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2007 IEEE International Symposium on Quality of Electronic Design (2007)
San Jose, CA
March 26, 2007 to March 28, 2007
ISBN: 0-7695-2795-7
TABLE OF CONTENTS
Participating Organizations
Introduction
pp. xvii-xviii
pp. xxiii
pp. xxiii
Tutorials
Tutorial I (PDF)
pp. null
Gerhard Knoblinger , Infineon Technologies
pp. 3
Tutorial II (PDF)
pp. null
Lech Jozwiak , Eindhoven University of Technology
pp. 5
Evening Panel Discussion EP1
Resve Saleh , ECE Dept UBC Vancouver
Pallab Chatterjee , SiliconMap
Ivan Pesic , Silvaco/Simucad
Robbert Dobkins , CTO, Linear Technologies
Mike Smayling , CTO Applied Materials
Joe Sawicki , VP Design to Silicon Div Mentor Graphics
pp. 7-8
Plenary Session 1P
Session 1A: Design for Manufacturing
Variation (Abstract)
Duane Boning , MIT, USA
Hong Cai , MIT, USA
Nigel Drego , MIT, USA
Ali Farahanchi , MIT, USA
Karen Gettings , MIT, USA
Daihyun Lim , MIT, USA
Ajay Somani , MIT, USA
Hayden Taylor , MIT, USA
Daniel Truque , MIT, USA
Xiaolin Xie , MIT, USA
pp. 15-20
Takashi Sato , Tokyo Institute of Technology, Japan
Takumi Uezono , Tokyo Institute of Technology, Japan
Shiho Hagiwara , Tokyo Institute of Technology, Japan
Kenichi Okada , Tokyo Institute of Technology, Japan
Shuhei Amakawa , Tokyo Institute of Technology, Japan
Noriaki Nakayama , Tokyo Institute of Technology, Japan
Kazuya Masu , Tokyo Institute of Technology, Japan
pp. 21-26
Rajani Kuchipudi , San Francisco State University, USA
Hamid Mahmoodi , San Francisco State University, USA
pp. 27-32
Rouwaida Kanj , IBM Austin Research Labs, USA
Rajiv Joshi , IBM TJ Watson Labs, USA
Jayakumaran Sivagnaname , IBM Austin Research Labs, USA
JB Kuang , IBM Austin Research Labs, USA
Dhruva Acharyya , IBM Austin Research Labs, USA
Tuyet Nguyen , IBM Austin Research Labs, USA
Chandler McDowell , IBM Austin Research Labs, USA
Sani Nassif , IBM Austin Research Labs, USA
pp. 33-40
Session 1B: Device and Circuit Reliability
Rakesh Vattikonda , Arizona State University, USA
Yansheng Luo , Synopsys Inc, USA
Alex Gyure , Synopsys Inc, USA
Xiaoning Qi , Synopsys Inc, USA
Sam Lo , Synopsys Inc, USA
Mahmoud Shahram , Synopsys Inc, USA
Yu Cao , Arizona State University, USA
Kishore Singhal , Synopsys Inc, USA
Dino Toffolon , Synopsys Inc, USA
pp. 41-46
Xiangning Yang , University of Wisconsin-Madison, USA
Kewal Saluja , University of Wisconsin-Madison, USA
pp. 47-52
Benoit Dubois , Institut d'Electronique du Solide et des Systemes, France
Jean-Baptiste Kammerer , Institut d'Electronique du Solide et des Systemes, France
Luc Hebrard , Institut d'Electronique du Solide et des Systemes, France
Francis Braun , Institut d'Electronique du Solide et des Systemes, France
pp. 53-58
Aram Shin , Korea University, Korea
Sang Jun Hwang , Korea University, Korea
Seung Woo Yu , Korea University, Korea
Man Young Sung , Korea University, Korea
pp. 59-66
Session 1C: Power and Thermal Management
Mosin Mondal , Rice University
Andrew Ricketts , Pennsylvania State University, USA
Sami Kirolos , Rice University
Tamer Ragheb , Rice University
Greg Link , York College of Pennsylvania
Vijaykrishnan Narayanan , Pennsylvania State University
Yehia Massoud , Rice University
pp. 67-72
Sherif A. Tawfik , University of Wisconsin-Madison, USA
Volkan Kursun , University of Wisconsin-Madison, USA
pp. 73-78
Weihuang Wang , Texas A&M University, USA
Gwan Choi , Texas A&M University, USA
