo, ON, Canada

Jose Pineda de Gyvez, Philips Research Labs, Eindhoven, Netherlands

Osamu Wada, Toshiba Corporation, Kawasaki, Japan

Toshimasa Namekawa, Toshiba Corporation, Kawasaki, Japan

Hiroshi Ito, Toshiba Corporation, Kawasaki, Japan

Atsushi Nakayama, Toshiba Corporation, Kawasaki, Japan

Shuso Fujii, Toshiba Corporation, Kawasaki, Japan

Shahdad Irajpour, University of Southern California, Los Angeles, CA

Sandeep K. Gupta, University of Southern California, Los Angeles, CA

Melvin A. Breuer, University of Southern California, Los Angeles, CA

Manan Syal, Virginia Tech, Blacksburg, VA.

Michael S. Hsiao, Virginia Tech, Blacksburg, VA.

Sreejit Chakravarty, Intel Architecture Group, Intel Corporation, Santa Clara, CA

Quming Zhou, Department of Electrical and Computer Engineering Rice University, Houston, TX

Kartik Mohanram, Department of Electrical and Computer Engineering Rice University, Houston, TX

Puneet Gupta, Cadence Design Systems, TDA, Endicott, NY

Michael S. Hsiao, Virginia Tech, Blacksburg, VA

Charles A. Njinda, Procket Networks, Cadillac Court, Milpitas, CA

Sunil Kalidindi, IXIA Corporation., Calabasas CA,

Nghia Huynh, Cisco Systems Inc., San Jose CA,

Bill Eklow, Cisco Systems Inc., San Jose CA

Josh Goldstein, IXIA Corporation, Calabasas CA

Thomas J. Anderson, Wavecrest Corporatio, Technology Drive, San Jose, CA

Baolin Deng, University of Erlangen-Nuremberg, Germany

Wolfram Glauert, University of Erlangen-Nuremberg, Germany

M. Zambaldi, Infineon Technologies AG, Munich, Germany

W. Ecker, Infineon Technologies AG, Munich, Germany

R Raghuraman, Texas Instruments Ltd., Bangalore , India.

Bhaskar Chatterjee, University of Waterloo, Waterloo, ON, Canada

Manoj Sachdev, University of Waterloo, Waterloo, ON, Canada

Ali Keshavarzi, Circuits Research, Intel Labs Hillsboro, OR, USA

Ramyanshu Datta, University of Texas at Austin Austin, TX

Ravi Gupta, University of Texas at Austin Austin, TX

Antony Sebastine, University of Texas at Austin Austin, TX

Jacob A. Abraham, University of Texas at Austin Austin, TX

Manuel d'Abreu, Sun Microsystems, Sunnyvale, CA

Kenneth A. Brand, Stanford University, Stanford, CA, USA

Erik Volkerink, Stanford University, Stanford, CA, USA

Edward J. McCluskey, Stanford University, Stanford, CA, USA

Subhasish Mitra, Intel Corporation, Folsom, CA, USA

Dongwoo Hong, University of California, Santa Barbara

Chee-Kian Ong, University of California, Santa Barbara

Kwang-Ting (Tim) Cheng, University of California, Santa Barbara

Peter M. Levine, McGill University, Canada

Gordon W. Roberts, McGill University, Canada

Mike Li, Wavecrest, Technology Dr., San Jose, CA

Andy Martwick, Intel, Folsom, CA

Gerry Talbot, AMD, MA

Jan Wilstrup, Teradyne Inc., Fridley, MN

William R. Mann, SWTW General Chair and Rockwell International, Newport Beach, CA

Frederick L. Taber, BiTS Workshop General Chair and IBM Microelectronics, LaGrangeville, NY

Philip W. Seitzer, Distinguished Member of Technical Staff, Agere Systems, Allentown PA

