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2009 10th International Symposium on Quality of Electronic Design
San Jose, CA, USA
March 16-March 18
ISBN: 978-1-4244-2952-3
Table of Contents
Papers
Adam C. Cabe, University of Virginia, 301 McCormick Rd., Charlottesville, 22904, USA
Zhenyu Qi, University of Virginia, 301 McCormick Rd., Charlottesville, 22904, USA
Stuart N. Wooters, University of Virginia, 301 McCormick Rd., Charlottesville, 22904, USA
Travis N. Blalock, University of Virginia, 301 McCormick Rd., Charlottesville, 22904, USA
Mircea R. Stan, University of Virginia, 301 McCormick Rd., Charlottesville, 22904, USA
pp. 1-6
Chenyue Ma, The Micro-&Nano Electronic Device and Integrated Technology Group, The Key Laboratory of Integrated Microsystems, Shenzhen Graduate School of Peking University, China
Bo Li, The Micro-&Nano Electronic Device and Integrated Technology Group, The Key Laboratory of Integrated Microsystems, Shenzhen Graduate School of Peking University, China
Lining Zhang, TSRC, Key Laboratory of Microelectronic Devices and Circuits of Ministry of Education, Institute of Microelectronics, EECS, Peking University, Beijing, China
Jin He, The Micro-&Nano Electronic Device and Integrated Technology Group, The Key Laboratory of Integrated Microsystems, Shenzhen Graduate School of Peking University, China
Xing Zhang, TSRC, Key Laboratory of Microelectronic Devices and Circuits of Ministry of Education, Institute of Microelectronics, EECS, Peking University, Beijing, China
Xinnan Lin, The Micro-&Nano Electronic Device and Integrated Technology Group, The Key Laboratory of Integrated Microsystems, Shenzhen Graduate School of Peking University, China
Mansun Chan, Department of ECE, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong
pp. 7-12
Balaji Vaidyanathan, Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, Taiwan
Anthony S. Oates, Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, Taiwan
Yuan Xie, Department of Computer Science and Engineering, Pennsylvania State University, USA
Yu Wang, Department of Electronics Engineering, Tsinghua University, Beijing, China
pp. 13-18
Yu Wang, Dept. of E.E., TNList, Tsinghua Univ., Beijing, China
Xiaoming Chen, Dept. of E.E., TNList, Tsinghua Univ., Beijing, China
Wenping Wang, Dept. of E.E., Arizona State Univ., USA
Varsha Balakrishnan, Dept. of E.E., Arizona State Univ., USA
Yu Cao, Dept. of E.E., Arizona State Univ., USA
Yuan Xie, Dept. of CSE, Pennsylvania State Univ., USA
Huazhong Yang, Dept. of E.E., TNList, Tsinghua Univ., Beijing, China
pp. 19-26
R. Venkatraman, LSI Corporation, Milpitas, CA, USA
R. Castagnetti, LSI Corporation, Milpitas, CA, USA
A. Teene, LSI Corporation, Milpitas, CA, USA
B. Mbouombouo, LSI Corporation, Milpitas, CA, USA
S. Ramesh, LSI Corporation, Milpitas, CA, USA
pp. 27-32
Hariharan Sankaran, CSE Department, University of South Florida, 4202 E. Fowler Ave., ENB 118, Tampa, 33620, USA
Srinivas Katkoori, CSE Department, University of South Florida, 4202 E. Fowler Ave., ENB 118, Tampa, 33620, USA
pp. 33-39
Wei Yao, Electrical Engineering Dept., University of California, Los Angeles, 90095, USA
Yiyu Shi, Electrical Engineering Dept., University of California, Los Angeles, 90095, USA
Lei He, Electrical Engineering Dept., University of California, Los Angeles, 90095, USA
Sudhakar Pamarti, Electrical Engineering Dept., University of California, Los Angeles, 90095, USA
Yu Hu, Electrical Engineering Dept., University of California, Los Angeles, 90095, USA
pp. 40-46
Dhruva Ghai, VLSI Design and CAD Laboratory (VDCL), University of North Texas, Denton, 76203, USA
Saraju P. Mohanty, VLSI Design and CAD Laboratory (VDCL), University of North Texas, Denton, 76203, USA
Elias Kougianos, VLSI Design and CAD Laboratory (VDCL), University of North Texas, Denton, 76203, USA
Priyadarsan Patra, Validation Research Lab, Intel Corporation, Hillsboro, OR 97124, USA
pp. 47-54
Xin Wang, Synopsys Inc., 700 E. Middlefield Rd, Mountain View, CA 9404, USA
Alireza Kasnavi, Synopsys Inc., 700 E. Middlefield Rd, Mountain View, CA 9404, USA
Harold Levy, Synopsys Inc., 700 E. Middlefield Rd, Mountain View, CA 9404, USA
pp. 55-61
Chandra S. Nagarajan, Cisco Systems Inc., San Jose, CA, USA
Lin Yuan, Synopsys, Inc., Mountain View, CA, USA
Gang Qu, University of Maryland, College Park, USA
Barbara G. Stamps, Atmel Corp., Columbia, MD, USA
pp. 62-67
Chun-Yu Chuang, Industrial Technology Research Institute, Taiwan
Wai-Kei Mak, Department of Computer Science, National Tsing-Hua University, Taiwan
pp. 68-73
Savithri Sundareswaran, Freescale Semiconductor, Austin, Texas USA
Rajendran Panda, Freescale Semiconductor, Austin, Texas USA
Jacob A. Abraham, The University of Texas at Austin, USA
Yun Zhang, Freescale Semiconductor, Austin, Texas USA
Amit Mittal, Freescale Semiconductor, Austin, Texas USA
pp. 74-79
Charles Augustine, School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA
Arijit Raychowdhury, Intel Corporation, Hillsboro, OR, USA
Yunfei Gao, School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA
Mark Lundstrom, School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA
Kaushik Roy, School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA
pp. 80-85
Rakesh Anigundi, Rensselaer Polytechnic Institute, Troy, NY USA
Hongbin Sun, Xi'an Jiaotong University, Shaanxi, China
Jian-Qiang Lu, Rensselaer Polytechnic Institute, Troy, NY USA