pp. 79-84
Kanak Agarwal , IBM Corporation, USA
Kevin Nowka , IBM Corporation, USA
pp. 85-92
Session 1D: Analog and Mixed Signal Design
Peter Hazucha , Intel Corporation, USA
Fabrice Paillet , Intel Corporation, USA
Sung Tae Moon , Intel Corporation, USA
David J. Rennie , University of Waterloo, Canada
Gerhard Schrom , Intel Corporation, USA
Donald S. Gardner , Intel Corporation, USA
Kenneth Ikeda , Intel Corporation, USA
Gell Gellman , Intel Corporation, USA
Tanay Karnik , Intel Corporation, USA
pp. 93-97
Pengfei Li , Student Member, IEEE; University of Florida, USA
Rizwan Bashirullah , Member, IEEE; University of Florida, USA
pp. 98-101
Hong Li , Purdue University, USA
Cheng-Kok Koh , Purdue University, USA
Venkataramanan Balakrishnan , Purdue University, USA
Yiran Chen , Synopsys Inc., USA
pp. 102-107
Liang Rong , Royal Institute of Technology, Sweden
E. Martin I. Gustafsson , Royal Institute of Technology, Sweden
Ana Rusu , Royal Institute of Technology, Sweden
Mohammed Ismail , Royal Institute of Technology, Sweden
pp. 108-114
Luncheon Speech
Session 2A: Quality and Reliability
Tamer Cakici , Purdue University, USA
Keejong Kim , Purdue University, USA
Kaushik Roy , Purdue University, USA
pp. 127-132
Asha Balijepalli , Arizona State University, USA
Joseph Ervin , Arizona State University, USA
Yu Cao , Arizona State University, USA
Trevor Thornton , Arizona State University, USA
pp. 133-138
Hong Luo , Tsinghua Univ., China
Yu Wang , Tsinghua Univ., China
Ku He , Tsinghua Univ., China
Rong Luo , Tsinghua Univ., China
Huazhong Yang , Tsinghua Univ., China
Yuan Xie , Pennsylvania State University, USA
pp. 139-144
Jie Deng , Stanford University, USA
Keunwoo Kim , IBM T.J. Watson Research Center, USA
Ching-Te Chuang , IBM T.J. Watson Research Center, USA
H.-S Philip Wong , Stanford University, USA
pp. 145-152
Session 2B: Advances in Timing and Power in Physical Design
Ahmed Youssef , University of Waterloo, Canada
Tor Myklebust , University of Waterloo, Canada
Mohab Anis , University of Waterloo, Canada
Mohamed Elmasry , University of Waterloo, Canada
pp. 153-158
Gustavo R. Wilke , Fujitsu Laboratories of America, Inc., USA
Rajeev Murgai , Fujitsu Laboratories of America, Inc., USA
pp. 165-170
Zhanyuan Jiang , Texas A&M University, USA
Shiyan Hu , Texas A&M University, USA
Jiang Hu , Texas A&M University, USA
Weiping Shi , Texas A&M University, USA
pp. 171-175
Nahmsuk Oh , Synopsys, Inc., USA
Alireza Kasnavi , Synopsys, Inc., USA
Peivand Tehrani , Synopsys, Inc., USA
pp. 176-184
Session 2C: Power-Aware System Design Methodologies
Minh Q. Do , Chalmers University of Technology, Sweden
Mindaugas Drazdziulis , Chalmers University of Technology, Sweden
Per Larsson-Edefors , Chalmers University of Technology, Sweden
Lars Bengtsson , Chalmers University of Technology, Sweden
pp. 185-191
Amin Khajeh Djahromi , UC Irvine, USA
Ahmed M. Eltawil , UC Irvine, USA
Fadi J. Kurdahi , UC Irvine, USA
Rouwaida Kanj , IBM Austin Research Labs, USA
pp. 192-197
Hwisung Jung , University of Southern California, USA
Massoud Pedram , University of Southern California, USA
pp. 198-203
Yongpan Liu , Tsinghua University, China
Huazhong Yang , Tsinghua University, China
Robert P. Dick , Northwestern University, USA
Hui Wang , Tsinghua University, China
Li Shang , Queen's University, Canada
pp. 204-209
Foad Dabiri , University of California Los Angeles, USA
Roozbeh Jafari , University of Texas at Dallas, USA