Jerry J. Broz, SWTW Technical Chair and International Test Solutions, Reno, NV

Qiang Xu, McMaster University, Hamilton, ON

Nicola Nicolici, McMaster University, Hamilton, ON

Anuja Sehgal, Duke University

Sandeep Kumar Goel, Philips Research, Netherlands

Erik Jan Marinissen, Philips Research, Netherlands

Krishnendu Chakrabarty, Duke University

Kuo-Liang Cheng, National Tsing Hua University, Taiwan

Jing-Reng Huang, National Tsing Hua University, Taiwan

Chih-Wea Wang, National Tsing Hua University, Taiwan

Chih-Yen Lo, National Tsing Hua University, Taiwan

Li-Ming Denq, National Tsing Hua University, Taiwan

Chih-Tsun Huang, National Tsing Hua University, Taiwan

Shin-Wei Hung, Global UniChip Corp., Taiwan

Jye-Yuan Lee, Global UniChip Corp., Taiwan

C. Metra, DEIS - U. of Bologna (Italy)

TM Mak, Intel Corp., Santa Clara (CA)

M. Omana, DEIS - U. of Bologna (Italy)

Man Wah Chiang, McGill University, Canada

Zeljko Zilic, McGill University, Canada

Jean-Samuel Chenard, McGill University, Canada

Katarzyna Radecka, Concordia University, Canada

Kaijie Wu, Polytechnic University, Brooklyn, NY

Ramesh Karri, Polytechnic University, Brooklyn, NY

Grigori Kuznetsov, University of Potsdam, Germany

Michael Goessel, University of Potsdam, Germany

Burnell G. West, Credence, Baytech Drive, San Jose, CA

Michael F. Jones, Credence, Baytech Drive, San Jose, CA

Daisuke Watanabe, ADVANTEST Corporation, Japan

Masakatsu Suda, ADVANTEST Corporation, Japan

Toshiyuki Okayasu, ADVANTEST Corporation, Japan

Maurizio Gavardoni, Credence Systems Corporation, San Jose, CA

Michael Jones, Credence Systems Corporation, San Jose, CA

Russell Poffenberger, Credence Systems Corporation, San Jose, CA

Miguel Conde, Credence Systems Corporation, Cedex - France

Bipul C Paul, Purdue University

Cassondra Neau, Purdue University

Kaushik Roy, Purdue University

S.A. Bota, Univ. de les Illes Balears, Palma de Mallorca, Spain

M. Rosales, Univ. de les Illes Balears, Palma de Mallorca, Spain

J.L. Rosello, Univ. de les Illes Balears, Palma de Mallorca, Spain

J. Segura, Univ. de les Illes Balears, Palma de Mallorca, Spain

A. Keshavarzi, Circuit Research Labs., Intel Corporation, Portland, OR, USA

Brady Benware, LSI Logic Corporation, Fort Collins, CO

Cam Lu, LSI Logic Corporation, Fort Collins, CO

John Van Slyke, LSI Logic Corporation, Fort Collins, CO

Prabhu Krishnamurthy, LSI Logic Corporation, Fort Collins, CO

Robert Madge, LSI Logic Corporation, Fort Collins, CO

Martin Keim, Mentor Graphics Corporation

Mark Kassab, Mentor Graphics Corporation

Janusz Rajski, Mentor Graphics Corporation

Andy Kuo, University of British Columbia

Touraj Farahmand, University of British Columbia

Nelson Ou, University of British Columbia

Andre Ivanov, University of British Columbia

Sassan Tabatabaei, Guide Technology, Sunnyvale, CA

Gert Hansel, Infineon Technologies AG, Munich, Germany

Korbinian Stieglbauer, Infineon Technologies AG, Munich, Germany

Sassan Tabatabaei, Guide Technology, Sunnyvale, CA

Michael Lee, Guide Technology, Sunnyvale, CA

Freddy Ben-Zeev, Guide Technology, Sunnyvale, CA

Shalini Ghosh, Dept. of Electrical and Computer Engineering, University of Texas, Austin, TX

Nur A. Touba, Dept. of Electrical and Computer Engineering, University of Texas, Austin, TX

