ISBN: 0-7803-8107-6

David W. Yen, Sun Microsystems

Janusz Rajski, Mentor Graphics Corporation

J. M. Portal, IMT - Technop?le de Ch?teau Gombert

H. Aziza, IMT - Technop?le de Ch?teau Gombert; ST-Microelectronics

D. N?, ST-Microelectronics

Chih-Wea Wang, National Tsing Hua University

Kuo-Liang Cheng, National Tsing Hua University

Jih-Nung Lee, National Tsing Hua University

Yung-Fa Chou, National Tsing Hua University

Chih-Tsun Huang, National Tsing Hua University

Cheng-Wen Wu, National Tsing Hua University

Frank Huang, Spirox Co.

Hong-Tzer Yang, Spirox Co.

Derek Wright, University of Waterloo, Canada

Manoj Sachdev, University of Waterloo, Canada

Masashi Shimanouchi, NPTest, a Schlumberger Company

Takahiro J. Yamaguchi, Advantest Laboratories, Ltd., Sendai, Miyagi, Japan

Mani Soma, University of Washington, Seattle, WA

Masahiro Ishida, Advantest Laboratories, Ltd., Sendai, Miyagi, Japan

Makoto Kurosawa, Advantest Corporation, Gunma, Japan

Hirobumi Musha, Advantest Corporation, Gunma, Japan

Henry C. Lin, University of Washington, Seattle, WA

Karen Taylor, University of Washington, Seattle, WA

Alan Chong, University of Washington, Seattle, WA

Eddie Chan, University of Washington, Seattle, WA

Mani Soma, University of Washington, Seattle, WA

Hosam Haggag, Santa Clara Design Center, National Semiconductor, Santa Clara, CA

Jeff Huard, Tacoma Design Center, National Semiconductor, Federal Way, WA

Jim Braatz, Tacoma Design Center, National Semiconductor, Federal Way, WA

Thomas S. Barnett, IBM Microelectronics

Adit D. Singh, Auburn University

Yoshihito Nishizaki, Kawasaki Microelectronics, Inc.

Osamu Nakayama, Kawasaki Microelectronics, Inc.

Chiaki Matsumoto, Kawasaki Microelectronics, Inc.

Yoshitaka Kimura, Kawasaki Microelectronics, Inc.

Toshimi Kobayashi, Kawasaki Microelectronics, Inc.

Hiroyuki Nakamura, Kawasaki Microelectronics, Inc.