Ani Nahapetian , University of California Los Angeles, USA
Majid Sarrafzadeh , University of California Los Angeles, USA
pp. 210-218
Session 2D: Poster Papers
Charbel J. Akl , University of Louisiana at Lafayette, USA
Magdy A. Bayoumi , University of Louisiana at Lafayette, USA
pp. 219-224
Bi Yuan , San Jose State University, USA
Yi Zhang , San Jose State University, USA
Lili He , San Jose State University, USA
pp. 225-228
Yamei Li , San Jose State University, USA
Lili He , San Jose State University, USA
pp. 229-232
Yokesh Kumar , International Institute of Information Technology, India
Prosenjit Gupta , International Institute of Information Technology, India
pp. 233-238
Zhiyu Liu , University of Wisconsin-Madison, USA
Volkan Kursun , University of Wisconsin-Madison, USA
pp. 239-244
Ling Zhang , University of California, San Diego, USA
Hongyu Chen , Synopsys Inc., USA
Bo Yao , Mentorgraphics Corp., USA
Kevin Hamilton , Qualcomm Inc., USA
Chung-Kuan Cheng , University of California, San Diego, USA
pp. 251-256
Xudong Niu , Peking University, China
Yan Song , Peking University, China
Bo Li , Peking University, China
Wei Bian , Peking University, China
Yadong Tao , Peking University, China
Feng Liu , Peking University, China
Jinhua Hu , Peking University, China
Yu Chen , Peking University, China
Frank He , Peking University, China
pp. 263-268
Naiyong Jin , East China Normal University, China
Taoyong Ni , East China Normal University, China
pp. 269-274
Zhenyu (Jerry) Qi , University of Virginia, USA
Matthew Ziegler , IBM, T.J. Watson Research Center, USA
Stephen V. Kosonocky , IBM, T.J. Watson Research Center, USA
Jan M. Rabaey , University of California at Berkeley, USA
Mircea R. Stan , University of Virginia, USA
pp. 275-280
Alfred L. Crouch , Inovys Corp.
Phil Burlison , Inovys Corp.
Dennis Ciplickas , PDF Solutions, Inc.
pp. 293-298
Weixiang Shen , Tsinghua University, China
Yici Cai , Tsinghua University, China
Xianlong Hong , Tsinghua University, China
Jiang Hu , Texas A&M University, USA
Bing Lu , Cadence Design Sys. Inc, USA
pp. 299-304
David Rennie , University of Waterloo, Canada
Manoj Sachdev , University of Waterloo, Canada
pp. 305-310
Daniela De Venuto , DEE Politecnico di Bari, Italy
Bruno Ricco , DEIS Universita di Bologna, Italy
pp. 311-316
Patrick Ndai , Purdue University, USA
Shih-Lien Lu , Intel Corporation, USA
Dinesh Somesekhar , Intel Corporation, USA
Kaushik Roy , Purdue University, USA
pp. 317-321
A. Ilumoka , University of Hartford, USA
Hong Lang Tan , University of Hartford, USA
pp. 322-326
V. Mahalingam , University of South Florida, USA
N. Ranganathan , University of South Florida, USA
pp. 327-332
Amol Mupid , The Pennsylvania State University, USA
Madhu Mutyam , International Institute of Information Technology, India
N. Vijaykrishnan , The Pennsylvania State University, USA
Y. Xie , The Pennsylvania State University, USA
M.J. Irwin , The Pennsylvania State University, USA
pp. 333-338
Qi Lin , Xilinx Inc., USA
Mei Ma , Xilinx Inc., USA
Tony Vo , Xilinx Inc., USA
Jenny Fan , Xilinx Inc., USA
Xin Wu , Xilinx Inc., USA
Richard Li , Xilinx Inc., USA
Xiao-Yu Li , Xilinx Inc., USA
pp. 339-343
Yu-Min Kuo , National Tsing Hua University, Taiwan
Cheng-Hung Lin , National Tsing Hua University, Taiwan
Chun-Yao Wang , National Tsing Hua University, Taiwan
Shih-Chieh Chang , National Tsing Hua University, Taiwan
Pei-Hsin Ho , Synopsys, Inc.