Ken Rose, Rensselaer Polytechnic Institute, Troy, NY USA
Tong Zhang, Rensselaer Polytechnic Institute, Troy, NY USA
pp. 86-90
Jeremy R. Tolbert, Georgia Institute of Technology, 266 Ferst Drive NW, Atlanta, USA
Saibal Mukhopadhyay, Georgia Institute of Technology, 266 Ferst Drive NW, Atlanta, USA
pp. 91-96
Bao Liu, Electrical and Computer Engineering Department, The University of Texas at San Antonio, 78249-0669, USA
pp. 97-102
Karthik Rajagopal, Texas Instruments India Pvt. Ltd., Bagmane Tech Park Bangalore, Karnataka - 560093 INDIA
Aatmesh, Texas Instruments India Pvt. Ltd., Bagmane Tech Park Bangalore, Karnataka - 560093 INDIA
Vinod Menezes, Texas Instruments India Pvt. Ltd., Bagmane Tech Park Bangalore, Karnataka - 560093 INDIA
pp. 103-106
Soheil Ziabakhsh, Electrical Engineering, University of Guilan, Faculty of Engineering, Rasht, Iran
Hosein Alavi-Rad, Electrical Engineering, University of Guilan, Faculty of Engineering, Rasht, Iran
Mohammad Alavi-Rad, Electrical Engineering Department, Sharif University of Technology, Tehran, Iran
Mohammad Mortazavi, Engineering&Science Department, Sharif University of Technology, International Campus, Kish, Iran
pp. 107-111
Wai Leng Cheong, School of EECS, Oregon State University, Corvallis, 97331, USA
Brian Owens, School of EECS, Oregon State University, Corvallis, 97331, USA
Hui En Pham, School of EECS, Oregon State University, Corvallis, 97331, USA
Christopher Hanken, School of EECS, Oregon State University, Corvallis, 97331, USA
Jim Le, School of EECS, Oregon State University, Corvallis, 97331, USA
Terri Fiez, School of EECS, Oregon State University, Corvallis, 97331, USA
Kartikeya Mayaram, School of EECS, Oregon State University, Corvallis, 97331, USA
pp. 112-115
Charbel J. Akl, University of Louisiana at Lafayette, LA USA
Rafic A. Ayoubi, University of Balamand, Lebanon
Magdy A. Bayoumi, University of Louisiana at Lafayette, LA USA
pp. 116-119
Ehsan Pakbaznia, University of Southern California, USA
Massoud Pedram, University of Southern California, USA
pp. 120-126
Kwangok Jeong, ECE Department, University of California at San Diego, USA
Andrew B. Kahng, CSE Department, University of California at San Diego, USA
Hailong Yao, CSE Department, University of California at San Diego, USA
pp. 127-134
Antonio Gusmao, TU Lisbon, IST / INESC-ID, Rua Alves Redol, 9, 1000-029 Lisboa, Portugal
L. Miguel Silveira, TU Lisbon, IST / INESC-ID, Rua Alves Redol, 9, 1000-029 Lisboa, Portugal
Jose Monteiro, TU Lisbon, IST / INESC-ID, Rua Alves Redol, 9, 1000-029 Lisboa, Portugal
pp. 135-140
Ying-Cherng Lan, Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, Taiwan, ROC
Michael C. Chen, Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, Taiwan, ROC
Wei-De. Chen, Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, Taiwan, ROC
Sao-Jie Chen, Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, Taiwan, ROC
Yu-Hen Hu, Department of Electrical and Computer Engineering, University of Wisconsin, Madison, WI53706, USA
pp. 141-146
Siddharth Garg, Dept. of ECE, Carnegie-Mellon University, PA USA, USA
Diana Marculescu, Dept. of ECE, Carnegie-Mellon University, PA USA, USA
pp. 147-155
Valeriy Sukharev, Mentor Graphics Corporation, San Jose, CA, USA
Ara Markosian, Mentor Graphics Corporation, San Jose, CA, USA
Armen Kteyan, Mentor Graphics Corporation, San Jose, CA, USA
Levon Manukyan, Mentor Graphics Corporation, San Jose, CA, USA
Nikolay Khachatryan, Mentor Graphics Corporation, San Jose, CA, USA
Jun-Ho Choy, Mentor Graphics Corporation, San Jose, CA, USA
Hasmik Lazaryan, Mentor Graphics Corporation, San Jose, CA, USA
Henrik Hovsepyan, Mentor Graphics Corporation, San Jose, CA, USA
Seiji Onoue, Toshiba Corporation, Corporate, Manufacturing Engineering Center, Japan
Takuo Kikuchi, Toshiba Corporation, Corporate, Manufacturing Engineering Center, Japan
Tetsuya Kamigaki, Toshiba Corporation Semiconductor, Company, Advanced Memory Development Center, Japan
pp. 156-161
Farshad Moradi, Nanoelectronics Group, Department of Informatics, University of Oslo, NO-0316, NORWAY
Dag T. Wisland, Nanoelectronics Group, Department of Informatics, University of Oslo, NO-0316, NORWAY
Hamid Mahmoodi, School of Engineering San Francisco State University, CA 94132, USA
Ali Peiravi, School of Engineering, Ferdowsi University of Mashhad, IRAN
Snorre Aunet, Nanoelectronics Group, Department of Informatics, University of Oslo, NO-0316, NORWAY
Tuan Vu Cao, Nanoelectronics Group, Department of Informatics, University of Oslo, NO-0316, NORWAY
pp. 162-166
Simeon Realov, Department of Electrical Engineering, Columbia University, USA
William McLaughlin, Department of Electrical Engineering, Columbia University, USA
K. L. Shepard, Department of Electrical Engineering, Columbia University, USA
pp. 167-171
Dhruva Ghai, VLSI Design and CAD Laboratory, University of North Texas, Denton, 76203, USA
Saraju P. Mohanty, VLSI Design and CAD Laboratory, University of North Texas, Denton, 76203, USA
Elias Kougianos, VLSI Design and CAD Laboratory, University of North Texas, Denton, 76203, USA
pp. 172-178
Jwu-E Chen, Department of Electrical Engineering National Central University Jhongli, Taoyuan, Taiwan, R.O.C.
Pei-Wen Luo, SoC Technology Center Industrial Technology Research Institute Hsin Chu, Taiwan, R.O.C.
Chin-Long Wey, Department of Electrical Engineering National Central University Jhongli, Taoyuan, Taiwan, R.O.C.