Oleg Semenov, University of Waterloo, Canada

Arman Vassighi, University of Waterloo, Canada

Manoj Sachdev, University of Waterloo, Canada

Ali Keshavarzi, Intel Corporation, Hillsboro, OR

C.F. Hawkins, University of New Mexico, Albuquerque

Haihua Yan, Auburn University

Adit D. Singh, Auburn University

Xiaoliang Bai, University of California, San Diego, CA

Sujit Dey, University of California, San Diego, CA

Angela Krstic, University of California, Santa Barbara, CA

Rahul Kundu, Carnegie Mellon University, Pittsburgh, PA

R. D. (Shawn) Blanton, Carnegie Mellon University, Pittsburgh, PA

S. R. Seward, University of Arkansas, Fayetteville

P. K. Lala, University of Arkansas, Fayetteville

Miroslav N. Velev, Georgia Institute of Technology, Atlanta

Amir Hekmatpour, IBM Microelectronics, Research Triangle Park, North Carolina

James Coulter, IBM Microelectronics, Research Triangle Park, North Carolina

Eric Starkloff, National Instruments, Austin, TX

Tim Fountain, National Instruments, Austin, TX

Garth Black, National Instruments, Austin, TX

J.S. Davis, Georgia Institute of Technology

D.C. Keezer, Georgia Institute of Technology

O. Liboiron-Ladouceur, Columbia University

K. Bergman, Columbia University

Ahmed Rashid Syed, NPTest

Maurizio Gavardoni, NPTest

D.C. Keezer, Georgia Institute of Technology, Atlanta

D. Minier, IBM Canada

M.C. Caron, IBM Canada

S. Bernard, University of Montpellier / CNRS, France

M. Comte, University of Montpellier / CNRS, France

F. Aza?, University of Montpellier / CNRS, France

Y. Bertrand, University of Montpellier / CNRS, France

M. Renovell, University of Montpellier / CNRS, France

Gwenol? Maugard, Raheen Industrial Estate, Limerick, Ireland

Carsten Wegener, University College Cork, Ireland

Tom O'Dwyer, Raheen Industrial Estate, Limerick, Ireland

Michael Peter Kennedy, University College Cork, Ireland

Le Jin, Texas Instruments Inc., Dallas

Kumar Parthasarathy, Iowa State University, Ames

Turker Kuyel, Iowa State University, Ames

Degang Chen, Texas Instruments Inc., Dallas

Randall L. Geiger, Texas Instruments Inc., Dallas

Stephen K. Sunter, LogicVision, Inc.

Franco Stellari, IBM T.J. Watson Research Center, Yorktown Heights, NY

Peilin Song, IBM T.J. Watson Research Center, Yorktown Heights, NY

Moyra K. McManus, IBM T.J. Watson Research Center, Yorktown Heights, NY

Robert Gauthier, IBM Microelectronics Semiconductor and Research Development Center, Essex Junction, VT

Alan J. Weger, IBM T.J. Watson Research Center, Yorktown Heights, NY

Kiran Chatty, IBM Microelectronics Semiconductor and Research Development Center, Essex Junction, VT

Mujahid Muhammad, IBM Microelectronics Semiconductor and Research Development Center, Essex Junction, VT

Pia Sanda, IBM Systems Group, Poughkeepsie, NY

K. R. Wilsher, NPTest, San Jose, CA

Romain Desplats, CNES- French Space Agency, France

Felix Beaudoin, CNES- French Space Agency, France

Philippe Perdu, CNES- French Space Agency, France

Nagamani Nataraj, NPTest, San Jose, CA

Ted Lundquist, NPTest, San Jose, CA

Ketan Shah, NPTest, San Jose, CA

Jeremy A. Rowlette, Intel Corporation

Travis M. Eiles, Intel Corporation

Vishwani D. Agrawal, Rutgers University, Piscataway, NJ

A. V. S. S. Prasad, Agere Systems, Bangalore, India

Madhusudan V. Atre, Agere Systems, Bangalore, India

Qingwei Wu, Virginia Tech, Blacksburg, VA

Michael S. Hsiao, Virginia Tech, Blacksburg, VA

Liang Zhang, Virginia Tech, Blacksburg, VA

Indradeep Ghosh, Fujitsu Labs. of America Inc., Sunnyvale, CA

Michael Hsiao, Virginia Tech, Blacksburg, VA

Mahesh A. Iyer, Synopsys, Inc. Mountain View, CA

Thomas J. Vogels, Carnegie Mellon University, Pittsburgh, PA

Wojciech Maly, Carnegie Mellon University, Pittsburgh, PA

R.D. (Shawn) Blanton, Carnegie Mellon University, Pittsburgh, PA

Yu Huang, Mentor Graphics Corporation, Wilsonville, OR

Wu-Tung Cheng, Mentor Graphics Corporation, Wilsonville, OR

Sudhakar M. Reddy, University of Iowa, Iowa City

Cheng-Ju Hsieh, Faraday Technology Corporation

Yu-Ting Hung, Faraday Technology Corporation

Zhiyuan Wang, University of California, Santa Barbara

Kun-Han Tsai, Mentor Graphics Corporation

Malgorzata Marek-Sadowska, University of California, Santa Barbara

Janusz Rajski, Mentor Graphics Corporation

Angela Krstic, UC-Santa Barbara

Li-C. Wang, Intel Corporation

Kwang-Ting Cheng

T. M. Mak

YongJoon Kim, Yonsei University

DongSub Song, Yonsei University

YongSeung Shin, Yonsei University

Sunghoon Chun, Yonsei University

Sungho Kang, Yonsei University

Kevin Melocco, Cadence Design Systems - Test Design Automation - Endicott, NY

Hina Arora, Cadence Design Systems - Test Design Automation - Endicott, NY

Paul Setlak, Cadence Design Systems - Test Design Automation - Endicott, NY

Gary Kunselman, IBM Microelectronics - DFTS Development and Methodology - Burlington, VT