pp. 344-349
Yici Cai , Tsinghua University, China
Bin Liu , Tsinghua University, China
Jin Shi , Tsinghua University, China
Qiang Zhou , Tsinghua University, China
Xianlong Hong , Tsinghua University, China
pp. 350-355
Boyuan Yan , University of California, Riverside, USA
Pu Liu , University of California, Riverside, USA
Sheldon X.-D. Tan , University of California, Riverside, USA
Bruce McGaughy , Cadence Design Systems Inc., USA
pp. 356-361
Kaijian Shi , Synopsys (Professional Services), USA
Zhian Lin , Synopsys Inc., USA
Yi-Min Jiang , Synopsys Inc., USA
pp. 362-367
Yuan Cai , University of Iowa, USA
Sudhakar M. Reddy , University of Iowa, USA
Bashir M. Al-Hashimi , University of Southampton, UK
pp. 368-373
Yuji Kunitake , Kyushu Institute of Technology, Japan
Akihiro Chiyonobu , Kyushu Institute of Technology, Japan
Koichiro Tanaka , Kyushu Institute of Technology, Japan
Toshinori Sato , Kyushu University, Japan
pp. 374-379
Hamid R. Zarandi , Sharif University of Technology; Bristol University, UK
Seyed G. Miremadi , Sharif University of Technology
Dhiraj K. Pradhan , Bristol University, UK
Jimson Mathew , Bristol University, UK
pp. 380-385
Xiaofang Wang , Villanova University, USA
Sotirios G. Ziavras , New Jersey Institute of Technology, USA
pp. 386-391
Gautam Kumar Singh , Pulsecore Semiconductor (India) Pvt. Ltd., India
Santosh Kumar Panigrahi , Pulsecore Semiconductor (India) Pvt. Ltd., India
pp. 392-397
Joon-Sung Yang , University of Texas, USA
Anand Rajaram , University of Texas, USA; Texas Instruments Inc., USA
Ninghy Shi , University of Texas, USA
Jian Chen , University of Texas, USA
David Z. Pan , University of Texas, USA
pp. 398-403
Chaoming Zhang , The University of Texas at Austin, USA
Ranjit Gharpurey , The University of Texas at Austin, USA
Jacob A. Abraham , The University of Texas at Austin, USA
pp. 404-409
Michael N. Skoufis , Southern Illinois University at Carbondale, USA
Haibo Wang , Southern Illinois University at Carbondale, USA
Themistoklis Haniotakis , Southern Illinois University at Carbondale, USA
Spyros Tragoudas , Southern Illinois University at Carbondale, USA
pp. 410-415
Yong Sin Kim , Univ. of California, Santa Cruz, USA
Sung-Mo Kang , Univ. of California, Santa Cruz, USA
pp. 416-419
Manoj Kumar Goparaju , Southern Illinois University Carbondale, USA
Spyros Tragoudas , Southern Illinois University Carbondale, USA
pp. 420-425
Kumar Yelamarthi , Wright State University, USA
Chien-In Henry Chen , Wright State University, USA
pp. 426-431
Mehboob Alam , Rice University, USA
Arthur Nieuwoudt , Rice University, USA
Yehia Massoud , Rice University, USA
pp. 432-437
Rasit Onur Topaloglu , University of California San Diego, USA
pp. 444-451
Santosh Shah , Cadence Design Systems, Inc., USA
Arani Sinha , Cadence Design Systems, Inc., USA
Li Song , Cadence Design Systems, Inc., USA
Narain D. Arora , Cadence Design Systems, Inc., USA
pp. 452-457
Ashok Narasimhan , University of Buffalo (SUNY), USA
Ramalingam Sridhar , University of Buffalo (SUNY), USA
pp. 458-466
Session 3A: Electrical Quality
Andrew B. Kahng , University of California at San Diego, USA
Rasit Onur Topaloglu , University of California at San Diego, USA
pp. 467-474
Jeong-Yeol Kim , Samsung Electronics, Korea
Ho-Soon Shin , Samsung Electronics, Korea
Jong-Bae Lee , Samsung Electronics, Korea
Moon-Hyun Yoo , Samsung Electronics, Korea
Jeong-Taek Kong , Samsung Electronics, Korea
pp. 475-480
Jun Zou , Techn. Univ. Muenchen, Germany
Daniel Mueller , Techn. Univ. Muenchen, Germany
Helmut Graeb , Techn. Univ. Muenchen, Germany