Sugato Basu, Dept. of Computer Sciences, University of Texas, Austin, TX

F. Corno, Politecnico di Torino - Dipartimento di Automatica e Informatica - Torino, Italy

M. Sonza Reorda, Politecnico di Torino - Dipartimento di Automatica e Informatica - Torino, Italy

S. Tosato, Politecnico di Torino - Dipartimento di Automatica e Informatica - Torino, Italy

F. Esposito, FIAT Auto - Product and Process Engineering - Integrated Chassis Control - Torino, Italy

Haibo Wang, Southern Illinois University Carbondale

Suchitra Kulkarni, Southern Illinois University Carbondale

Spyros Tragoudas, Southern Illinois University Carbondale

Erik Larsson, Linkopings Universitet, Sweden

Ozgur Sinanoglu, University of California, San Diego

Alex Orailoglu, University of California, San Diego

Chunsheng Liu, University of Nebraska

Hamid Sharif, University of Nebraska

Erika Cota, Universidade Federal do Rio Grande do Sul, Brazil

D.K. Pradhan, University of Bristol, UK

Hanjun Jiang, Iowa State University Ames, IA

Beatriz Olleta, Iowa State University Ames, IA

Degang Chen, Iowa State University Ames, IA

Randall L. Geiger, Iowa State University Ames, IA

Hak-soo Yu, University of Texas at Austin, Austin, TX

Hongjoong Shin, University of Texas at Austin, Austin, TX

Ji Hwan (Paul) Chun, University of Texas at Austin, Austin, TX

Jacob A. Abraham, University of Texas at Austin, Austin, TX

Zhongjun Yu, Iowa State University

Degang Chen, Iowa State University

Randy Geiger, Iowa State University

Gordon D Robinson, Fremont, CA

Sergio M Perez, Advantest America, Inc.

Dr. Burnell G. West, Credence Systems Corporation, San Jose, USA

Erik Jan Marinissen, Erik Jan Marinissen

Herve FLEURY, Philips Semiconductors, France

Stephen Pateras, LogicVision

Rohit Kapur, Synopsys Inc.

Laurent Sourgen, STMicroelectronics, France

Mohamed M. Hafed, DFT MicroSystems Canada Inc.

Greg Aldrich, Mentor Graphics Corporation

Brady R. Benware, LSI Logic Corporation, Fort Collins, CO

Kenneth M. Butler, Texas Instruments Inc.

Phil Nigh, IBM Technology and Systems Group, Essex Junction, VT

Sanjay Sengupta, Intel Corp. Santa Clara, CA, USA

Tom Storey, BAE Systems Manassas, VA

Bill Eklow, Cisco Systems, Inc.

Jay J. Nejedlo, Intel Corporation at Hillsboro, OR

Rob Jukna, Jabil Circuit Inc.- Advanced Manufacturing Technology

Kenneth P. Parker, Agilent Technologies Loveland, CO

Michael J Smith, Teradyne Inc, North Reading, MA. USA

Robert Daasch, Portland State University

Manu Rehani, LSI Logic Corporation, OR

Phil Nigh, IBM Technology and Systems Group Essex Junction, VT

Robert Madge, LSI Logic

Nilanjan Mukherjee, Mentor Graphics Corporation, Wilsonville, OR

Mike Tripp, Intel Corporation

Mike Li, Wavecrest, San Jose, CA

Takahiro J. Yamaguchi, Advantest Laboratories, Ltd., Sendai, Miyagi, Japan

John C. Johnson, Intel Corporation, Test Platform Architecture and Development

Mike Li, Wavecrest, San Jose, CA

Jim Sproch, Synopsys Test Automation Products Group

Yukio Okuda, Sony SSNC, ITC-Asia Subcommittee, Japan

Thomas W. Bartenstein, Cadence Design Inc., Endicott, NY

Edward I. Jr. Cole, Sandia National Laboratories Albuquerque, USA

Anne Gattiker, IBM Austin Research Lab, Austin, TX

Srikanth Venkataraman, Intel Corporation, Hillsboro, OR

Kiyoshi Nikawa, NEC Electronics Corporation

Yervant Zorian, Virage Logic, Inc.

Jitendra B. Khare, Ample Communications, Inc., Fremont, CA USA.

Joseph A. Reynick, eSilicon Corporation, Allentown, Pennsylvania, USA

Jun Qian, Cisco Systems, Inc. San Jose, USA

Mike Tripp, Intel Corporation

T.M. Mak, Intel Corporation

Anne Meixner, Intel Corporation