Shazia Mardhani, Sun Microsystems - High End Server Engineering - Burlington, MA

Kendrick Baker, Raytheon Company, McKinney, TX

Henk D.L. Hollmann, Philips Research Laboratories

Erik Jan Marinissen, Philips Research Laboratories

Bart Vermeulen, Philips Research Laboratories

D. Appello, ST Microelectronics, Cornaredo, Italy

P. Bernardi, Politecnico di Torino, Italy

A. Fudoli, ST Microelectronics, Cornaredo, Italy

M. Rebaudengo, Politecnico di Torino, Italy

M. Sonza Reorda, Politecnico di Torino, Italy

V. Tancorre, ST Microelectronics, Cornaredo, Italy

M. Violante, Politecnico di Torino, Italy

Theo J. Powell, Texas Instruments Inc.

Wu-Tung Cheng, Mentor Graphics Corporation

Joseph Rayhawk, Mentor Graphics Corporation

Omer Samman, Mentor Graphics Corporation

Paul Policke, Texas Instruments Inc.

Sherry Lai, Texas Instruments Inc.

Jin-Fu Li, National Central University

Jen-Chieh Yeh, National Tsing Hua University

Rei-Fu Huang, National Tsing Hua University

Cheng-Wen Wu, National Tsing Hua University

Peir-Yuan Tsai, ADMTek Incorporated

Archer Hsu, ADMTek Incorporated

Eugene Chow, ADMTek Incorporated

Kranthi K. Pinjala, Arizona State University

Bruce C. Kim, Arizona State University

Pramod Variyam, Texas Instruments, Inc.

Nobuhiro Sato, Advantest Corp., Japan

Yoshihiro Hashimoto, Advantest Corp., Japan

Tomokazu Yoneda, Nara Institute of Science and Technology, Japan

Tetsuo Uchiyama, SOC Design Center, CANON INC.

Hideo Fujiwara, Nara Institute of Science and Technology, Japan

Yu-Shen Yang, University of Toronto, ON

J. Brandon Liu, University of Toronto, ON

Paul Thadikaran, Intel Corporation, OR

Andreas Veneris, University of Toronto, ON

N. Kranitis, University of Athens, Greece

G. Xenoulis, University of Piraeus, Greece

A. Paschalis, University of Athens, Greece

D. Gizopoulos, University of Piraeus, Greece

Y. Zorian, Virage Logic, Fremont, CA

Irith Pomeranz, Purdue University

Armin W?rtenberger, University of Innsbruck, Austria

Christofer S. Tautermann, University of Innsbruck, Austria

Sybille Hellebrand, University of Innsbruck, Austria

Lei Li, Duke University, Durham, NC

Krishnendu Chakrabarty, Duke University, Durham, NC

Bhargab B. Bhattacharya, Indian Statistical Institute

Sharad C. Seth, University of Nebraska-Lincoln

Sheng Zhang, University of Nebraska-Lincoln

Takaki Yoshida, Matsushita Electric Industrial Co., Ltd.

Masafumi Watati, Matsushita Electric Industrial Co., Ltd.

Y. Bonhomme, LIRMM, Universit? Montpellier II/CNRS, France

P. Girard, LIRMM, Universit? Montpellier II/CNRS, France

L. Guiller, Synopsys Inc., Mountain View, CA

C. Landrault, LIRMM, Universit? Montpellier II/CNRS, France

S. Pravossoudovitch, LIRMM, Universit? Montpellier II/CNRS, France

Bill Eklow, Cisco Systems Inc., San Jose CA

Carl Barnhart, Cadence Design Systems, Ojai, CA

Mike Ricchetti, Intellitech, Durham, NH

Terry Borroz, Teradyne, North Reading, MA

Ken Posse, Teseda, Corporation

Geir Eide, Teseda, Corporation

George Bao, Motorola Semiconductors Hong Kong Limited

Michael A. Jones

Jie Sun, Wavecrest Corporation, San Jose, CA

Mike Li, Wavecrest Corporation, San Jose, CA

Thomas P. Warwick, Evaluation and Product Engineering, Inc.

Xiaoyun Sun, University of Minnesota, Minneapolis

Larry Kinney, University of Minnesota, Minneapolis

Bapiraju Vinnakota, University of Minnesota, Minneapolis

Yukio Okuda, Platform Technology Center, Sony Corp.