Ulf Schlichtmann , Techn. Univ. Muenchen, Germany
pp. 481-486
Kai-hui Chang , University of Michigan at Ann Arbor, USA
David A. Papa , University of Michigan at Ann Arbor, USA
Igor L. Markov , University of Michigan at Ann Arbor, USA
Valeria Bertacco , University of Michigan at Ann Arbor, USA
pp. 487-494
Session 3B: Analog and RF Testing
Joonsung Park , The University of Texas at Austin, USA
Hongjoong Shin , The University of Texas at Austin, USA
Jacob A. Abraham , The University of Texas at Austin, USA
pp. 495-500
Amit Laknaur , Southern Illinois University, USA
Rui Xiao , Southern Illinois University, USA
Sai Durbha , Southern Illinois University, USA
Haibo Wang , Southern Illinois University, USA
pp. 501-506
Guo Yu , Texas A&M University, USA
Peng Li , Texas A&M University, USA
Wei Dong , Texas A&M University, USA
pp. 513-518
Daniela De Venuto , Politecnico di Bari, Italy
Leonardo Reyneri , Politecnico di Torino, Italy
pp. 519-526
Session 3C: Low Power Circuits
Byunghee Choi , KAIST, Korea
Youngsoo Shin , KAIST, Korea
pp. 533-538
Toshinori Sato , Kyushu University, Japan
Yuji Kunitake , Kyushu Institute of Technology, Japan
pp. 539-544
Jaydeep P. Kulkarni , Purdue University, USA
Kaushik Roy , Purdue University, USA
pp. 545-549
Andrew B. Kahng , UC San Diego, USA
Sherief Reda , Brown University, USA
Puneet Sharma , UC San Diego, USA
pp. 550-555
Plenary Session 2P
Session 4A: Package Circuit Co-Design
Dongkeun Oh , UW Madison, USA
Charlie Chung Ping Chen , UW Madison, USA
Yu Hen Hu , UW Madison, USA
pp. 567-572
Eunseok Song , Samsung Electronics, Co., Ltd., Korea
Heeseok Lee , Samsung Electronics, Co., Ltd., Korea
Jungtae Lee , Samsung Electronics, Co., Ltd., Korea
Woojin Jin , Samsung Electronics, Co., Ltd., Korea
Kiwon Choi , Samsung Electronics, Co., Ltd., Korea
Sa-Yoon Kang , Samsung Electronics, Co., Ltd., Korea
pp. 573-579
Syed M. Alam , Freescale Semiconductor Inc., USA
Robert E. Jones , Freescale Semiconductor Inc., USA
Shahid Rauf , Freescale Semiconductor Inc., USA
Ritwik Chatterjee , Freescale Semiconductor Inc., USA
pp. 580-585
Juan Pablo Martinez Brito , Federal University of Rio Grande do Sul, Brazil
Hamilton Klimach , Federal University of Rio Grande do Sul, Brazil
Sergio Bampi , Federal University of Rio Grande do Sul, Brazil
pp. 586-594
Session 4B: High Level Optimization
David C. Zaretsky , University of Illinois at Chicago, USA
Gaurav Mittal , University of Illinois at Chicago, USA
Robert P. Dick , Northwestern University, USA
Prith Banerjee , University of Illinois at Chicago, USA
pp. 595-601
Cheng-Tao Hsieh , National Tsing Hua University, Taiwan
Jian-Cheng Lin , National Tsing Hua University, Taiwan
Shih-Chieh Chang , National Tsing Hua University, Taiwan
pp. 602-606
Dimitri Kagaris , Southern Illinois University, USA
Themistoklis Haniotakis , Southern Illinois University, USA
pp. 607-612
Marc Boule , McGill University, Canada
Jean-Samuel Chenard , McGill University, Canada
Zeljko Zilic , McGill University, Canada
pp. 613-620
Session 4C: Interconnects and Power Grids
Jae-sun Seo , University of Michigan, Ann Arbor, USA
Prashant Singh , University of Michigan, Ann Arbor, USA
Dennis Sylvester , University of Michigan, Ann Arbor, USA
David Blaauw , University of Michigan, Ann Arbor, USA
pp. 621-626
Hong Li , Purdue University, USA
Jitesh Jain , Purdue University, USA
Venkataramanan Balakrishnan , Purdue University, USA
Cheng-Kok Koh , Purdue University, USA
pp. 627-632
Ning Mi , University of California, Riverside, USA
Boyuan Yan , University of California, Riverside, USA