pp. 179-184
Aditya P. Karmarkar, Synopsys (India) Private Limited, Hyderabad, Andhra Pradesh, India
Xiaopeng Xu, Synopsys, Inc., Mountain View, CA USA
Victor Moroz, Synopsys, Inc., Mountain View, CA USA
Greg Rollins, Synopsys, Inc., Mountain View, CA USA
Xiao Lin, Synopsys, Inc., Mountain View, CA USA
pp. 185-189
R. Kanj, IBM Austin Research Labs, Tx 78758, USA
R. Joshi, IBM Austin Research Labs, Tx 78758, USA
JB Kuang, IBM Austin Research Labs, Tx 78758, USA
J. Kim, IBM Austin Research Labs, Tx 78758, USA
M. Meterelliyoz, IBM Austin Research Labs, Tx 78758, USA
W. Reohr, IBM Austin Research Labs, Tx 78758, USA
S. Nassif, IBM Austin Research Labs, Tx 78758, USA
K. Nowka, IBM Austin Research Labs, Tx 78758, USA
pp. 190-194
Hiroki Sunagawa, Department of Communications and Computer Engineering, Kyoto University, Japan
Haruhiko Terada, Department of Communications and Computer Engineering, Kyoto University, Japan
Akira Tsuchiya, Department of Communications and Computer Engineering, Kyoto University, Japan
Kazutoshi Kobayashi, Department of Communications and Computer Engineering, Kyoto University, Japan
Hidetoshi Onodera, Department of Communications and Computer Engineering, Kyoto University, Japan
pp. 195-200
Yan Liu, Cardiac Rhythm Disease Management, Medtronic, Inc., 8200 Coral Sea Street NE, Mounds View, MN, 55112, USA
Scott Hareland, Cardiac Rhythm Disease Management, Medtronic, Inc., 8200 Coral Sea Street NE, Mounds View, MN, 55112, USA
Donald Hall, Cardiac Rhythm Disease Management, Medtronic, Inc., 8200 Coral Sea Street NE, Mounds View, MN, 55112, USA
Bill Wold, Cardiac Rhythm Disease Management, Medtronic, Inc., 8200 Coral Sea Street NE, Mounds View, MN, 55112, USA
Roger Hubing, Cardiac Rhythm Disease Management, Medtronic, Inc., 8200 Coral Sea Street NE, Mounds View, MN, 55112, USA
Robert Mehregan, Cardiac Rhythm Disease Management, Medtronic, Inc., 8200 Coral Sea Street NE, Mounds View, MN, 55112, USA
Ronen Malka, Cardiac Rhythm Disease Management, Medtronic, Inc., 8200 Coral Sea Street NE, Mounds View, MN, 55112, USA
Manish Sharma, Cardiac Rhythm Disease Management, Medtronic, Inc., 8200 Coral Sea Street NE, Mounds View, MN, 55112, USA
Tom Lane, Cardiac Rhythm Disease Management, Medtronic, Inc., 8200 Coral Sea Street NE, Mounds View, MN, 55112, USA
pp. 208-212
Satish Sivaswamy, Department of Electrical and Computer Engineering, University of Minnesota, Minneapolis, 55455, USA
Kia Bazargan, Department of Electrical and Computer Engineering, University of Minnesota, Minneapolis, 55455, USA
Marc Riedel, Department of Electrical and Computer Engineering, University of Minnesota, Minneapolis, 55455, USA
pp. 213-219
Biwei Liu, National University of Defense Technology, Deya Street, Changsha, Hunan Province, China
Shuming Chen, National University of Defense Technology, Deya Street, Changsha, Hunan Province, China
Yi Xu, National University of Defense Technology, Deya Street, Changsha, Hunan Province, China
pp. 220-225
Jone F. Chen, Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University, Tainan 701, Taiwan
Kuen-Shiuan Tian, Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University, Tainan 701, Taiwan
Shiang-Yu Chen, Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University, Tainan 701, Taiwan
Kuo-Ming Wu, Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu 300, Taiwan
C. M. Liu, Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu 300, Taiwan
pp. 226-229
Amir Khatib Zadeh, Department of Electrical&Computer Engineering, University of Waterloo, Canada, N2L 3G1
Catherine Gebotys, Department of Electrical&Computer Engineering, University of Waterloo, Canada, N2L 3G1
pp. 230-235
Hai Yu, TIMA Laboratory (CNRS-UJF-INPG), 46 Avenue F
Michael Nicolaidis, TIMA Laboratory (CNRS-UJF-INPG), 46 Avenue F
Lorena Anghel, TIMA Laboratory (CNRS-UJF-INPG), 46 Avenue F
pp. 236-240
Meng-Syue Chan, Dept. of Computer Science, National Tsing Hua University, Hsinchu, Taiwan
Chun-Yao Wang, Dept. of Computer Science, National Tsing Hua University, Hsinchu, Taiwan
Yung-Chih Chen, Dept. of Computer Science, National Tsing Hua University, Hsinchu, Taiwan
pp. 241-247
Bin Zhou, Microelectronics Center, Harbin Institute of Technology, Harbin, China
Yi-zheng Ye, Microelectronics Center, Harbin Institute of Technology, Harbin, China
Zhao-lin Li, Institute of Information Technology, Tsinghua University, Beijing, China
Xin-chun Wu, Microelectronics Center, Harbin Institute of Technology, Harbin, China
Rui Ke3, Research Center of Satellite Technology, Harbin Institute of Technology, China
pp. 248-252
Y. Benabboud, Laboratoire d'Informatique de Robotique et de Micro
A. Bosio, Laboratoire d'Informatique de Robotique et de Micro
P. Girard, Laboratoire d'Informatique de Robotique et de Micro
S. Pravossoudovitch, Laboratoire d'Informatique de Robotique et de Micro
A. Virazel, Laboratoire d'Informatique de Robotique et de Micro
L. Bouzaida, STMICROELECTRONICS 850 rue Jean Monnet 38920 Crolles, France
I. Izaute, STMICROELECTRONICS 850 rue Jean Monnet 38920 Crolles, France
pp. 253-259
A. Chandra, Synopsys, Inc., 700 E. Middlefield Rd., Mountain View, CA, 94043, USA
Y. Kanzawa, Synopsys, Inc., 700 E. Middlefield Rd., Mountain View, CA, 94043, USA
R. Kapur, Synopsys, Inc., 700 E. Middlefield Rd., Mountain View, CA, 94043, USA
pp. 260-265
Hsiu-Ming Chang, Department of Electrical and Computer Engineering, University of California, Santa Barbara, U.S.A.
Kuan-Yu Lin, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan
Chin-Hsuan Chen, Department of Electrical and Computer Engineering, University of California, Santa Barbara, U.S.A.
Kwang-Ting Cheng, Department of Electrical and Computer Engineering, University of California, Santa Barbara, U.S.A.
pp. 266-271
Hector Navarro, Inst. for Applied Microelectronics, Dept. of Electronic Engineering and Automation, ULPGC, Spain
Saeid Nooshabadi, Dept. of Information and Communications, Gwangju Institute of Science and Technology, Korea
Juan A. Montiel-Nelson, Inst. for Applied Microelectronics, Dept. of Electronic Engineering and Automation, ULPGC, Spain
V. Navarro, Inst. for Applied Microelectronics, Dept. of Electronic Engineering and Automation, ULPGC, Spain
J. Sosa, Inst. for Applied Microelectronics, Dept. of Electronic Engineering and Automation, ULPGC, Spain
Jose C. Garcia, Inst. for Applied Microelectronics, Dept. of Electronic Engineering and Automation, ULPGC, Spain