Nobuyuki Furukawa, Sony Semicon Kyushu Corp.

C. Schuermyer, LSI Logic Corporation, Gresham, Oregon

B. Benware, LSI Logic Corporation, Gresham, Oregon

K. Cota, LSI Logic Corporation, Gresham, Oregon

R. Madge, LSI Logic Corporation, Gresham, Oregon

R. Daasch, Portland State University, Oregon

L. Ning, Portland State University, Oregon

Seongmoon Wang, NEC Labs., America, Princeton, NJ

Srimat T. Chakradhar, NEC Labs., America, Princeton, NJ

Puneet Gupta, Virginia Tech, Blacksburg

Michael S. Hsiao, Virginia Tech, Blacksburg

Wangqi Qiu, Texas A&M University

D. M. H. Walker, Texas A&M University

Ozgur Sinanoglu, University of California, San Diego

Alex Orailoglu, University of California, San Diego

?rika Cota, Universidade Federal do Rio Grande do Sul

Luigi Carro, Universidade Federal do Rio Grande do Sul

Fl?vio Wagner, Universidade Federal do Rio Grande do Sul

Marcelo Lubaszewski, Universidade Federal do Rio Grande do Sul

Qiang Xu, McMaster University, Hamilton, ON

Nicola Nicolici, McMaster University, Hamilton, ON

Suzette Vandivier, Agilent Technologies, Ft. Collins, CO.

Mark Wahl, Agilent Technologies, Ft. Collins, CO.

Jeff Rearick, Agilent Technologies, Ft. Collins, CO.

Ivan Duzevik, National Semiconductor, South Portland, Maine

Lee Whetsel, Texas Instruments

Jos? Pineda de Gyvez, Philips Research Laboratories

Guido Gronthoud, Philips Research Laboratories

Rashid Amine, Philips Research Laboratories

Iboun Taimiya Sylla, Texas Instruments Inc.

Achintya Halder, Georgia Institute of Technology, Atlanta

Soumendu Bhattacharya, Georgia Institute of Technology, Atlanta

Abhijit Chatterjee, Georgia Institute of Technology, Atlanta

Jeremy A. Walraven, Sandia National Laboratories, Albuquerque, NM

Tamal Mukherjee, Carnegie Mellon University, Pittsburgh, PA

Gary K. Fedder, Carnegie Mellon University, Pittsburgh, PA

Wanli Jiang, Guidant Corporation

Eric Peterson, Guidant Corporation

Bob Robotka, Guidant Corporation

Dhruva Acharyya, University of Maryland, Baltimore County

Jim Plusquellic, University of Maryland, Baltimore County

B. Alorda, Intel Corporation, Hillsboro, Oregon

B. Bloechel, Intel Corporation, Hillsboro, Oregon

A. Keshavarzi, Intel Corporation, Hillsboro, Oregon

J. Segura, Univ. de les Illes Balears, Dept. F?sica, Palma de Mallorca, Spain

Peter Wohl, Synopsys Inc.

John A. Waicukauski, Synopsys Inc.

Sanjay Patel, Synopsys Inc.

Minesh B. Amin, Synopsys Inc.

Ramesh C. Tekumalla, Sun Microsystems, Inc.

Janusz Rajski, Mentor Graphics Corporation

Jerzy Tyszer, Poznan University of Technology

Chen Wang, Mentor Graphics Corporation

Sudhakar M. Reddy, University of Iowa

Peter Dahlgren, Sun Microsystems, Inc.

Paul Dickinson, Sun Microsystems, Inc.

Ishwar Parulkar, Sun Microsystems, Inc.

Scott Erlanger, Intel

Dilip K. Bhavsar, Intel

Richard Davies, Hewlett-Packard Company

Teresa L. McLaurin, ARM Inc.

Frank Frederick, ARM Inc.

Rich Slobodnik, ARM Inc.