Sheldon X.-D. Tan , University of California, Riverside, USA
Jeffrey Fan , University of California, Riverside, USA
Hao Yu , University of California, Los Angeles, USA
pp. 633-638
Mini Nanua , Sun Microsystems Inc., USA
David Blaauw , University of Michigan, Ann Arbor, USA
pp. 639-646
Session 4D: Parametric Variations in Design
Smruti R. Sarangi , University of Illinois at Urbana-Champaign, USA
Brian Greskamp , University of Illinois at Urbana-Champaign, USA
Josep Torrellas , University of Illinois at Urbana-Champaign, USA
pp. 647-654
Mosin Mondal , Rice University, USA
Kartik Mohanram , Rice University, USA
Yehia Massoud , Rice University, USA
pp. 655-659
Kenichi Shinkai , Osaka University, Japan
Masanori Hashimoto , Osaka University, Japan
Takao Onoye , Osaka University, Japan
pp. 660-665
Javid Jaffari , University of Waterloo, Canada
Mohab Anis , University of Waterloo, Canada
pp. 666-671
Luncheon Panel Discussion LP2
Jacques Benkoski , Venture Executive, USVP
Michelle Clancy , Cayenne Communications
Shankar Krishnamoorthy , Sierra Design Automation
David Holt , Lightspeed Logic, Inc
Ravi Subramanian , Berkeley Design Automation
Clive Bittlestone , ASIC Back plane technology center, Texas Instruments
Tsuyoshi Yamamoto , Fujitsu Microelectronics America
Andrew Kanhg , Blaze DFM
pp. 672-676
Session 5A: DFM Statistics
Ayhan Mutlu , Extreme DA Corporation, USA
Kelvin J. Le , Extreme DA Corporation, USA
Mustafa Celik , Extreme DA Corporation, USA
Dar-sun Tsien , United Microelectronics Corporation, USA
Garry Shyu , United Microelectronics Corporation, USA
Long-Ching Yeh , United Microelectronics Corporation, USA
pp. 677-684
Uthman Alsaiari , University of British Columbia, Canada
Resve Saleh , University of British Columbia, Canada
pp. 703-710
Session 5B: Timing Test and Reliability
Rajeshwary Tayade , University of Texas at Austin, USA
Savithri Sundereswaran , Freescale Semiconductor
Jacob Abraham , University of Texas at Austin, USA
pp. 711-716
Rajsekhar Adapa , Southern Illinois University, Carbondale, USA
Edward Flanigan , Southern Illinois University, Carbondale, USA
Spyros Tragoudas , Southern Illinois University, Carbondale, USA
Michael Laisne , Qualcomm Incorporated, USA
Hailong Cui , Qualcomm Incorporated, USA
Tsvetomir Petrov , Qualcomm Incorporated, USA
pp. 717-722
Alodeep Sanyal , University of Massachusetts at Amherst, USA
Kunal Ganeshpure , University of Massachusetts at Amherst, USA
Sandip Kundu , University of Massachusetts at Amherst, USA
pp. 723-728
Edward Flanigan , Southern Illinois University at Carbondale, USA
Spyros Tragoudas , Southern Illinois University at Carbondale, USA
pp. 729-736
Session 5C: Variation Analysis and Design
Zhuo Feng , Texas A&M University, USA
Guo Yu , Texas A&M University, USA
Peng Li , Texas A&M University, USA
pp. 737-742
Yang Liu , Rensselaer Polytechnic Institute
Tong Zhang , Rensselaer Polytechnic Institute
Jiang Hu , Texas A&M University, USA
pp. 749-754
Ali Dasdan , Yahoo, Inc., USA
Jinfeng Liu , Synopsys, Inc., USA
Sridhar Tirumala , Synopsys, Inc., USA
Kayhan Kucukcakar , Synopsys, Inc., USA
pp. 761-770
Session 5D: Lithography and OPC
Jianliang Li , Synopsys, Inc., USA
Qiliang Yan , Synopsys, Inc., USA
Lawrence S. Melvin III , Synopsys, Inc., USA
pp. 771-775
Tetsuya Iizuka , University of Tokyo, Japan
Makoto Ikeda , University of Tokyo, Japan
Kunihiro Asada , University of Tokyo, Japan
pp. 776-781
Ye Chen , Zhejiang University, China
Zheng Shi , Zhejiang University, China
Xiaolang Yan , Zhejiang University, China