pp. 272-275
Bing-Wei Huang, Department of Electrical Engineering, National Central University, Jhongli, Taiwan 320
Jin-Fu Li, Department of Electrical Engineering, National Central University, Jhongli, Taiwan 320
pp. 276-279
Yuchun Ma, Department of Computer Science and Technology, Tsinghua University, Beijing, 100084, China
Xiang Qiu, Institute of Microelectronics, Tsinghua University, Beijing, 100084, China
Xiangqing He, Institute of Microelectronics, Tsinghua University, Beijing, 100084, China
Xianlong Hong, Department of Computer Science and Technology, Tsinghua University, Beijing, 100084, China
pp. 280-286
Yun Du, Institute of Microelectronics, Tsinghua University, Beijing, China
Yangshuo Ding, Institute of Microelectronics, Tsinghua University, Beijing, China
Yujie Chen, Institute of Microelectronics, Tsinghua University, Beijing, China
Zhiqiang Gao, Institute of Microelectronics, Tsinghua University, Beijing, China
pp. 287-290
Mohsen Raji, Amirkabir University of Technology, 424 Hafez Avenue, Tehran, I.R. Iran
Behnam Ghavami, Amirkabir University of Technology, 424 Hafez Avenue, Tehran, I.R. Iran
Hossein Pedram, Amirkabir University of Technology, 424 Hafez Avenue, Tehran, I.R. Iran
pp. 291-296
Lei Gao, University of Illinois at Chicago, 851 S. Morgan Street, 60607, USA
David Zaretsky, Binachip, Inc203 N. Wabash, Suite 603, Chicago, IL 60601, USA
Gaurav Mittal, Binachip, Inc203 N. Wabash, Suite 603, Chicago, IL 60601, USA
Dan Schonfeld, University of Illinois at Chicago, 851 S. Morgan Street, 60607, USA
Prith Banerjee, Binachip, Inc203 N. Wabash, Suite 603, Chicago, IL 60601, USA
pp. 297-302
Qian Ying Tang, University of California, Berkeley, 550 Cory Hall, 94720, USA
Qiang Chen, Synopsys, 700 E. Middlefield Rd. Mountain View, CA 94043, USA
Niloy Chatterjee, Synopsys (India) Pvt. Ltd., RMZ Infinity, Tower A, Muncipal #3, Benniganahalli, Old Madras Road, Bangalore, India 560016
Vedank Tripathi, Synopsys (India) Pvt. Ltd., RMZ Infinity, Tower A, Muncipal #3, Benniganahalli, Old Madras Road, Bangalore, India 560016
Natarajan Nandagopalan, Synopsys (India) Pvt. Ltd., RMZ Infinity, Tower A, Muncipal #3, Benniganahalli, Old Madras Road, Bangalore, India 560016
Sridhar Tirumala, Synopsys, 700 E. Middlefield Rd. Mountain View, CA 94043, USA
pp. 303-308
Thom Jefferson A. Eguia, Department of Electrical Engineering, University of California, Riverside, 92521, USA
Ning Mi, Department of Electrical Engineering, University of California, Riverside, 92521, USA
Sheldon X.-D. Tan, Department of Electrical Engineering, University of California, Riverside, 92521, USA
pp. 309-316
Yi-Ling Liu, Dept. of Computer Science, National Tsing Hua University, Hsinchu, Taiwan
Chun-Yao Wang, Dept. of Computer Science, National Tsing Hua University, Hsinchu, Taiwan
Yung-Chih Chen, Dept. of Computer Science, National Tsing Hua University, Hsinchu, Taiwan
Ya-Hsin Chang, Dept. of Computer Science, National Tsing Hua University, Hsinchu, Taiwan
pp. 317-323
Leomar S. da Rosa, Departamento de Inform
Felipe R. Schneider, Nangate Inc., Menlo Park, CA, USA
Renato P. Ribas, Instituto de Inform
Andre I. Reis, Nangate Inc., Menlo Park, CA, USA
pp. 324-329
Muhammad Rashid, Thomson Research and Development, Video Compression Laboratory, Cesson Sevigne, France
Fabrizio Ferrandi, Politecnico di Milano, Elettronica Informazione, Milan, Italy
Koen Bertels, Delft University of Technology, Computer Engineering Laboratory, The Netherlands
pp. 330-338
Adeel Israr, Integrated Circuits and Systems Lab, Technische Universit
Abdulhadi Shoufan, Integrated Circuits and Systems Lab, Technische Universit
Sorin A. Huss, Integrated Circuits and Systems Lab, Technische Universit
pp. 339-344
Feng Liu, National Lab of Parallel Distributed Processing, Hunan, China
Otmane Ait Mohamed, ECE department, Concordia University, Montreal, Quebec, Canada
Xiaoyu Song, ECE department, Portland State University, OR, USA
Qingping Tan, National Lab of Parallel Distributed Processing, Hunan, China
pp. 345-349
Amlan Ganguly, School of Electrical Engineering and Computer Science, Washington State University, Pullman, USA
Kevin Chang, School of Electrical Engineering and Computer Science, Washington State University, Pullman, USA
Partha Pratim Pande, School of Electrical Engineering and Computer Science, Washington State University, Pullman, USA
Benjamin Belzer, School of Electrical Engineering and Computer Science, Washington State University, Pullman, USA
Alireza Nojeh, Department of Electrical and Computer Engineering, University of British Columbia, Vancouver, Canada
pp. 350-355
Albert Chiang, Synopsys, Inc., Mountain View, CA USA 94043
Wei-Hua Han, Synopsys, Inc., Mountain View, CA USA 94043
Bhanu Kapoor, Mimasic, Richardson, TX USA 75082
pp. 356-359
Yongquan Fan, Department of ECE, McGill University, USA
Zeljko Zilic, Department of ECE, McGill University, USA
pp. 360-365
Hiroaki Yoshida, VLSI Design and Education Center (VDEC), University of Tokyo, Japan
Masahiro Fujita, VLSI Design and Education Center (VDEC), University of Tokyo, Japan
pp. 366-370
Mrinal Bose, Technology Solutions Organization, Freescale Semiconductor Inc., USA
Prashant Naphade, Technology Solutions Organization, Freescale Semiconductor Inc., USA
Jay Bhadra, Technology Solutions Organization, Freescale Semiconductor Inc., USA
Hillel Miller, Technology Solutions Organization, Freescale Semiconductor Inc., USA
pp. 377-381
Javid Jaffari, ECE Department, University of Waterloo, ON, Canada N2L 3G1
Mohab Anis, ECE Department, University of Waterloo, ON, Canada N2L 3G1
pp. 382-387
Koustav Bhattacharya, Department of Computer Science and Engineering, University of South Florida, Tampa - 33620, USA
Nagarajan Ranganathan, Department of Computer Science and Engineering, University of South Florida, Tampa - 33620, USA
pp. 388-393
Stephen Bijansky, The University of Texas at Austin, USA
Sae Kyu Lee, The University of Texas at Austin, USA
Adnan Aziz, The University of Texas at Austin, USA
pp. 394-400
Shingo Watanabe, Kyushu Institute of Technology, 680-4 Kawazu, Iizuka, 820-8502 Japan
Masanori Hashimoto, Osaka University, 1-5 Yamadaoka, Suita, 565-0871 Japan
Toshinori Sato, Fukuoka University, 8-19-1 Nanakuma, Jonan-ku, 814-0180 Japan
pp. 401-407
Natasa Miskov-Zivanov, Department of Electrical and Computer Engineering, Carnegie Mellon University, USA
Diana Marculescu, Department of Electrical and Computer Engineering, Carnegie Mellon University, USA