Jay J. Nejedlo, Intel Corporation, Hillsboro, OR

Jay J. Nejedlo, Intel Corporation, Hillsboro, OR

Leon van de Logt, Philips Research Eindhoven, The Netherlands

Frank van der Heyden, Philips Research Eindhoven, The Netherlands

Tom Waayers, Philips Research Eindhoven, The Netherlands

A.T. Sivaram, NPTest

Daniel Fan, NPTest

Jon Pryce, NPTest

A. Benso, Politecnico di Torino, Italy

S. Di Carlo, Politecnico di Torino, Italy

G. Di Natale, Politecnico di Torino, Italy

P. Prinetto, Politecnico di Torino, Italy

L. Tagliaferri, Politecnico di Torino, Italy

Daniel Fan, NPTest, Inc. LLC

Steve Roehling, NPTest, Inc. LLC

Rusty Carruth, NPTest, Inc. LLC

Paul Buxton, The Alba Centre, The Alba Campus, Livingston, Scotland

Paul Tabor, Test Advantage Inc, Tempe, AZ

Jeremy A. Walraven, Sandia National Laboratories, Albuquerque, NM

Jeremy A. Walraven, Sandia National Laboratories, Albuquerque, NM

Theresa Maudie, Motorola, Tempe, AZ

Alex Hardt, Motorola, Tempe, AZ

Rick Nielsen, Motorola, Tempe, AZ

Dennis Stanerson, Motorola, Tempe, AZ

Ron Bieschke, Motorola, Tempe, AZ

Mike Miller, Motorola, Tempe, AZ

Jeremy A. Walraven, Sandia National Laboratories, Albuquerque, NM

W. Maly, Carnegie Mellon University, Pittsburgh, PA

A. Gattiker, IBM

T. Zanon, Carnegie Mellon University, Pittsburgh, PA

T. Vogels, Carnegie Mellon University, Pittsburgh, PA

R. D. Blanton, Carnegie Mellon University, Pittsburgh, PA

T. Storey, PDF Solutions

Bram Kruseman, Philips Research Laboratories

Stefan van den Oetelaar, Philips Research Laboratories

R. D. (Shawn) Blanton, Carnegie Mellon University, Pittsburgh, PA

Kumar N. Dwarakanath, Carnegie Mellon University, Pittsburgh, PA

Anirudh B. Shah, Carnegie Mellon University, Pittsburgh, PA

Martin Oma?, D.E.I.S. University of Bologna, Italy

Daniele Rossi, D.E.I.S. University of Bologna, Italy

Cecilia Metra, D.E.I.S. University of Bologna, Italy

Kartik Mohanram, University of Texas at Austin, TX

Nur A. Touba, University of Texas at Austin, TX

Kaijie Wu, Polytechnic University

Ramesh Karri, Polytechnic University

B. Kiran Kumar, University of Arkansas, Fayetteville

P. K. Lala, University of Arkansas, Fayetteville

Ramesh Karri, Polytechnic University

Grigori Kuznetsov, University of Potsdam

Michael Goessel, University of Potsdam

H. Hashempour, Northeastern University, Boston, Mass

F. J. Meyer, Northeastern University, Boston, Mass

F. Lombardi, Northeastern University, Boston, Mass

F. Karimi, LTX Corp., San Jose, CA

Zhen Shi, University of Maryland

Peter Sandborn, University of Maryland

Burnell G. West, NPTest

Liviu Miclea, Technical University of Cluj-Napoca, Romania

Enyedi Szil?rd, Technical University of Cluj-Napoca, Romania

Gavril Toderean, Technical University of Cluj-Napoca, Romania

Alfredo Benso, Politecnico di Torino, Italy

Paolo Prinetto, Politecnico di Torino, Italy

Olivier Caty, Sun Microsystems, Sunnyvale, CA

Ismet Bayraktaroglu, Sun Microsystems, Sunnyvale, CA

Amitava Majumdar, Sun Microsystems, Sunnyvale, CA

Richard Lee, Microsoft Corporation, Mountain View, CA

John Bell, Sun Microsystems, Sunnyvale, CA

Lisa Curhan, Sun Microsystems, Sunnyvale, CA

Hardi Hungar, University of Dortmund, Germany; METAFrame Technologies GmbH, Germany

Tiziana Margaria, University of Dortmund, Germany; METAFrame Technologies GmbH, Germany