pp. 782-787
Yufu Zhang , Zhejiang University, China
Zheng Shi , Zhejiang University, China
pp. 788-794
Session 6A: DFM Process
Subarna Sinha , Synopsys Inc., USA
Qing Su , Synopsys Inc., USA
Linni Wen , Synopsys Inc., USA
Frank Lee , Synopsys Inc., USA
Charles Chiang , Synopsys Inc., USA
Yi-Kan Cheng , TSMC, Taiwan
Jin-Lien Lin , TSMC, Taiwan
Yu-Chyi Harn , TSMC, Taiwan
pp. 795-800
Arthur Nieuwoudt , Rice University, USA
Tamer Ragheb , Rice University, USA
Hamid Nejati , Rice University, USA
Yehia Massoud , Rice University, USA
pp. 801-806
S. Ramsundar , Indian Institute of Technology, India
Ahmad Al-Yamani , KFUPM, Saudi Arabia
Dhiraj K. Pradhan , University of Bristol, United Kingdom
pp. 807-813
Shubhankar Basu , University of Cincinnati, USA
Priyanka Thakore , University of Cincinnati, USA
Ranga Vemuri , University of Cincinnati, USA
pp. 814-820
Session 6B: PDM Physical Planning
Chen Li , Magma Design Automation, Inc., USA
Cheng-Koh Koh , Purdue University, USA
pp. 829-834
Hongjie Bai , Tsinghua University, China
Sheqin Dong , Tsinghua University, China
Xianlong Hong , Tsinghua University, China
pp. 835-840
Zhuo Li , IBM Austin, USA
Charles J. Alpert , IBM Austin, USA
Stephen T. Quay , IBM Austin, USA
Sachin Sapatnekar , University of Minnesota, Minneapolis, USA
Weiping Shi , Texas A&M University, USA
pp. 841-846
Hua Xiang , IBM T.J. Watson, USA
Liang Deng , UIUC, USA
Li-Da Huang , Magma Corp., USA
Martin D.F. Wong , UIUC, USA
pp. 847-852
Hailin Jiang , UCSB, USA
pp. 853-860
Session 6C: Reliability and Interconnect at the System Level
Frederic Worm , Ecole Polytechnique Federale de Lausanne (EPFL), Switzerland
Patrick Thiran , Ecole Polytechnique Federale de Lausanne (EPFL), Switzerland
Paolo Ienne , Ecole Polytechnique Federale de Lausanne (EPFL), Switzerland
pp. 861-866
Praveen Bhojwani , Texas A&M University, USA
Rabi N. Mahapatra , Texas A&M University, USA
pp. 867-872
Mosin Mondal , Rice University, USA
Tamer Ragheb , Rice University, USA
Xiang Wu , AMD
Adnan Aziz , University of Texas, USA
Yehia Massoud , Rice University, USA
pp. 873-878
Ting-Chun Huang , Carnegie Mellon University, USA
Umit Y. Ogras , Carnegie Mellon University, USA
Radu Marculescu , Carnegie Mellon University, USA
pp. 879-884
Vyas Krishnan , University of South Florida, USA
Srinivas Katkoori , University of South Florida, USA
pp. 885-892
Session 6D: Design and Modeling for Soft Error Reliability
Natasa Miskov-Zivanov , Carnegie Mellon University, USA
Diana Marculescu , Carnegie Mellon University, USA
pp. 893-898
Liang Wang , Beijing Microelectronics Technology Institute, China
Suge Yue , Beijing Microelectronics Technology Institute, China
Yuanfu Zhao , Beijing Microelectronics Technology Institute, China
Long Fan , Beijing Microelectronics Technology Institute, China
pp. 899-904
Roystein Oliveira , Rutgers University, USA
Aditya Jagirdar , Rutgers University, USA
Tapan J. Chakraborty , Alcatel-Lucent, USA
pp. 905-910
K. Ramakrishnan , Pennsylvania State University, USA
R. Rajaraman , Pennsylvania State University, USA
S. Suresh , Pennsylvania State University, USA
N. Vijaykrishnan , Pennsylvania State University, USA
Y. Xie , Pennsylvania State University, USA
M.J. Irwin , Pennsylvania State University, USA
pp. 911-916
Christian J. Hescott , University of Minnesota, USA
Drew C. Ness , University of Minnesota, USA
David J. Lilja , University of Minnesota, USA
pp. 917-922
Author Index
Author Index (PDF)
pp. 923-927
Best Paper Award
pp. 929
ISQED 2008 Call for Papers
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