pp. 408-413
Thorsten Weyl, Analog Devices, Raheen Business Park, Limerick, Ireland
Dave Clarke, Analog Devices, Raheen Business Park, Limerick, Ireland
Karl Rinne, Department of Electronic and Computer Engineering, University of Limerick, Ireland
James A. Power, Analog Devices, Raheen Business Park, Limerick, Ireland
pp. 414-418
Ayhan Mutlu, Extreme DA Corporation, 3211 Scott Blvd., Santa Clara, CA 95054, USA
Jiayong Le, Extreme DA Corporation, 3211 Scott Blvd., Santa Clara, CA 95054, USA
Ruben Molina, Extreme DA Corporation, 3211 Scott Blvd., Santa Clara, CA 95054, USA
Mustafa Celik, Extreme DA Corporation, 3211 Scott Blvd., Santa Clara, CA 95054, USA
pp. 419-423
Shu Li, Department of Electrical, Computer and Systems Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180 USA
Tong Zhang, Department of Electrical, Computer and Systems Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180 USA
pp. 424-429
Bao Liu, Electrical and Computer Engineering Department, The University of Texas at San Antonio, 78249-0669, USA
pp. 430-435
Anita Kumari, Nano-Computing Research group (NCRG), Electrical Engineering Department, University of South Florida, Tampa, USA
Javier F. Pulecio, Nano-Computing Research group (NCRG), Electrical Engineering Department, University of South Florida, Tampa, USA
Sanjukta Bhanja, Nano-Computing Research group (NCRG), Electrical Engineering Department, University of South Florida, Tampa, USA
pp. 436-441
Akif Sultan, Advanced Micro Devices, Inc., Texas, USA
John Faricelli, Advanced Micro Devices, Inc., Texas, USA
Sushant Suryagandh, Advanced Micro Devices, Inc., Texas, USA
Hans vanMeer, Advanced Micro Devices, Inc., Texas, USA
Kaveri Mathur, Advanced Micro Devices, Inc., Texas, USA
James Pattison, Advanced Micro Devices, Inc., Texas, USA
Sean Hannon, Advanced Micro Devices, Inc., Texas, USA
Greg Constant, Advanced Micro Devices, Inc., Texas, USA
Kalyana Kumar, Advanced Micro Devices, Inc., Texas, USA
Kevin Carrejo, Advanced Micro Devices, Inc., Texas, USA
Joe Meier, Advanced Micro Devices, Inc., Texas, USA
Rasit O. Topaloglu, Advanced Micro Devices, Inc., Texas, USA
Darin Chan, Advanced Micro Devices, Inc., Texas, USA
Uwe Hahn, Advanced Micro Devices, Inc., Texas, USA
Thorsten Knopp, Advanced Micro Devices, Inc., Texas, USA
Victor Andrade, Advanced Micro Devices, Inc., Texas, USA
Bill Gardiol, Advanced Micro Devices, Inc., Texas, USA
Steve Hejl, Advanced Micro Devices, Inc., Texas, USA
David Wu, Advanced Micro Devices, Inc., Texas, USA
James Buller, Advanced Micro Devices, Inc., Texas, USA
Larry Bair, Advanced Micro Devices, Inc., Texas, USA
Ali Icel, Advanced Micro Devices, Inc., Texas, USA
Yuri Apanovich, Advanced Micro Devices, Inc., Texas, USA
pp. 442-446
Maruthi Chandrasekhar Bh, Semiconductor Devices and VLSI Technology Group, Department of Electronics&Computer Engineering, Indian Institute of Technology, Roorkee, India
Sudeb Dasgupta, Semiconductor Devices and VLSI Technology Group, Department of Electronics&Computer Engineering, Indian Institute of Technology, Roorkee, India
pp. 447-450
Yulei Zhang, ECE Dept., University of California, San Diego, USA
Ling Zhang, CSE Dept., University of California, San Diego, USA
Alina Deutsch, IBM T. J. Watson Research Center, Yorktown Heights, NY, USA
George A. Katopis, IBM System Group, Poughkeepsie, NY, USA
Daniel M. Dreps, IBM System and Technology Group, Austin, TX, USA
James F. Buckwalter, ECE Dept., University of California, San Diego, USA
Ernest S. Kuh, University of California, Berkeley, USA
Chung-Kuan Cheng, CSE Dept., University of California, San Diego, USA
pp. 451-458
Ji-Hye Bong, School of Electrical Engineering, Kookmin University, Seoul, Korea
Yong-Jin Kwon, School of Electrical Engineering, Kookmin University, Seoul, Korea
Kyeong-Sik Min, School of Electrical Engineering, Kookmin University, Seoul, Korea
Sung-Mo Kang, School of Engineering, University of California, Merced, USA
pp. 459-464
Xin He, University of California Riverside, 900 University Ave., Riverside, USA
Syed Al-Kadry, University of California Riverside, 900 University Ave., Riverside, USA
Afshin Abdollahi, University of California Riverside, 900 University Ave., Riverside, USA
pp. 465-470
S. Lakshminarayanan, Cypress Semiconductor, 195 Champion Ct., San Jose, CA, USA
J. Joung, Cypress Semiconductor, 195 Champion Ct., San Jose, CA, USA
G. Narasimhan, Cypress Semiconductor, 195 Champion Ct., San Jose, CA, USA
R. Kapre, Cypress Semiconductor, 195 Champion Ct., San Jose, CA, USA
M. Slanina, Cypress Semiconductor, 195 Champion Ct., San Jose, CA, USA
J. Tung, Cypress Semiconductor, Hsinchu, Taiwan
M. Whately, Cypress Semiconductor, 195 Champion Ct., San Jose, CA, USA
C-L. Hou, United Microelectronics Corporation, Hsinchu, Taiwan
W-J. Liao, United Microelectronics Corporation, Hsinchu, Taiwan
S-C. Lin, United Microelectronics Corporation, Hsinchu, Taiwan
P-G. Ma, United Microelectronics Corporation, Hsinchu, Taiwan
C-W. Fan, United Microelectronics Corporation, Hsinchu, Taiwan
M-C. Hsieh, United Microelectronics Corporation, Hsinchu, Taiwan
F-C. Liu, United Microelectronics Corporation, Hsinchu, Taiwan
K-L. Yeh, United Microelectronics Corporation, Hsinchu, Taiwan
W-C. Tseng, United Microelectronics Corporation, Hsinchu, Taiwan
S.W. Lu, United Microelectronics Corporation, Hsinchu, Taiwan
pp. 471-475
Parimala Viswanath, Texas Instruments India Ltd., Bangalore, India
Pranav Murthy, Texas Instruments India Ltd., Bangalore, India
Debajit Das, Texas Instruments India Ltd., Bangalore, India
R. Venkatraman, Texas Instruments India Ltd., Bangalore, India
Ajoy Mandal, Texas Instruments India Ltd., Bangalore, India
Arvind Veeravalli, Texas Instruments India Ltd., Bangalore, India
Udayakumar H, Texas Instruments India Ltd., Bangalore, India
pp. 476-481
Jithendra Srinivas, SDTC Texas Instruments India
Madhusudan Rao, SDTC Texas Instruments India
S. Jairam, SDTC Texas Instruments India
H. Udayakumar, SDTC Texas Instruments India
Jagdish Rao, SDTC Texas Instruments India
pp. 482-487
Hsin-Hua Pan, AnaGlobe Technology, Inc., Hsinchu Science-Based Industrial Park, Taiwan
Hung-Ming Chen, Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan
Chia-Yi Chang, Realtek Semiconductor Corp., Science-Based Industrial Park, Hsinchu, Taiwan
pp. 488-493
Basab Datta, Electrical and Computer Engineering Department, University of Massachusetts, Amherst, 01003, U.S.A.