Bernhard Steffen, University of Dortmund, Germany

Rakesh N. Joshi, Texas Instruments, Inc. Sherman, Texas

Kenneth L. Williams, Texas Instruments, Inc. Sherman, Texas

Lee Whetsel, Texas Instruments, Inc. Sherman, Texas

Francisco DaSilva, Synopsys, Inc., Mountain View, CA

Yervant Zorian, Virage Logic, Fremont, CA

Lee Whetsel, Texas Instruments, Dallas, TX

Karim Arabi, PMC Sierra, Burnaby, BC

Rohit Kapur, Synopsys, Inc., Mountain View, CA

Michael G. Wahl, Universit?t Siegen

Sudipta Bhawmik, Agere Systems

Kamran Zarrineh, Sun Microsystems

Pradipta Ghosh, Sun Microsystems

Scott Davidson, Sun Microsystems

Peter Harrod, ARM

Kenichi Kataoka, University of Tokyo

Toshihiro Itoh, University of Tokyo

Tadatomo Suga, University of Tokyo

Mike Tripp, Intel Corporation

T.M. Mak, Intel Corporation

Anne Meixner, Intel Corporation

Cheng Jia, Georgia Institute of Technology, Atlanta

Linda Milor, Georgia Institute of Technology, Atlanta

Brady Benware, LSI Logic Corporation, Gresham, OR

Chris Schuermyer, LSI Logic Corporation, Gresham, OR

Sreenevasan Ranganathan, LSI Logic Corporation, Gresham, OR

Robert Madge, LSI Logic Corporation, Gresham, OR

Prabhu Krishnamurthy, LSI Logic Corporation, Gresham, OR

Nagesh Tamarapalli, Mentor Graphics Corporation, Wilsonville, OR

Kun-Han Tsai, Mentor Graphics Corporation, Wilsonville, OR

Janusz Rajski, Mentor Graphics Corporation, Wilsonville, OR

Li-C. Wang, UC-Santa Barbara

Angela Krstic, UC-Santa Barbara

Leonard Lee, UC-Santa Barbara

Kwang-Ting Cheng, UC-Santa Barbara

M. Ray Mercer, Texas A&M U.

T. W. Williams, Synopsys, Inc.

Magdy S. Abadir, Motorola, Inc.

Piet Engelke, Albert-Ludwigs-University

Ilia Polian, Albert-Ludwigs-University

Michel Renovell, LIRMM - UMII

Bernd Becker, Albert-Ludwigs-University

Masao Naruse, RENASAS, Technology corp., Kodaira-shi, Tokyo

Irith Pomeranz, Purdue University, W. Lafayette, IN

Sudhakar M. Reddy, University of Iowa, IA

Sandip Kundu, Intel corp., Austin, TX

Harald Vranken, Philips Research, Digital Design & Test, The Netherlands

Friedrich Hapke, Philips Semiconductors, Germany

Soenke Rogge, Philips Semiconductors, Germany

Domenico Chindamo, Agilent Technologies, Italy

Erik Volkerink, Agilent Technologies, Palo Alto, CA

Huaxing Tang, University of Iowa, IA

Sudhakar M. Reddy, University of Iowa, IA

Irith Pomeranz, Purdue University, West Lafayette, IN

Kun Young Chung, University of Southern California

Sandeep K. Gupta, University of Southern California

Jayashree Saxena

Kenneth M. Butler

Vinay B. Jayaram

Subhendu Kundu

N. V. Arvind

Pravin Sreeprakash

Manfred Hachinger

Haluk Konuk, Broadcom Corporation, Santa Clara, California

Leon Xiao, Broadcom Corporation, Santa Clara, California

Clayton Gibbs, Texas Instruments, Inc., Sherman, Texas

L. Forli, IMT - Technop?le de Ch?teau Gombert, France; ST-Microelectronics, France

J. M. Portal, IMT - Technop?le de Ch?teau Gombert, France

D. N?, ST-Microelectronics, France

B. Borot, ST-Microelectronics, France

Erik Larsson, Link?pings Universitet, Sweden

Zebo Peng, Link?pings Universitet, Sweden

Tom Waayers, Philips Research Laboratories, The Netherlands

Zhen Guo, New Jersey Institute of Technology

Jacob Savir, New Jersey Institute of Technology

Haralampos-G. D. Stratigopoulos, Yale University

Yiorgos Makris, Yale University

Ram Voorakaranam, Ardext Technologies, Tucson, AZ

Randy Newby, Texas Instruments Inc., Tucson, AZ

Sasi Cherubal, Ardext Technologies, Tucson, AZ

Bob Cometta, Texas Instruments Inc., Tucson, AZ

Thomas Kuehl, Texas Instruments Inc., Tucson, AZ

David Majernik, Arctic Systems Inc, Burtonsville, MD

Abhijit Chatterjee, Georgia Institute of Technology, Atlanta

Arun A. Joseph, University of Twente, The Netherlands

Hans G. Kerkhoff, University of Twente, The Netherlands

Fei Su, Duke University, Durham, NC

Sule Ozev, Duke University, Durham, NC

Krishnendu Chakrabarty, Duke University, Durham, NC

Mahim Mishra, Carnegie Mellon University, Pittsburgh, PA

Seth C. Goldstein, Carnegie Mellon University, Pittsburgh, PA

Frank Poehl, Infineon Technologies AG, Munich, Germany

Matthias Beck, Infineon Technologies AG, Munich, Germany

Ralf Arnold, Infineon Technologies AG, Munich, Germany

Peter Muhmenthaler, Mentor Graphics Corporation, Wilsonville, OR

Nagesh Tamarapalli, Mentor Graphics Corporation, Wilsonville, OR

Mark Kassab, Mentor Graphics Corporation, Wilsonville, OR

Nilanjan Mukherjee, Mentor Graphics Corporation, Wilsonville, OR

Janusz Rajski, Mentor Graphics Corporation, Wilsonville, OR

Graham Hetherington, Texas Instruments Ltd.

Richard Simpson, Texas Instruments Ltd.

David M. Wu, Intel Corporation

Mike Lin, Intel Corporation

Subhasish Mitra, Intel Corporation

Kee Sup Kim, Intel Corporation

Anil Sabbavarapu, Intel Corporation

Talal Jaber, Intel Corporation

Pete Johnson, Intel Corporation

Dale March, Intel Corporation

Greg Parrish, Intel Corporation

Erik Chmelar, Stanford University

Dereck A. Fernandes, University of Massachusetts, Amherst

Ian G. Harris, University of California Irvine

Charles E. Stroud, Auburn University, AL

Keshia N. Leach, University of North Carolina at Charlotte

Thomas A. Slaughter, University of North Carolina at Charlotte

Kenneth P. Parker, Agilent Technologies, Loveland, CO

Wouter Rijckaert, Philips Research Laboratories, Eindhoven, NL

Frans de Jong, Philips Research Laboratories, Eindhoven, NL

Frans de Jong, Philips Research Eindhoven, NL

Leon van de Logt, Philips Research Eindhoven, NL

Rubin A. Parekhji, Texas Instruments (India) Pvt. Ltd., Murugeshpalya, Bangalore

Adit D. Singh, Auburn University, AL

Phil Nigh, IBM Microelectronics, Essex Junction, Vermont

M. Nicolaidis, iRoC Technologies, Grenoble, France

Peter Ehlig, Texas Instruments, Inc., Stafford, Texas

Yervant Zorian, Virage Logic Corporation, Fremont, California

Geir Eide, Teseda

Ken Posse, Teseda

Mustapha Slamani, IBM Microelectronics

A. Chatterjee, Georgia Institute of Technology, Atlanta

William R. Eisenstadt, University of Florida, Gainesville

Jim Paviol, Intersil Corporation-Wireless Division, Melbourne, FL

Ian G. Harris, University of California Irvine

Franco Fummi, Universit? di Verona, Verona, Italy

Prab Varma, Veritable Inc., Mountain View, CA

Kwang-Ting (Tim) Cheng, University of California, Santa Barbara

Jim Webster, Bae Systems, Edinburgh

Eric L. Smitt, ELS Designs

Bob Stasonis, Teradyne, Inc., North Reading, MA

Fidel Muradali, Agilent Technologies

Don Wheater, IBM Corporation

John Roberts, ST Assembly Test Services, Inc.

Lee Y. Song, Teradyne, Inc., Agoura Hills, CA

Tom Newsom, Agilent Technologies