Wayne Burleson, Electrical and Computer Engineering Department, University of Massachusetts, Amherst, 01003, U.S.A.
pp. 494-499
Uday Doddannagari, Department of ECE, Texas A&M University, College Station, 77843, USA
Shiyan Hu, Spansion Inc., Austin, TX 78749, USA
Weiping Shi, Department of ECE, Michigan Technological University, Houghton, 49931, USA
pp. 500-505
Liu Dawei, Department of Computer Science and Technology Tsinghua University, Beijing, China
Qiang Zhou, Department of Computer Science and Technology Tsinghua University, Beijing, China
Jinian Bian, Department of Computer Science and Technology Tsinghua University, Beijing, China
Yici Cai, Department of Computer Science and Technology Tsinghua University, Beijing, China
Xianlong Hong, Department of Computer Science and Technology Tsinghua University, Beijing, China
pp. 506-510
Mei-Fang Chiang, Graduate School of IPS, Waseda University, Kitakyushu 808-0135, Japan
Takumi Okamoto, NEC Corporation, Kanagawa 211-8666, Japan
Takeshi Yoshimura, Graduate School of IPS, Waseda University, Kitakyushu 808-0135, Japan
pp. 511-516
Adithya V. Kodati, San Jose State University, Department of Electrical Engineering, CA, USA
Koneswara S. Vemuri, San Jose State University, Department of Electrical Engineering, CA, USA
Lili He, San Jose State University, Department of Electrical Engineering, CA, USA
Morris Jones, San Jose State University, Department of Electrical Engineering, CA, USA
pp. 517-521
Zohreh Karimi, University of California, Los Angeles, USA
Majid Sarrafzadeh, University of California, Los Angeles, USA
pp. 522-526
Saraju P. Mohanty, VLSI Design and CAD Laboratory, University of North Texas, Denton, 76203, USA
Elias Kougianos, VLSI Design and CAD Laboratory, University of North Texas, Denton, 76203, USA
Wei Cai, VLSI Design and CAD Laboratory, University of North Texas, Denton, 76203, USA
Manish Ratnani, VLSI Design and CAD Laboratory, University of North Texas, Denton, 76203, USA
pp. 527-534
Shu-Hsuan Chou, Dept. of CSIE, National Chung Cheng University, Chia-Yi, Taiwan, R.O.C.
Che-Neng Wen, Dept. of CSIE, National Chung Cheng University, Chia-Yi, Taiwan, R.O.C.
Yan-Ling Liu, Dept. of CSIE, National Chung Cheng University, Chia-Yi, Taiwan, R.O.C.
Tien-Fu Chen, Dept. of CSIE, National Chung Cheng University, Chia-Yi, Taiwan, R.O.C.
pp. 535-540
Sumit Ahuja, CESCA, Virginia Tech, Blacksburg, 24061, USA
Deepak A. Mathaikutty, Microarchitecture Research Lab, Intel Corporation, Santa Clara, CA, 95054, USA
Gaurav Singh, CESCA, Virginia Tech, Blacksburg, 24061, USA
Joe Stetzer, CESCA, Virginia Tech, Blacksburg, 24061, USA
Sandeep K. Shukla, CESCA, Virginia Tech, Blacksburg, 24061, USA
Ajit Dingankar, Design Technology and Solutions, Intel Corporation, Folsom, CA 95630, USA
pp. 541-546
M. Miranda, IMEC Kapeldreef 75, 3001 Leuven, Belgium
B. Dierickx, IMEC Kapeldreef 75, 3001 Leuven, Belgium
P. Zuber, IMEC Kapeldreef 75, 3001 Leuven, Belgium
P. Dobrovoln, IMEC Kapeldreef 75, 3001 Leuven, Belgium
F. Kutscherauer, IMEC Kapeldreef 75, 3001 Leuven, Belgium
P. Roussel, IMEC Kapeldreef 75, 3001 Leuven, Belgium
P. Poliakov, IMEC Kapeldreef 75, 3001 Leuven, Belgium
pp. 547-553
Hailong You, Key Lab of Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices, School of Microelectronics, Xidian University, Xi'an, China
Maofeng Yang, Key Lab of Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices, School of Microelectronics, Xidian University, Xi'an, China
Dan Wang, Key Lab of Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices, School of Microelectronics, Xidian University, Xi'an, China
Xinzhang Jia, Key Lab of Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices, School of Microelectronics, Xidian University, Xi'an, China
pp. 554-558
Farhang Yazdani, BroadPak Corp., 3375 Scott Blvd. Suite 105, Santa Clara, CA USA
Jamal S. Izadian, RFconnext Inc., P.O. Box 20415, San Jose, CA USA
pp. 565-568
Syed M. Alam, Everspin Technologies, Inc., Austin, TX, USA
Robert E. Jones, Freescale Semiconductor, Inc. Austin, TX, USA
Scott Pozder, Freescale Semiconductor, Inc. Austin, TX, USA
Ankur Jain, Freescale Semiconductor, Inc. Austin, TX, USA
pp. 569-575
Amirali Shayan, CSE Dept., University of California, San Diego, 9500 Gilman Drive, La Jolla, USA
Xiang Hu, ECE Dept., University of California, San Diego, 9500 Gilman Drive, La Jolla, USA
He Peng, CSE Dept., University of California, San Diego, 9500 Gilman Drive, La Jolla, USA
Wenjian Yu, EDA Lab, Dept. of Computer Science&Technology, Tsinghua University, Beijing, China
Wanping Zhang, CSE Dept., University of California, San Diego, 9500 Gilman Drive, La Jolla, USA
Chung-Kuan Cheng, CSE Dept., University of California, San Diego, 9500 Gilman Drive, La Jolla, USA
Mikhail Popovich, Qualcomm Inc., San Diego, CA, USA
Xiaoming Chen, Qualcomm Inc., San Diego, CA, USA
Lew Chua-Eaon, Qualcomm Inc., San Diego, CA, USA
Xiaohua Kong, Qualcomm Inc., San Diego, CA, USA
pp. 576-581
Lining Zhang, Group of Micro-&Nano- Device and Integrated Technology, The Key Laboratory of Integrated, Microsystems, Shenzhen Graduate School of Peking University, 518055, China
Jin He, Group of Micro-&Nano- Device and Integrated Technology, The Key Laboratory of Integrated, Microsystems, Shenzhen Graduate School of Peking University, 518055, China
Jian Zhang, TSRC, Key Laboratory of Microelectronic Devices and Circuits of Ministry of Education, Institute of Microelectronics, EECS, Peking University, 100871, China
Feng Liu, TSRC, Key Laboratory of Microelectronic Devices and Circuits of Ministry of Education, Institute of Microelectronics, EECS, Peking University, 100871, China
Yue Fu, TSRC, Key Laboratory of Microelectronic Devices and Circuits of Ministry of Education, Institute of Microelectronics, EECS, Peking University, 100871, China
Yan Song, TSRC, Key Laboratory of Microelectronic Devices and Circuits of Ministry of Education, Institute of Microelectronics, EECS, Peking University, 100871, China
Xing Zhang, Group of Micro-&Nano- Device and Integrated Technology, The Key Laboratory of Integrated, Microsystems, Shenzhen Graduate School of Peking University, 518055, China
pp. 582-587
Vinayak Honkote, Dept. of Electrical and Computer Engineering, Drexel University, Philadelphia, PA 19104, USA
Baris Taskin, Dept. of Electrical and Computer Engineering, Drexel University, Philadelphia, PA 19104, USA
pp. 588-593
Kevin Brownell, School of Engineering and Applied Sciences, Harvard University, Cambridge, MA 02138, USA
Ali Durlov Khan, School of Engineering and Applied Sciences, Harvard University, Cambridge, MA 02138, USA
David Brooks, School of Engineering and Applied Sciences, Harvard University, Cambridge, MA 02138, USA
Gu-Yeon Wei, School of Engineering and Applied Sciences, Harvard University, Cambridge, MA 02138, USA
pp. 594-600
Genichi Tanaka, Renesas Technology Corp, Itami Hyogo Japan
Koichi Nakashiro, Renesas Technology Corp, Itami Hyogo Japan
pp. 601-606
Ying Zhou, Dept. of Electrical Engineering, Texas A&M University, College Station, 77843, USA
Rouwaida Kanj, IBM Austin Research Lab, Austin, Texas 78751, USA
Kanak Agarwal, IBM Research Division, Yorktown Heights, NY, 10598, USA
Zhuo Li, IBM Austin Research Lab, Austin, Texas 78751, USA
Rajiv Joshi, IBM Research Division, Yorktown Heights, NY, 10598, USA
Sani Nassif, IBM Austin Research Lab, Austin, Texas 78751, USA
Weiping Shi, Dept. of Electrical Engineering, Texas A&M University, College Station, 77843, USA
pp. 607-612
Y.Z. Xu, Altera Corporation, 101 Innovation Dr, San Jose, CA 95134, USA
L.S. Liu, Altera Corporation, 101 Innovation Dr, San Jose, CA 95134, USA
M. Chan, Altera Corporation, 101 Innovation Dr, San Jose, CA 95134, USA
J.T. Watt, Altera Corporation, 101 Innovation Dr, San Jose, CA 95134, USA
pp. 613-616
Soner Yaldiz, Electrical and Computer Engineering Department, Carnegie Mellon University, 5000 Forbes Ave., Pittsburgh, PA 15213, USA
Umut Arslan, Electrical and Computer Engineering Department, Carnegie Mellon University, 5000 Forbes Ave., Pittsburgh, PA 15213, USA
Xin Li, Electrical and Computer Engineering Department, Carnegie Mellon University, 5000 Forbes Ave., Pittsburgh, PA 15213, USA
Larry Pileggi, Electrical and Computer Engineering Department, Carnegie Mellon University, 5000 Forbes Ave., Pittsburgh, PA 15213, USA
pp. 617-621
Costas Argyrides, Department of Computer Science, University of Bristol, UK
Ahmad Al-Yamani, Department of Computer Engineering, KFUPM, Saudi Arabia
Carlos Lisboa, Departamento de Informatica Aplicada, PPGC, UFRGS, Brazil
Luigi Carro, Departamento de Informatica Aplicada, PPGC, UFRGS, Brazil
Dhiraj Pradhan, Department of Computer Science, University of Bristol, UK
pp. 622-626
Debasish Das, EECS, Northwestern University, Evanston, IL 60208, USA
William Scott, Magma Design Automation, San Jose, CA 95110, USA
Shahin Nazarian, Magma Design Automation, San Jose, CA 95110, USA
Hai Zhou, EECS, Northwestern University, Evanston, IL 60208, USA
pp. 627-633
Xiaoji Ye, Department of ECE, Texas A&M University, USA
Peng Li, Department of ECE, Texas A&M University, USA
pp. 634-640
R. Vishweshwara, Texas Instruments India, India
R. Venkatraman, Texas Instruments India, India
Kadodwala Vipul, Texas Instruments India, India
pp. 641-646
Aida Todri, University of California Santa Barbara, CA 93106, USA
Malgorzata Marek-Sadowska, University of California Santa Barbara, CA 93106, USA
Francois Maire, STMicroelectronics, Grenoble, France 38100
Christophe Matheron, STMicroelectronics, Grenoble, France 38100
pp. 653-658
Shunsuke Okumura, Kobe University, 1-1, Rokkodai-cho, Nada-ku, Hyogo, 657-8501, Japan
Yusuke Iguchi, Kobe University, 1-1, Rokkodai-cho, Nada-ku, Hyogo, 657-8501, Japan
Shusuke Yoshimoto, Kobe University, 1-1, Rokkodai-cho, Nada-ku, Hyogo, 657-8501, Japan
Hidehiro Fujiwara, Kobe University, 1-1, Rokkodai-cho, Nada-ku, Hyogo, 657-8501, Japan
Hiroki Noguchi, Kobe University, 1-1, Rokkodai-cho, Nada-ku, Hyogo, 657-8501, Japan
Koji Nii, Renesas Technology, 4-1, Mizuhara, Itami, Hyogo, 664-0005, Japan
Hiroshi Kawaguchi, Kobe University, 1-1, Rokkodai-cho, Nada-ku, Hyogo, 657-8501, Japan
Masahiko Yoshimoto, Kobe University, 1-1, Rokkodai-cho, Nada-ku, Hyogo, 657-8501, Japan
pp. 659-663
Suganth Paul, Intel Corporation, Austin, TX 78746, USA
Rajesh Garg, Department of ECE, Texas A&M University, College Station 77843, USA
Sunil P. Khatriz, Department of ECE, Texas A&M University, College Station 77843, USA
Sheila Vaidya, Lawrence Livermore National Laboratories, CA 94550, USA
pp. 664-672
Saraju P. Mohanty, VLSI Design and CAD Laboratory (VDCL), University of North Texas, Denton, 76203, USA
Dhruva Ghai, VLSI Design and CAD Laboratory (VDCL), University of North Texas, Denton, 76203, USA
Elias Kougianos, VLSI Design and CAD Laboratory (VDCL), University of North Texas, Denton, 76203, USA
Bharat Joshi, Electrical and Computer Engineering, University of North Carolina at Charlotte, 28223, USA
pp. 673-679
Basab Datta, Electrical and Computer Engineering Department, University of Massachusetts-Amherst, 01003, U.S.A.
Wayne Burleson, Electrical and Computer Engineering Department, University of Massachusetts-Amherst, 01003, U.S.A.
pp. 680-685
Amir Moradi, Department of Computer Engineering, Sharif University of Technology, Azadi St., Tehran, Iran
Mehrdad Khatir, Department of Computer Engineering, Sharif University of Technology, Azadi St., Tehran, Iran
Mahmoud Salmasizadeh, Electronics Research Center, Sharif University of Technology, Azadi St., Tehran, Iran
Mohammad T. Manzuri Shalmani, Department of Computer Engineering, Sharif University of Technology, Azadi St., Tehran, Iran
pp. 686-691
Bhanu Kapoor, Mimasic, Richardson, TX USA 75082
Shankar Hemmady, Synopsys, Inc., Mountain View, CA USA 94043
Shireesh Verma, Conexant, Irvine, CA USA 92612
Kaushik Roy, Purdue University, West Lafeyette, IN USA 47097
pp. 692-695
Alodeep Sanyal, Department of Electrical and Computer Engineering, University of Massachusetts, Amherst, 01003, USA
Abhisek Pan, Department of Electrical and Computer Engineering, University of Massachusetts, Amherst, 01003, USA
Sandip Kundu, Department of Electrical and Computer Engineering, University of Massachusetts, Amherst, 01003, USA
pp. 696-701
Ju-Yueh Lee, Electrical Engineering Department, University of California, Los Angeles, USA
Yu Hu, Electrical Engineering Department, University of California, Los Angeles, USA
Rupak Majumdar, Computer Science Department, University of California, Los Angeles, USA
Lei He, Electrical Engineering Department, University of California, Los Angeles, USA
pp. 702-707
Aftab Farooqi, Dept of ECE, Texas Tech University, Lubbock, 79409, USA
Richard O. Gale, Dept of ECE, Texas Tech University, Lubbock, 79409, USA
Sudhakar M. Reddy, Dept of ECE, University of Iowa, Iowa City, 52242, USA
Brian Nutter, Dept of ECE, Texas Tech University, Lubbock, 79409, USA
Chris Monico, Dept of Mathematics, Texas Tech University, Lubbock, 79409, USA
pp. 708-713
Alexander Stempkovsky, Research Institute for Design Problems in Microelectronics (IPPM RAS), Moscow, Russia
Alexey Glebov, Research Institute for Design Problems in Microelectronics (IPPM RAS), Moscow, Russia
Sergey Gavrilov, Research Institute for Design Problems in Microelectronics (IPPM RAS), Moscow, Russia
pp. 714-718
Ali Dasdan, Yahoo, Inc., 2821 Mission College Blvd, Santa Clara, CA 95054, USA
Santanu Kolay, Yahoo, Inc., 2821 Mission College Blvd, Santa Clara, CA 95054, USA
Mustafa Yazgan, Extreme DA, 3211 Scott Blvd Ste 103, Santa Clara, CA 95054, USA
pp. 719-727
Song Chen, Graduate School of Information, Produciton, and System, Waseda University, USA
Zheng Xu, Graduate School of Information, Produciton, and System, Waseda University, USA
Takeshi Yoshimura, Graduate School of Information, Produciton, and System, Waseda University, USA
pp. 734-739
Xu He, Tsinghua National Laboratory for Information Science&Technology, Tsinghua University, Beijing, China, 100084
Sheqin Dong, Tsinghua National Laboratory for Information Science&Technology, Tsinghua University, Beijing, China, 100084
Yuchun Ma, Tsinghua National Laboratory for Information Science&Technology, Tsinghua University, Beijing, China, 100084
Xianlong Hong, Tsinghua National Laboratory for Information Science&Technology, Tsinghua University, Beijing, China, 100084
pp. 740-745
Akhilesh Kumar, Dept. of ECE, University of Waterloo, ON, Canada N2L3G1
Mohab Anis, Dept. of ECE, University of Waterloo, ON, Canada N2L3G1
pp. 746-752
Sriram Sambamurthy, Computer Engineering Research Center, University of Texas at Austin, USA
Sankar Gurumurthy, Computer Engineering Research Center, University of Texas at Austin, USA
Ramtilak Vemu, Computer Engineering Research Center, University of Texas at Austin, USA
Jacob A. Abraham, Computer Engineering Research Center, University of Texas at Austin, USA
pp. 753-758
Jonathan Rosenfeld, Department of Electrical and Computer Engineering, University of Rochester, USA
Eby G. Friedman, Department of Electrical and Computer Engineering, University of Rochester, USA
pp. 759-764
Xiongfei Meng, Dept. of ECE, University of British Columbia, 2356 Main Mall, Vancouver, V6T 1Z4, Canada
Resve Saleh, Dept. of ECE, University of British Columbia, 2356 Main Mall, Vancouver, V6T 1Z4, Canada
pp. 765-769
Shan Zeng, EDA Lab, Dept. Computer Science and Technology, Tsinghua University, Beijing, China
Wenjian Yu, EDA Lab, Dept. Computer Science and Technology, Tsinghua University, Beijing, China
Wanping Zhang, Department of Computer Science and Engineering, University of California, San Diego, 92093, USA
Jian Wang, EDA Lab, Dept. Computer Science and Technology, Tsinghua University, Beijing, China
Xianlong Hong, EDA Lab, Dept. Computer Science and Technology, Tsinghua University, Beijing, China
Chung-Kuan Cheng, Department of Computer Science and Engineering, University of California, San Diego, 92093, USA
pp. 770-775
Zhiyu Zeng, Department of Electrical and Computer Engineering, Texas A&M University, College Station, USA
Peng Li, Department of Electrical and Computer Engineering, Texas A&M University, College Station, USA
Zhuo Feng, Department of Electrical and Computer Engineering, Texas A&M University, College Station, USA
pp. 776-781
Animesh Kumar, EECS, University of California, Berkeley, 94720, USA
Jan Rabaey, EECS, University of California, Berkeley, 94720, USA
Kannan Ramchandran, EECS, University of California, Berkeley, 94720, USA
pp. 782-787
Seung Eun Lee, University of California, Irvine, USA
Chris Wilkerson, Intel Corporation, Hillsboro, OR USA
Ming Zhang, Intel Corporation, Hillsboro, OR USA
Rajendra Yavatkar, Intel Corporation, Hillsboro, OR USA
Shih-Lien Lu, Intel Corporation, Hillsboro, OR USA
Nader Bagherzadeh, University of California, Irvine, USA
pp. 788-793
Charbel J. Akl, University of Louisiana at Lafayette, USA
Rafic A. Ayoubi, University of Balamand, Lebanon
Magdy A. Bayoumi, University of Louisiana at Lafayette, USA
pp. 794-798
Ashay Narsale, Department of Electrical&Computer Engineering, University of Rochester, USA
Michael C. Huang, Department of Electrical&Computer Engineering, University of Rochester, USA
pp. 799-805
Rajballav Dash, Department of ECE, Texas A&M University, College Station 77843, USA
Rajesh Garg, Department of ECE, Texas A&M University, College Station 77843, USA
Sunil P. Khatri, Department of ECE, Texas A&M University, College Station 77843, USA
Gwan Choi, Department of ECE, Texas A&M University, College Station 77843, USA
pp. 806-813
Sohaib Majzoub, SoC Research Lab, University of British Columbia, 2356 Main Mall Vancouver, Canada
Resve Saleh, SoC Research Lab, University of British Columbia, 2356 Main Mall Vancouver, Canada
Rabab Ward, Image Processing Lab, University of British Columbia, 2366 Main Mall Vancouver, Canada
pp. 814-819
Toshinori Sato, Fukuoka University, 8-19-1 Nanakuma, Jonan-ku, 814-0180 Japan
Shingo Watanabe, Kyushu Institute of Technology, 680-4 Kawazu, Iizuka, 820-8502 Japan
pp. 820-825
Avinash Kodi, School of Electrical Engineering and Computer Science, Ohio University, Athens, 45701, USA
Ahmed Louri, Department of Electrical and Computer Engineering, University of Arizona, Tucson, 85721, USA
Janet Wang, Department of Electrical and Computer Engineering, University of Arizona, Tucson, 85721, USA
pp. 826-832
Jin Sun, Department of Electrical and Computer Engineering, University of Arizona, 1230 E. Speedway, Tucson, 85721, USA
Avinash Kodi, Department of Electrical and Computer Engineering, Russ College of Engineering and Technology, Ohio University, 322D Stocker Center, Athens, 45701, USA
Ahmed Louri, Department of Electrical and Computer Engineering, University of Arizona, 1230 E. Speedway, Tucson, 85721, USA
Janet M. Wang, Department of Electrical and Computer Engineering, University of Arizona, 1230 E. Speedway, Tucson, 85721, USA
pp. 833-838
Mehrtash Manoochehri, Department of Computer Engineering, Sharif University of Technology, Iran
Alireza Ejlali, Department of Computer Engineering, Sharif University of Technology, Iran
Seyed Ghassem Miremadi, Department of Computer Engineering, Sharif University of Technology, Iran
pp. 839-844
Notes (PDF)
pp. xxv
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